CN102110701B - 固态成像装置和成像系统 - Google Patents

固态成像装置和成像系统 Download PDF

Info

Publication number
CN102110701B
CN102110701B CN2010105972529A CN201010597252A CN102110701B CN 102110701 B CN102110701 B CN 102110701B CN 2010105972529 A CN2010105972529 A CN 2010105972529A CN 201010597252 A CN201010597252 A CN 201010597252A CN 102110701 B CN102110701 B CN 102110701B
Authority
CN
China
Prior art keywords
mos transistor
reset
voltage
solid
imaging device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010105972529A
Other languages
English (en)
Chinese (zh)
Other versions
CN102110701A (zh
Inventor
沖田彰
箕轮雅章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN102110701A publication Critical patent/CN102110701A/zh
Application granted granted Critical
Publication of CN102110701B publication Critical patent/CN102110701B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN2010105972529A 2009-12-25 2010-12-21 固态成像装置和成像系统 Expired - Fee Related CN102110701B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-295442 2009-12-25
JP2009295442A JP5538876B2 (ja) 2009-12-25 2009-12-25 固体撮像装置

Publications (2)

Publication Number Publication Date
CN102110701A CN102110701A (zh) 2011-06-29
CN102110701B true CN102110701B (zh) 2013-12-18

Family

ID=43877076

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010105972529A Expired - Fee Related CN102110701B (zh) 2009-12-25 2010-12-21 固态成像装置和成像系统

Country Status (4)

Country Link
US (1) US8525896B2 (https=)
EP (1) EP2339629A3 (https=)
JP (1) JP5538876B2 (https=)
CN (1) CN102110701B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102056905B1 (ko) * 2011-07-25 2019-12-18 삼성전자주식회사 광센싱 장치 및 그 구동 방법, 광센싱 장치를 포함하는 광터치 스크린 장치
US9891102B2 (en) 2010-04-22 2018-02-13 Samsung Electronics Co., Ltd. Simplified light sensing circuit, light sensing apparatus including the light sensing circuit, method of driving the light sensing apparatus, and image acquisition apparatus and optical touch screen apparatus including the light sensing apparatus
US8445828B2 (en) 2010-07-01 2013-05-21 Silicon Optronics, Inc. High dynamic range image sensor with in pixel memory
JPWO2013027524A1 (ja) * 2011-08-24 2015-03-19 シャープ株式会社 固体撮像素子
JP5864990B2 (ja) 2011-10-03 2016-02-17 キヤノン株式会社 固体撮像装置およびカメラ
JP5967915B2 (ja) 2011-12-09 2016-08-10 キヤノン株式会社 固体撮像装置の駆動方法
JP5967944B2 (ja) 2012-01-18 2016-08-10 キヤノン株式会社 固体撮像装置およびカメラ
JP6023437B2 (ja) 2012-02-29 2016-11-09 キヤノン株式会社 固体撮像装置及びカメラ
JP6174901B2 (ja) 2013-05-10 2017-08-02 キヤノン株式会社 固体撮像装置及びカメラ
US9654714B2 (en) 2013-11-01 2017-05-16 Silicon Optronics, Inc. Shared pixel with fixed conversion gain
CN103716559B (zh) * 2014-01-13 2017-02-15 中国科学院上海高等研究院 像素单元读出装置及方法、像素阵列读出装置及方法
JP6109125B2 (ja) 2014-08-20 2017-04-05 キヤノン株式会社 半導体装置、固体撮像装置、および撮像システム
JP6700656B2 (ja) * 2014-10-31 2020-05-27 キヤノン株式会社 撮像装置
JP6738200B2 (ja) 2016-05-26 2020-08-12 キヤノン株式会社 撮像装置
US10319765B2 (en) 2016-07-01 2019-06-11 Canon Kabushiki Kaisha Imaging device having an effective pixel region, an optical black region and a dummy region each with pixels including a photoelectric converter

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6242728B1 (en) * 1998-08-20 2001-06-05 Foveon, Inc. CMOS active pixel sensor using native transistors

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3461265B2 (ja) 1996-09-19 2003-10-27 株式会社東芝 固体撮像装置および固体撮像装置応用システム
US6674470B1 (en) * 1996-09-19 2004-01-06 Kabushiki Kaisha Toshiba MOS-type solid state imaging device with high sensitivity
JP3487575B2 (ja) * 1997-12-26 2004-01-19 キヤノン株式会社 光電変換装置
JP3428875B2 (ja) * 1997-09-29 2003-07-22 キヤノン株式会社 光電変換装置
JP3466886B2 (ja) * 1997-10-06 2003-11-17 キヤノン株式会社 固体撮像装置
JP3621844B2 (ja) * 1999-02-24 2005-02-16 シャープ株式会社 増幅型固体撮像装置
JP3725007B2 (ja) * 2000-06-06 2005-12-07 シャープ株式会社 対数変換型画素構造およびそれを用いた固体撮像装置
JP3861244B2 (ja) * 2000-12-26 2006-12-20 本田技研工業株式会社 画像処理装置
JP2005516401A (ja) * 2002-01-24 2005-06-02 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ イメージャ
JP3921093B2 (ja) * 2002-01-29 2007-05-30 シャープ株式会社 増幅型固体撮像装置
JP4164733B2 (ja) * 2002-02-05 2008-10-15 ソニー株式会社 固体撮像装置及びその駆動方法
JP4132850B2 (ja) * 2002-02-06 2008-08-13 富士通株式会社 Cmosイメージセンサおよびその制御方法
JP4242258B2 (ja) * 2003-11-21 2009-03-25 シャープ株式会社 固体撮像素子
JP4067054B2 (ja) * 2004-02-13 2008-03-26 キヤノン株式会社 固体撮像装置および撮像システム
JP5224633B2 (ja) 2004-03-30 2013-07-03 キヤノン株式会社 半導体装置の製造方法
JP4916101B2 (ja) * 2004-09-01 2012-04-11 キヤノン株式会社 光電変換装置、固体撮像装置及び固体撮像システム
JP2006073736A (ja) * 2004-09-01 2006-03-16 Canon Inc 光電変換装置、固体撮像装置及び固体撮像システム
JP4513497B2 (ja) * 2004-10-19 2010-07-28 ソニー株式会社 固体撮像装置
JP2006197392A (ja) * 2005-01-14 2006-07-27 Canon Inc 固体撮像装置、カメラ、及び固体撮像装置の駆動方法
JP4459064B2 (ja) * 2005-01-14 2010-04-28 キヤノン株式会社 固体撮像装置、その制御方法及びカメラ
JP4416668B2 (ja) * 2005-01-14 2010-02-17 キヤノン株式会社 固体撮像装置、その制御方法及びカメラ
JP4459099B2 (ja) * 2005-03-18 2010-04-28 キヤノン株式会社 固体撮像装置及びカメラ
JP4677258B2 (ja) * 2005-03-18 2011-04-27 キヤノン株式会社 固体撮像装置及びカメラ
JP4459098B2 (ja) * 2005-03-18 2010-04-28 キヤノン株式会社 固体撮像装置及びカメラ
JP4110193B1 (ja) * 2007-05-02 2008-07-02 キヤノン株式会社 固体撮像装置および撮像システム
JP4991436B2 (ja) * 2007-08-02 2012-08-01 キヤノン株式会社 撮像装置及び撮像システム
JP2009117613A (ja) * 2007-11-06 2009-05-28 Toshiba Corp 半導体装置
JP5167799B2 (ja) * 2007-12-18 2013-03-21 ソニー株式会社 固体撮像装置およびカメラ
JP5156434B2 (ja) * 2008-02-29 2013-03-06 キヤノン株式会社 撮像装置および撮像システム
JP5568880B2 (ja) * 2008-04-03 2014-08-13 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法および電子機器
JP5089514B2 (ja) * 2008-07-11 2012-12-05 キヤノン株式会社 撮像装置、及び撮像システム
JP4617372B2 (ja) * 2008-08-29 2011-01-26 キヤノン株式会社 撮像装置及び撮像システム
US8913166B2 (en) * 2009-01-21 2014-12-16 Canon Kabushiki Kaisha Solid-state imaging apparatus
JP2011091474A (ja) * 2009-10-20 2011-05-06 Sony Corp 固体撮像装置及び撮像機器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6242728B1 (en) * 1998-08-20 2001-06-05 Foveon, Inc. CMOS active pixel sensor using native transistors

Also Published As

Publication number Publication date
US20110157398A1 (en) 2011-06-30
EP2339629A2 (en) 2011-06-29
US8525896B2 (en) 2013-09-03
EP2339629A3 (en) 2012-05-23
JP2011135515A (ja) 2011-07-07
CN102110701A (zh) 2011-06-29
JP5538876B2 (ja) 2014-07-02

Similar Documents

Publication Publication Date Title
CN102110701B (zh) 固态成像装置和成像系统
US8085330B2 (en) Image pickup apparatus
CN1225897C (zh) 摄像装置
EP1492334B1 (en) Solid-state image pickup device
US11064140B2 (en) Solid-state image pickup device having buffers connected to gates of transistors with first gate insulating film thicker than second gate insulating film
US8427567B2 (en) Image sensing apparatus and image capturing system
CN102316279B (zh) 固体摄像元件
JP5316606B2 (ja) 固体撮像素子及びその製造方法
US7410823B2 (en) Image sensors for reducing dark current and methods of manufacturing the same
US7214974B2 (en) Image sensors for reducing dark current and methods of manufacturing the same
US6914228B2 (en) Solid-state imaging device
US9881961B2 (en) Solid-state imaging device
JP2018093297A (ja) 光電変換装置、撮像システム
CN115767294B (zh) 摄像元件及摄像装置
JP5645553B2 (ja) 固体撮像装置及び撮像システム
US20080087925A1 (en) Solid-State Imaging Device and Method for Driving the Same
JP2006100761A (ja) 固体撮像素子及びその製造方法並びに固体撮像素子の駆動方法
JP3597176B2 (ja) Ccd型固体撮像素子
JP2004104116A (ja) 撮像装置
US20210144324A1 (en) Complementary metal-oxide-semiconductor image sensors with submicron pixels and punch through charge transfer
JP4618170B2 (ja) 固体撮像装置
JP3585898B2 (ja) Ccd型固体撮像素子を用いたカメラ
KR20040034497A (ko) 고체 촬상 소자 및 그 제조 방법
CN106098718A (zh) 一种传输空穴的图像传感器像素结构
JP4561651B2 (ja) 固体撮像素子

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131218

Termination date: 20211221

CF01 Termination of patent right due to non-payment of annual fee