DE3486131T2 - Harzmaterial mit geringer thermischer Ausdehnung für Verdrahtungsisolationsfolie. - Google Patents
Harzmaterial mit geringer thermischer Ausdehnung für Verdrahtungsisolationsfolie.Info
- Publication number
- DE3486131T2 DE3486131T2 DE19843486131 DE3486131T DE3486131T2 DE 3486131 T2 DE3486131 T2 DE 3486131T2 DE 19843486131 DE19843486131 DE 19843486131 DE 3486131 T DE3486131 T DE 3486131T DE 3486131 T2 DE3486131 T2 DE 3486131T2
- Authority
- DE
- Germany
- Prior art keywords
- thermal expansion
- resin material
- insulation film
- low thermal
- wiring insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009413 insulation Methods 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 239000011347 resin Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13943883A JPS6032827A (ja) | 1983-08-01 | 1983-08-01 | 低熱膨張樹脂材料 |
JP15235183A JPS6044338A (ja) | 1983-08-19 | 1983-08-19 | 複合成形品 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3486131D1 DE3486131D1 (de) | 1993-05-27 |
DE3486131T2 true DE3486131T2 (de) | 1993-10-28 |
Family
ID=26472257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19843486131 Expired - Fee Related DE3486131T2 (de) | 1983-08-01 | 1984-07-31 | Harzmaterial mit geringer thermischer Ausdehnung für Verdrahtungsisolationsfolie. |
Country Status (3)
Country | Link |
---|---|
US (2) | US4690999A (de) |
EP (1) | EP0133533B1 (de) |
DE (1) | DE3486131T2 (de) |
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US4612210A (en) * | 1985-07-25 | 1986-09-16 | International Business Machines Corporation | Process for planarizing a substrate |
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US4692205A (en) * | 1986-01-31 | 1987-09-08 | International Business Machines Corporation | Silicon-containing polyimides as oxygen etch stop and dual dielectric coatings |
JPH0632351B2 (ja) * | 1986-05-30 | 1994-04-27 | 日東電工株式会社 | フレキシブルプリント基板 |
EP0255037B1 (de) * | 1986-07-30 | 1992-12-09 | Hitachi, Ltd. | Verfahren zur Herstellung eines Polyimidfilms durch chemische Ablagerung aus der Dampfphase |
US4886573A (en) * | 1986-08-27 | 1989-12-12 | Hitachi, Ltd. | Process for forming wiring on substrate |
US4810770A (en) * | 1986-11-10 | 1989-03-07 | E. I. Du Pont De Nemours And Company | Elastomers |
US4731435A (en) * | 1986-11-10 | 1988-03-15 | E. I. Du Pont De Nemours And Company | Elastomers |
US4847353A (en) * | 1986-11-20 | 1989-07-11 | Nippon Steel Chemical Co., Ltd. | Resins of low thermal expansivity |
KR930004777B1 (ko) * | 1987-01-31 | 1993-06-08 | 가부시키가이샤 도시바 | 내열성 절연피복재 및 이것을 이용한 써말 헤드 |
US4913759A (en) * | 1987-04-13 | 1990-04-03 | Ethyl Corporation | Polyimide precursor and pseudo hot-melt prepregging process employing same |
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US4859530A (en) * | 1987-07-09 | 1989-08-22 | Ethyl Corporation | High temperature adhesive for polymide films |
US4831977A (en) * | 1987-07-17 | 1989-05-23 | Ethyl Corporation | Pistons with wear resistant solid film lubricant coatings |
US4963645A (en) * | 1987-08-25 | 1990-10-16 | Ube Industries, Ltd. | Terminal-modified imide oligomer and solution composition of the same |
JPH01245586A (ja) * | 1988-03-28 | 1989-09-29 | Nippon Steel Chem Co Ltd | フレキシブルプリント基板 |
US4876329A (en) * | 1988-06-28 | 1989-10-24 | Amoco Corporation | Polyimide polymers and copolymers using 3,5-diaminobenzotrifluoride |
US5192619A (en) * | 1988-06-30 | 1993-03-09 | Chisso Corporation | Flexible copper-applied substrates |
JPH0710583B2 (ja) * | 1988-06-30 | 1995-02-08 | チッソ株式会社 | 可撓性銅張基板 |
US4877653A (en) * | 1988-07-12 | 1989-10-31 | Hoechst Celanese Corporation | Process for insolublizing solvent soluble polyimide compositions |
JPH07102646B2 (ja) * | 1988-09-30 | 1995-11-08 | 株式会社日立製作所 | 金属とポリイミドの複合成形体 |
US4997869A (en) * | 1988-10-11 | 1991-03-05 | Ethyl Corporation | Production of electronic coatings by spin coating a partially fluorinated polyimide composition |
US5037673A (en) * | 1988-10-11 | 1991-08-06 | Ethyl Corporation | Method of spin coating a solution of partially fluorinated polyamic acid polymer and cycloaliphatic ketone solvent |
US4996254A (en) * | 1988-10-11 | 1991-02-26 | Ethyl Corporation | Production of electronic coatings by spin coating a partially fluorinated polyamic acid composition |
US5068131A (en) * | 1988-10-11 | 1991-11-26 | Ethyl Corporation | Method for production of electronic coatings |
US4973660A (en) * | 1988-11-30 | 1990-11-27 | Amoco Corporation | Polyamide of diamino-t-butyltoluene |
US5231162A (en) * | 1989-09-21 | 1993-07-27 | Toho Rayon Co. Ltd. | Polyamic acid having three-dimensional network molecular structure, polyimide obtained therefrom and process for the preparation thereof |
EP0471650B1 (de) * | 1990-08-17 | 1995-05-03 | Ciba-Geigy Ag | Copolyimide, Verfahren zu deren Herstellung und deren Verwendung |
US5198316A (en) * | 1990-08-17 | 1993-03-30 | Ciba-Geigy Corporation | Copolyimides, their preparation and the use thereof |
US5061781A (en) * | 1990-09-18 | 1991-10-29 | American Cyanamid Company | Polyimides from diaminobenzotrifluorides |
US5021540A (en) * | 1990-09-18 | 1991-06-04 | American Cyanamid | Polyimides from diaminobenzotrifluorides |
JPH06105836B2 (ja) * | 1990-10-05 | 1994-12-21 | 富士通株式会社 | 薄膜多層基板の製造方法 |
US5175240A (en) * | 1990-12-17 | 1992-12-29 | E.I. Du Pont De Nemours And Company | Aromatic homopolyimide or copolyimide films having low water absorption and high thermal durability |
EP0646141B1 (de) * | 1991-04-01 | 2000-06-07 | Foster-Miller, Inc. | Extrudierte thermoplasten, flüssigkristalline polymere und daraus bestehende zusammensetzungen mit planärer morphologie |
US5427848A (en) * | 1991-05-06 | 1995-06-27 | International Business Machines Corporation | Stress balanced composite laminate material |
JP2868167B2 (ja) * | 1991-08-05 | 1999-03-10 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 多重レベル高密度相互接続構造体及び高密度相互接続構造体 |
US5374469A (en) * | 1991-09-19 | 1994-12-20 | Nitto Denko Corporation | Flexible printed substrate |
US5166292A (en) * | 1991-10-29 | 1992-11-24 | E. I. Du Pont De Nemours And Company | Process for preparing a polyimide film with a preselected value for CTE |
US5264534A (en) * | 1991-10-31 | 1993-11-23 | Foster-Miller, Inc. | Oriented semicrystalline polymer films |
US5470693A (en) * | 1992-02-18 | 1995-11-28 | International Business Machines Corporation | Method of forming patterned polyimide films |
US5981007A (en) * | 1992-03-31 | 1999-11-09 | Foster-Miller, Inc. | Extruded thermoplastic, liquid crystalline polymers and blends thereof having a planar morphology |
US5310863A (en) * | 1993-01-08 | 1994-05-10 | International Business Machines Corporation | Polyimide materials with improved physico-chemical properties |
US5849397A (en) * | 1995-10-03 | 1998-12-15 | Ube Industries, Ltd. | Aromatic polyimide film and polyimide/copper foil composite sheet |
US6336973B1 (en) * | 1997-08-05 | 2002-01-08 | Micron Technology, Inc. | Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid |
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US6013535A (en) * | 1997-08-05 | 2000-01-11 | Micron Technology, Inc. | Method for applying adhesives to a lead frame |
US6326685B1 (en) * | 1998-05-04 | 2001-12-04 | Agere Systems Guardian Corp. | Low thermal expansion composite comprising bodies of negative CTE material disposed within a positive CTE matrix |
US6346750B1 (en) * | 2000-04-28 | 2002-02-12 | Micron Technology, Inc. | Resistance-reducing conductive adhesives for attachment of electronic components |
KR100917101B1 (ko) * | 2000-08-04 | 2009-09-15 | 도요 보세키 가부시키가이샤 | 플렉시블 금속적층체 및 그 제조방법 |
KR100796034B1 (ko) * | 2000-11-06 | 2008-01-21 | 한학수 | 미세전자소자 패키지용 저응력 폴리이미드 공중합체의 제조방법 |
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US7026436B2 (en) * | 2002-11-26 | 2006-04-11 | E.I. Du Pont De Nemours And Company | Low temperature polyimide adhesive compositions and methods relating thereto |
JP2006080013A (ja) * | 2004-09-10 | 2006-03-23 | Mitsui Mining & Smelting Co Ltd | 導電性ペースト及びその導電性ペーストを用いて得られるフレキシブルプリント配線板 |
WO2006082887A2 (ja) * | 2005-02-04 | 2006-08-10 | Zeon Corp | 多層フィルムおよびこれを用いた積層体並びに積層体の製造方法 |
JP2007141977A (ja) * | 2005-11-16 | 2007-06-07 | Matsushita Electric Ind Co Ltd | 半導体装置 |
TWI387812B (zh) * | 2006-11-13 | 2013-03-01 | Ind Tech Res Inst | 具有光學補償功能之透明基板及其液晶顯示器 |
US20080118730A1 (en) * | 2006-11-22 | 2008-05-22 | Ta-Hua Yu | Biaxially oriented film, laminates made therefrom, and method |
KR101227317B1 (ko) * | 2007-07-31 | 2013-01-28 | 코오롱인더스트리 주식회사 | 열안정성이 개선된 폴리이미드 필름 |
US8999764B2 (en) * | 2007-08-10 | 2015-04-07 | International Business Machines Corporation | Ionizing radiation blocking in IC chip to reduce soft errors |
KR101444694B1 (ko) * | 2009-05-25 | 2014-10-01 | 에스케이이노베이션 주식회사 | 연성금속박적층체 및 이의 제조방법 |
EP2501741A1 (de) * | 2009-11-20 | 2012-09-26 | E. I. du Pont de Nemours and Company | Deckschichtzusammensetzungen und entsprechende verfahren |
KR101004429B1 (ko) * | 2009-12-30 | 2010-12-28 | 주식회사 대림코퍼레이션 | 내열성과 고온영역의 인장특성이 향상된 전방향족 폴리이미드 수지의 제조방법 |
US9216390B2 (en) | 2010-07-15 | 2015-12-22 | Ohio State Innovation Foundation | Systems, compositions, and methods for fluid purification |
KR101898455B1 (ko) * | 2016-03-31 | 2018-09-13 | 가부시키가이샤 아이.에스.티 | 폴리이미드 섬유 및 폴리이미드 섬유의 제조 방법 |
US10665545B2 (en) * | 2018-09-19 | 2020-05-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor devices, semiconductor packages and methods of forming the same |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3179633A (en) * | 1962-01-26 | 1965-04-20 | Du Pont | Aromatic polyimides from meta-phenylene diamine and para-phenylene diamine |
BE627626A (de) * | 1962-01-26 | 1900-01-01 | ||
US3179630A (en) * | 1962-01-26 | 1965-04-20 | Du Pont | Process for preparing polyimides by treating polyamide-acids with lower fatty monocarboxylic acid anhydrides |
US3708458A (en) * | 1971-03-16 | 1973-01-02 | Upjohn Co | Copolyimides of benzophenone tetracarboxylic acid dianhydride and mixture of diisocyanates |
NL7405552A (nl) * | 1974-04-25 | 1975-10-28 | Philips Nv | Kathodestraalbuis. |
US3979633A (en) * | 1974-09-25 | 1976-09-07 | Gte Sylvania Incorporated | Directional getter attached to multi-apertured member |
JPS6042817B2 (ja) * | 1978-06-30 | 1985-09-25 | 宇部興産株式会社 | ポリイミド成形物の製造方法 |
US4405550A (en) * | 1981-04-17 | 1983-09-20 | Mobil Oil Corporation | Manufacture of polyimide film by solvent casting |
US4708958A (en) * | 1986-09-24 | 1987-11-24 | G. D. Searle & Co. | 6-(imidazolyphenyl)-4-iminopyrimidinones useful as hypotensive agents |
-
1984
- 1984-07-31 DE DE19843486131 patent/DE3486131T2/de not_active Expired - Fee Related
- 1984-07-31 EP EP19840109054 patent/EP0133533B1/de not_active Expired - Lifetime
- 1984-08-01 US US06/636,736 patent/US4690999A/en not_active Expired - Lifetime
-
1987
- 1987-07-24 US US07/077,390 patent/US4792476A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0133533A3 (en) | 1988-08-31 |
EP0133533B1 (de) | 1993-04-21 |
DE3486131D1 (de) | 1993-05-27 |
EP0133533A2 (de) | 1985-02-27 |
US4690999A (en) | 1987-09-01 |
US4792476A (en) | 1988-12-20 |
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