CN105451443A - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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Publication number
CN105451443A
CN105451443A CN201510710461.2A CN201510710461A CN105451443A CN 105451443 A CN105451443 A CN 105451443A CN 201510710461 A CN201510710461 A CN 201510710461A CN 105451443 A CN105451443 A CN 105451443A
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China
Prior art keywords
printed circuit
circuit board
pcb
plate portion
coupling part
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CN201510710461.2A
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English (en)
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CN105451443B (zh
Inventor
F·鲍尔
D·巴贡
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Vitesco Technologies GmbH
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Continental Automotive GmbH
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Publication of CN105451443A publication Critical patent/CN105451443A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/7047—Locking or fixing a connector to a PCB with a fastener through a screw hole in the coupling device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/7041—Gluing or taping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

本发明涉及一种带有至少两个刚性印刷电路板部分(1a，1b)的印刷电路板(1)，所述刚性印刷电路板部分通过至少一个比刚性印刷电路板部分(1a，1b)薄的柔性连接部分(1c)彼此连接，并通过连接部分(1c)的弯曲可以彼此相对移动，其中通过印刷电路板部分(1a，1b)相对于连接部分(1c)的不同的厚度而形成的凹槽(5)用弹性材料(7)来填充。

Description

印刷电路板
技术领域
本发明涉及一种带有至少两个刚性印刷电路板部分的印刷电路板，所述刚性印刷电路板部分通过至少一个比该刚性印刷电路板部分薄的、柔性的连接部分彼此连接，并通过连接部分的弯曲可以彼此相对移动。
背景技术
从DE102013200635A1已知这样的印刷电路板。在那里，多个刚性印刷电路板部分通过相应数目的柔性连接部分彼此连接，并可以通过相应连接部分的弯曲而被引入大致垂直于分别相邻的印刷电路板部分定向的位置中，以便可以以该方式在壳体内节省空间地来布置。
在各个或所有印刷电路板部分上往往布置功率器件，所述功率器件由于其高度发热必须被冷却，因此所述功率器件必须与往往是金属的壳体壁或其他冷却体紧密接触。为此DE102013200635A1提出，通过相关印刷电路板部分与冷却板、尤其是壳体壁的粘结或者力或形状配合的连接设置相关印刷电路板部分的热力学连接。
此外，在DE4212369C2中提出，印刷电路板借助于金属弹簧卡紧在壳体壁上。
然而，所有这些连接和固定方法都费用高昂和成本高昂。
发明内容
下面应该借助于附图根据实施例详细解释本发明。在此：
附图说明
图1示出用于制造按照本发明的印刷电路板的制造方法步骤；以及
图2示出按照本发明的印刷电路板的一种弯曲的变型方案。
具体实施方式
图1示出印刷电路板1中的一部分，该印刷电路板由绝缘的衬底2、例如玻璃纤维增强的环氧树脂形成，并在该印刷电路板的两个表面上设有金属层3，4。金属层3，4在此整面地被示出，然而在印刷电路板1的未示出的区域被结构化，以便在印刷电路板1的表面上产生导体电路。原则上应该也可以的是，在衬底2的内部中设置其他导体电路，即使用多层印刷电路板。
在第一方法步骤中，如其在图1的中间图示中所示，凹槽5例如通过铣削被引入到印刷电路板1中。由此形成两个刚性印刷电路板部分1a和1b，和一个柔性连接部分1c。视连接部分1c应该多柔性而定，该凹槽5可以更深或更浅地被引入到印刷电路板1中。在图1所示的示例中，衬底2的一部分还保留在凹槽5底部处，然而原则上也可以被铣穿直至下金属层4上。
在后续方法步骤中，按照图1的下部图示，弹性材料7被引入到凹槽5中。
通过按照本发明的这个措施，在印刷电路板1在柔性连接部分1c处弯曲时，如图2中所示，使得两个印刷电路板部分1a和1b大致彼此垂直地定向，例如是绝缘体并且可以是硅树脂的柔性材料7被压紧，并因此对两个印刷电路板部分1a，1b产生复位力。
如果现在把以该方式弯曲的印刷电路板1引入到壳体内，并且两个印刷电路板部分1a或1b中的一个固定在壳体上，这例如可以通过拧紧、粘贴或类似的来进行，则另外的印刷电路板部分通过弹性材料7的复位力压到相应的壳体壁上，由此在这里可以省去其他固定装置。
如果印刷电路板例如由三个刚性印刷电路板部分组成并具有两个柔性连接部分，该印刷电路板的两个连接部分各自弯曲90°，则这样U形弯曲的印刷电路板可以不用其他固定装置特征地安置在壳体内，并且在此由于凹槽5内弹性材料7的复位力，印刷电路板部分被压到壳体壁上或被压到底部和顶部上，以便例如建立良好的导热连接，以用于冷却印刷电路板部分上的功率器件。

Claims (5)

1.带有至少两个刚性印刷电路板部分(1a，1b)的印刷电路板(1)，所述刚性印刷电路板部分通过至少一个比刚性印刷电路板部分(1a，1b)薄的、柔性连接部分(1c)彼此连接，并通过连接部分(1c)的弯曲可以彼此相对移动，其特征在于，
通过印刷电路板部分(1a，1b)相对于连接部分(1c)的不同的厚度而形成的凹槽(5)用弹性材料(7)来填充。
2.根据权利要求1所述的印刷电路板，其特征在于，所述印刷电路板部分(1a，1b)和所述连接部分(1c)一体地构造。
3.根据权利要求2所述的印刷电路板，其特征在于，所述凹槽(5)是通过深铣单件的印刷电路板(1)而形成的。
4.根据上列权利要求之一所述的印刷电路板，其特征在于，所述弹性材料(7)是硅树脂。
5.根据上列权利要求之一所述的印刷电路板，其特征在于，所述弹性材料(7)是绝缘体。
CN201510710461.2A 2014-09-18 2015-09-18 印刷电路板 Active CN105451443B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014218821.0 2014-09-18
DE102014218821.0A DE102014218821A1 (de) 2014-09-18 2014-09-18 Leiterplatte

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CN105451443A true CN105451443A (zh) 2016-03-30
CN105451443B CN105451443B (zh) 2018-08-07

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CN (1) CN105451443B (zh)
DE (1) DE102014218821A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN107845868A (zh) * 2016-06-17 2018-03-27 泰科电子机电元件有限公司 具有增大的安装表面的电动汽车连接器

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Publication number Priority date Publication date Assignee Title
CN107864552B (zh) * 2017-11-09 2019-12-06 京东方科技集团股份有限公司 柔性电路板及其组装方法以及显示装置
US10880995B2 (en) 2017-12-15 2020-12-29 2449049 Ontario Inc. Printed circuit board with stress relief zones for component and solder joint protection
US11503705B2 (en) 2020-12-16 2022-11-15 Valeo North America, Inc. Light source support for automotive vehicle

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CN101547551A (zh) * 2008-03-28 2009-09-30 欧陆汽车有限责任公司 印刷电路板和制造印刷电路板的方法
US8029165B2 (en) * 2007-05-21 2011-10-04 Goldeneye, Inc. Foldable LED light recycling cavity
US8624130B2 (en) * 2008-12-16 2014-01-07 Continental Automotive Gmbh Circuit board having grown metal layer in a flexible zone

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DE4212369C2 (de) 1992-04-13 1997-12-11 Siemens Ag Steuergerät
US6927344B1 (en) * 2004-02-27 2005-08-09 Motorola, Inc. Flexible circuit board assembly
US8342717B1 (en) 2007-05-21 2013-01-01 Goldeneye, Inc. Foldable LEDs light recycling cavity
DE102009006757B3 (de) * 2009-01-30 2010-08-19 Continental Automotive Gmbh Lötstopplack-Beschichtung für starrbiegsame Leiterplatten
JP5360223B2 (ja) * 2009-10-05 2013-12-04 株式会社村田製作所 回路基板
DE102012221002A1 (de) * 2012-11-16 2014-05-22 Jumatech Gmbh Abwinkelbare und/oder abgewinkelte Leiterplattenstruktur mit zumindest zwei Leiterplattenabschnitten und Verfahren zu deren Herstellung
DE102013200635B4 (de) 2013-01-17 2021-10-14 Vitesco Technologies GmbH Vorrichtung zur Aufnahme von Elektronikbauteilen

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US8029165B2 (en) * 2007-05-21 2011-10-04 Goldeneye, Inc. Foldable LED light recycling cavity
CN101547551A (zh) * 2008-03-28 2009-09-30 欧陆汽车有限责任公司 印刷电路板和制造印刷电路板的方法
US8624130B2 (en) * 2008-12-16 2014-01-07 Continental Automotive Gmbh Circuit board having grown metal layer in a flexible zone

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107845868A (zh) * 2016-06-17 2018-03-27 泰科电子机电元件有限公司 具有增大的安装表面的电动汽车连接器
CN107845868B (zh) * 2016-06-17 2020-10-23 泰科电子机电元件有限公司 具有增大的安装表面的电动汽车连接器

Also Published As

Publication number Publication date
US20160087357A1 (en) 2016-03-24
CN105451443B (zh) 2018-08-07
US9660365B2 (en) 2017-05-23
DE102014218821A1 (de) 2016-03-24

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Effective date of registration: 20230417

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Patentee before: CONTINENTAL AUTOMOTIVE GmbH