CN102163561B - 半导体器件和使用相同载体在wlcsp中形成tmv和tsv的方法 - Google Patents
半导体器件和使用相同载体在wlcsp中形成tmv和tsv的方法 Download PDFInfo
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- CN102163561B CN102163561B CN201110043183.1A CN201110043183A CN102163561B CN 102163561 B CN102163561 B CN 102163561B CN 201110043183 A CN201110043183 A CN 201110043183A CN 102163561 B CN102163561 B CN 102163561B
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- Engineering & Computer Science (AREA)
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- Power Engineering (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/710,995 US8822281B2 (en) | 2010-02-23 | 2010-02-23 | Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier |
US12/710995 | 2010-02-23 |
Publications (2)
Publication Number | Publication Date |
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CN102163561A CN102163561A (zh) | 2011-08-24 |
CN102163561B true CN102163561B (zh) | 2016-06-15 |
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CN201110043183.1A Active CN102163561B (zh) | 2010-02-23 | 2011-02-23 | 半导体器件和使用相同载体在wlcsp中形成tmv和tsv的方法 |
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US (2) | US8822281B2 (zh) |
CN (1) | CN102163561B (zh) |
SG (2) | SG173952A1 (zh) |
TW (1) | TWI531011B (zh) |
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