TW200942596A - Film-shaped circuit connection material, circuit member connection structure, and manufacturing method thereof - Google Patents
Film-shaped circuit connection material, circuit member connection structure, and manufacturing method thereofInfo
- Publication number
- TW200942596A TW200942596A TW098120260A TW98120260A TW200942596A TW 200942596 A TW200942596 A TW 200942596A TW 098120260 A TW098120260 A TW 098120260A TW 98120260 A TW98120260 A TW 98120260A TW 200942596 A TW200942596 A TW 200942596A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit
- film
- manufacturing
- connection structure
- member connection
- Prior art date
Links
- 239000000463 material Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002245 particle Substances 0.000 abstract 3
- 239000010419 fine particle Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Combinations Of Printed Boards (AREA)
- Non-Insulated Conductors (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004002308A JP4380328B2 (ja) | 2004-01-07 | 2004-01-07 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
JP2004002305A JP4380327B2 (ja) | 2004-01-07 | 2004-01-07 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200942596A true TW200942596A (en) | 2009-10-16 |
Family
ID=34752086
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098120264A TW200945373A (en) | 2004-01-07 | 2005-01-07 | Circuit connection material, circuit member connection structure, and manufacturing method thereof |
TW094100507A TW200525005A (en) | 2004-01-07 | 2005-01-07 | Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof |
TW098120262A TW200951201A (en) | 2004-01-07 | 2005-01-07 | Circuit connection material, circuit member connection structure, and manufacturing method thereof |
TW098120260A TW200942596A (en) | 2004-01-07 | 2005-01-07 | Film-shaped circuit connection material, circuit member connection structure, and manufacturing method thereof |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098120264A TW200945373A (en) | 2004-01-07 | 2005-01-07 | Circuit connection material, circuit member connection structure, and manufacturing method thereof |
TW094100507A TW200525005A (en) | 2004-01-07 | 2005-01-07 | Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof |
TW098120262A TW200951201A (en) | 2004-01-07 | 2005-01-07 | Circuit connection material, circuit member connection structure, and manufacturing method thereof |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100025089A1 (zh) |
EP (1) | EP1702968A4 (zh) |
KR (4) | KR100908370B1 (zh) |
CN (2) | CN103409082A (zh) |
SG (1) | SG158842A1 (zh) |
TW (4) | TW200945373A (zh) |
WO (1) | WO2005066298A1 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4967482B2 (ja) * | 2006-02-27 | 2012-07-04 | 日立化成工業株式会社 | 導電粒子、接着剤組成物及び回路接続材料 |
WO2008056773A1 (en) * | 2006-11-10 | 2008-05-15 | Hitachi Chemical Company, Ltd. | Adhesive film, and connection structure and connecting method for circuit member |
CN101689410B (zh) * | 2007-08-02 | 2013-10-16 | 日立化成株式会社 | 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法 |
CN101835859B (zh) * | 2007-10-29 | 2015-04-08 | 日立化成株式会社 | 电路连接材料、连接结构体及其制造方法 |
JP5430093B2 (ja) * | 2008-07-24 | 2014-02-26 | デクセリアルズ株式会社 | 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法 |
JP5435040B2 (ja) * | 2010-04-01 | 2014-03-05 | 株式会社村田製作所 | 電子部品及びその製造方法 |
WO2014084173A1 (ja) * | 2012-11-28 | 2014-06-05 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、導電材料及び接続構造体 |
GB2518363A (en) | 2013-09-18 | 2015-03-25 | Novalia Ltd | Circuit board assembly |
DE102013219688B3 (de) * | 2013-09-30 | 2015-02-05 | Robert Bosch Gmbh | Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung |
CN105295812B (zh) * | 2014-07-22 | 2021-03-02 | 昭和电工材料株式会社 | 连接材料和太阳能电池模块 |
KR102422589B1 (ko) * | 2017-01-27 | 2022-07-18 | 쇼와덴코머티리얼즈가부시끼가이샤 | 절연 피복 도전 입자, 이방 도전 필름, 이방 도전 필름의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법 |
US10733136B1 (en) * | 2019-03-01 | 2020-08-04 | Western Digital Technologies, Inc. | Vertical surface mount type C USB connector |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4999460A (en) * | 1989-08-10 | 1991-03-12 | Casio Computer Co., Ltd. | Conductive connecting structure |
JPH04115407A (ja) * | 1990-09-03 | 1992-04-16 | Soken Kagaku Kk | 異方導電性接着剤組成物 |
JP3004042B2 (ja) * | 1990-10-12 | 2000-01-31 | 綜研化学株式会社 | 金属含有樹脂粒子およびその用途 |
JP2748705B2 (ja) * | 1991-02-14 | 1998-05-13 | 日立化成工業株式会社 | 回路の接続部材 |
JPH07105716A (ja) * | 1993-10-05 | 1995-04-21 | Soken Kagaku Kk | 被覆粒子および異方導電性接着剤 |
JPH07133466A (ja) * | 1993-11-09 | 1995-05-23 | Soken Kagaku Kk | 接着方法 |
TW277152B (zh) * | 1994-05-10 | 1996-06-01 | Hitachi Chemical Co Ltd | |
DE69606396T2 (de) * | 1995-04-04 | 2000-07-27 | Hitachi Chemical Co., Ltd. | Klebstoff, klebstofffilm und metallfolie, die auf ihrer rückseite mit klebstoff vorsehen ist |
EP0744884A3 (en) * | 1995-05-23 | 1997-09-24 | Hitachi Chemical Co Ltd | Method of manufacturing a multilayer printed circuit board |
KR100261793B1 (ko) * | 1995-09-29 | 2000-07-15 | 니시무로 타이죠 | 고강도 고신뢰성 회로기판 및 그 제조방법 |
JP4469089B2 (ja) * | 1999-02-08 | 2010-05-26 | 日立化成工業株式会社 | 回路接続用フィルム状異方導電性接着剤、電極の接続構造及び電極の接続方法 |
WO2001014484A1 (fr) * | 1999-08-25 | 2001-03-01 | Hitachi Chemical Company, Ltd. | Agent adhesif, technique de raccordement pour bornes de fil et structure de fils |
MY124944A (en) * | 2000-02-09 | 2006-07-31 | Hitachi Chemical Co Ltd | Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards |
JP4788036B2 (ja) * | 2000-11-29 | 2011-10-05 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 |
JP4752107B2 (ja) * | 2000-11-29 | 2011-08-17 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 |
JP4852785B2 (ja) * | 2000-11-29 | 2012-01-11 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 |
TW557237B (en) * | 2001-09-14 | 2003-10-11 | Sekisui Chemical Co Ltd | Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure |
KR100589799B1 (ko) * | 2003-05-06 | 2006-06-14 | 한화석유화학 주식회사 | 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품 |
US7393771B2 (en) * | 2004-06-29 | 2008-07-01 | Hitachi, Ltd. | Method for mounting an electronic part on a substrate using a liquid containing metal particles |
-
2005
- 2005-01-01 US US10/585,461 patent/US20100025089A1/en not_active Abandoned
- 2005-01-06 WO PCT/JP2005/000070 patent/WO2005066298A1/ja active Application Filing
- 2005-01-06 KR KR1020087014740A patent/KR100908370B1/ko active IP Right Grant
- 2005-01-06 KR KR1020097008205A patent/KR100996035B1/ko active IP Right Grant
- 2005-01-06 CN CN2013103506129A patent/CN103409082A/zh active Pending
- 2005-01-06 KR KR1020067015544A patent/KR100865204B1/ko active IP Right Grant
- 2005-01-06 EP EP05703338A patent/EP1702968A4/en not_active Withdrawn
- 2005-01-06 CN CN201010245654.2A patent/CN101944659B/zh active Active
- 2005-01-06 SG SG200908709-9A patent/SG158842A1/en unknown
- 2005-01-06 KR KR1020097008206A patent/KR100981483B1/ko active IP Right Grant
- 2005-01-07 TW TW098120264A patent/TW200945373A/zh unknown
- 2005-01-07 TW TW094100507A patent/TW200525005A/zh unknown
- 2005-01-07 TW TW098120262A patent/TW200951201A/zh unknown
- 2005-01-07 TW TW098120260A patent/TW200942596A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TWI320427B (zh) | 2010-02-11 |
TW200945373A (en) | 2009-11-01 |
CN101944659A (zh) | 2011-01-12 |
KR100908370B1 (ko) | 2009-07-20 |
TWI320575B (zh) | 2010-02-11 |
KR100996035B1 (ko) | 2010-11-22 |
CN101944659B (zh) | 2016-08-17 |
KR100865204B1 (ko) | 2008-10-23 |
WO2005066298A1 (ja) | 2005-07-21 |
EP1702968A4 (en) | 2010-08-25 |
KR20080065314A (ko) | 2008-07-11 |
KR20090064461A (ko) | 2009-06-18 |
EP1702968A1 (en) | 2006-09-20 |
TWI323276B (zh) | 2010-04-11 |
TW200951201A (en) | 2009-12-16 |
SG158842A1 (en) | 2010-02-26 |
CN103409082A (zh) | 2013-11-27 |
US20100025089A1 (en) | 2010-02-04 |
KR20070012337A (ko) | 2007-01-25 |
KR100981483B1 (ko) | 2010-09-10 |
KR20090074778A (ko) | 2009-07-07 |
TW200525005A (en) | 2005-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200942596A (en) | Film-shaped circuit connection material, circuit member connection structure, and manufacturing method thereof | |
FI20041525A0 (fi) | Elektroniikka moduuli ja menetelmä sen valmistamiseksi | |
WO2009078409A1 (ja) | 回路接続材料及び回路部材の接続構造 | |
DE60205664D1 (de) | Wärmehärtbare harzzusammensetzung | |
MX2007011790A (es) | Tarjeta de circuito de capas multiples con componentes embebidos y metodo de fabricacion. | |
WO2008106555A3 (en) | Piezoelectric package with improved lead structure | |
TW200627491A (en) | Surface-mount capacitor and method of producing the same | |
TW200745308A (en) | Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method | |
EP1453364A4 (en) | FILM FOR CIRCUIT BOARD | |
TWI256128B (en) | Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus | |
TW200506971A (en) | Coated conductive particles, anisotropic conductive material and conductive connection structure | |
RU2010144076A (ru) | Узел соединителя и электрических дорожек | |
WO2009044732A1 (ja) | 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 | |
TW200733824A (en) | Wiring circuit board | |
WO2009028241A1 (ja) | 異方性導電フィルム及びそれを用いた接続構造体の製造方法 | |
TW200707468A (en) | Conductive paste, circuit board, circuit article and method for manufacturing such circuit article | |
MX2021008385A (es) | Nodo electrico, metodo de fabricacion del nodo electrico y estructura multicapa que comprende el nodo electrico. | |
TW200739612A (en) | Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure | |
WO2008009283A8 (de) | Widerstandsanordnung und verfahren zu deren herstellung | |
WO2008096464A1 (ja) | プリント配線板及びそのプリント配線板の製造方法 | |
WO2009017001A1 (ja) | 回路部材の接続構造 | |
EP1278404A4 (en) | PCB AND METHOD FOR THE PRODUCTION THEREOF | |
EP1784065A4 (en) | ELECTRODE SUBSTRATE | |
DE602005014945D1 (de) | Bimorpher spiegel mit zwei durch einen zentralkern aus halb-flexiblem material getrennten piezoelektrischen schichten | |
ATE541312T1 (de) | Chip mit zwei gruppen von chipkontakten |