MXPA05011963A - Metodo para montar un componente electronico sobre un sustrato. - Google Patents

Metodo para montar un componente electronico sobre un sustrato.

Info

Publication number
MXPA05011963A
MXPA05011963A MXPA05011963A MXPA05011963A MXPA05011963A MX PA05011963 A MXPA05011963 A MX PA05011963A MX PA05011963 A MXPA05011963 A MX PA05011963A MX PA05011963 A MXPA05011963 A MX PA05011963A MX PA05011963 A MXPA05011963 A MX PA05011963A
Authority
MX
Mexico
Prior art keywords
substrate
component
electronic component
conductive
conductive paths
Prior art date
Application number
MXPA05011963A
Other languages
English (en)
Inventor
Francois Droz
Original Assignee
Nagraid Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagraid Sa filed Critical Nagraid Sa
Publication of MXPA05011963A publication Critical patent/MXPA05011963A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1311—Foil encapsulation, e.g. of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Abstract

La finalidad de la presente invencion es proveer un metodo para hacer un transpondedor en forma de una tarjeta o etiqueta que puede ser doblada o torcida sin romper las conexiones de componentes electronicos. Esta finalidad se logra por medio de un metodo para montar por lo menos un componente electronico (1) que comprende areas conductoras (3) sustancialmente planas conectadas a pistas conductoras sobre la superficie de un portador o sustrato (5) aislante generalmente plano, caracterizado porque comprende los siguientes pasos: colocar el sustrato (5) sobre la superficie de trabajo con el lado que comprende las pistas conductoras (6??) dirigidas hacia arriba, colocar el componente electronico (1) en una cavidad (7) en el sustrato (5) en un area del mismo que comprende las pistas conductoras (6??), de tal manera que las areas conductoras (3) del componente (1) hacen contacto con pistas de contacto correspondientes sobre el sustrato (5), y depositar una capa de material aislante (8) tanto sobre el componente (1) como por lo menos sobre un area del sustrato (5) que esta ubicada alrededor del componente (1), por lo que las areas conductoras (3) son electricamente conectadas a las pistas conductoras (6??) por la presion ejercida por la capa aislante (8) sobre el componente.
MXPA05011963A 2003-05-13 2004-05-12 Metodo para montar un componente electronico sobre un sustrato. MXPA05011963A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH8322003 2003-05-13
PCT/IB2004/050645 WO2004102469A1 (fr) 2003-05-13 2004-05-12 Procédé d'assemblage d'un composant électronique sur un substrat

Publications (1)

Publication Number Publication Date
MXPA05011963A true MXPA05011963A (es) 2006-02-02

Family

ID=33438095

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA05011963A MXPA05011963A (es) 2003-05-13 2004-05-12 Metodo para montar un componente electronico sobre un sustrato.

Country Status (18)

Country Link
US (1) US8127997B2 (es)
EP (1) EP1623369B1 (es)
JP (1) JP5042627B2 (es)
KR (1) KR101158128B1 (es)
CN (1) CN100468450C (es)
AT (1) ATE353457T1 (es)
AU (1) AU2004239501B2 (es)
BR (1) BRPI0411163A (es)
CA (1) CA2524673C (es)
DE (1) DE602004004647T2 (es)
ES (1) ES2281802T3 (es)
MX (1) MXPA05011963A (es)
MY (1) MY148205A (es)
PL (1) PL1623369T3 (es)
PT (1) PT1623369E (es)
RU (1) RU2328840C2 (es)
TW (1) TWI331497B (es)
WO (1) WO2004102469A1 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG172719A1 (en) 2006-06-19 2011-07-28 Nagraid Sa Method of fabricating cards comprising at least one electronic module, assembly involved in this method and intermediate product
MX2008016267A (es) 2006-06-19 2009-03-31 Nagraid Sa Metodo para fabricacion de tarjetas cada una de las cuales comprende un modulo electronico y productos intermedios.
WO2008082617A2 (en) 2006-12-29 2008-07-10 Solicore, Inc. Mailing apparatus for powered cards
US7967214B2 (en) 2006-12-29 2011-06-28 Solicore, Inc. Card configured to receive separate battery
ES2393884T3 (es) 2007-02-09 2012-12-28 Nagraid S.A. Procedimiento de fabricación de tarjetas electrónicas comprendiendo al menos un motivo impreso
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9202162B2 (en) * 2012-11-09 2015-12-01 Maxim Integrated Products, Inc. Embedded radio frequency identification (RFID) package
BR112017017273A2 (pt) 2015-02-20 2018-04-17 Nid Sa processo para fabricação de um dispositivo compreendendo pelo menos um elemento eletrônico associado a um substrato e a uma antena e produto obtido por meio deste processo

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JPS6420197A (en) * 1987-07-16 1989-01-24 Toshiba Corp Portable medium
DE4401458A1 (de) * 1994-01-19 1995-07-20 Ods Gmbh & Co Kg Verfahren und Vorrichtung zum Herstellen von Chipkarten
DE4403753C1 (de) * 1994-02-08 1995-07-20 Angewandte Digital Elektronik Kombinierte Chipkarte
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
WO1996009175A1 (fr) * 1994-09-22 1996-03-28 Rohm Co., Ltd. Carte de ci du type sans contact et procede de fabrication de cette carte
JPH091972A (ja) * 1995-06-26 1997-01-07 Hitachi Ltd Ｉｃカード
DE19527398A1 (de) 1995-07-27 1997-01-30 Philips Patentverwaltung Verfahren zum Löten von Bauelementen auf einer Trägerfolie
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JPH09286187A (ja) * 1996-04-22 1997-11-04 Toppan Printing Co Ltd Ｉｃカード、ｉｃカード製造用中間体およびｉｃカードの製造方法
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Also Published As

Publication number Publication date
US20060226237A1 (en) 2006-10-12
CA2524673A1 (en) 2004-11-25
CN1788275A (zh) 2006-06-14
US8127997B2 (en) 2012-03-06
ES2281802T3 (es) 2007-10-01
AU2004239501B2 (en) 2010-06-17
KR20060017779A (ko) 2006-02-27
PL1623369T3 (pl) 2007-07-31
RU2005134859A (ru) 2006-07-27
DE602004004647D1 (de) 2007-03-22
WO2004102469A1 (fr) 2004-11-25
JP2007511811A (ja) 2007-05-10
AU2004239501A1 (en) 2004-11-25
RU2328840C2 (ru) 2008-07-10
BRPI0411163A (pt) 2006-07-11
CA2524673C (en) 2012-01-24
JP5042627B2 (ja) 2012-10-03
CN100468450C (zh) 2009-03-11
KR101158128B1 (ko) 2012-06-19
TWI331497B (en) 2010-10-01
DE602004004647T2 (de) 2007-11-08
PT1623369E (pt) 2007-05-31
EP1623369A1 (fr) 2006-02-08
TW200501859A (en) 2005-01-01
ATE353457T1 (de) 2007-02-15
EP1623369B1 (fr) 2007-02-07
MY148205A (en) 2013-03-15

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