CN102110701B - 固态成像装置和成像系统 - Google Patents
固态成像装置和成像系统 Download PDFInfo
- Publication number
- CN102110701B CN102110701B CN2010105972529A CN201010597252A CN102110701B CN 102110701 B CN102110701 B CN 102110701B CN 2010105972529 A CN2010105972529 A CN 2010105972529A CN 201010597252 A CN201010597252 A CN 201010597252A CN 102110701 B CN102110701 B CN 102110701B
- Authority
- CN
- China
- Prior art keywords
- mos transistor
- reset
- voltage
- solid
- imaging device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-295442 | 2009-12-25 | ||
| JP2009295442A JP5538876B2 (ja) | 2009-12-25 | 2009-12-25 | 固体撮像装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102110701A CN102110701A (zh) | 2011-06-29 |
| CN102110701B true CN102110701B (zh) | 2013-12-18 |
Family
ID=43877076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105972529A Expired - Fee Related CN102110701B (zh) | 2009-12-25 | 2010-12-21 | 固态成像装置和成像系统 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8525896B2 (https=) |
| EP (1) | EP2339629A3 (https=) |
| JP (1) | JP5538876B2 (https=) |
| CN (1) | CN102110701B (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102056905B1 (ko) * | 2011-07-25 | 2019-12-18 | 삼성전자주식회사 | 광센싱 장치 및 그 구동 방법, 광센싱 장치를 포함하는 광터치 스크린 장치 |
| US9891102B2 (en) | 2010-04-22 | 2018-02-13 | Samsung Electronics Co., Ltd. | Simplified light sensing circuit, light sensing apparatus including the light sensing circuit, method of driving the light sensing apparatus, and image acquisition apparatus and optical touch screen apparatus including the light sensing apparatus |
| US8445828B2 (en) | 2010-07-01 | 2013-05-21 | Silicon Optronics, Inc. | High dynamic range image sensor with in pixel memory |
| JPWO2013027524A1 (ja) * | 2011-08-24 | 2015-03-19 | シャープ株式会社 | 固体撮像素子 |
| JP5864990B2 (ja) | 2011-10-03 | 2016-02-17 | キヤノン株式会社 | 固体撮像装置およびカメラ |
| JP5967915B2 (ja) | 2011-12-09 | 2016-08-10 | キヤノン株式会社 | 固体撮像装置の駆動方法 |
| JP5967944B2 (ja) | 2012-01-18 | 2016-08-10 | キヤノン株式会社 | 固体撮像装置およびカメラ |
| JP6023437B2 (ja) | 2012-02-29 | 2016-11-09 | キヤノン株式会社 | 固体撮像装置及びカメラ |
| JP6174901B2 (ja) | 2013-05-10 | 2017-08-02 | キヤノン株式会社 | 固体撮像装置及びカメラ |
| US9654714B2 (en) | 2013-11-01 | 2017-05-16 | Silicon Optronics, Inc. | Shared pixel with fixed conversion gain |
| CN103716559B (zh) * | 2014-01-13 | 2017-02-15 | 中国科学院上海高等研究院 | 像素单元读出装置及方法、像素阵列读出装置及方法 |
| JP6109125B2 (ja) | 2014-08-20 | 2017-04-05 | キヤノン株式会社 | 半導体装置、固体撮像装置、および撮像システム |
| JP6700656B2 (ja) * | 2014-10-31 | 2020-05-27 | キヤノン株式会社 | 撮像装置 |
| JP6738200B2 (ja) | 2016-05-26 | 2020-08-12 | キヤノン株式会社 | 撮像装置 |
| US10319765B2 (en) | 2016-07-01 | 2019-06-11 | Canon Kabushiki Kaisha | Imaging device having an effective pixel region, an optical black region and a dummy region each with pixels including a photoelectric converter |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6242728B1 (en) * | 1998-08-20 | 2001-06-05 | Foveon, Inc. | CMOS active pixel sensor using native transistors |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3461265B2 (ja) | 1996-09-19 | 2003-10-27 | 株式会社東芝 | 固体撮像装置および固体撮像装置応用システム |
| US6674470B1 (en) * | 1996-09-19 | 2004-01-06 | Kabushiki Kaisha Toshiba | MOS-type solid state imaging device with high sensitivity |
| JP3487575B2 (ja) * | 1997-12-26 | 2004-01-19 | キヤノン株式会社 | 光電変換装置 |
| JP3428875B2 (ja) * | 1997-09-29 | 2003-07-22 | キヤノン株式会社 | 光電変換装置 |
| JP3466886B2 (ja) * | 1997-10-06 | 2003-11-17 | キヤノン株式会社 | 固体撮像装置 |
| JP3621844B2 (ja) * | 1999-02-24 | 2005-02-16 | シャープ株式会社 | 増幅型固体撮像装置 |
| JP3725007B2 (ja) * | 2000-06-06 | 2005-12-07 | シャープ株式会社 | 対数変換型画素構造およびそれを用いた固体撮像装置 |
| JP3861244B2 (ja) * | 2000-12-26 | 2006-12-20 | 本田技研工業株式会社 | 画像処理装置 |
| JP2005516401A (ja) * | 2002-01-24 | 2005-06-02 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | イメージャ |
| JP3921093B2 (ja) * | 2002-01-29 | 2007-05-30 | シャープ株式会社 | 増幅型固体撮像装置 |
| JP4164733B2 (ja) * | 2002-02-05 | 2008-10-15 | ソニー株式会社 | 固体撮像装置及びその駆動方法 |
| JP4132850B2 (ja) * | 2002-02-06 | 2008-08-13 | 富士通株式会社 | Cmosイメージセンサおよびその制御方法 |
| JP4242258B2 (ja) * | 2003-11-21 | 2009-03-25 | シャープ株式会社 | 固体撮像素子 |
| JP4067054B2 (ja) * | 2004-02-13 | 2008-03-26 | キヤノン株式会社 | 固体撮像装置および撮像システム |
| JP5224633B2 (ja) | 2004-03-30 | 2013-07-03 | キヤノン株式会社 | 半導体装置の製造方法 |
| JP4916101B2 (ja) * | 2004-09-01 | 2012-04-11 | キヤノン株式会社 | 光電変換装置、固体撮像装置及び固体撮像システム |
| JP2006073736A (ja) * | 2004-09-01 | 2006-03-16 | Canon Inc | 光電変換装置、固体撮像装置及び固体撮像システム |
| JP4513497B2 (ja) * | 2004-10-19 | 2010-07-28 | ソニー株式会社 | 固体撮像装置 |
| JP2006197392A (ja) * | 2005-01-14 | 2006-07-27 | Canon Inc | 固体撮像装置、カメラ、及び固体撮像装置の駆動方法 |
| JP4459064B2 (ja) * | 2005-01-14 | 2010-04-28 | キヤノン株式会社 | 固体撮像装置、その制御方法及びカメラ |
| JP4416668B2 (ja) * | 2005-01-14 | 2010-02-17 | キヤノン株式会社 | 固体撮像装置、その制御方法及びカメラ |
| JP4459099B2 (ja) * | 2005-03-18 | 2010-04-28 | キヤノン株式会社 | 固体撮像装置及びカメラ |
| JP4677258B2 (ja) * | 2005-03-18 | 2011-04-27 | キヤノン株式会社 | 固体撮像装置及びカメラ |
| JP4459098B2 (ja) * | 2005-03-18 | 2010-04-28 | キヤノン株式会社 | 固体撮像装置及びカメラ |
| JP4110193B1 (ja) * | 2007-05-02 | 2008-07-02 | キヤノン株式会社 | 固体撮像装置および撮像システム |
| JP4991436B2 (ja) * | 2007-08-02 | 2012-08-01 | キヤノン株式会社 | 撮像装置及び撮像システム |
| JP2009117613A (ja) * | 2007-11-06 | 2009-05-28 | Toshiba Corp | 半導体装置 |
| JP5167799B2 (ja) * | 2007-12-18 | 2013-03-21 | ソニー株式会社 | 固体撮像装置およびカメラ |
| JP5156434B2 (ja) * | 2008-02-29 | 2013-03-06 | キヤノン株式会社 | 撮像装置および撮像システム |
| JP5568880B2 (ja) * | 2008-04-03 | 2014-08-13 | ソニー株式会社 | 固体撮像装置、固体撮像装置の駆動方法および電子機器 |
| JP5089514B2 (ja) * | 2008-07-11 | 2012-12-05 | キヤノン株式会社 | 撮像装置、及び撮像システム |
| JP4617372B2 (ja) * | 2008-08-29 | 2011-01-26 | キヤノン株式会社 | 撮像装置及び撮像システム |
| US8913166B2 (en) * | 2009-01-21 | 2014-12-16 | Canon Kabushiki Kaisha | Solid-state imaging apparatus |
| JP2011091474A (ja) * | 2009-10-20 | 2011-05-06 | Sony Corp | 固体撮像装置及び撮像機器 |
-
2009
- 2009-12-25 JP JP2009295442A patent/JP5538876B2/ja not_active Expired - Fee Related
-
2010
- 2010-12-01 US US12/957,797 patent/US8525896B2/en not_active Expired - Fee Related
- 2010-12-14 EP EP10194854A patent/EP2339629A3/en not_active Withdrawn
- 2010-12-21 CN CN2010105972529A patent/CN102110701B/zh not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6242728B1 (en) * | 1998-08-20 | 2001-06-05 | Foveon, Inc. | CMOS active pixel sensor using native transistors |
Also Published As
| Publication number | Publication date |
|---|---|
| US20110157398A1 (en) | 2011-06-30 |
| EP2339629A2 (en) | 2011-06-29 |
| US8525896B2 (en) | 2013-09-03 |
| EP2339629A3 (en) | 2012-05-23 |
| JP2011135515A (ja) | 2011-07-07 |
| CN102110701A (zh) | 2011-06-29 |
| JP5538876B2 (ja) | 2014-07-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131218 Termination date: 20211221 |
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| CF01 | Termination of patent right due to non-payment of annual fee |