CN102165858B - 电子部件的安装装置及安装方法 - Google Patents

电子部件的安装装置及安装方法 Download PDF

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Publication number
CN102165858B
CN102165858B CN200980138068.3A CN200980138068A CN102165858B CN 102165858 B CN102165858 B CN 102165858B CN 200980138068 A CN200980138068 A CN 200980138068A CN 102165858 B CN102165858 B CN 102165858B
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China
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mentioned
main body
apparatus main
electronic unit
dust
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CN200980138068.3A
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English (en)
Chinese (zh)
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CN102165858A (zh
Inventor
南浜悦郎
森治雄
广濑圭刚
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication of CN102165858A publication Critical patent/CN102165858A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN200980138068.3A 2008-09-29 2009-08-10 电子部件的安装装置及安装方法 Active CN102165858B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008250516A JP5173708B2 (ja) 2008-09-29 2008-09-29 電子部品の実装装置及び実装方法
JP2008-250516 2008-09-29
PCT/JP2009/064143 WO2010035582A1 (fr) 2008-09-29 2009-08-10 Appareil et procédé de montage de composant électronique

Publications (2)

Publication Number Publication Date
CN102165858A CN102165858A (zh) 2011-08-24
CN102165858B true CN102165858B (zh) 2014-11-12

Family

ID=42059589

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980138068.3A Active CN102165858B (zh) 2008-09-29 2009-08-10 电子部件的安装装置及安装方法

Country Status (5)

Country Link
JP (1) JP5173708B2 (fr)
KR (1) KR101223896B1 (fr)
CN (1) CN102165858B (fr)
TW (1) TWI462664B (fr)
WO (1) WO2010035582A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012033612A (ja) * 2010-07-29 2012-02-16 Hitachi High-Technologies Corp Ｆｐｄモジュール組立装置
JP5702110B2 (ja) * 2010-10-26 2015-04-15 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5650983B2 (ja) * 2010-10-26 2015-01-07 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
WO2013153598A1 (fr) * 2012-04-09 2013-10-17 富士機械製造株式会社 Dispositif de nettoyage de tête de montage
JP5996241B2 (ja) * 2012-04-12 2016-09-21 デクセリアルズ株式会社 接着フィルムの貼着装置、接着フィルムの貼着方法、及び接続構造体
JP6045837B2 (ja) * 2012-07-26 2016-12-14 日東電工株式会社 半導体ウエハのマウント方法および半導体ウエハのマウント装置
EP2978294B1 (fr) * 2013-03-19 2018-01-03 Fuji Machine Mfg. Co., Ltd. Machine de montage de composant
JP6155467B2 (ja) * 2013-09-18 2017-07-05 パナソニックＩｐマネジメント株式会社 部品実装機
WO2016163029A1 (fr) * 2015-04-10 2016-10-13 富士機械製造株式会社 Appareil de montage de composant
TWI567011B (zh) * 2016-06-15 2017-01-21 All Ring Tech Co Ltd Method and device for conveying the components of the bonding process
CN107322685A (zh) * 2017-07-04 2017-11-07 深圳市联得自动化装备股份有限公司 覆晶薄膜自动冲切设备
JP6820809B2 (ja) * 2017-07-27 2021-01-27 三菱電機株式会社 チップマウンター、電子回路基板の製造方法、およびパワーモジュールの製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2956312B2 (ja) * 1991-10-14 1999-10-04 松下電器産業株式会社 ガード付電子部品の打抜装置
JP4011843B2 (ja) * 2000-09-18 2007-11-21 芝浦メカトロニクス株式会社 部品実装装置およびその装置で用いられる部品受渡方法
JP4262903B2 (ja) * 2001-04-11 2009-05-13 芝浦メカトロニクス株式会社 部品実装装置およびその方法
JP2003164652A (ja) * 2001-11-30 2003-06-10 Heiwa Corp 排気ファン装置
JP2004214574A (ja) * 2003-01-09 2004-07-29 Renesas Technology Corp 調湿機能付インナーリードボンディング装置
JP4680704B2 (ja) * 2005-07-19 2011-05-11 パナソニック株式会社 基板クリーニング装置、及び基板搬送装置
WO2007138671A1 (fr) * 2006-05-30 2007-12-06 Hirata Corporation Dispositif d'usinage automatique d'une pièce
JP4819602B2 (ja) * 2006-07-05 2011-11-24 パナソニック株式会社 Ａｃｆ貼付装置及びａｃｆ貼付方法
JP5046253B2 (ja) * 2007-02-22 2012-10-10 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开2002-314294A 2002.10.25 *
JP特开2002-93859A 2002.03.29 *

Also Published As

Publication number Publication date
CN102165858A (zh) 2011-08-24
TWI462664B (zh) 2014-11-21
WO2010035582A1 (fr) 2010-04-01
JP2010080874A (ja) 2010-04-08
KR20110081825A (ko) 2011-07-14
TW201026179A (en) 2010-07-01
JP5173708B2 (ja) 2013-04-03
KR101223896B1 (ko) 2013-01-17

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