CN1283132C - 用于软性印刷电路板的聚酰亚胺膜以及采用该膜的软性印刷电路板 - Google Patents

用于软性印刷电路板的聚酰亚胺膜以及采用该膜的软性印刷电路板 Download PDF

Info

Publication number
CN1283132C
CN1283132C CNB028084462A CN02808446A CN1283132C CN 1283132 C CN1283132 C CN 1283132C CN B028084462 A CNB028084462 A CN B028084462A CN 02808446 A CN02808446 A CN 02808446A CN 1283132 C CN1283132 C CN 1283132C
Authority
CN
China
Prior art keywords
flexible printed
film
printed circuit
polyimide film
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB028084462A
Other languages
English (en)
Chinese (zh)
Other versions
CN1504067A (zh
Inventor
金城永泰
赤堀廉一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19123345&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN1283132(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Publication of CN1504067A publication Critical patent/CN1504067A/zh
Application granted granted Critical
Publication of CN1283132C publication Critical patent/CN1283132C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24959—Thickness [relative or absolute] of adhesive layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
CNB028084462A 2001-09-28 2002-09-27 用于软性印刷电路板的聚酰亚胺膜以及采用该膜的软性印刷电路板 Expired - Lifetime CN1283132C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP303219/2001 2001-09-28
JP2001303219 2001-09-28

Publications (2)

Publication Number Publication Date
CN1504067A CN1504067A (zh) 2004-06-09
CN1283132C true CN1283132C (zh) 2006-11-01

Family

ID=19123345

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028084462A Expired - Lifetime CN1283132C (zh) 2001-09-28 2002-09-27 用于软性印刷电路板的聚酰亚胺膜以及采用该膜的软性印刷电路板

Country Status (6)

Country Link
US (1) US7018704B2 (enExample)
JP (1) JPWO2003030598A1 (enExample)
KR (1) KR20040030536A (enExample)
CN (1) CN1283132C (enExample)
TW (1) TWI304079B (enExample)
WO (1) WO2003030598A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002102882A1 (en) * 2001-06-15 2002-12-27 Kaneka Corporation Semiconductive polyimide film and process for production thereof
JP2006310643A (ja) * 2005-04-28 2006-11-09 Sumitomo Electric Ind Ltd フレキシブルプリント配線板
JP2007208087A (ja) * 2006-02-03 2007-08-16 Kaneka Corp 高屈曲性フレキシブルプリント配線板
US20080118730A1 (en) * 2006-11-22 2008-05-22 Ta-Hua Yu Biaxially oriented film, laminates made therefrom, and method
EP2191701B1 (en) 2007-09-28 2013-03-20 Tri-Star Laminates, Inc. Entry sheet, method of manufacturing thereof and methods for drilling holes in printed circuit boards
JP2009170891A (ja) * 2007-12-07 2009-07-30 Integral Technology Inc リジッドプリント回路板用の改良された絶縁層
JP5275001B2 (ja) * 2008-12-10 2013-08-28 日本メクトロン株式会社 多層フレキシブル配線板の製造方法
CN102712753B (zh) * 2009-11-20 2015-08-26 E·I·内穆尔杜邦公司 热稳定的且尺寸稳定的聚酰亚胺薄膜及与其相关的方法
JP2012049368A (ja) * 2010-08-27 2012-03-08 Arisawa Mfg Co Ltd カバーレイフィルム及びこれを用いたフレキシブルプリント配線板
KR20130140026A (ko) * 2010-10-28 2013-12-23 카네카 코포레이션 도전성 폴리이미드 필름의 제조 방법
EP3006209B1 (en) 2013-05-31 2022-12-21 Kaneka Corporation Insulated coating material and use of same
KR102309828B1 (ko) 2013-12-13 2021-10-08 이 아이 듀폰 디 네모아 앤드 캄파니 다층 필름
US9469781B2 (en) 2013-12-17 2016-10-18 E I Du Pont De Nemours And Company Multilayer film
WO2016084661A1 (ja) 2014-11-27 2016-06-02 株式会社カネカ 耐摩耗性の優れる絶縁被覆材料
JP6639410B2 (ja) * 2014-11-27 2020-02-05 株式会社カネカ 耐摩耗性の優れる絶縁被覆材料
US9481150B2 (en) 2014-12-10 2016-11-01 E I Du Pont De Nemours And Company Multilayer film
CN109575831A (zh) * 2018-11-20 2019-04-05 深圳市弘海电子材料技术有限公司 低反弹力覆盖膜及其制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH066360B2 (ja) 1985-06-14 1994-01-26 日東電工株式会社 ポリイミド−金属箔複合フイルム
US5432001A (en) * 1990-01-30 1995-07-11 Trw Inc. Concentrated prepolymer composition useful for forming polyimide articles
JP3356568B2 (ja) 1994-11-30 2002-12-16 鐘淵化学工業株式会社 新規なフレキシブル銅張積層板
JPH11227099A (ja) 1998-02-10 1999-08-24 Mitsubishi Chemical Corp 耐熱性基板
JPH11298102A (ja) 1998-04-10 1999-10-29 Unitika Ltd 二層フレキシブルプリント基板及びその製造方法
JP2000299359A (ja) 1999-04-16 2000-10-24 Kanegafuchi Chem Ind Co Ltd Ｔａｂ用テープ
US6653433B2 (en) * 1999-11-24 2003-11-25 E. I. Du Pont De Nemours And Company Polyimide composition having improved peel strength when clad

Also Published As

Publication number Publication date
WO2003030598A1 (en) 2003-04-10
CN1504067A (zh) 2004-06-09
TWI304079B (enExample) 2008-12-11
US20040081808A1 (en) 2004-04-29
JPWO2003030598A1 (ja) 2005-01-20
US7018704B2 (en) 2006-03-28
KR20040030536A (ko) 2004-04-09

Similar Documents

Publication Publication Date Title
CN1283132C (zh) 用于软性印刷电路板的聚酰亚胺膜以及采用该膜的软性印刷电路板
CN1241733C (zh) 层压品及其生产方法
US20100316877A1 (en) Method for preparing polyimide and polyimide prepared using the same
CN1088074C (zh) 热塑性聚酰亚胺聚合物
CN1265686C (zh) 软性印刷电路板
CN102459466A (zh) 聚酰胺酸溶液、聚酰亚胺树脂及使用其的柔性金属箔层叠板
JP4996473B2 (ja) ゴム変性ポリアミド樹脂、エポキシ樹脂組成物、およびその硬化物
KR102571970B1 (ko) 금속 피복 적층판 및 회로 기판
CN1898084A (zh) 金属层压板及其制备方法
CN115122735A (zh) 聚酰亚胺、树脂组合物、树脂膜、层叠体、覆盖膜、带树脂铜箔、覆金属层叠板及电路基板
JP2016192531A (ja) 回路基板
JP2008230035A (ja) ポリイミド積層フィルムおよびそれを用いたプリント基板
WO2010058734A1 (ja) フェノール性水酸基含有芳香族ポリアミド樹脂およびその用途
CN101208373A (zh) 聚酰胺树脂，环氧树脂组合物及其固化物
JPWO2008072630A1 (ja) ポリアミド樹脂、並びにそれを用いるエポキシ樹脂組成物及びその用途
JP2019014062A (ja) 積層体、フレキシブル金属張積層板、およびフレキシブルプリント回路基板
JP2021106248A (ja) 金属張積層板及び回路基板
KR20230004322A (ko) 폴리아미드산, 폴리이미드, 폴리이미드 필름, 금속박적층판 및 회로기판
JP2007208087A (ja) 高屈曲性フレキシブルプリント配線板
CN1846465A (zh) 柔性印刷线路板用的基板及其制造方法
JP2010202681A (ja) ポリイミドフィルム
JP2005290327A (ja) 絶縁接着フィルムおよびこれを含む積層体、並びにプリント配線板
CN101258212A (zh) 耐热性粘接片
WO2007083526A1 (ja) ポリイミドフィルムおよびその利用
CN116178712A (zh) 聚酰亚胺系树脂前体

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20061101

CX01 Expiry of patent term