JP5862584B2 - モジュールおよびこのモジュールの製造方法ならびにこのモジュールを備える電子装置 - Google Patents
モジュールおよびこのモジュールの製造方法ならびにこのモジュールを備える電子装置 Download PDFInfo
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- JP5862584B2 JP5862584B2 JP2013046237A JP2013046237A JP5862584B2 JP 5862584 B2 JP5862584 B2 JP 5862584B2 JP 2013046237 A JP2013046237 A JP 2013046237A JP 2013046237 A JP2013046237 A JP 2013046237A JP 5862584 B2 JP5862584 B2 JP 5862584B2
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- Prior art keywords
- columnar conductor
- module
- resin layer
- gap
- solder
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
- H05K2201/10318—Surface mounted metallic pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
本発明の第1実施形態にかかるモジュール2を備える電子装置1について、図1および図2を参照して説明する。なお、図1は第1実施形態にかかる電子装置1の断面図であり、図2は図1のモジュールの底面図である。
次に、本発明の第2実施形態にかかるモジュール2aについて、図5を参照して説明する。なお、図5はモジュール2aが実装基板7に実装された電子装置1aの断面図である。
2,2a モジュール
3 配線基板
4 部品
5,5a 柱状導体
6 樹脂層
7 実装基板
9 間隙
10 半田(導電性部材)
11 被覆材
Claims (6)
- 半田を用いて外部と接続されるモジュールであって、
配線基板と、
前記配線基板に実装された部品と、
その一端が前記配線基板に接続された外部接続用の柱状導体と、
前記配線基板に設けられ、その表面から前記柱状導体の他端の端面が露出した状態で前記柱状導体および前記部品を被覆する樹脂層とを備え、
前記柱状導体の他端側の少なくとも一部の周面と前記樹脂層との間に、半田充填用の間隙が形成され、
前記間隙に前記半田よりも融点が低い材料が充填されている
ことを特徴とするモジュール。 - 前記柱状導体として、第1柱状導体と第2柱状導体とを備え、
前記樹脂層と前記第1柱状導体との間の前記間隙の容積と前記第2柱状導体との間の前記間隙の容積とが異なっていることを特徴とする請求項1に記載のモジュール。 - 請求項1または2に記載のモジュールが実装基板に実装された電子装置において、
前記実装基板が前記柱状導体の他端側に配置され、前記間隙に前記半田が充填された状態で、前記実装基板と前記柱状導体とが前記半田を介して接続されることを特徴とする電子装置。 - 部品が実装されるとともに、外部接続用の柱状導体であって、他端側の外周面が半田よりも融点が低い材料から成る被覆材により被覆されている柱状導体の一端が接続された配線基板を準備する準備工程と、
前記部品および前記柱状導体を被覆する樹脂層を前記配線基板に形成する樹脂層形成工程と、
前記樹脂層を研磨または研削して、前記柱状導体の他端および前記被覆材を前記樹脂層の表面から露出させる露出工程と
を備えることを特徴とするモジュールの製造方法。 - 前記被覆材を成す材料の融点が、半田の融点よりも低く、かつ、前記樹脂層の樹脂の硬化温度よりも低いことを特徴とする請求項4に記載のモジュールの製造方法。
- 前記被覆材の材料が、ワックス、蝋材またはフラックスであることを特徴とする請求項4または5に記載のモジュールの製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013046237A JP5862584B2 (ja) | 2013-03-08 | 2013-03-08 | モジュールおよびこのモジュールの製造方法ならびにこのモジュールを備える電子装置 |
US14/200,743 US20140251670A1 (en) | 2013-03-08 | 2014-03-07 | Module, method for manufacturing the module, and electronic apparatus including the module |
CN201410082961.1A CN104037155B (zh) | 2013-03-08 | 2014-03-07 | 模块及该模块的制造方法、以及具有该模块的电子装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013046237A JP5862584B2 (ja) | 2013-03-08 | 2013-03-08 | モジュールおよびこのモジュールの製造方法ならびにこのモジュールを備える電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014175443A JP2014175443A (ja) | 2014-09-22 |
JP5862584B2 true JP5862584B2 (ja) | 2016-02-16 |
Family
ID=51467869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013046237A Active JP5862584B2 (ja) | 2013-03-08 | 2013-03-08 | モジュールおよびこのモジュールの製造方法ならびにこのモジュールを備える電子装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20140251670A1 (ja) |
JP (1) | JP5862584B2 (ja) |
CN (1) | CN104037155B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN210897246U (zh) * | 2017-04-28 | 2020-06-30 | 株式会社村田制作所 | 电路模块 |
US10497635B2 (en) | 2018-03-27 | 2019-12-03 | Linear Technology Holding Llc | Stacked circuit package with molded base having laser drilled openings for upper package |
WO2020218289A1 (ja) * | 2019-04-26 | 2020-10-29 | 株式会社村田製作所 | モジュール部品、アンテナモジュール及び通信装置 |
US11844178B2 (en) * | 2020-06-02 | 2023-12-12 | Analog Devices International Unlimited Company | Electronic component |
CN114126211A (zh) * | 2020-08-25 | 2022-03-01 | 华为技术有限公司 | 一种封装模块以及电子设备 |
US11744021B2 (en) | 2022-01-21 | 2023-08-29 | Analog Devices, Inc. | Electronic assembly |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6448051U (ja) * | 1987-09-18 | 1989-03-24 | ||
JP2780631B2 (ja) * | 1994-03-09 | 1998-07-30 | 日本電気株式会社 | 電子部品の接続構造およびその製造方法 |
JP2000138327A (ja) * | 1998-10-29 | 2000-05-16 | Ibiden Co Ltd | 変換モジュール及びその製造方法 |
JP3446825B2 (ja) * | 1999-04-06 | 2003-09-16 | 沖電気工業株式会社 | 半導体装置およびその製造方法 |
JP3823881B2 (ja) * | 2002-06-04 | 2006-09-20 | 株式会社村田製作所 | 回路基板間の接続構造、その形成方法、回路基板、および実装基板に表面実装された電子部品 |
JP4119866B2 (ja) * | 2004-05-12 | 2008-07-16 | 富士通株式会社 | 半導体装置 |
EP1909322A4 (en) * | 2005-07-27 | 2011-08-03 | Murata Manufacturing Co | STACKED ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING STACKED ELECTRONIC COMPONENT |
JP4738971B2 (ja) * | 2005-10-14 | 2011-08-03 | Okiセミコンダクタ株式会社 | 半導体装置及びその製造方法 |
EP1843391A4 (en) * | 2005-10-26 | 2009-12-30 | Murata Manufacturing Co | STACKED ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING STACKED ELECTRONIC COMPONENT |
JP4303282B2 (ja) * | 2006-12-22 | 2009-07-29 | Tdk株式会社 | プリント配線板の配線構造及びその形成方法 |
JP4331769B2 (ja) * | 2007-02-28 | 2009-09-16 | Tdk株式会社 | 配線構造及びその形成方法並びにプリント配線板 |
KR100832651B1 (ko) * | 2007-06-20 | 2008-05-27 | 삼성전기주식회사 | 인쇄회로기판 |
JP5214554B2 (ja) * | 2009-07-30 | 2013-06-19 | ラピスセミコンダクタ株式会社 | 半導体チップ内蔵パッケージ及びその製造方法、並びに、パッケージ・オン・パッケージ型半導体装置及びその製造方法 |
JP5171777B2 (ja) * | 2009-09-30 | 2013-03-27 | 三菱電機株式会社 | 電力用半導体装置 |
US8816223B2 (en) * | 2009-11-17 | 2014-08-26 | Restaurant Accuracy Systems, Llc | Fry station with integral portion weight sensing system and method |
US8822281B2 (en) * | 2010-02-23 | 2014-09-02 | Stats Chippac, Ltd. | Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier |
US8755196B2 (en) * | 2010-07-09 | 2014-06-17 | Ibiden Co., Ltd. | Wiring board and method for manufacturing the same |
JP2012109822A (ja) * | 2010-11-18 | 2012-06-07 | Casio Comput Co Ltd | パッチアンテナ及びその実装方法 |
JP5673123B2 (ja) * | 2011-01-19 | 2015-02-18 | 株式会社村田製作所 | モジュール基板及びモジュール基板の製造方法 |
WO2012137714A1 (ja) * | 2011-04-04 | 2012-10-11 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
TWI495051B (zh) * | 2011-07-08 | 2015-08-01 | Unimicron Technology Corp | 無核心層之封裝基板及其製法 |
JP2013149948A (ja) * | 2011-12-20 | 2013-08-01 | Ngk Spark Plug Co Ltd | 配線基板及びその製造方法 |
CN102709260B (zh) * | 2012-05-08 | 2015-05-20 | 日月光半导体制造股份有限公司 | 半导体封装构造 |
-
2013
- 2013-03-08 JP JP2013046237A patent/JP5862584B2/ja active Active
-
2014
- 2014-03-07 US US14/200,743 patent/US20140251670A1/en not_active Abandoned
- 2014-03-07 CN CN201410082961.1A patent/CN104037155B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US20140251670A1 (en) | 2014-09-11 |
CN104037155B (zh) | 2017-03-01 |
CN104037155A (zh) | 2014-09-10 |
JP2014175443A (ja) | 2014-09-22 |
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