MX2020009766A - Estructura de multiples capas y metodo relacionado de fabricacion para dispositivos electronicos. - Google Patents

Estructura de multiples capas y metodo relacionado de fabricacion para dispositivos electronicos.

Info

Publication number
MX2020009766A
MX2020009766A MX2020009766A MX2020009766A MX2020009766A MX 2020009766 A MX2020009766 A MX 2020009766A MX 2020009766 A MX2020009766 A MX 2020009766A MX 2020009766 A MX2020009766 A MX 2020009766A MX 2020009766 A MX2020009766 A MX 2020009766A
Authority
MX
Mexico
Prior art keywords
substrate film
connector
electrically conductive
manufacture
multilayer structure
Prior art date
Application number
MX2020009766A
Other languages
English (en)
Inventor
Mikko Heikkinen
Jarmo Sääski
Ronald Haag
Tero Heikkinen
Mika Paani
Jan Tillonen
Original Assignee
Tactotek Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tactotek Oy filed Critical Tactotek Oy
Publication of MX2020009766A publication Critical patent/MX2020009766A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754—Connector integrally incorporated in the PCB or in housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Estructura de múltiples capas integrada (100, 500, 900, 1000, 1400, 1900, 2000), que comprende una película de sustrato (102) con un primer lado (102A) y un segundo lado opuesto (102B), dicha película de sustrato comprende un material de aislamiento eléctrico sustancial, un diseño de circuitos que comprende una cantidad de áreas de conductividad eléctrica (106, 306) de material con conductividad eléctrica sobre dicho primer y/o segundo lado de la película de sustrato, un conector (110, 210, 710, 1110, 1610, 1910, 2010, 2610) que comprende una cantidad de elementos de contacto de conductividad eléctrica (118, 118B, 118C, 2110A, 2110B, 2110C, 2210A, 2210B, 2310A, 2310B, 2510A, 2510B), dicho conector se proporciona a la película de sustrato de forma tal que se extienda hasta dicho primer y segundo lado de dicha película de sustrato y dicha cantidad de elementos de contacto de conductividad eléctrica se conectan con una o más de las áreas conductoras del diseño de circuitos y al mismo tiempo se configuran además para acoplarse eléctricamente a un elemento de conexión externo (112) en respuesta al acoplamiento del elemento de conexión externo con el conector sobre dicho primer o segundo lado de, o en adyacencia a, la película de sustrato, y al menos una capa de plástico (104, 105), preferentemente de material termoplástico, moldeada sobre dicho primer y/o segundo lado de la película de sustrato de manera de cubrir al menos parcialmente el conector y mejorar la sujeción del conector a la película de sustrato, se presenta un método de fabricación correspondiente.
MX2020009766A 2018-03-19 2019-03-18 Estructura de multiples capas y metodo relacionado de fabricacion para dispositivos electronicos. MX2020009766A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/924,697 US11088066B2 (en) 2018-03-19 2018-03-19 Multilayer structure and related method of manufacture for electronics
PCT/FI2019/050226 WO2019180316A1 (en) 2018-03-19 2019-03-18 Multilayer structure for electronics and related method of manufacture

Publications (1)

Publication Number Publication Date
MX2020009766A true MX2020009766A (es) 2020-10-08

Family

ID=65995767

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2020009766A MX2020009766A (es) 2018-03-19 2019-03-18 Estructura de multiples capas y metodo relacionado de fabricacion para dispositivos electronicos.

Country Status (8)

Country Link
US (2) US11088066B2 (es)
EP (1) EP3769594A1 (es)
JP (1) JP7255603B2 (es)
KR (1) KR102566274B1 (es)
CN (1) CN111869338A (es)
MX (1) MX2020009766A (es)
TW (1) TWI791797B (es)
WO (1) WO2019180316A1 (es)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11088066B2 (en) * 2018-03-19 2021-08-10 Tactotek Oy Multilayer structure and related method of manufacture for electronics
US11162203B2 (en) * 2018-07-10 2021-11-02 Haier Us Appliance Solutions, Inc. Appliance control module with in-molded electronics
US10886685B2 (en) * 2019-03-08 2021-01-05 Onanon, Inc. Preformed solder-in-pin system
JP7336677B2 (ja) * 2019-12-23 2023-09-01 パナソニックＩｐマネジメント株式会社 入力装置
US20210188193A1 (en) * 2019-12-24 2021-06-24 Inteva Products, Llc Vehicle interior trim part formed with intergrated electronics and method of making
US11547001B2 (en) * 2020-02-28 2023-01-03 Haier Us Appliance Solutions, Inc. Consumer appliance and touch panel interface
US11309676B2 (en) * 2020-05-12 2022-04-19 Tactotek Oy Integrated multilayer structure and a method for manufacturing a multilayer structure
US10849235B1 (en) 2020-05-20 2020-11-24 Tactotek Oy Method of manufacture of a structure and structure
KR102358393B1 (ko) * 2020-09-22 2022-02-08 (주)티에스이 연성인쇄회로기판 및 이의 제조방법
US11573102B2 (en) * 2020-11-17 2023-02-07 Ford Global Technologies, Llc Method of manufacturing multi-layer electrode for a capacitive pressure sensor and multi-layer electrodes formed therefrom
KR102357563B1 (ko) * 2020-12-14 2022-02-07 인탑스 주식회사 전자회로 도금 공법을 이용한 ime 구조 및 그 제조방법
US11988894B2 (en) 2021-02-26 2024-05-21 Stmicroelectronics (Research & Development) Limited Lens displacement detection circuit for an optical device
JP2022159909A (ja) 2021-04-05 2022-10-18 日本航空電子工業株式会社 デバイス
US11800643B2 (en) * 2021-04-05 2023-10-24 Japan Aviation Electronics Industry, Limited Device having closed space between overlapping sealing members
CN115308850A (zh) * 2021-05-08 2022-11-08 鹏鼎控股(深圳)股份有限公司 光电复合电路板以及光电复合电路板的制作方法
US11175014B1 (en) * 2021-05-17 2021-11-16 Tactotek Oy Optoelectronically functional multilayer structure and related manufacturing method
KR102663754B1 (ko) * 2021-10-12 2024-05-03 캠아이티(주) 다층구조의 메일 핀 커넥터
EP4369088A1 (en) 2022-02-09 2024-05-15 Samsung Electronics Co., Ltd. Connector, printed circuit board on which connector is mounted and display apparatus having same
US11460185B1 (en) 2022-03-25 2022-10-04 Tactotek Oy Integrated multilayer structure containing optically functional module and related method of manufacture
KR102663438B1 (ko) * 2022-06-27 2024-05-03 유한회사 대구특수금속 핀헤더 단자연결부의 신뢰성 향상을 위한 인몰드 전자장치
CN116607056A (zh) * 2023-05-30 2023-08-18 宝鸡恒业有色金属科技有限公司 一种高强度耐拉伸的钽钨合金丝材及其制备方法

Family Cites Families (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE788558A (fr) * 1971-09-10 1973-01-02 Ericsson Telefon Ab L M Reglette de raccordement et son procede de
GB1541365A (en) * 1977-01-05 1979-02-28 Molex Inc Electrical connector assembly
US4225209A (en) * 1979-05-18 1980-09-30 Amp Incorporated Electrical connector receptacle
JPS58111969U (ja) * 1982-01-25 1983-07-30 オムロン株式会社 柔軟性電気回路基板への実装構造
JPS5967685A (ja) * 1982-10-12 1984-04-17 沖電気工業株式会社 フレキシブル印刷配線板と硬質印刷配線板の結合方法
US4533202A (en) * 1983-09-29 1985-08-06 The Siemon Company Multiple electrical connector and block with printed circuit board connector clip
US4703983A (en) * 1986-02-07 1987-11-03 Edco, Inc. Apparatus for grounding an electronic module coupled to a terminal connecting block
US4965227A (en) * 1987-05-21 1990-10-23 Olin Corporation Process for manufacturing plastic pin grid arrays and the product produced thereby
KR970003915B1 (ko) * 1987-06-24 1997-03-22 미다 가쓰시게 반도체 기억장치 및 그것을 사용한 반도체 메모리 모듈
US5198888A (en) * 1987-12-28 1993-03-30 Hitachi, Ltd. Semiconductor stacked device
FR2629665B1 (fr) * 1988-03-30 1991-01-11 Bendix Electronics Sa Boitier pour circuit electronique
US4925393A (en) * 1988-09-06 1990-05-15 Independent Technologies, Inc. 66 Block adapter
US4968260A (en) * 1989-11-22 1990-11-06 Independent Technologies, Inc. Bix block adapter
US5169343A (en) * 1990-11-29 1992-12-08 E. I. Du Pont De Nemours And Company Coax connector module
US5229922A (en) * 1991-09-26 1993-07-20 Yazaki Corporation Electrical junction box with stacked insulating plates and bus-bars with stepped tabs
JP2897562B2 (ja) * 1992-11-20 1999-05-31 株式会社村田製作所 カード型回線インターフェース装置
JPH06251834A (ja) * 1993-02-26 1994-09-09 Toshiba Lighting & Technol Corp フレキシブル印刷配線板装置及びコネクタ装置
JP3163592B2 (ja) * 1993-04-01 2001-05-08 矢崎総業株式会社 複合回路基板
DE4329083A1 (de) * 1993-08-30 1995-03-02 Telefunken Microelectron Baugruppe zur Aufnahme elektronischer Bauelemente
JPH07161441A (ja) * 1993-12-02 1995-06-23 Whitaker Corp:The 表面実装型コネクタ及びその製造方法
US5554821A (en) * 1994-07-15 1996-09-10 National Semiconductor Corporation Removable computer peripheral cards having a solid one-piece housing
US5564949A (en) * 1995-01-05 1996-10-15 Thomas & Betts Corporation Shielded compact data connector
US5588202A (en) * 1995-03-17 1996-12-31 Honeywell Inc. Method for manufacturing an overmolded sensor
US6043435A (en) * 1996-05-29 2000-03-28 Tokai Kogyo Kabushiki Kaisha Conducting section device and method for manufacturing the same
JPH10135652A (ja) * 1996-10-25 1998-05-22 Oki Electric Ind Co Ltd 電子機器における付属品の取付構造
US5984690A (en) * 1996-11-12 1999-11-16 Riechelmann; Bernd Contactor with multiple redundant connecting paths
JP3013794B2 (ja) * 1996-12-10 2000-02-28 富士電機株式会社 半導体装置
US5958556A (en) * 1996-12-19 1999-09-28 Minnesota Mining And Manufacturing Company Vibration damped and stiffened circuit articles
JP3930054B2 (ja) * 1997-03-18 2007-06-13 ローム株式会社 コネクタ
US5921818A (en) * 1997-06-23 1999-07-13 Lucent Technologies Inc. Low crosstalk electrical connector
US6117292A (en) * 1998-05-06 2000-09-12 Honeywell International Inc Sensor packaging having an integral electrode plug member
US5971796A (en) * 1998-06-02 1999-10-26 Yazaki Corporation Wire harness and connector shroud
JP3485162B2 (ja) * 1998-10-09 2004-01-13 矢崎総業株式会社 バッテリ用接続プレートおよびその製造方法
ATE289223T1 (de) * 1999-07-02 2005-03-15 Prosonic Company Ltd Gerader oder gekrümmter ultraschallwandler und anschlusstechnik dafür
JP2001211529A (ja) * 2000-01-20 2001-08-03 Auto Network Gijutsu Kenkyusho:Kk 電気接続箱
TW490881B (en) * 2000-02-24 2002-06-11 Asahi Glass Co Ltd Terminal device for a glass antenna
US6518600B1 (en) * 2000-11-17 2003-02-11 General Electric Company Dual encapsulation for an LED
US6431884B1 (en) * 2001-01-23 2002-08-13 Trw Inc. Apparatus and method for shielding a circuit from electromagnetic interference
TW550997B (en) * 2001-10-18 2003-09-01 Matsushita Electric Ind Co Ltd Module with built-in components and the manufacturing method thereof
JP4013577B2 (ja) 2002-02-15 2007-11-28 株式会社デンソー コネクタ一体型電子機器
US6940021B2 (en) * 2002-09-30 2005-09-06 Rockwell Automation Technologies, Inc. Zero space component adapter for rail mounted terminal block relays
JP4155048B2 (ja) * 2003-02-14 2008-09-24 住友電装株式会社 パワーモジュール及びその製造方法
JP4318201B2 (ja) * 2003-02-27 2009-08-19 株式会社山武 回路基板組立体
US7258549B2 (en) * 2004-02-20 2007-08-21 Matsushita Electric Industrial Co., Ltd. Connection member and mount assembly and production method of the same
US6905349B1 (en) * 2004-02-23 2005-06-14 Delphi Technologies, Inc. Technique for connector to printed circuit board decoupling to eliminate flexure
JP3909771B2 (ja) * 2004-04-28 2007-04-25 日本航空電子工業株式会社 コネクタ
US7230829B2 (en) * 2005-01-28 2007-06-12 Delphi Technologies, Inc. Overmolded electronic assembly with insert molded heat sinks
US20060286845A1 (en) * 2005-06-20 2006-12-21 Hinze Lee R Sealed fastenerless multi-board electronic module and method of manufacture
JP4764176B2 (ja) * 2006-01-16 2011-08-31 株式会社オートネットワーク技術研究所 電気接続箱
US20070184722A1 (en) * 2006-02-07 2007-08-09 Dynatech Action, Inc. Powered modular building block toy
JP4159593B2 (ja) * 2006-06-28 2008-10-01 原田工業株式会社 回路基板内蔵コネクタ及びキャッチャ
JP2008177382A (ja) * 2007-01-19 2008-07-31 Matsushita Electric Ind Co Ltd 熱伝導基板とその製造方法及びこれを用いた回路モジュール
CN101809691B (zh) * 2007-04-20 2012-07-18 英克-罗吉克斯有限公司 模内成型的电容式开关
US8078339B2 (en) 2007-07-13 2011-12-13 Cummins Inc. Circuit board with integrated connector
JP5026947B2 (ja) * 2007-12-21 2012-09-19 矢崎総業株式会社 回路基板の熱対策構造
CN201178157Y (zh) * 2008-01-17 2009-01-07 富士康(昆山)电脑接插件有限公司 电连接器组件
JP2009246075A (ja) * 2008-03-31 2009-10-22 Nec Corp 電子部品の実装構造及びその実装方法
US20110059652A1 (en) * 2009-09-10 2011-03-10 Amphenol Corporation Multi-pathway connector for circuit boards
US20120268864A1 (en) * 2011-04-21 2012-10-25 Delphi Technologies, Inc. Apparatus having plurality of openings to access removable electronic devices some of which have electrical connections using no circuit board trace
US9597607B2 (en) * 2011-08-26 2017-03-21 Littlebits Electronics Inc. Modular electronic building systems with magnetic interconnections and methods of using the same
JP5852500B2 (ja) * 2012-04-25 2016-02-03 日立オートモティブシステムズ株式会社 電子制御装置
KR101292747B1 (ko) * 2012-07-11 2013-08-02 한국몰렉스 주식회사 엘이디 다이렉트 타입 커넥터
TWI627875B (zh) * 2012-07-18 2018-06-21 鐘化股份有限公司 導電層一體型軟性印刷基板
US9077097B2 (en) * 2012-08-03 2015-07-07 Honeywell International Inc. Module connector for uninterrupted communication
US20140087586A1 (en) 2012-09-25 2014-03-27 International Business Machines Corporation Securing opposing components to a circuit board
JP2014082325A (ja) * 2012-10-16 2014-05-08 Toshiba Corp 電子機器、電子機器の製造方法、およびフレキシブルプリント回路板
US9622355B2 (en) * 2013-07-08 2017-04-11 Delphi Technologies, Inc. Environmentally sealed electrical housing assembly with integrated connector
US9843148B2 (en) * 2013-07-19 2017-12-12 Foxconn Interconnect Technology Limited Flippable electrical connector
JP2015060958A (ja) * 2013-09-19 2015-03-30 日立オートモティブシステムズ株式会社 リードフレーム、リードフレームを使用した電子制御装置及びリードフレーム搭載方法
JP5960930B2 (ja) * 2013-12-13 2016-08-02 ▲華▼▲為▼終端有限公司Ｈｕａｗｅｉ Ｄｅｖｉｃｅ Ｃｏ．， Ｌｔｄ． プラグ及びプリント回路基板組立体
CN204145603U (zh) * 2014-06-03 2015-02-04 惠州市桑莱士光电有限公司 一种手机摄像头模组
US10770814B2 (en) * 2015-08-06 2020-09-08 Fci Usa Llc Orthogonal electrical connector assembly
JP5967685B1 (ja) 2016-01-13 2016-08-10 国立大学法人名古屋大学 軟骨細胞のＷｎｔ／β−カテニンシグナル伝達経路の活性化抑制組成物及び変形性関節症治療用医薬組成物
US10057985B2 (en) * 2016-06-10 2018-08-21 Denso Corporation Printed substrate and electronic device
DE202016105563U1 (de) 2016-10-06 2017-02-02 Lear Corp. Leiterplattenanordnung
JP6251834B2 (ja) 2017-07-20 2017-12-20 シャープ株式会社 放送信号受信装置、放送信号受信方法、テレビジョン受像機、制御プログラム、および記録媒体
US11088066B2 (en) * 2018-03-19 2021-08-10 Tactotek Oy Multilayer structure and related method of manufacture for electronics
JP7161441B2 (ja) 2019-04-23 2022-10-26 ジェネシスヘルスケア株式会社 慢性副鼻腔炎のリスクを判定する方法

Also Published As

Publication number Publication date
US20210335702A1 (en) 2021-10-28
EP3769594A1 (en) 2021-01-27
US11594482B2 (en) 2023-02-28
TWI791797B (zh) 2023-02-11
TW201946511A (zh) 2019-12-01
JP2021524152A (ja) 2021-09-09
JP7255603B2 (ja) 2023-04-11
KR20200130699A (ko) 2020-11-19
US11088066B2 (en) 2021-08-10
CN111869338A (zh) 2020-10-30
US20190287892A1 (en) 2019-09-19
KR102566274B1 (ko) 2023-08-10
WO2019180316A1 (en) 2019-09-26

Similar Documents

Publication Publication Date Title
MX2020009766A (es) Estructura de multiples capas y metodo relacionado de fabricacion para dispositivos electronicos.
WO2018189419A3 (en) Multilayer structure and related method of manufacture of multilayer structure
MX2018003866A (es) Estructura de capas multiples y metodo de fabricacion relacionado para componentes electronicos.
JP2017134382A5 (ja) 半導体装置
MX2017014803A (es) Cubierta de plástico termoformado para componentes electronicos y método de fabricacion relacionado.
MX368077B (es) Estructuras de capas multiples y metodos de fabricacion relacionado para componentes electronicos.
PL1956647T3 (pl) Układ przełączający z urządzeniem połączeniowym oraz sposób jego wykonania
WO2007149362A3 (en) Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
WO2008051596A3 (en) Solid state light sheet and encapsulated bare die semiconductor circuits
US9345134B2 (en) Printed wiring board
MX2020002098A (es) Estructura de multicapa para alojar componentes electronicos y metodo de fabricacion relacionado.
US20160211473A1 (en) Electrically interconnecting foil
MX2021008385A (es) Nodo electrico, metodo de fabricacion del nodo electrico y estructura multicapa que comprende el nodo electrico.
US20150262985A1 (en) Photorelay
US9949368B2 (en) Resin substrate and electronic device
TWI256128B (en) Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus
MY177667A (en) Pane with at least two electrical connection elements and a connecting conductor
US20070111566A1 (en) Elastomeric connector assembly
KR102316608B1 (ko) 가요성 회로 상의 접촉 표면을 금속 접촉부와 접촉시키는 방법, 크림핑 부품, 가요성 회로와 금속 접촉부의 연결부, 및 제어 장치
US20200161784A1 (en) Circuit device
US8558454B2 (en) Light-emitting device
MX2022014139A (es) Estructuras de conexion para la inclusion en estructuras multicapa integradas.
JP2016136612A5 (ja) 圧力センサおよび接続部材の製造方法
US10219379B1 (en) Stacked flexible printed circuit board assembly with side connection section
TW200509746A (en) Organic electronic device