CN101944659B - 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法 - Google Patents

电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法 Download PDF

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Publication number
CN101944659B
CN101944659B CN201010245654.2A CN201010245654A CN101944659B CN 101944659 B CN101944659 B CN 101944659B CN 201010245654 A CN201010245654 A CN 201010245654A CN 101944659 B CN101944659 B CN 101944659B
Authority
CN
China
Prior art keywords
circuit
film
connection
particles
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201010245654.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN101944659A (zh
Inventor
竹田津润
渡边伊津夫
后藤泰史
山口夫
山口一夫
藤井正规
藤井绫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004002305A external-priority patent/JP4380327B2/ja
Priority claimed from JP2004002308A external-priority patent/JP4380328B2/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN101944659A publication Critical patent/CN101944659A/zh
Application granted granted Critical
Publication of CN101944659B publication Critical patent/CN101944659B/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
CN201010245654.2A 2004-01-07 2005-01-06 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法 Expired - Lifetime CN101944659B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004-002308 2004-01-07
JP2004-002305 2004-01-07
JP2004002305A JP4380327B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2004002308A JP4380328B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
CNA200580001944XA CN1906265A (zh) 2004-01-07 2005-01-06 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNA200580001944XA Division CN1906265A (zh) 2004-01-07 2005-01-06 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法

Publications (2)

Publication Number Publication Date
CN101944659A CN101944659A (zh) 2011-01-12
CN101944659B true CN101944659B (zh) 2016-08-17

Family

ID=34752086

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201010245654.2A Expired - Lifetime CN101944659B (zh) 2004-01-07 2005-01-06 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法
CN2013103506129A Pending CN103409082A (zh) 2004-01-07 2005-01-06 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2013103506129A Pending CN103409082A (zh) 2004-01-07 2005-01-06 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法

Country Status (7)

Country Link
US (1) US20100025089A1 (enExample)
EP (1) EP1702968A4 (enExample)
KR (4) KR100908370B1 (enExample)
CN (2) CN101944659B (enExample)
SG (1) SG158842A1 (enExample)
TW (4) TW200945373A (enExample)
WO (1) WO2005066298A1 (enExample)

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JP4967482B2 (ja) * 2006-02-27 2012-07-04 日立化成工業株式会社 導電粒子、接着剤組成物及び回路接続材料
TW201217482A (en) * 2006-11-10 2012-05-01 Hitachi Chemical Co Ltd Adhesive film, and connection structure and connecting method for circuit member
EP2178094A4 (en) * 2007-08-02 2013-02-20 Hitachi Chemical Co Ltd SWITCHING CONNECTING MATERIAL AND CONNECTING STRUCTURE OF A SWITCHING ELEMENT AND CONNECTION METHOD OF A SWITCHING ELEMENT ON THE SWITCHING CONNECTING MATERIAL
EP2206756A1 (en) * 2007-10-29 2010-07-14 Hitachi Chemical Company, Ltd. Circuit connecting material, connection structure and method for producing the same
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
WO2011125414A1 (ja) * 2010-04-01 2011-10-13 株式会社村田製作所 電子部品及びその製造方法
KR102095291B1 (ko) * 2012-11-28 2020-03-31 세키스이가가쿠 고교가부시키가이샤 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체
GB2518363A (en) 2013-09-18 2015-03-25 Novalia Ltd Circuit board assembly
DE102013219688B3 (de) * 2013-09-30 2015-02-05 Robert Bosch Gmbh Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung
CN105295812B (zh) * 2014-07-22 2021-03-02 昭和电工材料株式会社 连接材料和太阳能电池模块
KR102422589B1 (ko) * 2017-01-27 2022-07-18 쇼와덴코머티리얼즈가부시끼가이샤 절연 피복 도전 입자, 이방 도전 필름, 이방 도전 필름의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
US10733136B1 (en) * 2019-03-01 2020-08-04 Western Digital Technologies, Inc. Vertical surface mount type C USB connector

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US5162087A (en) * 1990-09-03 1992-11-10 Soken Chemical & Engineering Co., Ltd. Anisotropic conductive adhesive compositions
CN1115485A (zh) * 1994-05-10 1996-01-24 日立化成工业株式会社 各向异性的导电树脂膜
CN1136758A (zh) * 1995-05-23 1996-11-27 日立化成工业株式会社 生产多层印刷电路板的方法
CN1180368A (zh) * 1995-04-04 1998-04-29 日立化成工业株式会社 粘合剂、胶膜及带粘合剂底面的金属箔
CN1339055A (zh) * 1999-02-08 2002-03-06 日立化成工业株式会社 粘合剂、电极连接构造及电极连接方法
CN1377393A (zh) * 1999-08-25 2002-10-30 日立化成工业株式会社 粘合剂,配线端子的连接方法和配线结构体

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US4999460A (en) * 1989-08-10 1991-03-12 Casio Computer Co., Ltd. Conductive connecting structure
JP3004042B2 (ja) * 1990-10-12 2000-01-31 綜研化学株式会社 金属含有樹脂粒子およびその用途
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JPH07105716A (ja) * 1993-10-05 1995-04-21 Soken Kagaku Kk 被覆粒子および異方導電性接着剤
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MY124944A (en) * 2000-02-09 2006-07-31 Hitachi Chemical Co Ltd Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards
JP4788036B2 (ja) * 2000-11-29 2011-10-05 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4752107B2 (ja) * 2000-11-29 2011-08-17 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4852785B2 (ja) * 2000-11-29 2012-01-11 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
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Publication number Priority date Publication date Assignee Title
US5162087A (en) * 1990-09-03 1992-11-10 Soken Chemical & Engineering Co., Ltd. Anisotropic conductive adhesive compositions
CN1115485A (zh) * 1994-05-10 1996-01-24 日立化成工业株式会社 各向异性的导电树脂膜
CN1180368A (zh) * 1995-04-04 1998-04-29 日立化成工业株式会社 粘合剂、胶膜及带粘合剂底面的金属箔
CN1136758A (zh) * 1995-05-23 1996-11-27 日立化成工业株式会社 生产多层印刷电路板的方法
CN1339055A (zh) * 1999-02-08 2002-03-06 日立化成工业株式会社 粘合剂、电极连接构造及电极连接方法
CN1377393A (zh) * 1999-08-25 2002-10-30 日立化成工业株式会社 粘合剂,配线端子的连接方法和配线结构体

Also Published As

Publication number Publication date
KR100908370B1 (ko) 2009-07-20
KR100996035B1 (ko) 2010-11-22
CN103409082A (zh) 2013-11-27
US20100025089A1 (en) 2010-02-04
KR100981483B1 (ko) 2010-09-10
TW200525005A (en) 2005-08-01
CN101944659A (zh) 2011-01-12
KR100865204B1 (ko) 2008-10-23
SG158842A1 (en) 2010-02-26
TW200942596A (en) 2009-10-16
KR20090074778A (ko) 2009-07-07
TW200951201A (en) 2009-12-16
TW200945373A (en) 2009-11-01
EP1702968A1 (en) 2006-09-20
TWI323276B (enExample) 2010-04-11
KR20070012337A (ko) 2007-01-25
EP1702968A4 (en) 2010-08-25
KR20090064461A (ko) 2009-06-18
KR20080065314A (ko) 2008-07-11
TWI320427B (enExample) 2010-02-11
TWI320575B (enExample) 2010-02-11
WO2005066298A1 (ja) 2005-07-21

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Patentee before: Showa electrical materials Co.,Ltd.

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Granted publication date: 20160817