CN102165858B - 电子部件的安装装置及安装方法 - Google Patents
电子部件的安装装置及安装方法 Download PDFInfo
- Publication number
- CN102165858B CN102165858B CN200980138068.3A CN200980138068A CN102165858B CN 102165858 B CN102165858 B CN 102165858B CN 200980138068 A CN200980138068 A CN 200980138068A CN 102165858 B CN102165858 B CN 102165858B
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- China
- Prior art keywords
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- electronic unit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008250516A JP5173708B2 (ja) | 2008-09-29 | 2008-09-29 | 電子部品の実装装置及び実装方法 |
JP2008-250516 | 2008-09-29 | ||
PCT/JP2009/064143 WO2010035582A1 (fr) | 2008-09-29 | 2009-08-10 | Appareil et procédé de montage de composant électronique |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102165858A CN102165858A (zh) | 2011-08-24 |
CN102165858B true CN102165858B (zh) | 2014-11-12 |
Family
ID=42059589
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980138068.3A Active CN102165858B (zh) | 2008-09-29 | 2009-08-10 | 电子部件的安装装置及安装方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5173708B2 (fr) |
KR (1) | KR101223896B1 (fr) |
CN (1) | CN102165858B (fr) |
TW (1) | TWI462664B (fr) |
WO (1) | WO2010035582A1 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012033612A (ja) * | 2010-07-29 | 2012-02-16 | Hitachi High-Technologies Corp | Fpdモジュール組立装置 |
JP5702110B2 (ja) * | 2010-10-26 | 2015-04-15 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置及び実装方法 |
JP5650983B2 (ja) * | 2010-10-26 | 2015-01-07 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置及び実装方法 |
WO2013153598A1 (fr) * | 2012-04-09 | 2013-10-17 | 富士機械製造株式会社 | Dispositif de nettoyage de tête de montage |
JP5996241B2 (ja) * | 2012-04-12 | 2016-09-21 | デクセリアルズ株式会社 | 接着フィルムの貼着装置、接着フィルムの貼着方法、及び接続構造体 |
JP6045837B2 (ja) * | 2012-07-26 | 2016-12-14 | 日東電工株式会社 | 半導体ウエハのマウント方法および半導体ウエハのマウント装置 |
EP2978294B1 (fr) * | 2013-03-19 | 2018-01-03 | Fuji Machine Mfg. Co., Ltd. | Machine de montage de composant |
JP6155467B2 (ja) * | 2013-09-18 | 2017-07-05 | パナソニックIpマネジメント株式会社 | 部品実装機 |
WO2016163029A1 (fr) * | 2015-04-10 | 2016-10-13 | 富士機械製造株式会社 | Appareil de montage de composant |
TWI567011B (zh) * | 2016-06-15 | 2017-01-21 | All Ring Tech Co Ltd | Method and device for conveying the components of the bonding process |
CN107322685A (zh) * | 2017-07-04 | 2017-11-07 | 深圳市联得自动化装备股份有限公司 | 覆晶薄膜自动冲切设备 |
JP6820809B2 (ja) * | 2017-07-27 | 2021-01-27 | 三菱電機株式会社 | チップマウンター、電子回路基板の製造方法、およびパワーモジュールの製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2956312B2 (ja) * | 1991-10-14 | 1999-10-04 | 松下電器産業株式会社 | ガード付電子部品の打抜装置 |
JP4011843B2 (ja) * | 2000-09-18 | 2007-11-21 | 芝浦メカトロニクス株式会社 | 部品実装装置およびその装置で用いられる部品受渡方法 |
JP4262903B2 (ja) * | 2001-04-11 | 2009-05-13 | 芝浦メカトロニクス株式会社 | 部品実装装置およびその方法 |
JP2003164652A (ja) * | 2001-11-30 | 2003-06-10 | Heiwa Corp | 排気ファン装置 |
JP2004214574A (ja) * | 2003-01-09 | 2004-07-29 | Renesas Technology Corp | 調湿機能付インナーリードボンディング装置 |
JP4680704B2 (ja) * | 2005-07-19 | 2011-05-11 | パナソニック株式会社 | 基板クリーニング装置、及び基板搬送装置 |
WO2007138671A1 (fr) * | 2006-05-30 | 2007-12-06 | Hirata Corporation | Dispositif d'usinage automatique d'une pièce |
JP4819602B2 (ja) * | 2006-07-05 | 2011-11-24 | パナソニック株式会社 | Acf貼付装置及びacf貼付方法 |
JP5046253B2 (ja) * | 2007-02-22 | 2012-10-10 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置及び実装方法 |
-
2008
- 2008-09-29 JP JP2008250516A patent/JP5173708B2/ja active Active
-
2009
- 2009-08-10 KR KR1020117009508A patent/KR101223896B1/ko active IP Right Grant
- 2009-08-10 CN CN200980138068.3A patent/CN102165858B/zh active Active
- 2009-08-10 WO PCT/JP2009/064143 patent/WO2010035582A1/fr active Application Filing
- 2009-08-12 TW TW098127097A patent/TWI462664B/zh active
Non-Patent Citations (2)
Title |
---|
JP特开2002-314294A 2002.10.25 * |
JP特开2002-93859A 2002.03.29 * |
Also Published As
Publication number | Publication date |
---|---|
CN102165858A (zh) | 2011-08-24 |
TWI462664B (zh) | 2014-11-21 |
WO2010035582A1 (fr) | 2010-04-01 |
JP2010080874A (ja) | 2010-04-08 |
KR20110081825A (ko) | 2011-07-14 |
TW201026179A (en) | 2010-07-01 |
JP5173708B2 (ja) | 2013-04-03 |
KR101223896B1 (ko) | 2013-01-17 |
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Legal Events
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---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |