MX2018003866A - Estructura de capas multiples y metodo de fabricacion relacionado para componentes electronicos. - Google Patents

Estructura de capas multiples y metodo de fabricacion relacionado para componentes electronicos.

Info

Publication number
MX2018003866A
MX2018003866A MX2018003866A MX2018003866A MX2018003866A MX 2018003866 A MX2018003866 A MX 2018003866A MX 2018003866 A MX2018003866 A MX 2018003866A MX 2018003866 A MX2018003866 A MX 2018003866A MX 2018003866 A MX2018003866 A MX 2018003866A
Authority
MX
Mexico
Prior art keywords
substrate film
substrate
connector
manufacture
multilayer structure
Prior art date
Application number
MX2018003866A
Other languages
English (en)
Inventor
Heikkinen Mikko
Sääski Jarmo
RAAPPANA Pasi
Original Assignee
Tactotek Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tactotek Oy filed Critical Tactotek Oy
Publication of MX2018003866A publication Critical patent/MX2018003866A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Abstract

Una estructura de capas múltiples (100), que comprende una película de sustrato flexible (102) que tiene un primer lado y un segundo lado opuesto, un número de trazas conductivas (108), definiendo opcionalmente almohadillas de contacto y/o conductores, de preferencia impresas en el primer lado de la película de sustrato para establecer un diseño de circuitos predeterminado deseado, una capa de plástico (104) moldeada sobre el primer lado de la película de sustrato (102) para encerrar a los circuitos entre la capa de plástico y el primer lado de la película de sustrato (102), y un conector de preferencia flexible (114) para proporcionar una conexión eléctrica externa a los circuitos impresos en el primer lado desde el segundo lado opuesto de la película de sustrato (102), un extremo del conector se une a un área de contacto predeterminada en el primer lado, mientras que el otro extremo (114B) se localiza en el segundo lado del sustrato para acoplarse con un elemento externo (118), la porción intermedia que conecta los dos extremos es alimentada a través de una abertura (115) en el sustrato, en donde la abertura que se extiende a través del espesor de la película de sustrato, de preferencia está dimensionada para alojar el conector sin un espacio adicional sustancial; se presenta un método de fabricación correspondiente.
MX2018003866A 2015-09-28 2016-09-28 Estructura de capas multiples y metodo de fabricacion relacionado para componentes electronicos. MX2018003866A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562233730P 2015-09-28 2015-09-28
PCT/FI2016/050674 WO2017055686A1 (en) 2015-09-28 2016-09-28 Multilayer structure and related method of manufacture for electronics

Publications (1)

Publication Number Publication Date
MX2018003866A true MX2018003866A (es) 2018-06-15

Family

ID=58406215

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018003866A MX2018003866A (es) 2015-09-28 2016-09-28 Estructura de capas multiples y metodo de fabricacion relacionado para componentes electronicos.

Country Status (8)

Country Link
US (1) US9801286B2 (es)
EP (2) EP3890460A1 (es)
JP (2) JP2018532617A (es)
KR (2) KR20190133289A (es)
CN (1) CN108029211B (es)
MX (1) MX2018003866A (es)
TW (1) TWI636880B (es)
WO (1) WO2017055686A1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2018012535A (es) * 2016-04-13 2019-02-25 Tactotek Oy Estructura multicapa con electronica multicapa incorporada.
US10257925B2 (en) 2017-04-10 2019-04-09 Tactotek Oy Method for manufacturing an electronic assembly
US10667396B2 (en) * 2017-08-25 2020-05-26 Tactotek Oy Multilayer structure for hosting electronics and related method of manufacture
US10561019B2 (en) * 2017-08-25 2020-02-11 Tactotek Oy Ecological multilayer structure for hosting electronics and related method of manufacture
US11357111B2 (en) * 2018-08-27 2022-06-07 Tactotek Oy Method for manufacturing a multilayer structure with embedded functionalities and related multilayer structure
US11166363B2 (en) * 2019-01-11 2021-11-02 Tactotek Oy Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node
CN111524883B (zh) * 2020-04-29 2022-09-20 业成科技（成都）有限公司 膜内电子组件及其制备方法
US10849235B1 (en) * 2020-05-20 2020-11-24 Tactotek Oy Method of manufacture of a structure and structure

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
JPS6242596A (ja) 1985-08-20 1987-02-24 松下電器産業株式会社 フレキシブルプリント基板
JPH0351953Y2 (es) * 1985-12-13 1991-11-08
JP3042531B2 (ja) * 1988-08-31 2000-05-15 大日本印刷株式会社 被熱転写シート
JPH0645481A (ja) * 1992-07-23 1994-02-18 Dainippon Ink & Chem Inc 樹脂封止電子部品及びその製造方法
JPH10190156A (ja) * 1996-12-25 1998-07-21 Canon Inc 電装部材
JP3042531U (ja) * 1997-04-15 1997-10-21 船井電機株式会社 ケーブルと基板の接続構造
US7237074B2 (en) 2003-06-13 2007-06-26 Sandisk Corporation Tracking cells for a memory system
SE527518C2 (sv) * 2003-11-21 2006-03-28 Mevein Holding Ag Metod och anordning för att montera en elektrisk eller optisk krets, täckskikt för användning vid nämnda metod samt detalj innefattande nämnda täckskikt
JP2006108387A (ja) * 2004-10-05 2006-04-20 Sony Corp フレキシブルプリント配線板補強構造
WO2008050448A1 (fr) * 2006-10-27 2008-05-02 Asahi Denka Kenkyusho Co., Ltd. Structure de connexion électrique
JP4962034B2 (ja) 2007-02-07 2012-06-27 日本電気株式会社 フレキシブルプリント基板を備える機器及びバックライトユニット並びに接続補助部材
JP5059486B2 (ja) * 2007-05-28 2012-10-24 パナソニック株式会社 部品内蔵モジュールの製造方法
WO2009018172A2 (en) 2007-07-27 2009-02-05 Second Sight Medical Products Implantable device for the brain
JP4827971B2 (ja) * 2007-09-21 2011-11-30 三菱電機株式会社 フレキシブル配線基板の固定構造
JP5732250B2 (ja) * 2010-12-28 2015-06-10 日本航空電子工業株式会社 コネクタユニット及びコネクタ装置
JP5831057B2 (ja) * 2011-09-07 2015-12-09 株式会社村田製作所 モジュールの製造方法
KR101292746B1 (ko) * 2012-07-04 2013-08-02 한국몰렉스 주식회사 오프셋 타입 와이어 투 보드 커넥터
JP6208935B2 (ja) * 2012-10-31 2017-10-04 タイコエレクトロニクスジャパン合同会社 コネクタ

Also Published As

Publication number Publication date
KR20190133289A (ko) 2019-12-02
TW201720654A (zh) 2017-06-16
WO2017055686A4 (en) 2017-06-15
EP3357310B1 (en) 2021-06-23
JP6955529B2 (ja) 2021-10-27
EP3890460A1 (en) 2021-10-06
TWI636880B (zh) 2018-10-01
WO2017055686A9 (en) 2017-08-17
WO2017055686A1 (en) 2017-04-06
JP2018532617A (ja) 2018-11-08
EP3357310A4 (en) 2019-05-08
US20170094776A1 (en) 2017-03-30
CN108029211A (zh) 2018-05-11
JP2019169722A (ja) 2019-10-03
EP3357310A1 (en) 2018-08-08
KR20180037283A (ko) 2018-04-11
CN108029211B (zh) 2019-09-13
US9801286B2 (en) 2017-10-24
KR102096095B1 (ko) 2020-04-02

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