JP2007511811A - 基板への電子部品の実装方法 - Google Patents
基板への電子部品の実装方法 Download PDFInfo
- Publication number
- JP2007511811A JP2007511811A JP2006530807A JP2006530807A JP2007511811A JP 2007511811 A JP2007511811 A JP 2007511811A JP 2006530807 A JP2006530807 A JP 2006530807A JP 2006530807 A JP2006530807 A JP 2006530807A JP 2007511811 A JP2007511811 A JP 2007511811A
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- JP
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- Prior art keywords
- substrate
- chip
- component
- bonding pad
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Credit Cards Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Radar Systems Or Details Thereof (AREA)
- Wire Bonding (AREA)
Abstract
Description
‐ 作業面に基板を置き、導線経路を含む面を上に向ける工程と、
‐ 導線経路を含む部位内にある基板のスロット内に電子部品を設置し、部品のボンディングパッドを基板の対応する経路に接触させる工程と、
‐ 絶縁材料層を、部品と、前記部品を囲む基板の少なくとも1つの部位の上に延びるように被せ、絶縁層を部品に圧着することにより、ボンディングパッドと導線経路の間の電気的接続が確保されるようにする工程と
を含む方法により達成される。
Claims (14)
- 基板(5)とよばれる通常は平面の絶縁支持体の表面上に配置された導線経路に接続されたほぼ平面のボンディングパッド(3)を含む少なくとも1つの電子部品(1)の実装方法であって、
‐ 作業面に基板(5)を置き、導線経路(6')を含む面を上に向ける工程と、
‐ 導線経路(6')を含む部位内にある基板(5)のスロット(7)内に電子部品(1)を設置し、部品(1)のボンディングパッド(3)を基板(5)の対応する経路に接触させる工程と、
‐ 絶縁材料層(8)を、部品(1)と、前記部品(1)を囲む基板(5)の少なくとも1つの部位の上に延びるように被せ、絶縁層(8)を部品に圧着することにより、ボンディングパッド(3)と導線経路(6')の間の電気的接続が確保されるようにする工程と
を含むことを特徴とする電子部品の実装方法。 - 電子部品(1)が、表面のうちの1つに接点を具備するチップ(2)で形成され、前記接点が、チップ(2)の接点を延長するボンディングパッド(3)を構成する導体シートに付加され、チップ(2)の反対の面に絶縁層(4)が被覆されることを特徴とする、請求項1に記載の方法。
- 絶縁材料層が、部品(1)がその被覆面から挿入されるスロット(7)を含む第1基板(5)で構成され、前記部品のボンディングパッド(3)が、作業面の第2基板(9)の対応するボンディングパッド(6)に接続されることを特徴とする、請求項1に記載の方法。
- 電子部品(1)が、面のうちの1つに接点を具備するチップ(2)で形成され、前記接点が、チップ(2)の接点を延長するボンディングパッド(3)を構成する導体シートに付加されることを特徴とする、請求項1に記載の方法。
- 絶縁材料層が、部品(1)のチップ(2)がその被覆面から挿入されるスロット(7)を含む第1基板(5)で構成され、基板(5)の面を押圧する前記部品(1)のボンディングパッド(3)が作業面上に置かれた第2基板(9)の対応するボンディングパッド(6)に接続されることを特徴とする、請求項1及び4に記載の方法。
- 部品(7)のスロットが、部品(1)のチップ(2)を加熱し、次に、適切な工具により前記チップ(2)を基板(5)の材料内に押し込むことによって得られ、前記部品(1)のボンディングパッド(3)が基板(5)の面に押圧されることを特徴とする、請求項1及び4に記載の方法。
- 電子部品(1)が、ほぼ平面の接点を面のうちの1つにおいて具備するチップ(2)で形成されるにことを特徴とする、請求項1に記載の方法。
- 絶縁材料層が、チップ(2)が挿入されるスロット(7)を含む第1基板(5)で構成され、基板(5)の表面と同じ高さの前記チップの接点が、作業面上に置かれた第2基板(9)の対応するボンディングパッド(6)に接続されることを特徴とする、請求項7に記載の方法。
- 部品(1)のスロット(7)が切削加工された空洞又はスタンピング加工された窓であることを特徴とする、請求項1に記載の方法。
- チップ(2)のスロット(7)が、加熱し、次に、適切な工具により前記チップ(2)を基板(5)の材料内に押し込むことによって得られ、前記チップ(2)のボンディングパッドが基板(5)の表面と同じ高さにあることを特徴とする、請求項8に記載の方法。
- 電子部品(1)が、表面のうちの1つに平面の接点ユニットを含み、対向する面にユニットの各接点に接続されたボンディングパッドを含むモジュールで形成されることを特徴とする、請求項1に記載の方法。
- モジュールが、モジュールの厚さにほぼ等しい厚さの第1基板(5)内に切り込まれた窓を具備するスロット(7)の中に挿入され、平面接点ユニットが前記基板(5)の表面と同じ高さであり、対向する面のボンディングパッドが、第1基板(5)上に組みつけられた第2基板(9)の導線経路(6')に載架することを特徴とする、請求項1及び11に記載の方法。
- 少なくとも1つの追加モジュール又はチップ(2)がいずれかの基板(5,9)内に実装され、前記モジュールが、いずれかの基板(5,9)の対応する導線経路(6')に押圧接続されたボンディングパッド(3)を含むことを特徴とする、請求項12に記載の方法。
- 基板(5,9)を重ねることにより形成されるアセンブリーを接着及び圧着する追加工程を含むことを特徴とする、請求項3及び13に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH20030832/03 | 2003-05-13 | ||
CH8322003 | 2003-05-13 | ||
PCT/IB2004/050645 WO2004102469A1 (fr) | 2003-05-13 | 2004-05-12 | Procédé d'assemblage d'un composant électronique sur un substrat |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007511811A true JP2007511811A (ja) | 2007-05-10 |
JP2007511811A5 JP2007511811A5 (ja) | 2012-06-07 |
JP5042627B2 JP5042627B2 (ja) | 2012-10-03 |
Family
ID=33438095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006530807A Expired - Fee Related JP5042627B2 (ja) | 2003-05-13 | 2004-05-12 | 基板への電子部品の実装方法 |
Country Status (18)
Country | Link |
---|---|
US (1) | US8127997B2 (ja) |
EP (1) | EP1623369B1 (ja) |
JP (1) | JP5042627B2 (ja) |
KR (1) | KR101158128B1 (ja) |
CN (1) | CN100468450C (ja) |
AT (1) | ATE353457T1 (ja) |
AU (1) | AU2004239501B2 (ja) |
BR (1) | BRPI0411163A (ja) |
CA (1) | CA2524673C (ja) |
DE (1) | DE602004004647T2 (ja) |
ES (1) | ES2281802T3 (ja) |
MX (1) | MXPA05011963A (ja) |
MY (1) | MY148205A (ja) |
PL (1) | PL1623369T3 (ja) |
PT (1) | PT1623369E (ja) |
RU (1) | RU2328840C2 (ja) |
TW (1) | TWI331497B (ja) |
WO (1) | WO2004102469A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2036008B1 (fr) | 2006-06-19 | 2015-04-01 | Nagravision S.A. | Procede de fabrication de cartes comprenant au moins un module electronique, ensemble intervenant dans ce procede et produit intermediaire |
WO2007147727A1 (fr) | 2006-06-19 | 2007-12-27 | Nagraid S.A. | Procede de fabrication de cartes comprenant chacune un module electronique et produits intermediaires |
WO2008082616A1 (en) | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Card configured to receive separate battery |
WO2008082617A2 (en) | 2006-12-29 | 2008-07-10 | Solicore, Inc. | Mailing apparatus for powered cards |
PL2132684T3 (pl) | 2007-02-09 | 2013-03-29 | Nagravision Sa | Sposób produkcji kart elektronicznych zawierających co najmniej jeden nadrukowany wzór |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
US9202162B2 (en) * | 2012-11-09 | 2015-12-01 | Maxim Integrated Products, Inc. | Embedded radio frequency identification (RFID) package |
EP3259708A1 (fr) | 2015-02-20 | 2017-12-27 | Nid Sa | Procédé de fabrication d'un dispositif comportant au moins un élément électronique associé à un substrat et à une antenne |
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WO2000055808A1 (fr) * | 1999-03-12 | 2000-09-21 | Gemplus | Procede de fabrication pour dispositif electronique du type carte sans contact |
JP2000294577A (ja) * | 1999-04-06 | 2000-10-20 | Sony Chem Corp | 半導体装置 |
WO2002103628A1 (fr) * | 2001-06-14 | 2002-12-27 | Ask S.A. | Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux |
JP2003108970A (ja) * | 2001-09-29 | 2003-04-11 | Toshiba Corp | カード型電子機器 |
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-
2004
- 2004-04-14 MY MYPI20041362A patent/MY148205A/en unknown
- 2004-04-19 TW TW093110859A patent/TWI331497B/zh not_active IP Right Cessation
- 2004-05-12 RU RU2005134859/09A patent/RU2328840C2/ru not_active IP Right Cessation
- 2004-05-12 DE DE602004004647T patent/DE602004004647T2/de not_active Expired - Lifetime
- 2004-05-12 WO PCT/IB2004/050645 patent/WO2004102469A1/fr active IP Right Grant
- 2004-05-12 ES ES04732370T patent/ES2281802T3/es not_active Expired - Lifetime
- 2004-05-12 BR BRPI0411163-0A patent/BRPI0411163A/pt not_active Application Discontinuation
- 2004-05-12 EP EP04732370A patent/EP1623369B1/fr not_active Expired - Lifetime
- 2004-05-12 AT AT04732370T patent/ATE353457T1/de active
- 2004-05-12 PL PL04732370T patent/PL1623369T3/pl unknown
- 2004-05-12 US US10/556,398 patent/US8127997B2/en not_active Expired - Fee Related
- 2004-05-12 KR KR1020057021437A patent/KR101158128B1/ko not_active IP Right Cessation
- 2004-05-12 CA CA2524673A patent/CA2524673C/en not_active Expired - Fee Related
- 2004-05-12 PT PT04732370T patent/PT1623369E/pt unknown
- 2004-05-12 JP JP2006530807A patent/JP5042627B2/ja not_active Expired - Fee Related
- 2004-05-12 MX MXPA05011963A patent/MXPA05011963A/es active IP Right Grant
- 2004-05-12 CN CNB2004800128885A patent/CN100468450C/zh not_active Expired - Fee Related
- 2004-05-12 AU AU2004239501A patent/AU2004239501B2/en not_active Ceased
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH091972A (ja) * | 1995-06-26 | 1997-01-07 | Hitachi Ltd | Icカード |
JPH09286187A (ja) * | 1996-04-22 | 1997-11-04 | Toppan Printing Co Ltd | Icカード、icカード製造用中間体およびicカードの製造方法 |
JP2000207521A (ja) * | 1999-01-18 | 2000-07-28 | Toppan Printing Co Ltd | 複合icカ―ドとその製造方法 |
WO2000055808A1 (fr) * | 1999-03-12 | 2000-09-21 | Gemplus | Procede de fabrication pour dispositif electronique du type carte sans contact |
JP2000294577A (ja) * | 1999-04-06 | 2000-10-20 | Sony Chem Corp | 半導体装置 |
WO2002103628A1 (fr) * | 2001-06-14 | 2002-12-27 | Ask S.A. | Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux |
JP2003108970A (ja) * | 2001-09-29 | 2003-04-11 | Toshiba Corp | カード型電子機器 |
Also Published As
Publication number | Publication date |
---|---|
JP5042627B2 (ja) | 2012-10-03 |
PT1623369E (pt) | 2007-05-31 |
CA2524673C (en) | 2012-01-24 |
MXPA05011963A (es) | 2006-02-02 |
AU2004239501B2 (en) | 2010-06-17 |
PL1623369T3 (pl) | 2007-07-31 |
CN100468450C (zh) | 2009-03-11 |
RU2328840C2 (ru) | 2008-07-10 |
DE602004004647D1 (de) | 2007-03-22 |
DE602004004647T2 (de) | 2007-11-08 |
CN1788275A (zh) | 2006-06-14 |
MY148205A (en) | 2013-03-15 |
EP1623369B1 (fr) | 2007-02-07 |
US8127997B2 (en) | 2012-03-06 |
WO2004102469A1 (fr) | 2004-11-25 |
KR20060017779A (ko) | 2006-02-27 |
US20060226237A1 (en) | 2006-10-12 |
CA2524673A1 (en) | 2004-11-25 |
TW200501859A (en) | 2005-01-01 |
ES2281802T3 (es) | 2007-10-01 |
AU2004239501A1 (en) | 2004-11-25 |
BRPI0411163A (pt) | 2006-07-11 |
EP1623369A1 (fr) | 2006-02-08 |
ATE353457T1 (de) | 2007-02-15 |
RU2005134859A (ru) | 2006-07-27 |
TWI331497B (en) | 2010-10-01 |
KR101158128B1 (ko) | 2012-06-19 |
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