MX2019012118A - Metodo para fabricar un ensamblaje electronico y un ensamblaje electronico. - Google Patents
Metodo para fabricar un ensamblaje electronico y un ensamblaje electronico.Info
- Publication number
- MX2019012118A MX2019012118A MX2019012118A MX2019012118A MX2019012118A MX 2019012118 A MX2019012118 A MX 2019012118A MX 2019012118 A MX2019012118 A MX 2019012118A MX 2019012118 A MX2019012118 A MX 2019012118A MX 2019012118 A MX2019012118 A MX 2019012118A
- Authority
- MX
- Mexico
- Prior art keywords
- contact pad
- electrical contact
- molding
- electronic assembly
- cavity
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
- B29C45/14377—Coating a portion of the article, e.g. the edge of the article using an additional insert, e.g. a fastening element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2628—Moulds with mould parts forming holes in or through the moulded article, e.g. for bearing cages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
- B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14688—Coating articles provided with a decoration
- B29C2045/14704—Coating articles provided with a decoration ink decorations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Se presentan un método para fabricar un ensamblaje electrónico y ensamblajes electrónicos; el método comprende obtener una película de sustrato para acomodar componentes electrónicos, proporcionar al menos una almohadilla de contacto eléctrico a la película de sustrato, acoplar un miembro conductor eléctrico a la almohadilla de contacto eléctrico, y moldeado, tal como mediante moldeado por inyección, una capa de material sobre la película de sustrato para incrustar el miembro conductor eléctrico elástico utilizando una estructura de molde que define una cavidad para moldeado; el miembro conductor eléctrico elástico está dispuesto para extenderse durante el moldeado desde la almohadilla de contacto eléctrico a través de la cavidad para estar en contacto con un elemento en un lado diferente de la cavidad con respecto a la almohadilla de contacto eléctrico para mantener al menos una parte del miembro conductor eléctrico elástico accesible después del moldeado para proporcionar una conexión eléctrica a través de la capa de material a la almohadilla de contacto eléctrico.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/483,202 US10257925B2 (en) | 2017-04-10 | 2017-04-10 | Method for manufacturing an electronic assembly |
PCT/FI2018/050250 WO2018189418A1 (en) | 2017-04-10 | 2018-04-06 | Method for manufacturing an electronic assembly and an electronic assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2019012118A true MX2019012118A (es) | 2019-11-21 |
Family
ID=62063567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2019012118A MX2019012118A (es) | 2017-04-10 | 2018-04-06 | Metodo para fabricar un ensamblaje electronico y un ensamblaje electronico. |
Country Status (7)
Country | Link |
---|---|
US (2) | US10257925B2 (es) |
EP (1) | EP3609669B1 (es) |
JP (1) | JP7113027B2 (es) |
KR (1) | KR102464287B1 (es) |
CN (1) | CN110621466B (es) |
MX (1) | MX2019012118A (es) |
WO (1) | WO2018189418A1 (es) |
Families Citing this family (8)
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US10559237B2 (en) * | 2015-07-24 | 2020-02-11 | The Boeing Company | Method for conforming a display panel |
TWI708539B (zh) * | 2019-04-10 | 2020-10-21 | 欣興電子股份有限公司 | 印刷電路板堆疊結構及其形成方法 |
US11800641B2 (en) | 2019-06-14 | 2023-10-24 | Hutchinson Aeronautique & Industrie Ltée. | Composite panel comprising an integrated electrical circuit and manufacturing method thereof |
CN110324973B (zh) * | 2019-08-07 | 2022-10-28 | 深圳市恒翊科技有限公司 | 覆膜注塑成型的电路结构体及其制作方法 |
WO2021045958A1 (en) * | 2019-09-06 | 2021-03-11 | Illumina, Inc. | Pcb interconnect scheme for co-planar led strips |
US20210188193A1 (en) * | 2019-12-24 | 2021-06-24 | Inteva Products, Llc | Vehicle interior trim part formed with intergrated electronics and method of making |
KR102357563B1 (ko) * | 2020-12-14 | 2022-02-07 | 인탑스 주식회사 | 전자회로 도금 공법을 이용한 ime 구조 및 그 제조방법 |
CN116916851A (zh) * | 2021-03-05 | 2023-10-20 | 圣犹达医疗用品心脏病学部门有限公司 | 用于超声导管的柔性电子电路 |
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KR20180129924A (ko) | 2016-04-13 | 2018-12-05 | 택토텍 오와이 | 내장 다층 전자 소자를 포함하는 다층 구조체 |
-
2017
- 2017-04-10 US US15/483,202 patent/US10257925B2/en active Active
- 2017-11-14 US US15/811,889 patent/US10653004B2/en active Active
-
2018
- 2018-04-06 MX MX2019012118A patent/MX2019012118A/es unknown
- 2018-04-06 WO PCT/FI2018/050250 patent/WO2018189418A1/en active Search and Examination
- 2018-04-06 CN CN201880030920.4A patent/CN110621466B/zh active Active
- 2018-04-06 KR KR1020197033211A patent/KR102464287B1/ko active IP Right Grant
- 2018-04-06 JP JP2019555487A patent/JP7113027B2/ja active Active
- 2018-04-06 EP EP18720653.7A patent/EP3609669B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3609669A1 (en) | 2020-02-19 |
WO2018189418A1 (en) | 2018-10-18 |
JP7113027B2 (ja) | 2022-08-04 |
EP3609669B1 (en) | 2020-12-23 |
US10257925B2 (en) | 2019-04-09 |
KR20190137870A (ko) | 2019-12-11 |
KR102464287B1 (ko) | 2022-11-07 |
US20180295712A1 (en) | 2018-10-11 |
US20180295711A1 (en) | 2018-10-11 |
JP2020516487A (ja) | 2020-06-11 |
CN110621466A (zh) | 2019-12-27 |
CN110621466B (zh) | 2022-09-13 |
US10653004B2 (en) | 2020-05-12 |
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