TWI304079B - - Google Patents

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Publication number
TWI304079B
TWI304079B TW091122314A TW91122314A TWI304079B TW I304079 B TWI304079 B TW I304079B TW 091122314 A TW091122314 A TW 091122314A TW 91122314 A TW91122314 A TW 91122314A TW I304079 B TWI304079 B TW I304079B
Authority
TW
Taiwan
Prior art keywords
film
flexible printed
printed circuit
circuit board
dianhydride
Prior art date
Application number
TW091122314A
Other languages
English (en)
Chinese (zh)
Inventor
Kaneshiro Hisayasu
Akahori Kiyokazu
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19123345&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI304079(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Kaneka Corp filed Critical Kaneka Corp
Application granted granted Critical
Publication of TWI304079B publication Critical patent/TWI304079B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24959—Thickness [relative or absolute] of adhesive layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW091122314A 2001-09-28 2002-09-27 TWI304079B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001303219 2001-09-28

Publications (1)

Publication Number Publication Date
TWI304079B true TWI304079B (enExample) 2008-12-11

Family

ID=19123345

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091122314A TWI304079B (enExample) 2001-09-28 2002-09-27

Country Status (6)

Country Link
US (1) US7018704B2 (enExample)
JP (1) JPWO2003030598A1 (enExample)
KR (1) KR20040030536A (enExample)
CN (1) CN1283132C (enExample)
TW (1) TWI304079B (enExample)
WO (1) WO2003030598A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7416695B2 (en) * 2001-06-15 2008-08-26 Kaneka Corporation Semiconductive polymide film and process for production thereof
JP2006310643A (ja) * 2005-04-28 2006-11-09 Sumitomo Electric Ind Ltd フレキシブルプリント配線板
JP2007208087A (ja) * 2006-02-03 2007-08-16 Kaneka Corp 高屈曲性フレキシブルプリント配線板
US20080118730A1 (en) * 2006-11-22 2008-05-22 Ta-Hua Yu Biaxially oriented film, laminates made therefrom, and method
EP2191701B1 (en) 2007-09-28 2013-03-20 Tri-Star Laminates, Inc. Entry sheet, method of manufacturing thereof and methods for drilling holes in printed circuit boards
CN101897244A (zh) * 2007-12-07 2010-11-24 英泰格尔技术有限公司 用于刚性印制电路板的改进的绝缘层
JP5275001B2 (ja) * 2008-12-10 2013-08-28 日本メクトロン株式会社 多層フレキシブル配線板の製造方法
KR20120096000A (ko) * 2009-11-20 2012-08-29 이 아이 듀폰 디 네모아 앤드 캄파니 와이어 랩 구조체 및 그 관련 방법
JP2012049368A (ja) * 2010-08-27 2012-03-08 Arisawa Mfg Co Ltd カバーレイフィルム及びこれを用いたフレキシブルプリント配線板
US20130270487A1 (en) * 2010-10-28 2013-10-17 Kaneka Corporation Process for production of electrically conductive polyimide film
CN105307861B (zh) 2013-05-31 2018-02-09 株式会社钟化 绝缘包覆材料及其利用
US9481809B2 (en) 2013-12-13 2016-11-01 E I Du Pont De Nemours And Company Multilayer film
KR102309825B1 (ko) 2013-12-17 2021-10-08 이 아이 듀폰 디 네모아 앤드 캄파니 다층 필름
EP3226259B1 (en) * 2014-11-27 2024-10-02 Kaneka Corporation Insulating coating material having excellent wear resistance
JP6694826B2 (ja) 2014-11-27 2020-05-20 株式会社カネカ 耐摩耗性の優れる絶縁被覆材料
US9481150B2 (en) 2014-12-10 2016-11-01 E I Du Pont De Nemours And Company Multilayer film
CN109575831A (zh) * 2018-11-20 2019-04-05 深圳市弘海电子材料技术有限公司 低反弹力覆盖膜及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH066360B2 (ja) * 1985-06-14 1994-01-26 日東電工株式会社 ポリイミド−金属箔複合フイルム
US5432001A (en) * 1990-01-30 1995-07-11 Trw Inc. Concentrated prepolymer composition useful for forming polyimide articles
JP3356568B2 (ja) * 1994-11-30 2002-12-16 鐘淵化学工業株式会社 新規なフレキシブル銅張積層板
JPH11227099A (ja) * 1998-02-10 1999-08-24 Mitsubishi Chemical Corp 耐熱性基板
JPH11298102A (ja) * 1998-04-10 1999-10-29 Unitika Ltd 二層フレキシブルプリント基板及びその製造方法
JP2000299359A (ja) * 1999-04-16 2000-10-24 Kanegafuchi Chem Ind Co Ltd Ｔａｂ用テープ
US6653433B2 (en) * 1999-11-24 2003-11-25 E. I. Du Pont De Nemours And Company Polyimide composition having improved peel strength when clad

Also Published As

Publication number Publication date
JPWO2003030598A1 (ja) 2005-01-20
CN1283132C (zh) 2006-11-01
KR20040030536A (ko) 2004-04-09
CN1504067A (zh) 2004-06-09
US20040081808A1 (en) 2004-04-29
US7018704B2 (en) 2006-03-28
WO2003030598A1 (en) 2003-04-10

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