TWI320427B - - Google Patents

Info

Publication number
TWI320427B
TWI320427B TW098120262A TW98120262A TWI320427B TW I320427 B TWI320427 B TW I320427B TW 098120262 A TW098120262 A TW 098120262A TW 98120262 A TW98120262 A TW 98120262A TW I320427 B TWI320427 B TW I320427B
Authority
TW
Taiwan
Prior art keywords
circuit
particles
mass
covered
insulating fine
Prior art date
Application number
TW098120262A
Other languages
English (en)
Other versions
TW200951201A (en
Inventor
Jun Taketatsu
Itsuo Watanabe
Yasushi Gotou
Kazuo Yamaguchi
Masaki Fujii
Aya Fujii
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004002308A external-priority patent/JP4380328B2/ja
Priority claimed from JP2004002305A external-priority patent/JP4380327B2/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200951201A publication Critical patent/TW200951201A/zh
Application granted granted Critical
Publication of TWI320427B publication Critical patent/TWI320427B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
TW098120262A 2004-01-07 2005-01-07 Circuit connection material, circuit member connection structure, and manufacturing method thereof TW200951201A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004002308A JP4380328B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2004002305A JP4380327B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Publications (2)

Publication Number Publication Date
TW200951201A TW200951201A (en) 2009-12-16
TWI320427B true TWI320427B (zh) 2010-02-11

Family

ID=34752086

Family Applications (4)

Application Number Title Priority Date Filing Date
TW098120264A TW200945373A (en) 2004-01-07 2005-01-07 Circuit connection material, circuit member connection structure, and manufacturing method thereof
TW098120260A TW200942596A (en) 2004-01-07 2005-01-07 Film-shaped circuit connection material, circuit member connection structure, and manufacturing method thereof
TW094100507A TW200525005A (en) 2004-01-07 2005-01-07 Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof
TW098120262A TW200951201A (en) 2004-01-07 2005-01-07 Circuit connection material, circuit member connection structure, and manufacturing method thereof

Family Applications Before (3)

Application Number Title Priority Date Filing Date
TW098120264A TW200945373A (en) 2004-01-07 2005-01-07 Circuit connection material, circuit member connection structure, and manufacturing method thereof
TW098120260A TW200942596A (en) 2004-01-07 2005-01-07 Film-shaped circuit connection material, circuit member connection structure, and manufacturing method thereof
TW094100507A TW200525005A (en) 2004-01-07 2005-01-07 Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof

Country Status (7)

Country Link
US (1) US20100025089A1 (zh)
EP (1) EP1702968A4 (zh)
KR (4) KR100908370B1 (zh)
CN (2) CN101944659B (zh)
SG (1) SG158842A1 (zh)
TW (4) TW200945373A (zh)
WO (1) WO2005066298A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI703769B (zh) * 2019-03-01 2020-09-01 美商西方數位科技公司 連接裝置及組合連接裝置之方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4967482B2 (ja) * 2006-02-27 2012-07-04 日立化成工業株式会社 導電粒子、接着剤組成物及び回路接続材料
CN101536260B (zh) * 2006-11-10 2012-01-11 日立化成工业株式会社 粘接膜、以及电路部件的连接结构和连接方法
CN101689410B (zh) * 2007-08-02 2013-10-16 日立化成株式会社 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法
EP2206756A1 (en) * 2007-10-29 2010-07-14 Hitachi Chemical Company, Ltd. Circuit connecting material, connection structure and method for producing the same
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
JP5435040B2 (ja) * 2010-04-01 2014-03-05 株式会社村田製作所 電子部品及びその製造方法
CN104584141B (zh) * 2012-11-28 2017-04-12 积水化学工业株式会社 带有绝缘性粒子的导电性粒子、导电材料及连接结构体
GB2518363A (en) * 2013-09-18 2015-03-25 Novalia Ltd Circuit board assembly
DE102013219688B3 (de) * 2013-09-30 2015-02-05 Robert Bosch Gmbh Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung
CN105295812B (zh) * 2014-07-22 2021-03-02 昭和电工材料株式会社 连接材料和太阳能电池模块
JP7077963B2 (ja) * 2017-01-27 2022-05-31 昭和電工マテリアルズ株式会社 絶縁被覆導電粒子、異方導電フィルム、異方導電フィルムの製造方法、接続構造体及び接続構造体の製造方法

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US4999460A (en) * 1989-08-10 1991-03-12 Casio Computer Co., Ltd. Conductive connecting structure
JPH04115407A (ja) * 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JP3004042B2 (ja) * 1990-10-12 2000-01-31 綜研化学株式会社 金属含有樹脂粒子およびその用途
JP2748705B2 (ja) * 1991-02-14 1998-05-13 日立化成工業株式会社 回路の接続部材
JPH07105716A (ja) * 1993-10-05 1995-04-21 Soken Kagaku Kk 被覆粒子および異方導電性接着剤
JPH07133466A (ja) * 1993-11-09 1995-05-23 Soken Kagaku Kk 接着方法
TW277152B (zh) * 1994-05-10 1996-06-01 Hitachi Chemical Co Ltd
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EP0744884A3 (en) * 1995-05-23 1997-09-24 Hitachi Chemical Co Ltd Method of manufacturing a multilayer printed circuit board
KR100261793B1 (ko) * 1995-09-29 2000-07-15 니시무로 타이죠 고강도 고신뢰성 회로기판 및 그 제조방법
JP4469089B2 (ja) * 1999-02-08 2010-05-26 日立化成工業株式会社 回路接続用フィルム状異方導電性接着剤、電極の接続構造及び電極の接続方法
JP4499329B2 (ja) * 1999-08-25 2010-07-07 日立化成工業株式会社 接着剤、配線端子の接続方法及び配線構造体
MY124944A (en) * 2000-02-09 2006-07-31 Hitachi Chemical Co Ltd Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards
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US7393771B2 (en) * 2004-06-29 2008-07-01 Hitachi, Ltd. Method for mounting an electronic part on a substrate using a liquid containing metal particles

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI703769B (zh) * 2019-03-01 2020-09-01 美商西方數位科技公司 連接裝置及組合連接裝置之方法

Also Published As

Publication number Publication date
TWI320575B (zh) 2010-02-11
TW200945373A (en) 2009-11-01
KR20090074778A (ko) 2009-07-07
SG158842A1 (en) 2010-02-26
KR20070012337A (ko) 2007-01-25
KR100996035B1 (ko) 2010-11-22
TW200951201A (en) 2009-12-16
US20100025089A1 (en) 2010-02-04
KR20080065314A (ko) 2008-07-11
CN103409082A (zh) 2013-11-27
KR100981483B1 (ko) 2010-09-10
KR100865204B1 (ko) 2008-10-23
KR20090064461A (ko) 2009-06-18
CN101944659B (zh) 2016-08-17
EP1702968A4 (en) 2010-08-25
KR100908370B1 (ko) 2009-07-20
TWI323276B (zh) 2010-04-11
EP1702968A1 (en) 2006-09-20
CN101944659A (zh) 2011-01-12
WO2005066298A1 (ja) 2005-07-21
TW200525005A (en) 2005-08-01
TW200942596A (en) 2009-10-16

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