TW201026179A - Apparatus and method for mounting electronic component - Google Patents

Apparatus and method for mounting electronic component Download PDF

Info

Publication number
TW201026179A
TW201026179A TW098127097A TW98127097A TW201026179A TW 201026179 A TW201026179 A TW 201026179A TW 098127097 A TW098127097 A TW 098127097A TW 98127097 A TW98127097 A TW 98127097A TW 201026179 A TW201026179 A TW 201026179A
Authority
TW
Taiwan
Prior art keywords
electronic component
dust
tcp
mounting
substrate
Prior art date
Application number
TW098127097A
Other languages
Chinese (zh)
Other versions
TWI462664B (en
Inventor
Etsuo Minamihama
Haruo Mori
Keigou Hirose
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW201026179A publication Critical patent/TW201026179A/en
Application granted granted Critical
Publication of TWI462664B publication Critical patent/TWI462664B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75Apparatus for connecting with bump connectors or layer connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

An apparatus for mounting an electronic component is provided with: a punching apparatus (5A, 5B) which is arranged at one end of an apparatus main body (1) and punches out a TCP from a carrier tape (3); a first receiving/transferring means (6A, 6B) which receives the punched out TCP and transfers the TCP to a predetermined position; an index means (18A, 18B) having a plurality of holding heads which receive and hold the transferred TCPs; an adhering apparatus (31A, 31B) which adheres the adhesive tape on the TCPs which have been transferred to the holding heads; a table apparatus which receives and aligns a substrate; a mounting head (53) which mounts the TCP having the adhesive tape adhered thereon on the substrate which has been aligned by the table apparatus; a gas-supplying unit (72) which introduces an external gas into an apparatus main body from above the apparatus main body, and makes the gas flow downward along the punching apparatus; and a gas-releasing unit (77) which ejects, from a bottom section, dusts generated in the apparatus main body due to such flow.

Description

201026179 六、發明說明: 【發明所屬之技彳椅領域】 本發明係有關將作為電子零件之TCP(載帶封裝體; Tape Carrier Package)安裝至作為諸如基板之液晶顯示面板 上的電子零件之安裝裝置及安裝方法。 在製1¾作為基板之液晶顯示面板時,係進行藉由安裝 裝置而將作為電子零件之tCP安裝於該液晶顯示面板上的 安裝。上述安裝裝置係具有箱型狀的裝置本體。該裝置本 體内係設置有用於將來自載帶之上述TCP予以穿通之穿通 裝置。被穿通裝置所穿通之Tcp係藉由構成交付機構之接 受體而被接受。 上述接受體係將已穿通之TCP搬送至指定的位置,並 在该位置交付至複數個保持頭,該等保持頭係設置在以每 -指定角度間歇地旋轉驅動之分度台上。保持頭係設置成 可於上下方向驅動。 被交付至分度台之保持頭的TCP係因應該分度台之間 歇旋轉而喊轉卿上述Tcp之端子科以清雜,再進 行安裝位置之定位。在該安裝位置,欲安I TCP之基板係 藉由基台裝置進行定位而待機。 接著倘右藉由分度台之間歇旋轉而進行伴持右τρρ 之上述保持頭之安裝位置的定位,該保持 下。藉此,鋪在保持頭之上述TCP係成為可被安裳於基 板之側邊部上。如此之習知技術係揭示於專利文獻i或專 3 201026179 利文獻2。 習知係在擴及基板之側邊部全長黏貼由異方性導電構 件所構成之黏著帶,並於該處以指定間隔安裝上述TCP。 然而,在擴及基板之側邊部全長黏貼黏著帶係有會使未安 裝TCP之黏著帶部分成為浪費,且未安裝TCP之部分會附 著塵埃等等缺失。 於此,在最近則是倘若以旋轉刷將保持在分度台之保 持頭上之TCP端子部進行清潔後,係以黏貼裝置而於該端 子部黏貼與TCP端子部約略相同長度之被分斷的黏著帶。 接著’將黏貼有黏著帶之TCP由上述保持頭交付至安 裝頭,藉由將該安裝頭定位於基板側邊部之上方後使其下 降’藉此,進行所謂將保持在安裝頭上之上述TCP安裝於 基板之側邊部的安裝。 專利文獻1 :日本專利特開第2002 —305398號 專利文獻2:曰本專利特開第2006— 120929號 【明内j 本發明所欲解決之課題 然而,倘若藉由穿通裝置而將來自載帶之TCp予以穿 通,此時不可避免地會錢生塵埃,且塵埃會浮游於裝置 本體部内部的情形H倘若以旋轉卿交付至分度台 之TCP _子部進行清潔,係有自端子部所去除之塵埃: 浮游在裝置本體内之情形。 倘若塵埃浮游在裝置本體内,係有塵埃附著在祕於 TCP前之黏著帶或㈣於TCP後之黏著帶,或是附著在設 201026179 置於女裝TCP之基板侧邊部上面的端子部分的情形。在黏 ㈣或基板之端子附著有塵埃之狀態下,倘若將上述TCP t裝於上述端子上’由於塵埃係存在於TCP與基板之端子 間’因而會有導致TCP之絲不良的情形。 本發明係提供電子零件之安裝裝置及安裝方法,其可 夺裝置本體内所產生之塵埃由裝置本體内確實地排出至外201026179 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to mounting of a TCP (Tape Carrier Package) as an electronic component to an electronic component as a liquid crystal display panel such as a substrate Device and installation method. In the case of manufacturing a liquid crystal display panel as a substrate, mounting of a tCP as an electronic component on the liquid crystal display panel by mounting means is performed. The above mounting device has a box-shaped device body. The device body is provided with a feedthrough for piercing the above-mentioned TCP from the carrier tape. The Tcp that is passed through by the punch-through device is accepted by the acceptor that constitutes the delivery mechanism. The acceptance system transports the over-traveled TCP to a designated location and delivers to a plurality of retention heads at the location, the retention heads being disposed on an indexing table that is rotationally driven intermittently at each specified angle. Keep the head system set to drive in the up and down direction. The TCP system that was delivered to the holding head of the indexing table was turned to the terminal section of the Tcp to clear the gap between the indexing stations, and then the positioning position was performed. At this mounting position, the substrate to be ITCP is placed on standby by the base station. Then, if the right side is rotated by the intermittent rotation of the indexing table, the positioning of the mounting position of the holding head with the right τρρ is performed, and the holding is continued. Thereby, the above-mentioned TCP system laid on the holding head can be mounted on the side portion of the substrate. Such a prior art is disclosed in Patent Document i or in the patent document 2 201026179. It is conventional to adhere an adhesive tape composed of an anisotropic conductive member over the entire length of the side portion of the substrate, and to mount the TCP at a predetermined interval there. However, the adhesive tape on the side of the side portion of the expanded substrate is such that the adhesive tape portion of the unmounted TCP is wasteful, and the portion where the TCP is not attached is attached with dust or the like. In this case, in the recent case, if the TCP terminal portion held on the holding head of the indexing table is cleaned by a rotating brush, the terminal portion is adhered to the terminal portion and the length of the TCP terminal portion is approximately the same length. Adhesive tape. Then, 'the TCP to which the adhesive tape is adhered is delivered from the holding head to the mounting head, and the mounting head is positioned above the side edge of the substrate to be lowered, thereby performing the so-called TCP that will be held on the mounting head. Mounted on the side of the substrate. Patent Document 1: Japanese Patent Laid-Open No. 2002-305398 Patent Document 2: Japanese Patent Laid-Open No. 2006-120929 [Ming J. The problem to be solved by the present invention, however, if the tape is passed through the device The TCp is punched through. At this time, it is inevitable that the money will be dusty, and the dust will float inside the main body of the device. If it is delivered to the TCP _ subsection of the indexing table for cleaning, it is from the terminal. Removed dust: The situation of floating in the body of the device. If the dust floats in the body of the device, there is dust attached to the adhesive tape before TCP or (4) adhesive tape after TCP, or attached to the terminal part of the side of the substrate of 2010-26179 placed on the substrate of Women's TCP. situation. In the state where the adhesion of the adhesive (4) or the substrate is adhered to the terminal, if the TCP t is mounted on the terminal, the dust is present between the terminal of the TCP and the substrate, and the wire of the TCP may be defective. The present invention provides a mounting device and a mounting method for an electronic component, which are capable of reliably discharging dust generated in the body of the device to the outside of the device body.

解決課題所需之手段 本發明係提供一種電子零件之安裝裝置,係將電子零 件安裝於基板之側邊部者,其特徵在於包含: 裝置本體; 上 穿通裝置,係設置於該裝置本體之前後方向的-端部 並將來自帶狀構件之上述電子零件^穿通; 交付機構’係接受被該穿通裝置所穿通之上述電子零 件並搬送至指定的位置; =度2構’係具有複數個保持頭,且料 被該父付機構所搬送之電子零件並加以保持· 又 保持=電:::著帶—該分度機構之 基台裝置,係設置於上诚奘 端部上並接受上述基板而加以定位;t前後方向的另一 =構,係將以上述黏貼裝置而黏貼有黏著帶之上 Γ 裝至藉由該基μ⑽定^上述基板上·’ 201026179 塵埃去除機構,係將來自上述裝置 二導入内部並沿著上述穿通裝置而往下方流動:藉由= 動而使產生於上述裝置本體内之塵埃由底部排出。- 再者,本發明係提供-種電子零件之安裝方法 電子零件絲於基板之㈣部者,騎徵在於包含.將 穿通步驟,係設置於裝置本體之前後方向的— 將來自帶狀構件之上述電切料以穿通; 搬送步驟,係接受來自上述帶狀構件之已穿通之 電子零件並搬送至指定的位置; 述 交付步驟,係接受已搬送至指定位置之電子零件並交 付至分度機構之保持頭; 乂 黏貼步驟,係將黏著帶黏貼於被交付至上述分度機 之保持頭的上述電子零件; 女裝乂驟,係將黏貼有黏著帶之上述電子零件安裝於 上述基板上,該基板係被保持在設置於上述裝置本體之前 後方向的另—端部上之基台裝置;及 排出步驟,係將上述裝置本體外部之氣體自裝置本體 上部導入内部而流向下方,藉由該流動而使產生於上述裝 置本體内之塵埃由上述裝置本體之底部排出。 發明效果 依據本發明’藉由使氣體自裝置本體上部往下方流 動而使裝置本體内之環境氣體朝向該氣體之流動而流 入進而可使裝置本體内產生之塵埃由裳置本體之底部排 201026179 藉此,即使自裝置本體内之穿通裝置等等產生塵埃, 本發明可防止因塵埃附著於黏貼裝置之黏著帶、黏貼於電 子零件之黏著帶或是欲安裝電子零件之基板等等,所導致 電子零件之安裝不良的情形。 圖式簡單說明 第1圖係顯示本發明一實施形態之安裝裝置之内部構 造的橫斷面圖。 第2圖係顯示安裝裝置之内部構造的縱斷面圖。 第3圖係顯示保持在保持頭之TCP位在刷洗位置之清 潔狀態的側面圖。 第4圖係顯示將自供給捲軸黏貼至離型帶而送出之黏 著帶於指定長度予以分斷之狀態的側面圖。 第5圖係顯示在交付位置將黏貼有黏著帶之TCP交付 至安裝頭之狀態的側面圖。 第6圖係形成有裝置本體之側壁之供給口與排出口之 部分的正面圖。 第7圖係顯示於裝置本體内之空間部流動氣體時所產 生之氣流的説明圖。 第8圖係顯示於本發明另一實施形態之裝置本體内之 空間部流動氣體時所產生之氣流的説明圖。 I:實施方式3 用以實施本發明之最佳形態 以下,將一邊參照圖式而說明本發明之實施形態。 第1圖至第7圖係顯示本發明之一實施形態。第1圖 7 201026179 係顯不安裝裝置之内部構造的横斷面圖,㈣2圖係 之縱斷面圖。如第1圖與第2圖所示,上述安裝裝置係i 備有设置在無塵室之箱型狀的裝置本體丨。於該裝置本體【 之!,後端侧的寬度方向中央部,係形成向後方突出 之突出部2’在該突出部2上,用於將來自載帶3之作為: 子零件之TCP4予以穿通的第!穿通敦置从與第2穿 置5B係相對於裝置本體i之寬度方向 第1圖)成左右對稱地配置。 、心,’.,、不於Means for Solving the Problems The present invention provides an electronic component mounting apparatus for mounting electronic components on a side edge of a substrate, comprising: a device body; and an upper punching device disposed before the device body The end portion of the direction passes through the electronic component from the strip member; the delivery mechanism ' receives the electronic component that is passed through the punchthrough device and transports it to a designated position; the degree 2 structure has a plurality of holds The head, and the electronic parts that are transported by the parent organization, are kept and kept. ==:: strap - the base unit of the indexing mechanism is placed on the upper end of the upper and accepts the above substrate And positioning; the other direction of the t-front direction is adhered to the adhesive tape by the above-mentioned adhesive device, and is mounted on the substrate by the base μ(10). The 201026179 dust removal mechanism will come from the above The device 2 is introduced into the interior and flows downward along the feedthrough device: the dust generated in the body of the device is discharged from the bottom by the action. Further, the present invention provides an electronic component mounting method. The electronic component is printed on the (fourth) portion of the substrate, and the riding is included. The step of passing through is disposed in the front and rear directions of the device body. The electric cutting material is passed through; the conveying step receives the passed through electronic components from the strip-shaped member and transports them to a designated position; and the delivery step accepts the electronic parts that have been transported to the designated position and delivers them to the indexing mechanism. Holding the head; the adhesive step is to adhere the adhesive tape to the electronic component that is delivered to the holding head of the indexing machine; the women's step is to mount the electronic component to which the adhesive tape is adhered to the substrate. The substrate is held by the base device disposed at the other end in the front-rear direction of the apparatus body; and the discharging step is to introduce the gas outside the device body into the inside from the upper portion of the device body and flow downward. The dust generated in the body of the apparatus is discharged by the bottom of the apparatus body. According to the present invention, the gas generated in the body of the device is caused to flow from the upper portion of the main body of the device to flow downward from the upper portion of the device body, so that the dust generated in the body of the device can be borrowed from the bottom of the body. Therefore, the present invention can prevent the dust from adhering to the adhesive tape of the adhesive device, the adhesive tape adhered to the electronic component, or the substrate on which the electronic component is to be mounted, etc., even if dust is generated from the punching device or the like in the device body. Poor installation of parts. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing the internal structure of a mounting device according to an embodiment of the present invention. Fig. 2 is a longitudinal sectional view showing the internal structure of the mounting device. Fig. 3 is a side view showing the state in which the TCP bit of the holding head is cleaned at the brushing position. Fig. 4 is a side view showing a state in which the adhesive tape fed from the supply reel to the release tape is separated at a predetermined length. Fig. 5 is a side view showing the state in which the TCP to which the adhesive tape is attached is delivered to the mounting head at the delivery position. Fig. 6 is a front elevational view showing a portion of a supply port and a discharge port of a side wall of the apparatus body. Fig. 7 is an explanatory view showing a flow of air generated when a gas flows in a space portion of the apparatus body. Fig. 8 is an explanatory view showing a flow of air generated when a gas flows in a space portion of a device body in another embodiment of the present invention. I. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 to 7 show an embodiment of the present invention. Fig. 1 7 201026179 is a cross-sectional view showing the internal structure of the unmounted device, and (4) a longitudinal sectional view of the 2 drawing system. As shown in Fig. 1 and Fig. 2, the mounting device is provided with a box-shaped device body 设置 provided in a clean room. In the central portion of the apparatus main body in the width direction of the rear end side, a projecting portion 2' projecting rearward is formed on the projecting portion 2 for piercing the TCP 4 as a sub-assembly from the carrier tape 3 First! The through-through is arranged symmetrically with respect to the width direction of the second body 5B relative to the apparatus body i (Fig. 1). Heart, '., not

動:述第T裝置Μ與第2穿通裝置5B係交互地作 ^被-方之穿通裝置灿所穿通之 第1父付機構6A、6B所承接。 卞 亦即,藉由第1穿通裝置5A而 ==Γ結束時,第2穿通巢置-係被作動, 而將載帶3之新的部分供給至第lf通裝置5A。藉此,來Actuation: The T-th device and the second punch-through device 5B are alternately engaged by the first parent-paid mechanism 6A, 6B through which the punch-through device is passed. That is, when the first punch-through device 5A ends ==Γ, the second punch-through nesting system is actuated, and a new portion of the carrier tape 3 is supplied to the lf-passing device 5A. Take this

自載帶3之已穿通的Tcp4係可交互地供給至—對第丄交 付機構6A、6B。 如第2圖所示,上述第卜第2穿通敦置5A'5B係具 備有:下面設置有穿孔器lla之上模具u、及在上下方向 形成有上述穿孔器lla所進入之貫通孔12a的下模具12。 上述上模具11係藉由驅動源13而可驅動於箭號所示之上 下方向。 上述載帶3係自供給捲轴14被送出,並藉由複數個導 概15而變換方向,—部份係沿著上述下模具^上面而以 8 201026179 平行行進的方式被導引捲繞於捲取捲軸16。 又,在供給捲軸14係卷繞有與載帶3重疊之用於保護 载帶3的保護帶17。 上述載帶3與保護帶17係自上述供給捲軸14分離而 被送出,上述保護帶17係與被上述穿通裝置5A、5B所穿 通之TCP4的載帶3 一起被捲繞於上述捲取捲軸16。 接受於一方之上述第丨交付機構6八的7(:][>4係被搬送The punched Tcp4 of the self-loading belt 3 can be alternately supplied to the first delivery mechanism 6A, 6B. As shown in Fig. 2, the second through-pass 5A'5B is provided with a mold u on the lower surface of the punch 11a and a through hole 12a through which the punch 11a is formed in the vertical direction. Lower mold 12. The upper mold 11 is driven by the drive source 13 in the upward direction indicated by the arrow. The carrier tape 3 is fed from the supply reel 14 and is changed in direction by a plurality of guides 15, and the portions are guided and wound around the lower mold die in parallel with 8 201026179. Winding reel 16. Further, a protective tape 17 for protecting the carrier tape 3 which is superposed on the carrier tape 3 is wound around the supply reel 14. The carrier tape 3 and the protective tape 17 are separated from the supply reel 14 and are fed out, and the protective tape 17 is wound around the take-up reel 16 together with the carrier tape 3 of the TCP 4 through which the feedthrough devices 5A and 5B are passed. . 7 (:][>4 is accepted to be transferred to the above-mentioned third delivery agency

第1刀度機構18A,而被設置於該第丨分度機構18A上 之保持頭19所承接。 ★接党於另一方之第1交付機構6B的TCP4係被搬送至 第2分度機構18B,而被設置於該第2分度機構18B上之 保持頭19所承接。 双罘2圖所示,上述第 布ώ /刀'度機稱w ”有刀度D 22 ’其係藉由第1Θ驅動源21而於周方向以如 度間隔間歇地旋轉驅動。在^度台22下面係設置有在周 方向以9〇度間隔之上述保持頭19。 ‘藉此’破上述—對第1交付機構6Α、6Β所搬送之 TCP4 =由各分度機構18Α、18Β之保持心而被吸附保持。 構!^卿4係由第1交付機構6Α、6Β而被交付至分度機 籌8Α、18Β之保持頭19。 19用 77度機構ΜΑ、18Β之保持頭 用以承接TOM之承接位置係如第WA所示。 反方^各分度台22之旋轉方向係為第1 ®箭號所示之相 被上述第1、第2穿通裝置 5A、5B所穿通之TCP4係 201026179 藉由各交付機構6A、6B之各接受具24而被交互地承接。 該接受具24係可驅動地設置於如第2圖箭號所示X方向 上’即’於沿著裝置本體i之前後方向而驅動之χ基台h 上’藉“θ驅動源23成為上下方向…向及成為旋轉The first tool mechanism 18A is received by the holding head 19 provided on the second indexing mechanism 18A. The TCP 4 of the first delivery means 6B of the other party is transported to the second indexing mechanism 18B, and is held by the holding head 19 provided on the second indexing mechanism 18B. As shown in the double 罘 2 diagram, the above-mentioned cloth/knife 'degree machine w' has a tool degree D 22 ' which is intermittently rotationally driven at intervals in the circumferential direction by the first cymbal drive source 21. The holding head 19 is provided at a distance of 9 degrees in the circumferential direction below the table 22. 'By the above', the TCP4 that is transported to the first delivery mechanism 6Α, 6Β = is maintained by each indexing mechanism 18Α, 18Β It is held by the heart. The structure is delivered to the holding head of the indexing machine 6Α, 18Β by the first delivery mechanism 6Α, 6Β. 19 The 77-degree mechanism ΜΑ, 18Β holding head is used to undertake The position of the TOM is as shown in Fig. WA. The direction of rotation of each of the indexing tables 22 is the TCP4 series 201026179 through which the first and second punch-through devices 5A and 5B are inserted. The receiving device 24 is alternately supported by the receiving members 24 of the respective delivery mechanisms 6A, 6B. The receiving device 24 is drivably disposed in the X direction as indicated by the arrows in Fig. 2, i.e., along the device body i. The θ base drive source 29 is driven by the front and rear directions, and the θ drive source 23 is turned up and down.

方向之Θ方向。上述Χ基台25係可移動地設置有沿著X 方向所設置之X導體26,而可藉由未圖示之線性馬達等沿 者上述X導體26驅動。 々心乐1 乂付機構6Α 的镬受具24自第1穿通 裝置5Α接又TCP4 ’係於第}圖箭號乂所示之裝置本體1 的前後方向及«Υ所示之寬度方向上被驅動,保持在上The direction of direction. The cymbal base 25 is movably provided with an X conductor 26 provided along the X direction, and can be driven along the X conductor 26 by a linear motor or the like (not shown).镬心乐1 乂 机构 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Drive, keep on

迷接受具24上面之TCP4的—端部係由“分度機構18A =度基台22下面於周方向上以9。度間隔所設置之4個 :持頭!”’以相對於上述承接位置A所定位之保持頭 下方的方式而定位驅動位置。 同様地,另一方之第1夺朴M 接成楚,、 又付機構诏的接受具24倘若 =⑽’第2分度機構18Β之分度基台& =9。度間隔所設置之4個保持頭19 ^承接位置Α所定位之保持頭19下方的方 =位之接受具24係藉由Ζθ㈣源^驅動於 := 此,保持在接受具24 一係與設置在上述 ^口 22上之保持頭19下面相接觸,於該狀態下,TCP4 '、上述接受具24而被交付至上述保持則9並吸附保持。 倘若TCP4被交躲設置在第卜^分度機構似、 201026179 18B之分度台22上的保持頭19,一對分度台22係藉由上 述第1Θ驅動源21而以第1圖箭號所示之相反方向而分別 以90度角度間歇地旋轉驅動。藉此,吸附保持有TCP4之 各分度台22之保持頭19係以第1圖B所示寸刷洗位置而 定位。 倘若自上述接受具24接受TCP4之保持頭19連同分 度台22 —起於周方向上旋轉驅動90度而定位於刷洗位置 φ B,保持於上述保持頭19之上述TCP4的端子部(未圖示) 係藉由第3圖所示之旋轉刷28而進行刷洗,亦即進行清 潔。藉此,將附著於端子部之塵埃加以去除。又,上述旋 轉刷28係以未圖示之馬達而於箭號R所示之方向旋轉驅 動。 上述旋轉刷28之一部份係浸潰於收容在洗淨容器29 之洗淨液L内。再者,與上述旋轉刷28相對向之部分,即, 分度台22之徑方向外側的部分係由下面開口之箱型蓋子 ® 30所覆蓋。該蓋子係連接有與未圖示之吸引栗相連通之 吸收管30a。藉此,蓋子30之内部環境氣體係可藉由上述 吸引管30a而排出。 上述旋轉刷28、洗淨容器29及蓋子30係載置於載置 台27上。該載置台27係藉由上下驅動源27a而可驅動於 上下方向。 倘若上述載置台27被驅動於上昇方向,且一邊使上述 旋轉刷28於箭號R方向旋轉,而與TCP4之端子部相接觸, 附著於該端子部之塵埃係被去除。已去除之塵埃的一部份 11 201026179 係如箭號s所示飛散於上述蓋子30内,殘餘部份則附著於 旋轉刷28。飛散於蓋子30内之塵埃係藉由吸引管施而加 以吸引排出,附著於旋轉刷28之塵埃則藉由 之洗淨液L加以洗淨去除。 ° 因此’即使附著於TCP4之端子部的塵埃係藉由旋轉 刷而去除,亦可大賴少自上述端子部所去除之塵埃浮 游於裝置本體1内部的比例。 倘若藉由旋轉刷28進行TCP4<端子㈣清潔,保持 有韓亥測之保持頭19係連同分度台22一 ㈣驅動90度’而定位第1KC所示之黏貼位置。 定位於黏貼位置CUCP4係藉由^、第2黏貼裝置 之於盘祕上述TCP4 6清潔之端子部上,貼如後述 異方叫_ 與第1、第2穿通裝置认、沾相同,上述 为度機構18A、18B以及第卜第2黏貼 :對一之寬度方向—二= 第1、第2分度機構18A、18B係配置比第】 =置5A、5B於裝置本體】之寬度方向更外側了第了、 黏貼裝置31A、31B係比第〗、第2分度機構^、· 置於寬度方向更外側。 如第2圖所示,上述第卜第2黏貼裝置31八、MR 具有配置在靠近裝置本體丨内之底面下部的供給掩細/系 12 201026179 在該供給捲軸34上,上述黏著帶32係被黏貼於離型帶35 之一侧面上而被捲繞。 黏貼在離型帶35之一側面上之上述黏著帶32係自上 述供給捲軸34沿著帶板狀之支撲塊33之板面而於上方約 略垂直地被拉出,藉由第1導輥36,黏著帶32係以朝上的 方式而變換成水平方向行進。 如第4圖所示,於上述黏著帶32與上述支撐塊33相 & 對向而垂直行進之部分中,藉由構成切斷機構37之驅動源 37a ’使具有雙刀之裁切器37b如箭號所示驅動於接近黏著 帶32之方向,藉此,於該黏著帶32上形成指定間隔之2 條切斷線32a。又,在黏貼有黏著帶32之離型帶35未被裁 切器37b切斷下,設定上述裁切器37b之裁切量。 因上述黏著帶32之2條切斷線32a而與其他部分呈分 離之部分’即,取出部分32b係藉由配置比切斷機構37更 上方之取出機構39而被取出。藉此,黏著帶32係分離為 • 指定長度,即’對應TCP4之長度。 上述取出機構39係具有驅動源39a、藉由該驅動源39a 而於接離上述黏著帶32之方向上驅動之推壓部39b、及藉 由該推壓部39b而被推壓於上述取出部分32b之去除帶4〇。 由於去除帶40之一部份係藉由蒸氣推壓部39b而被推 壓於黏著帶32之取出部分32b,因此,該取出部分32b係 被黏貼於去除帶40而被去除。又,去除帶4〇係自未圖示 之供給捲轴而被送出,並藉由同樣未圖示之捲取捲軸而捲 繞每一指定長度。 13 201026179 如第2圖所示,藉由上述第1導輕36八魅 *之《帶32係連同離型帶35 一起而變換定長 進,並精由以相對於上述第1導輥36呈指定間 向行 第2導輥41而變換為往下方之方向。B 1配置之 上述離型帶35之上述第1 部分係行進於刪之已咖料^ 2該=間之 持在疋位於上述分度台22之㈣位置c的保 上輪型帶35係藉由未圖示之驅動源 。The end of the TCP4 on the receiving device 24 is defined by the "indexing mechanism 18A = the number of the bases 22 below the circumference of the base station 22 at 9 degrees intervals: holding the head!" 'in relation to the above-mentioned receiving position Position the drive position by the way A is positioned to maintain the underside of the head. At the same time, the other party's first squad M is connected to Chu, and the institution's acceptance is 24 if the =(10)' 2nd division is 18 divisions of the abutment & The four holding heads 19 set in the interval interval ^ The receiving position 24 of the holding position under the holding head 19 positioned by the holding position 24 is driven by the Ζ θ (four) source ^: =, this is maintained in the receiving device 24 The holding head 19 is brought into contact with the lower surface of the holding port 19, and in this state, the TCP 4' and the receiving device 24 are delivered to the holding state 9 and are sucked and held. If the TCP 4 is placed in the holding head 19 provided on the indexing table 22 of the first indexing mechanism, 201026179 18B, the pair of indexing tables 22 are represented by the first first driving source 21 by the first figure arrow. The opposite directions are shown and are intermittently rotationally driven at an angle of 90 degrees. Thereby, the holding head 19 of each of the indexing tables 22 which adsorbs and holds the TCP 4 is positioned by the inch brushing position shown in Fig. 1B. The holding head 19 that receives the TCP 4 from the receiving device 24 is positioned at the brushing position φ B by rotationally driving 90 degrees in the circumferential direction together with the indexing table 22, and is held by the terminal portion of the TCP 4 of the holding head 19 (not shown). The brushing is performed by the rotating brush 28 shown in Fig. 3, that is, cleaning is performed. Thereby, the dust adhering to the terminal portion is removed. Further, the rotary brush 28 is rotationally driven in a direction indicated by an arrow R by a motor (not shown). One of the rotating brushes 28 is immersed in the cleaning liquid L accommodated in the washing container 29. Further, a portion facing the rotating brush 28, that is, a portion in the radial direction of the indexing table 22 is covered by a box cover ® 30 which is opened below. The cover is connected to an absorption tube 30a that communicates with a suction pump (not shown). Thereby, the internal atmosphere system of the cover 30 can be discharged by the above-mentioned suction pipe 30a. The rotating brush 28, the washing container 29, and the lid 30 are placed on the mounting table 27. The mounting table 27 is driven in the vertical direction by the vertical drive source 27a. When the mounting table 27 is driven in the upward direction and the rotating brush 28 is rotated in the direction of the arrow R to come into contact with the terminal portion of the TCP 4, the dust adhering to the terminal portion is removed. A portion of the removed dust 11 201026179 is scattered in the cover 30 as indicated by the arrow s, and the remaining portion is attached to the rotating brush 28. The dust scattered in the lid 30 is sucked and discharged by the suction pipe, and the dust adhering to the rotating brush 28 is washed and removed by the washing liquid L. Therefore, even if the dust adhering to the terminal portion of the TCP 4 is removed by the rotating brush, the ratio of the dust removed from the terminal portion floating inside the device body 1 can be reduced. If the TCP4 <terminal (4) cleaning is performed by the rotary brush 28, the holding head 19 held by the Hankook is held together with the indexing table 22 (four) to drive the 90 degree' position to position the first KC. The CUCP4 is positioned at the bonding position by the ^ and the second bonding device on the terminal portion of the above-mentioned TCP4 6 cleaning device, and is attached to the same as the first and second through devices, and the above is the same. Mechanisms 18A and 18B and second and second stickers: in the width direction of the first pair - two = the first and second indexing mechanisms 18A, 18B are disposed outside the width direction of the device body 5th, 5B, 5B, 5B First, the pasting devices 31A and 31B are placed outside the width direction in the second and second indexing mechanisms. As shown in Fig. 2, the second adhesive device 31 and the MR have a supply mask/system 12 disposed on a lower portion of the bottom surface of the device body, and the adhesive tape 32 is attached to the supply reel 34. Adhered to one side of the release belt 35 and wound. The adhesive tape 32 adhered to one side of the release tape 35 is pulled out from the supply reel 34 along the plate surface of the strip-shaped baffle 33 upwardly and vertically, by the first guide roller. 36. The adhesive tape 32 is changed in a horizontal direction to change in a horizontal direction. As shown in Fig. 4, in the portion where the adhesive tape 32 and the support block 33 are opposed to each other and vertically travel, the cutter 37b having the double knife is formed by the drive source 37a' constituting the cutting mechanism 37. Driven in the direction of the adhesive tape 32 as indicated by the arrow, two cutting lines 32a of a predetermined interval are formed on the adhesive tape 32. Further, when the release belt 35 to which the adhesive tape 32 is adhered is not cut by the cutter 37b, the cutting amount of the cutter 37b is set. The portion which is separated from the other portions by the two cutting lines 32a of the adhesive tape 32, that is, the take-out portion 32b is taken out by the take-out mechanism 39 disposed above the cutting mechanism 37. Thereby, the adhesive tape 32 is separated into a designated length, i.e., corresponding to the length of the TCP 4. The take-out mechanism 39 has a drive source 39a, a pressing portion 39b that is driven in a direction away from the adhesive tape 32 by the drive source 39a, and is pressed against the take-out portion by the pressing portion 39b. The removal of 32b is 4 inches. Since a portion of the removal tape 40 is pressed against the take-out portion 32b of the adhesive tape 32 by the vapor pressing portion 39b, the take-out portion 32b is adhered to the removal tape 40 and removed. Further, the removal tape 4 is fed out from a supply reel (not shown), and is wound around each designated length by a take-up reel (not shown). 13 201026179 As shown in Fig. 2, by the above-mentioned first guide light 36, the "band 32" together with the release belt 35, the length is changed, and the fine guide is specified with respect to the first guide roller 36. The second guide roller 41 is alternately oriented in the downward direction. The first part of the above-mentioned release belt 35 of the B 1 arrangement is carried by the culprits of the culprits 2, which are held at the (four) position c of the indexing table 22 A drive source not shown.

藉由並關2所示上下方向往復驅動之挾持機構動,並 持並以每-指定長度而被間歇地搬送。 破扶 型帶35上之黏著帶32的指定長度處所分斷的部離 挾持機構24而依序定位於已定位在黏貼位置 糸輪由 19的下方。 保持顇The holding mechanism that reciprocates in the up-and-down direction shown by the closing and closing directions 2 is moved and intermittently conveyed for every predetermined length. The portion of the adhesive tape 32 on the breakaway belt 35 that is separated at a specified length is positioned away from the gripping mechanism 24 in order to be positioned below the pick-up position. Keep 顇

上述離型帶35係藉由挾持機構24而被間歇地 倘若以指定長度分離之黏著帶32進行與Tcp4之端子邹, 方相對向之定位(該TCP4係保持在定位於黏貼位置匚2下 持頭19上)’該黏者▼ 32係連同上述離型帶35 一 笔藉由 推昇機構43而於被加熱同時一邊往上推昇,進而加 聲勒貼 於上述TCP4。 上述推昇機構43係具有藉由驅動源44而驅動於上昇 方向驅動之加壓體45。該加壓體45係内貯有成為熱源之加 熱器45a。接著,倘若加壓體45被驅動於上昇方向,該加 壓體45係透過離型帶35而將以指定長度分離之上述黏著 帶32 —邊加熱一邊加壓於上述TCP4之端子部。藉此,黏 14 201026179 著帶32係被勒貼至Tcp4之端子部。又,由於黏著帶η 係因加熱H 45a之加熱而提高黏著性,故可確實地黏貼於 TCP4之端子部。 ❹The release tape 35 is positioned opposite to the terminal of the Tcp4 by the adhesive tape 32 separated by a predetermined length by the holding mechanism 24 (the TCP4 is held in the adhesive position 匚2) The head 19) 'the viscous ▼ 32 series together with the above-mentioned release belt 35 is pushed up by the push-up mechanism 43 while being heated, and is then attached to the above-mentioned TCP 4. The push-up mechanism 43 has a pressurizing body 45 that is driven to drive in the ascending direction by the drive source 44. The pressurizing body 45 stores therein a heater 45a serving as a heat source. Then, when the pressurizing body 45 is driven in the upward direction, the pressurizing body 45 is transmitted through the release belt 35 to pressurize the adhesive tape 32 separated by a predetermined length to the terminal portion of the TCP 4 while heating. Thereby, the adhesive tape of 2010-26179 is attached to the terminal portion of Tcp4. Further, since the adhesive tape η is heated by heating H 45a to improve the adhesion, it can be reliably adhered to the terminal portion of the TCP 4 . ❹

倘若黏著帶32被黏貼於Tcp4,係藉由未圖示之離型 輥而使離型帶3自黏著帶32剥離。剝離後,分度台22係 進步被旋轉9〇度。藉此,保持有TCP4(黏貼有黏著帶切 之保持頭19係定位於第1 w D所示之交付位置。與此同 時’t離型帶35係藉由挾持機構42而被搬送,於黏著帶32 定長度處所刀斷之新的部分係^位與黏貼位置c之 TCP4相對向之位置。 又,離型帶35之黏著帶32被黏貼去 除之部分係收納於回收容芎46 黏貼有黏者帶32通令& > 疋位於交付位置D之TCP4係藉由 一對第2交付機構51八、 盖 — 51B而分別被交付至作為安裝機 攝之一對安裝頭53。 又,從一對第2交彳+Λ 付機構51Λ、51Β到一對安裝頭53 之TCP4的交付係先進 ., 丁從—對第2交付機構51Α、51Β之 一方相對於一對安裴頭 ^ 方相對於另-方之安卜 方的交付後,再進行從另— 於—制_ 、領53的交付。亦即,TCP4係相對 於對文裝頭53而交互地被交付。 如第5圖所示,上 .vu ^ ν _ 地第2交付機構51Α、51Β係具有 ^口者Χ方向而配置之’ 可動骷《 , 導弓丨件5S。在該X導引件55中, 了動體%係、藉由未圖 S'驅動源而可驅動地設置。在該可 動體56中,係設置有 鉦〇 " %動源57。該Z驅動源57之驅動 軸5%係驅動於為上下 勒 向之Z方向,在其先端係安震有 15 201026179 側面形狀為L字狀的接受具54。 接雙具54係藉由上述可動體5“驅動於y 上面(吸附面)係以與吸附保持在定位於上述交付位署°n、 保持碩19的TCP4未黏貼有 之 的方式而定位。 雜者帶32之另-端部相對向 吸附上述TCP4之另—端部的下面。在此同時,;咖係When the adhesive tape 32 is adhered to the Tcp 4, the release tape 3 is peeled off from the adhesive tape 32 by a release roll (not shown). After the peeling, the indexing table 22 is rotated by 9 degrees. Thereby, the TCP 4 is held (the holding head 19 to which the adhesive tape is stuck is positioned at the delivery position indicated by the first w D. At the same time, the 't release tape 35 is conveyed by the holding mechanism 42 to adhere thereto. The position of the new part with the cutting length of 32 is opposite to the position of TCP4 of the pasting position c. Moreover, the part of the adhesive tape 32 of the release tape 35 is removed and stored in the recycling capacity 46. The TCP4, which is located at the delivery position D, is delivered to the mounting head 53 as a mounting machine by a pair of second delivery mechanisms 51 VIII and _ 51B. The delivery of TCP4 to the second switch +Λ payment mechanism 51Λ, 51Β to a pair of mounting heads 53 is advanced. Ding from the second delivery mechanism 51Α, 51Β relative to the pair of Anzhen heads After the delivery of the other party, the delivery from the other system, the collar 53 is carried out. That is, the TCP 4 is delivered interactively with respect to the document head 53. As shown in Fig. 5. , on the .vu ^ ν _ the second delivery agency 51Α, 51Β has the direction of the mouth and the direction of the 'movable 骷', guide In the X guide 55, the movable body % is movably provided by a driving source not shown in Fig. S. In the movable body 56, a 钲〇 " % source is provided 57. The drive shaft of the Z drive source 57 is driven in the Z direction for the up and down direction, and the front end is provided with an impact device 54 having a side shape of an L-shaped shape. The movable body 5 is "driven on the upper surface of the y (adsorption surface) so as to be positioned so as not to be adhered to the TCP 4 positioned at the delivery position and maintained at the delivery position. The opposite part adsorbs the lower end of the other end of the TCP 4. At the same time, the coffee system

除藉由保持頭19之吸附保持。藉此,TCP4係自分声: 之保持頭19而被交付至接受具54。 又〇It is retained by the adsorption of the holding head 19. Thereby, the TCP 4 is delivered to the receiving tool 54 by the holding head 19 . Also

右已接t TCP4之接受具54往下降,可動體56 被驅動於第5圖箭號X所示方向,而定位於虛線所示之, 置。藉此,接受具54係、以與其移動方向上方待機之上述 襄頭53 了方相對向的方式而定位。安裝頭μ係藉 X Υ·ζ·θ驅動源58而可驅動於χ、γ、ζ、及θ方向 倘若上述接受具54定位於上述安裝頭53下方,安』 頭53係往下降方向被驅動,而對吸附保持在接受具μ ^ TCP4點貼有黏著帶32之—端部上面進行吸附。在此同時 係解除藉由上述接受具54之上述Tcp4的吸附狀態。襄 此,TCP4係自上述接受具54而被交付至安裝頭幻。 如第2圖所示,已接受TCP4之安裝頭53係定位於吸 附保持在基台裝置61上面之基板w之上述TCp4所安裝之 側部上方。安裝頭53與基板w係以未圖示之攝影機構進 行攝影,基於自該攝影機構之攝影信號,以上述Tcp4定 位於上述基板W之安裝位置上方的方式而藉由上述 16 201026179 X · Υ · Z · Θ驅動源58相對於χ、γ及0方向驅動。 偶若吸附保持在上述安裝頭53之TCP4定位於基板W 之安裝位置上方,上述安裝頭53係藉由上述χ . γ · ζ · θ 驅動源58而驅動於下降方向。藉此,吸附保持在安裝頭53 之TCP4係被安裝於基板w之側邊部上。 藉由如此進行,如第1圖虛線所示,黏貼有黏著帶32 之複數個TCP4係以指定間隔而相對於吸附保持在基台裝 置61上面之基板W之側邊部而依序安裝。 於上述裝置本體1内之前端部,一對γ導軌62係沿著 裝置本體1之寬度方向,即,與χ方向垂直之¥方向而鋪 設。上述基台裝置61係可移動地設置於上述γ導執62上, 並藉由未圖示之驅動源而沿著γ導軌62被驅動。 如第1圖所示,在上述裝置本體!之前端部之寬度方 亡的側部上係開口形成供給口 64。在上述基台裝置61 沿著Y導軌62而移動於上述裝置本I之寬度方向的一側 部時’第1圖虛線所示之供給裝置63係自上述供給口 64 而將基板W供給至裝置本體!内之上述基台裝置6ι。 在上述裝置本體1之前端部之寬度方向的另一端部上 係開口形成排出口 66。在上述基台裝置61沿著Y導軌a 而移動於上述裝置本體1之寬度方向的另-側部時,第! 圖虛線所示之排出裝置65係自上述排出口 66而進入裝置 本^内’並將上述基台裝置61之基板w,即,於側邊部 上安裝有複數個TCP4之基板W予以搬出。 如第6圖所示,在與上述裝置本體i之兩侧部之上述 17 201026179 供給口 64與排出口 66之上邊相對向的部位係設置有擴及 寬度方向全長而作為氣體喷射機構之噴嘴體67。在喷嘴體 67上,複數個喷射喷嘴68係以指定間隔被設置,藉由該等 喷射喷嘴68所喷射之潔淨的氣體而於上述供給口 64與排 出口 66形成氣幕。藉此,係防止含有塵埃之外氣自裝置本 體1外部進入内部。 如第1圖所示,上述裝置本體1之中央部係形成被一 對穿通裝置5A、5B、一對分度機構18A、18B及基台裝置 61所包圍之空間部71。如第7圖所示,該空間部71係貫 通擴及裝置本體1之上下方向全長。 與上述空間部71相對向之上述裝置本體1的頂部係設 置有送氣單元72。如第2圖所示,該送氣單元72係具有内 貯有HEPA過濾器73及送氣扇74之殼體75,被HEPA過 濾器73所潔淨化之無塵室内的氣體(空氣)係藉由送氣扇74 而以指定的流速自形成在上述殼體75之下端面之吹出口 76供給至裝置本體1内。 上述吹出口 76係沿著裝置本體1之寬度方向(Y方向) 而細長地形成。藉此,自上述吹出口 76供給至裝置本體1 内之氣體(以第7圖空心箭號Μ表示)係沿著設置在裝置本 體1内之一對穿通裝置5Α、5Β,即,上下一對之模具11、 12而可自上方流動至下方。 在與上述空間部71相對向之上述裝置本體1的底部係 設置有與上述送氣單元72構成塵埃去除機構之排氣單元 77。如第2圖所示,該排氣單元77係設置有用於將殼體78 201026179 内自上述送氣單元72供給至裝置本體1之空間部71的氣 體吸引並排出的排氣扇79,被該排氣扇79所吸引之裝置本 體1内的氣體係自下面的排氣口 80排出至外部。 倘若自上述送氣單元72所供給之氣體係以指定的速度 而流動於上述空間部71内,並自排氣單元77排出,藉由 該氣體的流動,係於裝置本體1内產生朝向流經上述空間 部71之氣體的吸引力。藉由吸引力所產生之氣流係以第7 圖之箭號N表示。 將自上述送氣單元72吐出且自排氣單元77所排出之 氣流作為主流,藉由該主流之吸引力,裝置本體1内之環 境氣體朝向上述主流的流動則稱為誘導流。 藉此,於上述裝置本體1内之上下一對模具11、12而 於穿通來自載帶3之TCP4時所產生的塵埃、於上述一對 分度台22而藉由旋轉刷28自TCP4所去除之塵埃,或是 裝置本體1内之各種驅動部分所產生之塵埃等等之於裝置 本體1内因種種原因所產生之塵埃係藉由於上下方向流經 上述空間部71之主流Μ及因主流Μ之吸引力所產生之誘 導流Ν而自排氣單元77排出至外部。亦即,藉由將塵埃集 中於裝置本體1内之中心部,可防止塵埃擴散而附著於其 他裝置。 如第1圖所示,在上述裝置本體1之周壁中,例如寬 度方向之兩側壁上形成開口部81。各開口部81係設置有過 濾器82。倘若於上述裝置本體1之空間部71流動氣體,並 藉由該氣流Μ產生吸引力,藉由該吸引力,裝置本體1之 19 201026179 外部氣體係於上述過濾器82被淨化而導入裝置本體1内。 倘若於裝置本體1之側壁設置過濾器82,而藉由流經 空間部71之主流Μ產生吸引力時,藉由該吸引力,於裝 置本體1内係容易產生朝向上述空間部71之誘導流Ν。亦 即,藉由主流Μ之吸引力所生成之誘導流Ν的流量將增 大。藉此,裝置本體1内所產生之塵埃係變得容易被捲入 流經上述空間部71之氣流(主流Μ與誘導流Ν)。 換言之,即使於裝置本體1内因種種原因產生塵埃, 該塵埃亦不會浮游於裝置本體1内,而變得容易藉由流經 空間部71之主流Μ與誘導流Ν而排出至外部。再者,藉 由吸引力,自過濾器82係導入已淨化之氣體。 藉此,係防止裝置本體1内所產生之塵埃附著於自第 1、第2黏貼裝置31Α、31Β之供給捲軸34所送出之黏著 帶32、自第1、第2黏貼裝置31Α、31Β而黏貼於TCP4 之黏著帶32,或保持在基台裝置61上之基板W上面等等。 而且,以淨化之氣體使塵埃流動,而可經常保持清潔的狀 態。 依據上述構成之安裝裝置,裝置本體1内係配置有用 於來自載帶3穿通TCP4而產生塵埃之第1、第2穿通裝置 5Α、5Β、及將於指定長處分斷之黏著帶32黏貼於TCP4 之端子部前,以旋轉刷28清潔該端子部而產生塵埃之第 1、第2分度機構18Α、18Β、甚或可能產生塵埃之虞的種 種驅動機構。 另一方面,於裝置本體1内之中心部,係形成貫通上 201026179 下方向全長之空間部71,以自該空間部71之上方朝向下 方,使主流Μ流動。 為此,藉由流經上述空間部71之主流Μ,在裝置本體 1内係產生朝向上述空間部71之吸引力,由於藉由該吸引 力,係產生朝向主流Μ之誘導流Ν,在裝置本體1内所產 生之塵埃係藉由誘導流而自裝置本體1内之周邊部朝向中 心部流動,該誘導流Ν係與在上下方向流經中心部之空間 部71的主流Μ會流,而自排氣單元77排出至外部。 亦即,即使於裝置本體1内產生塵埃,由於該塵埃係 朝向空間部71流動,而自該空間部71排出至外部,可防 止在裝置本體1内所產生之塵埃附著於黏著帶32或基板W 上,進而防止因塵埃存在於基板W與安裝於該基板W之 TCP4間所導致之TCP4的安裝不良。 倘若於裝置本體1之兩側壁設置過濾器82,藉由流經 空間部71之主流Μ產生吸引力,於藉由該吸引力所生成 之誘導流Ν係透過上述過濾器82使裝置本體1之外部氣體 流入,而與流經空間部71之主流Μ會流。 亦即,倘若藉由流經空間部71之主流Μ產生吸引力, 由於藉由該吸引力所生成之誘導流Ν的流量將大幅增加, 該誘導流Ν係自裝置本體1内之周邊部朝向中心部流動, 而有使裝置本體1内浮遊之塵埃成為容易通過上述空間部 71而排出至外部。 用於清潔TCP4之端子部的旋轉刷28係被連接於吸引 管30a之蓋子30所覆蓋。為此,即使因旋轉刷28清潔TCP4 21 201026179 而產生塵埃,塵埃的一部份係自蓋子30内部被吸引至吸引 管30a而排出。因此,即使因為旋轉刷28之清潔作用而產 生塵埃,可使塵埃浮游於裝置本體1内的量減少。 旋轉刷28之一部份係浸潰於洗淨容器29之洗淨液L 内。為此,即使自TCP4所去除之塵埃的一部份附著於旋 轉刷28,由於塵埃可藉由洗淨液L而洗淨去除,藉此,亦 可減少自旋轉刷28而飛散浮游於裝置本體1内之塵埃。 第8圖係顯示本發明之另一實施形態。於該實施形態 中,於塵埃去除機構之送氣單元72係連衔有作為分歧機構 之一對分歧管85。各分歧管85之先端係與第1、第2黏貼 裝置31A、31B之側邊,亦即,位於裝置本體1之寬度方 向内側位置之一側部相對向的方式而配置。 藉此,自送氣單元72所流出之氣體的一部份係流經上 述分歧管85,而如第8圖R所示,自該分歧管85係沿著 一對黏貼裝置31A、31B之寬度方向内側而流動。 倘若氣流R沿著黏貼裝置31A、31B之寬度方向内側 而由上方往下方流動,由於藉由該氣流R,係產生第8圖R 所示之自黏貼裝置31A、31B之寬度方向另一側朝向一側 之氣流,因此,藉由該氣流R,可防止浮游於黏貼裝置31A、 31B附近之塵埃附著於黏貼帶32上。 亦即,雖然設置於黏貼裝置31A、31B之黏著帶32係 容易附著塵埃,自送氣單元72所流出之氣體的一部分係經 分歧管85分歧,而沿著黏貼裝置3ΙΑ、31B之側邊流動, 藉此,可防止塵埃附著於黏著帶32上。 201026179 亦即,於塵埃容易附著之裝置,即,第1、第2黏貼裝 置31A、31B附近,使自送氣單元72所吐出之主流Μ分歧 而流動。為此,由於塵埃係藉由被分歧之氣體的流動所吸 引而防止被擴散,故可更確實地防止塵埃附著於第1、第2 黏貼裝置31Α、31Β。再者,由於主流Μ係被淨化,藉此, 亦可維持第1、第2黏貼裝置31Α、31Β的清潔。 在上述一實施形態中,雖然於裝置本體内,穿通裝置、 分度機構、黏貼裝置等等係分別左右對稱,即,一對2組 的設置,然而,因應安裝TCP之基板的大小,穿通裝置、 分度機構、黏貼裝置等等亦可非為1組,在該情況下亦可 適用本發明。 [:圖式簡單說明3 第1圖係顯示本發明一實施形態之安裝裝置之内部構 造的橫斷面圖。 第2圖係顯示安裝裝置之内部構造的縱斷面圖。 第3圖係顯示保持在保持頭之TCP位在刷洗位置之清 潔狀態的側面圖。 第4圖係顯示將自供給捲軸黏貼至離型帶而送出之黏 著帶於指定長度予以分斷之狀態的側面圖。 第5圖係顯示在交付位置將黏貼有黏著帶之TCP交付 至安裝頭之狀態的侧面圖。 第6圖係形成有裝置本體之側壁之供給口與排出口之 部分的正面圖。 第7圖係顯示於裝置本體内之空間部流動氣體時所產 23 201026179 生之氣流的説明圖。 第8圖係顯示於本發明另一實施形態之裝置本體内之 空間部流動氣體時所產生之氣流的説明圖。 【主要元件符號說明】 1 裝置本體 21 第1Θ驅動源 2 突出部 22 分度台 3 載帶 23 ΖΘ驅動源 4 TCP(電子零件) 24 接受具 5A 第1穿通裝置 25 X基台 5B 第2穿通裝置 26 X導體 6A 第1交付機構 27 載置台 6B 第1交付機構 27a 上下驅動源 11 上模具 28 旋轉刷 11a 穿孔器 29 洗淨容器 12 下模具 30 蓋子 12a 貫通孔 30a 吸引管 13 驅動源 31A 第1黏貼裝置 14 供給捲軸 31B 第2黏貼裝置 15 導輥 32 黏著帶 16 捲取捲轴 32a 切斷線 17 保護帶 32b 取出部分 18A 第1分度機構 33 支撐塊 18B 第2分度機構 34 供給捲軸 19 保持頭 35 離型帶The receiving member 54 of the right TCP 4 is lowered, and the movable body 56 is driven in the direction indicated by the arrow X in FIG. 5, and is positioned at the position indicated by the broken line. Thereby, the 54-piece system is received and positioned so as to face the above-mentioned hoe 53 which is waiting in the moving direction. The mounting head μ is driven by the X Υ·ζ·θ driving source 58 and can be driven in the χ, γ, ζ, and θ directions. If the receiving member 54 is positioned below the mounting head 53, the head 53 is driven in the descending direction. The adsorption is maintained on the end of the end of the adhesive tape 32 with the μ ^ TCP 4 point attached. At the same time, the adsorption state of the above Tcp4 by the receiving means 54 is released.襄 Thus, TCP4 is delivered to the installation head from the above-mentioned acceptance tool 54. As shown in Fig. 2, the mounting head 53 that has received the TCP 4 is positioned above the side portion to which the TCp 4 to which the substrate w held on the base device 61 is attached is attached. The mounting head 53 and the substrate w are imaged by an imaging unit (not shown), and the above-mentioned Tcp4 is positioned above the mounting position of the substrate W based on the imaging signal from the imaging unit, and the above-mentioned 16 201026179 X · Υ Z · Θ drive source 58 is driven in the χ, γ, and 0 directions. Even if the suction is held by the TCP 4 of the mounting head 53 positioned above the mounting position of the substrate W, the mounting head 53 is driven in the descending direction by the ?? γ · θ · θ driving source 58. Thereby, the TCP 4 which is adsorbed and held by the mounting head 53 is attached to the side portion of the substrate w. By doing so, as shown by the broken line in Fig. 1, a plurality of TCPs 4 to which the adhesive tape 32 is adhered are sequentially attached to the side portions of the substrate W which are held by the base device 61 at a predetermined interval. At the front end portion of the apparatus main body 1, a pair of γ rails 62 are laid along the width direction of the apparatus main body 1, i.e., in the direction of the ¥ perpendicular to the χ direction. The base device 61 is movably provided on the gamma guide 62, and is driven along the γ rail 62 by a drive source (not shown). As shown in Figure 1, the above device body! The side opening on the side of the width of the front end forms a supply port 64. When the base unit 61 moves along the Y rail 62 to the one side in the width direction of the apparatus I, the supply unit 63 indicated by a broken line in the first drawing supplies the substrate W from the supply port 64 to the apparatus. Ontology! The above-mentioned base station device 6i. The other end portion in the width direction of the front end portion of the apparatus body 1 is formed with an opening to form a discharge port 66. When the base device 61 moves along the Y rail a along the other side in the width direction of the apparatus body 1, the first! The discharge device 65 shown by the dotted line enters the device from the discharge port 66, and the substrate w of the base device 61, that is, the substrate W on which a plurality of TCPs 4 are attached to the side portions, is carried out. As shown in Fig. 6, a nozzle body which is a gas jetting mechanism is provided at a portion facing the upper side of the 17 201026179 supply port 64 and the discharge port 66 on both side portions of the apparatus main body i. 67. On the nozzle body 67, a plurality of injection nozzles 68 are provided at predetermined intervals, and a clean gas which is ejected by the injection nozzles 68 forms a gas curtain at the supply port 64 and the discharge port 66. Thereby, it is prevented that air other than dust enters the inside from the outside of the apparatus body 1. As shown in Fig. 1, the central portion of the apparatus main body 1 is formed with a space portion 71 surrounded by a pair of feedthrough devices 5A, 5B, a pair of indexing mechanisms 18A, 18B, and a base device 61. As shown in Fig. 7, the space portion 71 is continuously expanded and extended to the entire length of the apparatus body 1 in the vertical direction. An air supply unit 72 is provided to the top of the apparatus main body 1 so as to face the space portion 71. As shown in Fig. 2, the air supply unit 72 has a casing 75 in which a HEPA filter 73 and an air supply fan 74 are stored, and the gas (air) in the clean room cleaned by the HEPA filter 73 is supplied by air. The fan 74 is supplied into the apparatus body 1 from the air outlet 76 formed at the lower end surface of the casing 75 at a prescribed flow rate. The air outlet 76 is formed to be elongated in the width direction (Y direction) of the apparatus main body 1. Thereby, the gas supplied from the air outlet 76 into the apparatus body 1 (indicated by the hollow arrow 第 in FIG. 7) is along a pair of feedthroughs 5Α, 5Β disposed in the apparatus body 1, that is, a pair of upper and lower The molds 11, 12 can flow from above to below. An exhaust unit 77 that forms a dust removing mechanism with the air supply unit 72 is provided at a bottom portion of the apparatus main body 1 facing the space portion 71. As shown in Fig. 2, the exhaust unit 77 is provided with an exhaust fan 79 for sucking and discharging the gas supplied from the air supply unit 72 to the space portion 71 of the apparatus main body 1 in the casing 78 201026179, and is exhausted. The gas system in the apparatus body 1 sucked by the air fan 79 is discharged to the outside from the lower exhaust port 80. When the gas system supplied from the air supply unit 72 flows into the space portion 71 at a predetermined speed and is discharged from the air exhaust unit 77, the flow of the gas is generated in the apparatus body 1 to flow through the above-mentioned manner. The attraction of the gas in the space portion 71. The airflow generated by the attraction is indicated by the arrow N of Fig. 7. The flow of air discharged from the air supply unit 72 and discharged from the exhaust unit 77 is used as a main flow, and the flow of the ambient gas in the apparatus main body 1 toward the main flow is referred to as an induced flow by the attraction force of the main flow. Thereby, the dust generated when the pair of the molds 11 and 12 in the apparatus main body 1 passes through the TCP 4 from the carrier tape 3 is removed from the TCP 4 by the rotating brush 28 on the pair of indexing stages 22. The dust generated by the various driving portions in the apparatus body 1 or the like generated in the apparatus body 1 due to various reasons is mainly caused by the flow of the space portion 71 in the vertical direction and the main stream. The induced flow generated by the attraction is discharged from the exhaust unit 77 to the outside. That is, by collecting dust in the center portion of the apparatus body 1, it is possible to prevent dust from spreading and adhering to other devices. As shown in Fig. 1, in the peripheral wall of the apparatus main body 1, for example, opening portions 81 are formed on both side walls in the width direction. Each of the openings 81 is provided with a filter 82. If the gas flows through the space portion 71 of the apparatus body 1 and the suction force is generated by the air flow, the external air system of the apparatus body 1 is purified by the filter 82 and introduced into the apparatus body 1 by the suction force. Inside. If the filter 82 is provided on the side wall of the apparatus body 1 and the attraction force is generated by the main flow passing through the space portion 71, the induced flow toward the space portion 71 is easily generated in the apparatus body 1 by the suction force. Hey. That is, the flow of induced flow generated by the attraction of the mainstream will increase. Thereby, the dust generated in the apparatus main body 1 is easily caught in the airflow (mainstream enthalpy and induced flow) flowing through the space portion 71. In other words, even if dust is generated in the apparatus main body 1 for various reasons, the dust does not float in the apparatus main body 1 and is easily discharged to the outside by flowing through the main flow and the induced flow of the space portion 71. Further, the purified gas is introduced from the filter 82 by the attraction. By this, it is possible to prevent the dust generated in the apparatus main body 1 from adhering to the adhesive tape 32 fed from the supply reel 34 of the first and second adhesive devices 31, 31, and pasting from the first and second adhesive devices 31, 31, 31. The adhesive tape 32 on the TCP 4, or the substrate W held on the base device 61, and the like. Moreover, the cleaned gas is used to keep the dust flowing, and can always be kept clean. According to the mounting device having the above configuration, the first and second punch-through devices 5Α and 5Β for generating dust from the carrier tape 3 through the TCP 4 are disposed in the device main body 1, and the adhesive tape 32 which is to be separated at the designated length is attached to the TCP 4 Before the terminal portion, the first and second indexing mechanisms 18A, 18A, or even the dust that may generate dust are generated by the rotating brush 28 to clean the terminal portion. On the other hand, in the center portion of the apparatus main body 1, a space portion 71 that penetrates the entire length in the downward direction of 201026179 is formed, and the main flow Μ flows from the upper side of the space portion 71 toward the lower side. Therefore, by flowing through the main flow of the space portion 71, the attraction force toward the space portion 71 is generated in the apparatus main body 1, and the attraction force is generated by the suction force toward the main flow. The dust generated in the main body 1 flows from the peripheral portion in the apparatus main body 1 toward the center portion by the induced flow, and the induced flow system flows in the main flow of the space portion 71 flowing through the center portion in the vertical direction. The exhaust unit 77 is discharged to the outside. In other words, even if dust is generated in the apparatus main body 1, since the dust flows toward the space portion 71 and is discharged to the outside from the space portion 71, dust generated in the apparatus main body 1 can be prevented from adhering to the adhesive tape 32 or the substrate. In W, the mounting failure of the TCP 4 caused by dust between the substrate W and the TCP 4 mounted on the substrate W is prevented. If the filter 82 is provided on both side walls of the apparatus body 1, the attraction force generated by the main flow passing through the space portion 71 generates an induced flow generated by the suction force, and the apparatus body 1 is passed through the filter 82. The outside air flows in, and flows into the main stream flowing through the space portion 71. That is, if the attraction force is generated by the main flow passing through the space portion 71, since the flow rate of the induced flow generated by the attraction force is greatly increased, the induced flow is directed from the peripheral portion in the apparatus body 1. The center portion flows, and the dust floating in the apparatus main body 1 is easily discharged to the outside through the space portion 71. The rotating brush 28 for cleaning the terminal portion of the TCP 4 is covered by a cover 30 connected to the suction tube 30a. For this reason, even if dust is generated by the cleaning brush 28 cleaning TCP4 21 201026179, a part of the dust is sucked from the inside of the cover 30 to the suction pipe 30a to be discharged. Therefore, even if dust is generated due to the cleaning action of the rotating brush 28, the amount of dust floating in the apparatus body 1 can be reduced. One portion of the rotating brush 28 is immersed in the cleaning liquid L of the washing container 29. Therefore, even if a part of the dust removed from the TCP 4 adheres to the rotating brush 28, since the dust can be washed and removed by the cleaning liquid L, the self-rotating brush 28 can be reduced and floated on the apparatus body. 1 inside the dust. Figure 8 is a view showing another embodiment of the present invention. In this embodiment, the air supply unit 72 of the dust removing means is connected to the branch pipe 85 as one of the branching means. The tip end of each branch pipe 85 is disposed so as to face the side of the first and second pasting devices 31A and 31B, that is, the side of the device body 1 at the inner side in the width direction. Thereby, a part of the gas flowing out from the air supply unit 72 flows through the branch pipe 85, and as shown in FIG. 8R, the branch pipe 85 is along the width direction of the pair of pasting devices 31A, 31B. Flowing inside. If the airflow R flows from the upper side to the lower side along the inner side in the width direction of the pasting devices 31A and 31B, the airflow R generates the other side of the self-adhesive devices 31A and 31B shown in FIG. The air flow on one side, therefore, by the air flow R, dust adhering to the vicinity of the pasting devices 31A, 31B can be prevented from adhering to the adhesive tape 32. That is, although the adhesive tape 32 provided in the pasting devices 31A and 31B is likely to adhere to dust, a part of the gas flowing out from the air supply unit 72 is branched by the branch pipe 85, and flows along the side of the pasting devices 3A and 31B. Thereby, dust can be prevented from adhering to the adhesive tape 32. In other words, in the vicinity of the first and second pasting devices 31A and 31B, the main sputum discharged from the air supply unit 72 flows in a divergent manner. For this reason, since the dust is prevented from being diffused by being absorbed by the flow of the divergent gas, it is possible to more reliably prevent the dust from adhering to the first and second pasting devices 31A and 31B. Further, since the mainstream lanthanum is purified, the cleaning of the first and second pasting devices 31A and 31B can be maintained. In the above embodiment, in the device body, the punching device, the indexing mechanism, the pasting device, and the like are respectively bilaterally symmetrical, that is, a pair of two sets of settings, however, the size of the substrate to which the TCP is mounted, the punch-through device The indexing mechanism, the pasting device, and the like may not be one set, and the present invention is also applicable in this case. [Brief Description of the Drawings] Fig. 1 is a cross-sectional view showing the internal structure of a mounting apparatus according to an embodiment of the present invention. Fig. 2 is a longitudinal sectional view showing the internal structure of the mounting device. Fig. 3 is a side view showing the state in which the TCP bit of the holding head is cleaned at the brushing position. Fig. 4 is a side view showing a state in which the adhesive tape fed from the supply reel to the release tape is separated at a predetermined length. Fig. 5 is a side view showing the state in which the TCP to which the adhesive tape is attached is delivered to the mounting head at the delivery position. Fig. 6 is a front elevational view showing a portion of a supply port and a discharge port of a side wall of the apparatus body. Fig. 7 is an explanatory view showing the flow of the gas produced when the gas flows in the space portion of the apparatus body. Fig. 8 is an explanatory view showing a flow of air generated when a gas flows in a space portion of a device body in another embodiment of the present invention. [Description of main components] 1 Device body 21 1st drive source 2 Projection 22 Index table 3 Carrier tape 23 ΖΘ Drive source 4 TCP (electronic parts) 24 Acceptance tool 5A 1st feedthrough 25 X Base 5B 2nd pass Device 26 X conductor 6A First delivery mechanism 27 Stage 6B First delivery mechanism 27a Upper and lower drive source 11 Upper mold 28 Rotary brush 11a Perforator 29 Wash container 12 Lower mold 30 Cover 12a Through hole 30a Suction tube 13 Drive source 31A 1 Adhesive device 14 Supply reel 31B Second adhesive device 15 Guide roller 32 Adhesive tape 16 Reel reel 32a Cutting line 17 Protective tape 32b Removal portion 18A 1st indexing mechanism 33 Support block 18B 2nd indexing mechanism 34 Supply reel 19 retaining head 35 release belt

24 20102617924 201026179

36 導輥 61 基台裝置 37 切斷機構 62 Y導軌 37a 驅動源 63 供給裝置 37b 裁切器 64 供給口 39 取出機構 65 排出裝置 39a 驅動源 66 排出口 39b 推壓部 67 喷嘴體 40 去除帶 71 空間部 41 導棍 72 送氣單元 42 挾持機構 73 過濾器 43 推昇機構 74 送氣扇 44 驅動源 75 殼體 45 加壓體 76 吹出口 45a 加熱器 77 排氣單元 46 回收容器 78 殼體 51A 第2交付機構 79 排氣扇 51B 第2交付機構 80 排氣口 53 安裝頭(安裝機構) W 基板 58 X · Y · Z . Θ驅動源 2536 guide roller 61 abutment device 37 cutting mechanism 62 Y rail 37a drive source 63 supply device 37b cutter 64 supply port 39 take-out mechanism 65 discharge device 39a drive source 66 discharge port 39b push portion 67 nozzle body 40 removal belt 71 Space portion 41 guide bar 72 air supply unit 42 holding mechanism 73 filter 43 push mechanism 74 air supply fan 44 drive source 75 housing 45 pressurizing body 76 air outlet 45a heater 77 exhaust unit 46 recovery container 78 housing 51A second Delivery mechanism 79 Exhaust fan 51B Second delivery mechanism 80 Exhaust port 53 Mounting head (mounting mechanism) W Substrate 58 X · Y · Z . Θ Drive source 25

Claims (1)

201026179 七、申請專利範圍: 1. -種電子零件之絲裝1,⑽料零件絲於練《 侧邊部者’其特徵在於包含: 裝置本體; 穿通裝置,係設置於該裝置本體之前後方向的一端 部上,並將來自帶狀構件之上述電子零件予以穿通; 交付機構,係接受被該穿通裝置所穿通之上述電子 零件並搬送至指定的位置; 〜分度機構,係具有複數個保持頭,且該等保持頭接 ❿ 受被該交付機構所搬送之電子零件並加以保持; 黏貼裝置’係將黏著帶黏貼於被交付至該分度機構 之保持頭的上述電子零件; · 基台裝置,係設置於上述裝置本體之前後方向的另 . 端部上並接受上述基板而加以定位; 安裝機構,係將以上述黏貼裝置而黏貼有黏著帶之 上述電子零件安裝至藉由該基台裝置所定位之上述基& 上;及 ❹ 塵埃去除機構,係將來自上述裝置本體上部之外部 礼體導入内部並沿著上述穿通裝置而往下方流動,藉由 "亥流動而使產生於上述裝置本體狀塵埃由底部排出。 2·如申请專利範圍第i項之電子零件之安裝裝置,其中上 述塵埃去除機構係由送氣單元與排氣單元所構成,該送 氣單凡係設置於上述裝置本體之上部並將外部氣體導入 &置本體内’而該排氣單元係將經該送氣單元所導入裝 26 201026179 置本體内部之氣體由底部排出至外部。 3. 如申請專利範圍第2項之電子零件之安裝裝置,其中上 述塵埃去除機構係使自上述送氣單元所吐出之氣體經由 上述排氣單元而排出,藉此,使上述裝置本體内產生由 上部往下部之主流,並以該主流所生成之吸引力使上述 裝置本體内產生往上述主流之誘導流。 4. 如申請專利範圍第1項之電子零件之安裝裝置,其中於 上述裝置本體内,於前後方向之一端部上係配置有一對 成左右對稱之穿通裝置,而於裝置本體之前後方向的中 間部,一對分度機構與一對黏貼裝置係以比上述一對穿 通裝置更大的間隔而左右對稱地配置於寬度方向的兩端 部上,且於上述裝置本體之另一端部上,上述基台裝置 係沿著寬度方向而配置,以在上述裝置本體之中心部形 成擴及上下方向全長之空間部;且 上述塵埃去除機構係使上述裝置本體外部之氣體由 上述空間部之上部往向下部流動。 5. 如申請專利範圍第1項之電子零件之安裝裝置,其設置 有分歧機構,係將自上述塵埃去除機構導入裝置本體内 部之氣體的一部份予以分歧,並沿著上述黏貼裝置而流 動。 6. 如申請專利範圍第1項之電子零件之安裝裝置,其中上 述裝置本體之前後方向之另一端部的寬度方向一端上, 係開口形成用於將基板交付至上述基台裝置之供給口, 而另一端上係開口形成將安裝有電子零件之基板自上述 27 201026179 基台裝置搬出的搬出口; 且’於上述供給口與搬出口設置有氣體噴射機構, 該氣體喷射機構係形成用於阻止外部塵埃流人上述 本體内的氣幕。 夏 7.如申請料m圍第丨奴電切件之安隸置,其中於 上述裝置本體之側壁部係、設置有過㈣,該過攄器係藉 由上述塵埃去除機構使外部氣體自裝置本體上部往下部 流動所產生之吸引力將外部氣體導入内部。 8·如申請專圍第丨項之電子零件之钱裝置,其係且 有用於清潔保持在上述分度機構之第Μ持頭上之電; 零件的旋轉刷,紐轉刷係被蓋子職蓋在該蓋子上 ::置有吸引機構,該吸引機構係用於將自上述旋轉刷 飛散至上述蓋子内之塵埃吸引去除。 9.如申請糊範圍第8奴電子零件之絲|置,其係設 置^先淨容器,該洗淨容器係用於收容浸漬上述旋轉刷 清洗自上述電子零件被去除而附著於上述旋 轉刷之塵埃的液體。 H). 一種電子零件之安裝方法,係將電子 側邊部者,其特徵在於包含: 讀於基板之 穿通步驟,係設胁裝置本體之前後 上,並將來自帶狀構件之上述電子零件予以穿 搬送步驟,係接受來自 述電子零件《送至指定的位^之已穿通之上 交付步驟,係衫已搬紅衫位置之電子零件並 28 201026179 父付至分度機構之保持頭; 黏貼步驟’伽黏著帶獅於被交付至上述分度機 構之保持頭的上述電子零件; 女裝步驟,係將黏貼有黏著帶之上述電子零件安袭 於上述基板上,該基板係被保持在設置於上述裝置本體 之前後方向的另一端部上之基台裝置;及 排出步驟,係將上述裝置本體外部之氣體自裝置本 e 體上部導入内部而流向下方,藉由該流動而使產生於上 述裝置本體内之塵埃由上述裝置本體之底部排出。201026179 VII. Patent application scope: 1. - Wire-loading of electronic parts 1. (10) Material parts are used in the "side part" which is characterized by: the device body; the punch-through device is placed in front of the device body The one end portion passes through the electronic component from the strip member; the delivery mechanism accepts the electronic component that is passed through the punchthrough device and transports it to a designated position; the indexing mechanism has a plurality of retaining means a head, and the holding head is connected to and held by the electronic component conveyed by the delivery mechanism; the adhesive device 'adheres the adhesive tape to the electronic component that is delivered to the holding head of the indexing mechanism; The device is disposed on the other end of the device body in a front-rear direction and is received by the substrate; the mounting mechanism is configured to mount the electronic component to which the adhesive tape is adhered by the bonding device to the base The above-mentioned base & and the dust removing mechanism positioned by the device are external objects from the upper part of the device body And downward into the interior and along the through-flow device, by " Hai the flow generating means to the main body shaped dust withdrawn from the bottom. 2. The apparatus for mounting an electronic component according to the invention of claim i, wherein the dust removing mechanism is constituted by an air supply unit and an exhaust unit, and the air supply unit is disposed on the upper portion of the device body and introduces external air into the & The exhaust unit is configured to discharge the gas introduced into the body through the air supply unit from the bottom portion to the outside through the bottom portion. 3. The apparatus for mounting an electronic component according to the second aspect of the invention, wherein the dust removing mechanism discharges the gas discharged from the air supply unit through the exhaust unit, thereby causing the upper portion of the device body to be generated from the upper portion To the lower part of the mainstream, and with the attraction generated by the mainstream, the induced flow to the above-mentioned mainstream is generated in the apparatus body. 4. The mounting device for an electronic component according to the first aspect of the invention, wherein in the device body, a pair of left and right symmetrical through devices are disposed at one end of the front and rear direction, and the middle of the device body is in the front and rear directions. a pair of indexing means and a pair of pasting means disposed at both ends of the width direction symmetrically at a larger interval than the pair of feedthrough means, and at the other end of the apparatus body, The base device is disposed along the width direction to form a space portion extending in the vertical direction in the center portion of the apparatus body, and the dust removing mechanism causes the gas outside the device body to pass from the upper portion of the space portion The lower part flows. 5. The mounting device for an electronic component according to claim 1 is provided with a branching mechanism for diverging a portion of the gas introduced from the dust removing mechanism into the body of the device and flowing along the bonding device . 6. The mounting device for an electronic component according to claim 1, wherein the opening of the other end portion of the device body in the front-rear direction is formed at a supply port for delivering the substrate to the base device, And the other end opening forms a transfer port for carrying the substrate on which the electronic component is mounted from the above-mentioned 27 201026179 base device; and 'the gas supply mechanism is formed at the supply port and the transfer port, and the gas injection mechanism is formed to block The external dust flows into the air curtain of the above body. Xia 7. If the application is made, the side wall of the device body is provided with a fourth (4), and the filter is made by the dust removal mechanism to make the external gas from the device. The attraction generated by the upper portion flowing to the lower portion introduces external air into the interior. 8. If you apply for the money device for the electronic parts of the third item, it is used to clean and hold the electricity on the first holding head of the above-mentioned indexing mechanism; the rotating brush of the part, the button is covered by the cover The cover is provided with a suction mechanism for attracting and removing dust scattered from the rotating brush into the cover. 9. If the application of the paste range of the 8th slave electronic component wire|position is set, the first clean container is used for accommodating the above-mentioned rotary brush, and the electronic component is removed and attached to the rotary brush. Dust liquid. H). A method of mounting an electronic component, wherein the electronic side portion comprises: a step of inserting the substrate, a front and a rear of the body of the device, and the electronic component from the ribbon member The step of carrying and carrying is to receive the electronic component "send to the specified position ^ has been delivered through the delivery step, the shirt has been moved to the red shirt position of the electronic parts and 28 201026179 father paid to the indexing mechanism of the holding head; a gamma-coated lion in which the above-mentioned electronic component is delivered to the holding head of the above-mentioned indexing mechanism; the women's step is to attach the above-mentioned electronic component to which the adhesive tape is adhered to the substrate, and the substrate is held in the setting a base device on the other end portion of the device body in the front-rear direction; and a discharging step of introducing a gas outside the device body into the inside from the upper portion of the device body to flow downward, and the flow is generated in the device The dust in the body is discharged from the bottom of the apparatus body. 2929
TW098127097A 2008-09-29 2009-08-12 Installation and installation method of electronic parts (1) TWI462664B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008250516A JP5173708B2 (en) 2008-09-29 2008-09-29 Electronic component mounting apparatus and mounting method

Publications (2)

Publication Number Publication Date
TW201026179A true TW201026179A (en) 2010-07-01
TWI462664B TWI462664B (en) 2014-11-21

Family

ID=42059589

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098127097A TWI462664B (en) 2008-09-29 2009-08-12 Installation and installation method of electronic parts (1)

Country Status (5)

Country Link
JP (1) JP5173708B2 (en)
KR (1) KR101223896B1 (en)
CN (1) CN102165858B (en)
TW (1) TWI462664B (en)
WO (1) WO2010035582A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012033612A (en) * 2010-07-29 2012-02-16 Hitachi High-Technologies Corp Fpd module assembly apparatus
JP5702110B2 (en) * 2010-10-26 2015-04-15 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method
JP5650983B2 (en) * 2010-10-26 2015-01-07 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method
CN104206046B (en) * 2012-04-09 2017-03-15 富士机械制造株式会社 Mounting head cleaning device
JP5996241B2 (en) * 2012-04-12 2016-09-21 デクセリアルズ株式会社 Adhesive film sticking device, adhesive film sticking method, and connection structure
JP6045837B2 (en) * 2012-07-26 2016-12-14 日東電工株式会社 Semiconductor wafer mounting method and semiconductor wafer mounting apparatus
WO2014147733A1 (en) * 2013-03-19 2014-09-25 富士機械製造株式会社 Component mounting machine
JP6155467B2 (en) * 2013-09-18 2017-07-05 パナソニックIpマネジメント株式会社 Component mounter
CN107432115B (en) * 2015-04-10 2020-06-30 株式会社富士 Component mounting machine
TWI567011B (en) * 2016-06-15 2017-01-21 All Ring Tech Co Ltd Method and device for conveying the components of the bonding process
CN107322685A (en) * 2017-07-04 2017-11-07 深圳市联得自动化装备股份有限公司 Chip on film automatic cutting equipment
JP6820809B2 (en) * 2017-07-27 2021-01-27 三菱電機株式会社 How to make chip mounters, electronic circuit boards, and power modules

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2956312B2 (en) * 1991-10-14 1999-10-04 松下電器産業株式会社 Punching device for electronic parts with guard
JP4011843B2 (en) * 2000-09-18 2007-11-21 芝浦メカトロニクス株式会社 Component mounting apparatus and component delivery method used in the apparatus
JP4262903B2 (en) * 2001-04-11 2009-05-13 芝浦メカトロニクス株式会社 Component mounting apparatus and method
JP2003164652A (en) * 2001-11-30 2003-06-10 Heiwa Corp Exhaust fan device
JP2004214574A (en) * 2003-01-09 2004-07-29 Renesas Technology Corp Inner lead bonding apparatus having humidity adjusting function
JP4680704B2 (en) * 2005-07-19 2011-05-11 パナソニック株式会社 Substrate cleaning device and substrate transfer device
JP4598124B2 (en) * 2006-05-30 2010-12-15 平田機工株式会社 Automatic work device
JP4819602B2 (en) * 2006-07-05 2011-11-24 パナソニック株式会社 ACF sticking device and ACF sticking method
JP5046253B2 (en) * 2007-02-22 2012-10-10 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method

Also Published As

Publication number Publication date
TWI462664B (en) 2014-11-21
KR101223896B1 (en) 2013-01-17
KR20110081825A (en) 2011-07-14
WO2010035582A1 (en) 2010-04-01
CN102165858A (en) 2011-08-24
JP2010080874A (en) 2010-04-08
JP5173708B2 (en) 2013-04-03
CN102165858B (en) 2014-11-12

Similar Documents

Publication Publication Date Title
TW201026179A (en) Apparatus and method for mounting electronic component
JP4363756B2 (en) Chip mounting method and substrate cleaning apparatus used therefor
JP2011245772A (en) Pasting device, display panel manufacturing apparatus using the pasting device, and pasting method and display panel manufacturing method using the pasting method
KR20170096935A (en) Apparatus for conveying and recovering optical film, system for manufacturing optical film, and method for conveying and recovering optical film
JP5702110B2 (en) Electronic component mounting apparatus and mounting method
TW201028058A (en) Apparatus and method for mounting electronic component
JP5134425B2 (en) Substrate processing equipment
JP5317615B2 (en) Electronic component mounting apparatus and mounting method
JP2012019189A (en) Apparatus and method for mounting electronic component
CA2018223A1 (en) Method of separating a bonded film from a circuit board
JPWO2014147733A1 (en) Component mounter
JP3834469B2 (en) Substrate transfer system and substrate transfer method using the same
JP2007042927A (en) Used component tape discharge system
JP2020047699A (en) Device for adhering tape
JPH1034861A (en) Method and equipment for sticking film
KR100935449B1 (en) Acf feeder machine, and method for feeding acf tape
JP4002444B2 (en) Polarizer supply device
JP6240453B2 (en) Caret removal device for scribing brittle material substrate
CN111799206A (en) Stripping device
JP5650983B2 (en) Electronic component mounting apparatus and mounting method
WO2019097581A1 (en) Electronic component mounting device
JP5465043B2 (en) Adhesive tape sticking device and sticking method
CN218504748U (en) Can retrieve sticky tape device of uncapping by oneself
KR101931306B1 (en) Cutting apparatus and method for panel
JP2011199234A (en) Device and method of mounting electronic component