WO2006082887A2 - 多層フィルムおよびこれを用いた積層体並びに積層体の製造方法 - Google Patents
多層フィルムおよびこれを用いた積層体並びに積層体の製造方法 Download PDFInfo
- Publication number
- WO2006082887A2 WO2006082887A2 PCT/JP2006/301758 JP2006301758W WO2006082887A2 WO 2006082887 A2 WO2006082887 A2 WO 2006082887A2 JP 2006301758 W JP2006301758 W JP 2006301758W WO 2006082887 A2 WO2006082887 A2 WO 2006082887A2
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- WIPO (PCT)
- Prior art keywords
- multilayer film
- resin
- laminate
- film
- thermal expansion
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/24—Layered products comprising a layer of synthetic resin characterised by the use of special additives using solvents or swelling agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10009—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets
- B32B17/10018—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the number, the constitution or treatment of glass sheets comprising only one glass sheet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2398/00—Unspecified macromolecular compounds
- B32B2398/20—Thermoplastics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
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- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
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Definitions
- the present invention relates to a multilayer film, a laminate using the same, and a method for producing the laminate
- a multilayer film that can be obtained without being peeled or deformed when laminated with a glass thin film transistor substrate, etc., and a laminate using the multilayer film and its It relates to a manufacturing method.
- a thin film transistor (hereinafter sometimes abbreviated as "TFT") used for a liquid crystal or the like is usually made of an inorganic material such as glass.
- TFT substrate is required to create a non-planar display device such as a curved surface. Therefore, it is considered that the TFT substrate is made of a flexible resin.
- rosin tends to be inferior to inorganic materials such as glass in terms of blocking gas such as moisture and oxygen.
- a substrate having both functions of flexibility and gas barrier properties by laminating a resin film on a glass thin film has been considered.
- a method is known in which a TFT substrate is formed on a glass thin film laminated on a temporary substrate, and a flexible TFT substrate is formed by transferring the glass thin film to a resin film substrate.
- a method has been reported in which a glass thin film is bonded to a resin film to form a laminated substrate using a photo-curing type or thermosetting type adhesive.
- the method using a thermosetting adhesive is likely to cause problems such as deformation of the substrate and disconnection of the wiring due to large shrinkage of curing during bonding.
- a photo-curing adhesive is used, there is a risk of strong light hitting the TFT substrate during curing, causing the transistor part of the TFT body to deteriorate and electrical characteristics to change.
- Patent Document 1 discloses that a specific ring structure-containing thermoplastic polymer is useful as an adhesive for a semiconductor material, and describes a method of bonding under heat and pressure conditions.
- Patent Document 2 proposes an adhesive composed of a cyclic olefin resin and a solvent. Adhesion is recommended.
- Patent Document 1 WO99Z01519A1 Nonfret
- Patent Document 2 Japanese Patent Laid-Open No. 3-95286
- a laminated body in which a glass thin film and a thermoplastic resin film are laminated is not specially devised at the time of lamination. Due to problems such as film peeling, it is not easy to use as a TFT substrate.
- heat treatment must be performed at a high temperature, and as a result, a resin film having an alicyclic structure with excellent transparency is used.
- the multi-layer film in which the resin film and the adhesive resin layer are laminated sometimes suffers from a decrease in transparency due to the influence of high heat during the heat treatment.
- the average thermal expansion coefficient at 60 ° C was measured while the multilayer film heated to 130 ° C was cooled to 30 ° C or less and then heated again from 30 ° C to 130 ° C. 30-400ppmZ ° C large multilayer film,
- the film base material is a polyester resin, a polyether sulfone resin, a chain resin resin, a resin having an alicyclic structure, a polycarbonate resin, an acrylic resin, a methacrylic resin, and a polystyrene resin.
- the multilayer film according to (1) above comprising at least one resin selected from the group force consisting of, and having a glass transition temperature of 80 ° C. or higher for the resin.
- the adhesive resin layer contains a resin having at least one functional group selected from the group consisting of an acid anhydride group, an epoxy group, and a carboxyl group.
- a laminate comprising an inorganic material plate and the multilayer film according to (1) attached to at least one surface thereof,
- the inorganic material plate is at least one selected from the group consisting of a glass plate, silicon wello, stainless foil, copper foil, aluminum foil, and ceramic plate force.
- the multilayer film according to (1) and the inorganic material plate are bonded at 40 ° C or higher and not higher than the glass transition temperature of the resin constituting the adhesive resin layer. It is a manufacturing method of a laminated body.
- the multilayer film of the present invention has an adhesive resin layer that can be bonded to a glass plate or the like without using high temperature heating or ultraviolet rays that have good adhesion to an inorganic material or the like. For this reason, if it adhere
- This laminate can be suitably used for TFT substrates and the like where peeling, breakage, and cracking are unlikely to occur.
- the manufacturing method of the laminated body of this invention is a favorable manufacturing method of the said laminated body.
- the multilayer film of the present invention is a multilayer film in which an adhesive resin layer capable of adhering to an inorganic material is provided on a resin film substrate.
- the resin for the film base is not particularly limited, but is preferably an amorphous resin, preferably a resin having high transparency and a relatively high glass transition temperature.
- the unit include polystyrene resin.
- polyester resin and resin having an alicyclic structure are particularly suitable resins.
- these resins can be used suitably for TFTs of liquid crystal materials that have a good balance of optical properties such as heat resistance and transparency, adhesion to the resin of the adhesive resin layer, and thermal expansion coefficient.
- this multilayer film is composed of two layers, ie, a single resin film base layer and an adhesive resin layer
- the multilayer film that is, two or more resin film base layers and an adhesive resin layer
- a film base layer made of resin may be provided with a protective film layer made of resin on the surface opposite to the surface in contact with the adhesive resin layer.
- the glass transition temperature (hereinafter sometimes abbreviated as Tg) or melting point (hereinafter sometimes abbreviated as Tm) of the resin used for the film substrate is preferably 80 ° C. Above, more preferably 120 ° C or higher.
- the Tg or Tm of the resin for a film substrate is preferably equal to or higher than the Tg or Tm of the resin forming the adhesive resin layer (hereinafter sometimes referred to as an adhesive resin).
- an adhesive resin As a preferred method for producing the laminate of the present invention, which will be described later, when this multilayer film is heated to a temperature close to Tg or Tm of the adhesive resin and laminated to a glass plate, the resin base resin is soft. That's why.
- the multilayer film of the present invention is an average thermal expansion coefficient at 60 to 80 ° C measured while heating the multilayer film from 30 ° C to 130 ° C. It is 30 to 400 ppmZ ° C higher than the average coefficient of thermal expansion at 60 to 80 ° C measured while cooling from 30 ° C to 130 ° C after cooling to below ° C.
- the second heating is to measure the average coefficient of thermal expansion, and the average coefficient of thermal expansion can be measured even with heating to a minimum of 80 ° C.
- the thermal expansion coefficient in the present invention is a linear thermal expansion coefficient unless otherwise specified. In general, the thermal expansion coefficient of a resin is larger than the thermal expansion coefficient of an inorganic material!
- the thermal expansion coefficient of the resin forming the film substrate in the multilayer film is lOOppmZ ° C or less, and the thermal expansion coefficient of inorganic materials such as glass is 50 ppmZ ° C or less. If it is a difference, when a laminate for a TFT substrate is used, defects such as peeling, cracking and deformation do not occur in the laminate on which the film base material and the inorganic material are pasted.
- thermoplastic resin used as an adhesive resin layer for laminating a film substrate and an inorganic material
- thermal expansion will occur even if a laminate is formed with the inorganic material. Due to the difference in rate, problems such as peeling, cracking and deformation rarely occur in the laminate with the film substrate and the inorganic material attached.
- the adhesive resin layer that does not contain a solvent has no or poor adhesion to an inorganic material plate such as glass
- the adhesive temperature for adhering to the inorganic material is determined by the adhesive temperature of the adhesive resin layer. Must be above the glass transition temperature or melting point of the fat.
- the adhesive resin layer and the film substrate deteriorate and transparency, precision, etc. are likely to cause coloring, foaming, and deformation. In many cases, it cannot be used for TFT substrates, etc.
- the multilayer film of the present invention has a thermal expansion coefficient in a specific range and improves adhesion to an inorganic material by including a specific amount of a solvent in the adhesive resin layer.
- an adhesive resin containing a solvent or dissolved in a solvent when forming the adhesive resin layer on the film substrate in the production of the multilayer film, it is preferable to use an adhesive resin containing a solvent or dissolved in a solvent.
- Resin containing solvent has a very large coefficient of thermal expansion.
- the coefficient of thermal expansion at a temperature of 80 ° C or less tends to be large because the solvent does not evaporate and remains in the adhesive resin.
- the coefficient of thermal expansion above 80 ° C gradually decreases due to the transpiration of the solvent.
- the adhesive resin whose thermal expansion coefficient was measured while first heating to 130 ° C was cooled to 30 ° C or lower, and the thermal expansion coefficient was measured while heating again to 130 ° C.
- the coefficient of thermal expansion is almost constant regardless of the temperature conditions. This value is close to the coefficient of thermal expansion of the adhesive resin without solvent. From this, the solvent in the adhesive resin was evaporated by the heating operation during the first measurement of the thermal expansion coefficient, and the thermal expansion coefficient of only the adhesive resin was measured during the second thermal expansion coefficient measurement. It is considered a thing. That is, it is a multilayer film having an adhesive resin layer containing a solvent. However, once heat-treated, the solvent evaporates and shows the natural thermal expansion coefficient of fat.
- the multilayer film of the present invention has an average coefficient of thermal expansion at 60 to 80 ° C in the first measurement and a temperature at 60 to 80 ° C in the second measurement when the coefficient of thermal expansion of the multilayer film is measured twice. 30 to 400ppmZ ° C higher than the average coefficient of thermal expansion.
- the difference in thermal expansion coefficient is preferably 75 to 300 ppmZ. C, Yori
- the multilayer film preferably 130-27 ( ⁇ 1117 .. Dearu 0 further have preferred embodiment, the average coefficient of thermal expansion forces the second time measurement in the 80 to 120 ° C in the first round measured 20 to 70 ppmZ ° C, preferably 25 to 65 ppmZ ° C higher than the average coefficient of thermal expansion at 80 to 120 ° C.
- the lower limit of the difference in coefficient of thermal expansion is as described above.
- the upper limit of the difference in thermal expansion coefficient is within the above range.
- the difference between the coefficient of thermal expansion and the average coefficient of thermal expansion at 60-80 ° C in the second measurement is the difference between the average coefficient of thermal expansion at 80-120 ° C in the first measurement and 80-120 ° in the second measurement. It is preferable that the difference is larger than the difference from the average coefficient of thermal expansion in C.
- the coefficient of thermal expansion may be measured, for example, using a commercially available thermomechanical analyzer (TMA) in the following manner.
- TMA thermomechanical analyzer
- the film is cut into a predetermined size, and the cut multilayer film is set in a thermomechanical analyzer and under a nitrogen atmosphere with a load of 0.1 N, at a rate of 5 ° C / minute from room temperature.
- the difference from the thermal expansion coefficient may be obtained by subtracting the average thermal expansion coefficient at the second measurement from the average thermal expansion coefficient at the first measurement in each temperature range.
- the temperature at which the thermal expansion coefficient in the temperature range of 60 to 80 ° C can be measured That is, it is only necessary to heat to 80 ° C.
- the lamination of the multilayer film and the glass plate or the like is performed by pressure bonding the multilayer film and the glass plate or the like under conditions of about 40 to 120 ° C, preferably 60 to 120 ° C.
- Part of the solvent in the resin layer evaporates, and the resulting laminate has almost no solvent in the adhesive resin layer, and the thermal expansion coefficient of the adhesive resin layer is the original thermal expansion coefficient of the resin.
- the average coefficient of thermal expansion at 60 to 80 ° C in the first measurement for measuring the coefficient of thermal expansion while heating from 30 ° C to 130 ° C was measured as described above.
- Adhesive resin layer contains appropriate solvent, adhesion to inorganic materials and adhesion of laminate It was confirmed that the peelability was good.
- Such an evaluation method is suitable only for measuring the coefficient of thermal expansion of the multilayer film, and suitable for producing a laminate suitable for solving the problems of the present invention regardless of the type of adhesive resin. It is a very useful index for production management because it can easily identify multilayer films.
- the solvent content is from 0.6 to 2.3 mass 0/0, more preferably 0.7 to 1.8 wt%, particularly preferably 0.8 to 1.5 mass % Is desirable. If the solvent content is less than the above range, the adhesion of the multilayer film of the present invention to an inorganic material may be reduced. On the other hand, when the solvent content exceeds the above range, when the multilayer film of the present invention is applied to an inorganic material, peeling of the multilayer film, deformation, foaming, etc. easily occur due to heating during bonding.
- the solvent content is calculated by dissolving the multilayer film in a solvent and analyzing the resulting solution by gas chromatography using an internal standard. At this time, the solvent used when dissolving the multilayer film is different from the solvent used when forming the adhesive resin layer.
- the resin constituting the adhesive resin layer is not particularly limited, but it has the same force-similar molecular structure as the resin used for a film substrate that is preferably an amorphous resin.
- rosin include the acrylic resin, the polyester resin, the chain olefin resin, and the resin having the alicyclic structure.
- rosin having an alicyclic structure is preferable from the viewpoint of transparency.
- Coffin having an alicyclic structure has an alicyclic structure in the main chain and Z or side chain. Viewpoints such as mechanical strength and heat resistance
- the coffin having a suitable alicyclic structure contains an alicyclic structure in the main chain.
- alicyclic structures contained in coconut oil include saturated alicyclic hydrocarbon (cycloalkane) structures and unsaturated alicyclic hydrocarbon (cycloalkene) structures. From the viewpoint, a cycloalkane structure is preferable.
- the number of carbon atoms constituting the alicyclic structure is not particularly limited, but the mechanical strength is usually in the range of 4 to 30, preferably 5 to 20, more preferably 5 to 15. It is suitable because it is highly balanced in terms of heat resistance and film formability.
- the proportion of the repeating unit containing the alicyclic structure in the coconut resin having the alicyclic structure suitably used in the present invention may be appropriately selected according to the purpose of use, but is preferably 30% by mass. % Or more, more preferably 50% by mass or more, particularly preferably 70% by mass or more, and most preferably 90% by mass or more. Ratio power of repeating unit having alicyclic structure in alicyclic structure having alicyclic structure within this range, the transparency and heat resistance of the base film are also preferred.
- the resin having an alicyclic structure specifically includes (1) a norbornene polymer, (2) a monocyclic cyclic olefin-based polymer, (3) a cyclic conjugation-based polymer, and 4) Vinyl alicyclic hydrocarbon polymers, and hydrogenated products thereof.
- norbornene-based polymers and cyclic conjugated gen-based polymers are more preferable from the viewpoints of transparency and moldability.
- the norbornene polymer (1) includes a ring-opening polymer of a norbornene monomer, and a ring-opening copolymer of the norbornene monomer and another monomer capable of ring-opening copolymerization with the norbornene monomer.
- hydrides of these ring-opening copolymers, addition polymers of norbornene monomers, addition copolymers of norbornene monomers with other monomers copolymerizable with this norbornene monomer, etc. Can be mentioned.
- hydrides of ring-opening (co) polymers of norbornene monomers are particularly preferred from the viewpoint of heat resistance and mechanical strength.
- Examples of the monocyclic olefin-based polymer (2) include addition polymers of cyclic olefin-based monomers having a single ring such as cyclohexene, cycloheptene, and cyclootaten.
- Examples of the cyclic conjugated gen-based polymer (3) include a polymer obtained by cyclization reaction of an addition polymer of a conjugated gen-based monomer such as 1,3-butadiene, isoprene, and chloroprene. Mention may be made of 1,2 or 1,4 addition polymers of cyclic conjugation monomers such as pentagen and cyclohexagen, and their hydrides.
- the bur cycloaliphatic hydrocarbon polymer (4) includes a bu cycloaliphatic hydrocarbon polymer such as bulcyclohexene and bur cyclohexane, and its hydride, styrene, and ⁇ - A hydrogenated product of a hydrogenated aromatic ring part contained in a polymer formed by polymerizing a butyl aromatic hydrocarbon monomer such as methylstyrene, a bis-alicyclic hydrocarbon monomer or a butyl aromatic hydrocarbon monomer. Examples thereof include random copolymers with other monomers copolymerizable with these butyl aromatic hydrocarbon monomers, and hydrides of aromatic ring portions of copolymers such as block copolymers. Examples of the block copolymer include diblock, triblock or more multiblock, and gradient block copolymer.
- the resin having the above alicyclic structure is selected from known polymer cartridges disclosed in, for example, JP-A-2002-321302.
- the glass transition temperature of the resin constituting the adhesive resin layer is preferably 40 to 190 ° C, more preferably 50 to 160 ° C, and particularly preferably 60 to 145 ° C.
- the adhesive resin layer is made of a resin having at least one functional group selected from the group consisting of an acid anhydride group, an epoxy group, and a carboxyl group.
- Adhesiveness with an inorganic material board can be further improved because an adhesive resin layer consists of the resin which has the said functional group.
- the content of the functional group in the resin constituting the adhesive resin layer is a molar amount per 100 g of resin, preferably 0.005-0.25 mol, and more preferably 0.012 to 0.15. Monole, particularly preferably ⁇ or 0.015 to 0.12 monole.
- the molar amount per coconut resin lOOg that is, the functional group content per coconut resin lOOg is the value when the above functional group is regarded as a molecule and the mass (g) corresponding to the molecular weight is 1 mol. , ⁇ Fat The mass (g) of the functional group actually contained in lOOg is expressed in terms of moles.
- Examples of the method for forming the adhesive resin layer include a solution casting method and a melt extrusion method that are not particularly limited.
- the solution casting method is preferred in that the thickness of the adhesive resin layer can be applied as uniformly as possible and the solvent content in the multilayer film can be set to a desired amount.
- the resin constituting the adhesive resin layer is dissolved in a solvent in which the resin dissolves to obtain a varnish, reverse roll coating, gravure coating, air knife coating And coating on a resin film substrate by a method such as blade coating, followed by drying to remove the solvent.
- it is desirable that the solvent content of the multilayer film is within the above-mentioned range. Drying conditions are appropriately selected depending on the type of solvent used.
- Examples of the solvent used for forming the adhesive resin layer include ketones, ethers, esters, aromatic hydrocarbons, and hydrogen additives thereof. These may be used singly or in combination of two or more.
- the multilayer film of the present invention is often used for optical materials such as liquid crystal TFTs, so that light transmittance is important.
- the total light transmittance of the multilayer film of the present invention at a wavelength of 400 to 650 nm is preferably 80% or more, more preferably 85% or more, and particularly preferably 88% or more.
- the total light transmittance may be measured using a commercially available turbidimeter in accordance with JIS K7361-1.
- the laminate of the present invention has a structure in which the multilayer film of the present invention described above and an inorganic material plate are laminated.
- the inorganic material used for the laminate of the present invention may be a plate made of an inorganic material, such as white glass, soda glass, and vapor-deposited thin film glass (acidic silicon); aluminum, Examples thereof include plates made of materials such as metals such as copper, silicon, and iron, and metal oxide films; stainless steel, ITO (Indium Tin Oxide), and ceramics.
- glass plates, silicon wafers, stainless foils, copper foils, aluminum foil plates, and ceramic plates are preferable. In particular, glass plates are used in many TFT substrates and are useful laminates.
- the thickness of the inorganic material plate is preferably 0.1 to 200 m.
- 0.1 to 1 ⁇ m is a normal glass thin film. In the case of 1 ⁇ : About LOO m is desirable.
- the laminate of the present invention is 40 ° C or higher and the inorganic material sheet and the multilayer film of the present invention are contained in the multilayer film.
- Adhesion It can be suitably produced by adhering at a temperature lower than the glass transition temperature of the resin constituting the resin layer.
- the laminate of the present invention requires that the multilayer film of the present invention and the inorganic material plate are bonded with good adhesion, while suppressing peeling and deformation of the laminated body after bonding and maintaining transparency.
- the adhesive resin layer of the multilayer film contains a small amount of solvent, and quantitatively utilizes the change in the coefficient of thermal expansion to achieve adhesion during bonding and durability after bonding.
- the bonding method is important because it has a great influence on the adhesion at the time of bonding and the durability after bonding.
- the solvent in the adhesive resin layer remains as it is, and the thermal expansion coefficient of the adhesive resin layer of the produced laminate is increased, and there is a risk of foaming due to the vaporization of the solvent due to temperature change during use.
- the adhesive resin layer may melt during bonding, and the multilayer film may be greatly expanded or deformed.
- the resin used for the film substrate at the time of bonding is equal to or higher than the glass transition temperature.
- the adhesion temperature here can be represented, for example, by the temperature of the pressing surface of the pressing means when the multilayer film and the inorganic material plate are bonded and adhered using the pressing means. Examples of the apparatus having a pressing means include a laminator.
- a conductive flexible thin-film transparent glass plate can be provided by forming a transparent conductive material such as an ITO vapor deposition layer or an IZO (Indium Zinc Oxide) vapor deposition layer on the glass surface of this stack in advance or after bonding.
- a transparent conductive material such as an ITO vapor deposition layer or an IZO (Indium Zinc Oxide) vapor deposition layer
- the temperature is measured at 10 ° CZ by the differential scanning calorimetry (DSC method) and measured.
- Mass average molecular weight (referred to as Mw):
- GPC gel permeation chromatography
- the maleic acid unit in terms of rosin (per lOOg) is calculated as a mole by titration.
- thermomechanical analyzer TMA
- the cut multilayer film is set in a thermomechanical analyzer, heated at a rate of 5 ° C per minute under a nitrogen atmosphere while applying a load of 0.1 N, and heated from 30 ° C to 130 ° C.
- the coefficient of thermal expansion is measured (first measurement).
- it is cooled to room temperature (30 ° C or less) and heated at a rate of 5 ° CZ min again from room temperature while measuring a load of 0.1 N, and the coefficient of thermal expansion at a temperature of 30 to 130 ° C is measured.
- Yes second measurement
- the average coefficient of thermal expansion in the temperature range of 60 to 80 ° C and 80 to 130 ° C is calculated for each of the first and second measurements.
- the difference in the average thermal expansion coefficient in each temperature range is obtained by subtracting the average thermal expansion coefficient power in the first measurement and the average thermal expansion coefficient in the second measurement in each temperature range.
- Cut out the multilayer film (about 200mg) and weigh it accurately. Accurately weigh 5 ml of tetrahydrofuran containing toluene as an internal standard, add the cut multilayer film to dissolve it, and obtain a measurement solution. The obtained solution is analyzed by gas chromatography with a flame ion detector, and the solvent content in the multilayer film is calculated by the internal standard method.
- the initial adhesion and the adhesion after the moisture resistance test of the laminate in which the inorganic material plate and the multilayer film are bonded are evaluated by the following cross-cut peel test, and the initial adhesion test and the moisture resistance test are followed by the adhesion test.
- the conditions of the moisture resistance test are as follows.
- Heat resistance test Adhesion, interfacial debonding, interfacial foaming, corrugation, crack presence confirmation test: After leaving the laminated body of the inorganic material plate and multilayer film in a 130 ° C oven for 30 minutes, Cool to room temperature. This operation was repeated 3 times and then evaluated. Adhesion between the inorganic material plate and the multilayer film is evaluated by the cross-cut peel test described above. The film wrinkles) and the presence or absence of cracks due to the difference were evaluated by visual observation.
- Adhesive Resin E-1 Table 1 summarizes the physical properties of the obtained resin E-1.
- the cyclization rate indicates the cyclization rate of cyclized isoprene.
- the cyclization rate was calculated from the peak area of the proton derived from the double bond before and after the cyclization reaction of the conjugated gen double bond by proton NMR. The detailed measurement method was (i) m. A. Golub and J. Heller., Can. J. Chem., 41, 937 (1963). [0042] (3) Production of multilayer film
- rosin solution 1 20 parts of the adhesive resin M-1 obtained in Synthesis Example 1 was dissolved in 80 parts of a cyclopentyl methyl ether (boiling point 106 ° C) solvent and filtered through a 1 ⁇ m filter to obtain a resin solution having a viscosity of 130 cps. .
- the obtained rosin solution (hereinafter, sometimes referred to as rosin solution 1) was obtained by adding a norbornene polymer film (thickness 188 m, norbornene polymer Tgl 60 ° C, total light transmittance 92.3%, The film was coated by using a doctor blade with a thickness of 100 m (sometimes referred to as “film substrate 1”). Next, this coated film was dried at 105 ° C. for 15 minutes to obtain a multilayer film 1. The properties of the resulting multilayer film are shown in Tables 2 and 3.
- a multilayer film 2 was obtained in the same manner as in Example 1 except that the coating film was dried at 115 ° C. for 20 minutes in Example 1.
- the properties of the obtained multilayer film 2 are shown in Tables 2 and 3.
- Example 1 instead of the film substrate 1, a cyclic polyolefin film (Sumitomo Beklite, Sumilite FS-1700, thickness 100 m, glass transition temperature of cyclic polyolefin 163 ° C) was used.
- a multilayer film 3 was obtained by the same operation as in Example 1. The properties of the obtained multilayer film 3 are shown in Table-2 and Table-3.
- a multilayer film 4 was obtained by carrying out the same operations as in Example 1 except that this resin solution was used in place of the resin solution 1 in Example 1. The properties of the obtained multilayer film 3 are shown in Table 2 and Table 3.
- Example 1 instead of the film substrate 1, polycarbonate film (Sumitomo Beta Light Co., Ltd .: Sumilite FS-1650H, thickness 125 ⁇ m, polycarbonate glass transition temperature) A multilayer film 5 was obtained in the same manner as in Example 1 except that the temperature was 145 ° C. The characteristics of the obtained multilayer film 5 are shown in Table-2 and Table-3.
- Adhesive resin obtained in Synthesis Example 4 MIR-1 was dissolved in a mixture of toluene and ethyl acetate at a mass ratio of 3: 1 so that the concentration of the resin was 28% to obtain a resin solution. It was.
- a multilayer film 6 was obtained by performing the same operation as in Example 1 except that this resin solution was used in place of the resin solution 1 of Example 1. The characteristics of the obtained multilayer film 6 are shown in Table-2 and Table-3.
- a multilayer film 7 was obtained in the same manner as in Example 1 except that the coating film was dried at 80 ° C. for 15 minutes in Example 1.
- the properties of the obtained multilayer film 7 are shown in Tables 2 and 3.
- a multilayer film 8 was obtained in the same manner as in Example 1, except that the coating film was dried at 90 ° C. for 15 minutes in Example 1.
- the properties of the obtained multilayer film 8 are shown in Tables 2 and 3.
- a multilayer film 9 was obtained in the same manner as in Example 4 except that the drying conditions of the coated film were 80 ° C. and 15 minutes in Example 4.
- the properties of the obtained multilayer film 9 are shown in Tables 2 and 3.
- Example 5 the multilayer film 10 was obtained by performing the same operation as in Example 5, except that the drying condition of the coated film was 80 ° C. for 15 minutes.
- the properties of the obtained multilayer film 10 are shown in Tables 2 and 3.
- Example 6 the multilayer film 11 was obtained by performing the same operation as in Example 6 except that the drying condition of the coated film was 80 ° C. for 15 minutes.
- the characteristics of the obtained multilayer film 11 are shown in Table 2 and Table 3. [Comparative Example 6: Production of multilayer film 12]
- Example 1 except that the drying condition of the coated film was 120 ° C for 30 minutes,
- a multilayer film 12 was obtained by the same operation as in 1. The characteristics of the obtained multilayer film 12 are shown in Table 2 and Table 3.
- a 50 m thick glass film (manufactured by Matsunami Glass Co., Ltd.) was immersed in a mixed solution of 0.1% aminopropyltriethoxysilane and water for 2 minutes and then dried at room temperature for 24 hours. It was.
- This glass film and the surface of the adhesive resin layer of the multilayer film obtained in Example 1 were bonded together, and a laminate 1 was obtained by vacuum lamination using a vacuum laminator so as not to generate bubbles.
- Vacuum laminating conditions are as follows: vacuuming 15 seconds, bonding temperature 10 0 ° C, adhesion time 360 seconds, adhesion pressure IMPa.
- the obtained laminate 1 was evaluated by an initial adhesion test, an adhesion test after a moisture resistance test, and a heat test. The results are listed in Table 4.
- a laminate 2 was obtained by carrying out the same operations as in Example 8, except that the multilayer film 2 obtained in Example 2 was used instead of the multilayer film 1.
- the obtained laminate 2 was evaluated in the same manner as in Example 8. The results are shown in Table 4.
- a laminate 3 was obtained by performing the same operation as in Example 8, except that the multilayer film 3 obtained in Example 3 was used instead of the multilayer film 1.
- the obtained laminate 3 was evaluated in the same manner as in Example 8. The results are shown in Table 4.
- a laminated body 4 was obtained by performing the same operation as in Example 8, except that the multilayer film 4 obtained in Example 4 was used instead of the multilayer film 1.
- the obtained laminate 4 was evaluated in the same manner as in Example 8. The results are shown in Table 4.
- a laminated body 5 was obtained by performing the same operation as in Example 8, except that the multilayer film 5 obtained in Example 5 was used instead of the multilayer film 1.
- the obtained laminate 5 was evaluated in the same manner as in Example 8. The results are shown in Table 4.
- Example 6 the multilayer film 6 obtained in Example 6 was used, and the laminated body 6 was obtained by performing the same operation as in Example 8 except that the adhesion temperature was set to 60 ° C in a vacuum lamination. Obtained.
- the obtained laminate 6 was evaluated in the same manner as in Example 8. The results are shown in Table 4.
- a laminate 7 was obtained by performing the same operation as in Example 8, except that the multilayer film 7 obtained in Comparative Example 1 was used instead of the multilayer film 1.
- the obtained laminate 7 was evaluated in the same manner as in Example 8. The results are shown in Table 4.
- a laminate 9 was obtained in the same manner as in Example 8, except that the multilayer film 9 obtained in Comparative Example 3 was used instead of the multilayer film 1.
- the obtained laminate 9 was evaluated in the same manner as in Example 8. The results are shown in Table 4.
- a laminate 10 was obtained in the same manner as in Example 8, except that the multilayer film 10 obtained in Comparative Example 4 was used instead of the multilayer film 1.
- the obtained laminate 10 was evaluated in the same manner as in Example 8. The results are shown in Table 4.
- a laminate 11 was obtained by performing the same operation as in Example 8, except that the multilayer film 11 obtained in Comparative Example 5 was used instead of the multilayer film 1.
- the obtained laminate 11 was evaluated in the same manner as in Example 8. The results are shown in Table 4.
- the multilayer body was obtained by performing the same operation as in Example 8, except that the multilayer film 12 obtained in Comparative Example 6 was used instead of the multilayer film 7 and the adhesion temperature was set to 60 ° C. in the vacuum lamination. I got 12.
- the obtained laminate 12 was evaluated in the same manner as in Example 8. The results are listed in Table 4.
- Silane coupling agent (S-330 manufactured by AZMAX Co., Ltd.)
- the laminated film 1 was bonded to the surface of the adhesive resin layer and bonded with a vacuum laminator so as not to generate air bubbles to obtain a laminate.
- Lamination conditions were as follows: vacuuming 15 seconds, adhesion temperature 100 ° C, adhesion time 360 seconds, adhesion pressure IMPa.
- Xe-C1 excimer laser (wavelength 308nm) is irradiated from the quartz substrate side of the laminate, and the multilayer film 1 with the SiO film adhered is separated.
- the flexible substrate 1 was evaluated in the same manner as in Example 8. The results are shown in Table 5. Furthermore, the flexible substrate 1 has the SiO film side inside.
- a flexible substrate 2 was obtained by performing the same operation as in Example 15 except that the multilayer film 4 obtained in Example 4 was used instead of the multilayer film 1.
- the flexible substrate 2 was evaluated in the same manner as in Example 8, and the results are shown in Table 5. Furthermore, when the flexible substrate 1 was bent about 30 degrees so that the SiO film side was inside, the SiO film was peeled off. No separation or cracking occurred.
- a flexible substrate 3 was obtained in the same manner as in Example 15 except that the multilayer film 7 obtained in Comparative Example 1 was used instead of the multilayer film 1.
- This flexible substrate 3 was evaluated in the same manner as in Example 8. The results are shown in Table 5. Furthermore, when the flexible substrate 1 is bent about 30 degrees so that the SiO film side is inside, the SiO film
- UVZ-108E Nogawa Chemical
- An agent (UVZ-108E: Nogawa Chemical) was applied to a thickness of 30 / zm. Then, the film substrate 1 was adhered through this adhesive, and ultraviolet irradiation (6000 m j / m 2 ) was performed from the film substrate surface. Quartz substrate side force of transfer ultra-thin glass plate Xe-Cl excimer laser (wavelength: 308nm), film substrate 1 with SiO film adhered, separation layer and stone
- the laminated film of the comparative example has problems such as delamination, foaming, cracking, and deformation when bonded to an inorganic material plate and has low adhesion strength with the inorganic material plate. There is a chance to catch.
- the multilayer film and laminate of the present invention are useful for the production of liquid crystals and organic EL devices.
- the multilayer film and laminate of the present invention can provide a suitable material for a flexible thin film transistor substrate.
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- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
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- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims
Priority Applications (2)
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US11/883,582 US7527857B2 (en) | 2005-02-04 | 2006-02-02 | Multilayer film, laminate using the same, and method for producing the laminate |
JP2007501614A JPWO2006082887A1 (ja) | 2005-02-04 | 2006-02-02 | 多層フィルムおよびこれを用いた積層体並びに積層体の製造方法 |
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JP (1) | JPWO2006082887A1 (ja) |
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WO2021029283A1 (ja) * | 2019-08-09 | 2021-02-18 | 三菱瓦斯化学株式会社 | 貼り合わせ用粘着シート、多層体および多層体の製造方法 |
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JP2011162851A (ja) * | 2010-02-10 | 2011-08-25 | Fujifilm Corp | ガスバリアフィルムの製造方法 |
EP2434330A1 (en) * | 2010-09-24 | 2012-03-28 | Hoya Corporation | Method of manufacturing eyeglass lens |
JP6443348B2 (ja) * | 2014-01-29 | 2018-12-26 | 日本ゼオン株式会社 | 複合ガスバリア積層体及びその製造方法 |
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JPS6482928A (en) * | 1987-09-25 | 1989-03-28 | Mitsui Toatsu Chemicals | Flexible laminated plate of metal and plastic |
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CA2234317C (en) * | 1997-04-08 | 2008-06-17 | Sumitomo Chemical Co., Ltd. | Composite film comprising low-dielectric resin and para-oriented aromatic polyamide |
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- 2006-02-02 WO PCT/JP2006/301758 patent/WO2006082887A2/ja not_active Application Discontinuation
- 2006-02-02 JP JP2007501614A patent/JPWO2006082887A1/ja active Pending
- 2006-02-02 US US11/883,582 patent/US7527857B2/en not_active Expired - Fee Related
- 2006-02-02 KR KR1020077020116A patent/KR20070101373A/ko not_active Application Discontinuation
- 2006-02-03 TW TW095103774A patent/TW200700230A/zh unknown
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JPS55160489A (en) * | 1979-05-31 | 1980-12-13 | Kanegafuchi Chemical Ind | Flexible printed circuit board and method of fabricating same |
JPS6044338A (ja) * | 1983-08-19 | 1985-03-09 | 株式会社日立製作所 | 複合成形品 |
JPS6482928A (en) * | 1987-09-25 | 1989-03-28 | Mitsui Toatsu Chemicals | Flexible laminated plate of metal and plastic |
JPH0364386A (ja) * | 1989-08-03 | 1991-03-19 | Tomoegawa Paper Co Ltd | 電子部品用接着テープ |
WO1999001519A1 (fr) * | 1997-07-04 | 1999-01-14 | Nippon Zeon Co., Ltd. | Adhesif pour composants semi-conducteurs |
JP2002178423A (ja) * | 2000-12-13 | 2002-06-26 | Sharp Corp | プラスチック基板およびそれを用いた薄膜積層デバイスの製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021029283A1 (ja) * | 2019-08-09 | 2021-02-18 | 三菱瓦斯化学株式会社 | 貼り合わせ用粘着シート、多層体および多層体の製造方法 |
CN114207067A (zh) * | 2019-08-09 | 2022-03-18 | 三菱瓦斯化学株式会社 | 贴合用粘接片材、多层体和多层体的制造方法 |
Also Published As
Publication number | Publication date |
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US7527857B2 (en) | 2009-05-05 |
KR20070101373A (ko) | 2007-10-16 |
JPWO2006082887A1 (ja) | 2008-06-26 |
TW200700230A (en) | 2007-01-01 |
WO2006082887A3 (ja) | 2007-01-18 |
US20080138613A1 (en) | 2008-06-12 |
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