BRPI0411163A - processo para montar um componente eletrÈnico em uma base - Google Patents
processo para montar um componente eletrÈnico em uma baseInfo
- Publication number
- BRPI0411163A BRPI0411163A BRPI0411163-0A BRPI0411163A BRPI0411163A BR PI0411163 A BRPI0411163 A BR PI0411163A BR PI0411163 A BRPI0411163 A BR PI0411163A BR PI0411163 A BRPI0411163 A BR PI0411163A
- Authority
- BR
- Brazil
- Prior art keywords
- electronic component
- substrate
- conductive
- component
- tracks
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Abstract
"PROCESSO PARA MONTAR UM COMPONENTE ELETRÈNICO EM UMA BASE". O objetivo desta invenção é propor um processo de fabricação de um transponder em forma de um cartão ou de uma etiqueta capaz de resistir a flexões ou torções sem interromper as conexões dos componentes eletrónIcos. Este objetivo é alcançado através de um processo de montagem de pelo menos um componente eletrónico (1) incluindo áreas condutoras de superfície plana (3) que são conectadas às trilhas condutoras (6) localizadas na superfície de um suporte isolante geralmente plano chamado base (5) caracterizada pelas seguintes etapas: - colocar a base (5) em uma superfície de trabalho, cuja face inclui trilhas condutoras (6) que são orientadas para cima, - colocar o componente eletrónico (1) em uma cavidade (7) da base (5) situada em uma zona incluindo as trilhas condutoras (6), as áreas condutoras (3) do componente (1) para contatar-se com as trilhas correspondentes (6) da base (5), - aplicar uma camada de material isolante (8) que se estende ao mesmo tempo sobre o componente (1) e pelo menos em uma zona da base adjacente ao mencionado componente (1), de tal maneira que a conexão elétrica entre as áreas condutoras (3) e as trilhas condutoras (6) seja assegurada pela pressão da camada isolante (8) no componente (1).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH8322003 | 2003-05-13 | ||
PCT/IB2004/050645 WO2004102469A1 (fr) | 2003-05-13 | 2004-05-12 | Procédé d'assemblage d'un composant électronique sur un substrat |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0411163A true BRPI0411163A (pt) | 2006-07-11 |
Family
ID=33438095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0411163-0A BRPI0411163A (pt) | 2003-05-13 | 2004-05-12 | processo para montar um componente eletrÈnico em uma base |
Country Status (18)
Country | Link |
---|---|
US (1) | US8127997B2 (pt) |
EP (1) | EP1623369B1 (pt) |
JP (1) | JP5042627B2 (pt) |
KR (1) | KR101158128B1 (pt) |
CN (1) | CN100468450C (pt) |
AT (1) | ATE353457T1 (pt) |
AU (1) | AU2004239501B2 (pt) |
BR (1) | BRPI0411163A (pt) |
CA (1) | CA2524673C (pt) |
DE (1) | DE602004004647T2 (pt) |
ES (1) | ES2281802T3 (pt) |
MX (1) | MXPA05011963A (pt) |
MY (1) | MY148205A (pt) |
PL (1) | PL1623369T3 (pt) |
PT (1) | PT1623369E (pt) |
RU (1) | RU2328840C2 (pt) |
TW (1) | TWI331497B (pt) |
WO (1) | WO2004102469A1 (pt) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101174182B1 (ko) | 2006-06-19 | 2012-08-20 | 나그라아이디 에스.에이. | 각각 전자 모듈을 포함하는 카드와 중간 제품을 조립하는 방법 |
AU2007263133B2 (en) | 2006-06-19 | 2012-04-05 | Nagravision S.A. | Method of fabricating cards comprising at least one electronic module, assembly involved in this method and intermediate product |
WO2008082617A2 (en) | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Mailing apparatus for powered cards |
WO2008082616A1 (en) | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Card configured to receive separate battery |
CA2678157C (en) | 2007-02-09 | 2014-04-01 | Nagraid S.A. | Method of fabricating electronic cards including at least one printed pattern |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
US9202162B2 (en) * | 2012-11-09 | 2015-12-01 | Maxim Integrated Products, Inc. | Embedded radio frequency identification (RFID) package |
MX2017010502A (es) | 2015-02-20 | 2018-03-14 | Nid Sa | Proceso de fabricacion de un dispositivo que incluye al menos un elemento electronico asociado a un substrato y a una antena. |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3122981A1 (de) * | 1981-06-10 | 1983-01-05 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Verfahren zum einbau von ic-bausteinen in ausweiskarten |
JPS6420197A (en) * | 1987-07-16 | 1989-01-24 | Toshiba Corp | Portable medium |
DE4401458A1 (de) * | 1994-01-19 | 1995-07-20 | Ods Gmbh & Co Kg | Verfahren und Vorrichtung zum Herstellen von Chipkarten |
DE4403753C1 (de) * | 1994-02-08 | 1995-07-20 | Angewandte Digital Elektronik | Kombinierte Chipkarte |
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
DE4416697A1 (de) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
EP0786357A4 (en) | 1994-09-22 | 2000-04-05 | Rohm Co Ltd | CONTACTLESS CHIP CARD AND METHOD FOR PRODUCING THE SAME |
JPH091972A (ja) * | 1995-06-26 | 1997-01-07 | Hitachi Ltd | Icカード |
DE19527398A1 (de) * | 1995-07-27 | 1997-01-30 | Philips Patentverwaltung | Verfahren zum Löten von Bauelementen auf einer Trägerfolie |
US6072698A (en) * | 1995-09-27 | 2000-06-06 | Siemens Aktiengesellschaft | Chip module with heat insulation for incorporation into a chip card |
JPH09286187A (ja) * | 1996-04-22 | 1997-11-04 | Toppan Printing Co Ltd | Icカード、icカード製造用中間体およびicカードの製造方法 |
DE19645083C2 (de) * | 1996-11-01 | 2000-01-27 | Austria Card Gmbh Wien | Kontaktlose Chipkarte mit Transponderspule |
DE19710144C2 (de) * | 1997-03-13 | 1999-10-14 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
CN1075451C (zh) * | 1997-05-19 | 2001-11-28 | 日立马库塞鲁株式会社 | 柔性信用卡模块及其制造方法以及使用柔性信用卡模块制造信息载体的方法 |
US6607135B1 (en) * | 1997-06-23 | 2003-08-19 | Rohm Co., Ltd. | Module for IC card, IC card, and method for manufacturing module for IC card |
EP0952542B1 (en) * | 1997-06-23 | 2003-10-29 | Rohm Co., Ltd. | Ic module and ic card |
JP3914620B2 (ja) * | 1997-10-16 | 2007-05-16 | シチズン時計株式会社 | Icカード |
JP2000207521A (ja) * | 1999-01-18 | 2000-07-28 | Toppan Printing Co Ltd | 複合icカ―ドとその製造方法 |
FR2790849B1 (fr) * | 1999-03-12 | 2001-04-27 | Gemplus Card Int | Procede de fabrication pour dispositif electronique du type carte sans contact |
EP1043684A1 (de) * | 1999-03-29 | 2000-10-11 | OMD Productions AG | Informationsträger |
JP3661482B2 (ja) * | 1999-04-06 | 2005-06-15 | ソニーケミカル株式会社 | 半導体装置 |
US20020110955A1 (en) * | 1999-06-15 | 2002-08-15 | Philippe Patrice | Electronic device including at least one chip fixed to a support and a method for manufacturing such a device |
FR2795200B1 (fr) * | 1999-06-15 | 2001-08-31 | Gemplus Card Int | Dispositif electronique comportant au moins une puce fixee sur un support et procede de fabrication d'un tel dispositif |
FR2826154B1 (fr) * | 2001-06-14 | 2004-07-23 | A S K | Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux |
FR2829857B1 (fr) * | 2001-09-14 | 2004-09-17 | A S K | Carte a puce sans contact ou hybride contact-sans contact a tenue renforcee du module electronique |
JP2003108970A (ja) * | 2001-09-29 | 2003-04-11 | Toshiba Corp | カード型電子機器 |
US6830193B2 (en) * | 2001-11-29 | 2004-12-14 | Matsushita Electric Industrial Co., Ltd. | Non-contact IC card |
CN2533525Y (zh) * | 2002-04-22 | 2003-01-29 | 唐智良 | 远距离无源微波电子识别卡 |
KR100910769B1 (ko) * | 2002-06-11 | 2009-08-04 | 삼성테크윈 주식회사 | Ic 카드 및, 그것의 제조 방법 |
EP1544787A1 (en) * | 2003-12-19 | 2005-06-22 | Axalto SA | Contactless card including an antenna switch |
-
2004
- 2004-04-14 MY MYPI20041362A patent/MY148205A/en unknown
- 2004-04-19 TW TW093110859A patent/TWI331497B/zh not_active IP Right Cessation
- 2004-05-12 RU RU2005134859/09A patent/RU2328840C2/ru not_active IP Right Cessation
- 2004-05-12 CN CNB2004800128885A patent/CN100468450C/zh not_active Expired - Fee Related
- 2004-05-12 CA CA2524673A patent/CA2524673C/en not_active Expired - Fee Related
- 2004-05-12 PT PT04732370T patent/PT1623369E/pt unknown
- 2004-05-12 MX MXPA05011963A patent/MXPA05011963A/es active IP Right Grant
- 2004-05-12 ES ES04732370T patent/ES2281802T3/es not_active Expired - Lifetime
- 2004-05-12 WO PCT/IB2004/050645 patent/WO2004102469A1/fr active IP Right Grant
- 2004-05-12 AT AT04732370T patent/ATE353457T1/de active
- 2004-05-12 JP JP2006530807A patent/JP5042627B2/ja not_active Expired - Fee Related
- 2004-05-12 KR KR1020057021437A patent/KR101158128B1/ko not_active IP Right Cessation
- 2004-05-12 PL PL04732370T patent/PL1623369T3/pl unknown
- 2004-05-12 AU AU2004239501A patent/AU2004239501B2/en not_active Ceased
- 2004-05-12 BR BRPI0411163-0A patent/BRPI0411163A/pt not_active Application Discontinuation
- 2004-05-12 EP EP04732370A patent/EP1623369B1/fr not_active Expired - Lifetime
- 2004-05-12 US US10/556,398 patent/US8127997B2/en not_active Expired - Fee Related
- 2004-05-12 DE DE602004004647T patent/DE602004004647T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
AU2004239501B2 (en) | 2010-06-17 |
ATE353457T1 (de) | 2007-02-15 |
US8127997B2 (en) | 2012-03-06 |
EP1623369A1 (fr) | 2006-02-08 |
KR20060017779A (ko) | 2006-02-27 |
CN100468450C (zh) | 2009-03-11 |
CN1788275A (zh) | 2006-06-14 |
PL1623369T3 (pl) | 2007-07-31 |
JP5042627B2 (ja) | 2012-10-03 |
RU2005134859A (ru) | 2006-07-27 |
AU2004239501A1 (en) | 2004-11-25 |
RU2328840C2 (ru) | 2008-07-10 |
CA2524673A1 (en) | 2004-11-25 |
US20060226237A1 (en) | 2006-10-12 |
DE602004004647T2 (de) | 2007-11-08 |
MY148205A (en) | 2013-03-15 |
ES2281802T3 (es) | 2007-10-01 |
TWI331497B (en) | 2010-10-01 |
WO2004102469A1 (fr) | 2004-11-25 |
CA2524673C (en) | 2012-01-24 |
PT1623369E (pt) | 2007-05-31 |
TW200501859A (en) | 2005-01-01 |
JP2007511811A (ja) | 2007-05-10 |
MXPA05011963A (es) | 2006-02-02 |
KR101158128B1 (ko) | 2012-06-19 |
EP1623369B1 (fr) | 2007-02-07 |
DE602004004647D1 (de) | 2007-03-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B15K | Others concerning applications: alteration of classification |
Free format text: AS CLASSIFICACOES ANTERIORES ERAM: G06K 19/077 , B23K 1/00 Ipc: G06K 19/077 (2006.01) |
|
B25A | Requested transfer of rights approved |
Owner name: NAGRAVISION S.A (CH) |
|
B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
B09B | Patent application refused [chapter 9.2 patent gazette] |
Free format text: INDEFIRO O PEDIDO DE ACORDO COM O ARTIGO 8O COMBINADO COM ARTIGO 13 E ART. 25 DA LPI |
|
B09B | Patent application refused [chapter 9.2 patent gazette] |