MXPA06000842A - Tarjeta de circuito impreso con componentes empotrados y metodo de fabricacion. - Google Patents
Tarjeta de circuito impreso con componentes empotrados y metodo de fabricacion.Info
- Publication number
- MXPA06000842A MXPA06000842A MXPA06000842A MXPA06000842A MXPA06000842A MX PA06000842 A MXPA06000842 A MX PA06000842A MX PA06000842 A MXPA06000842 A MX PA06000842A MX PA06000842 A MXPA06000842 A MX PA06000842A MX PA06000842 A MXPA06000842 A MX PA06000842A
- Authority
- MX
- Mexico
- Prior art keywords
- manufacture
- circuit board
- embedded component
- substrate
- embedded components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Un ensamble (10) de substrato y metodo para fabricar el mismo tiene al menos un componente empotrado (25) en una via (24) de un nucleo (22) de substrato e incluye una primera capa adhesiva (20) acoplada al nucleo de substrato, y una segunda capa adhesiva (26) al menos sobre porciones de una superficie superior del nucleo de substrato y encima de porciones del componente empotrado. El ensamble de substrato puede incluir ademas una primera capa conductora (18) adherida a la superficie inferior del nucleo de substrato y una segunda capa conductora (28) sobre la segunda capa adhesiva. El ensamble de substrato puede incluir ademas una interconexion (36) entre una superficie conductora del componente empotrado y al menos una entre la primera capa conductora y la segunda capa conductora. La interconexion puede formarse mediante una abertura (34) que expone al menos temporalmente al menos una superficie conductora (32) del componente empotrado.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/626,058 US6928726B2 (en) | 2003-07-24 | 2003-07-24 | Circuit board with embedded components and method of manufacture |
PCT/US2004/023292 WO2005011343A2 (en) | 2003-07-24 | 2004-07-20 | Circuit board with embedded components and method of manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA06000842A true MXPA06000842A (es) | 2006-04-19 |
Family
ID=34080331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA06000842A MXPA06000842A (es) | 2003-07-24 | 2004-07-20 | Tarjeta de circuito impreso con componentes empotrados y metodo de fabricacion. |
Country Status (5)
Country | Link |
---|---|
US (1) | US6928726B2 (es) |
JP (1) | JP2006528839A (es) |
CN (1) | CN100490611C (es) |
MX (1) | MXPA06000842A (es) |
WO (1) | WO2005011343A2 (es) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005026525A (ja) * | 2003-07-03 | 2005-01-27 | Shinko Electric Ind Co Ltd | 配線基板および配線基板の製造方法 |
JP2007538389A (ja) * | 2004-05-15 | 2007-12-27 | シー−コア テクノロジーズ インコーポレイティド | レジン充填チャネル付き導電性抑制コアを有するプリント回路板 |
US7874260B2 (en) * | 2006-10-25 | 2011-01-25 | Lam Research Corporation | Apparatus and method for substrate electroless plating |
JP4785844B2 (ja) * | 2004-07-08 | 2011-10-05 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Mems中の部品の位置決め精度を改善するための方法 |
KR100645643B1 (ko) * | 2004-07-14 | 2006-11-15 | 삼성전기주식회사 | 수동소자칩 내장형의 인쇄회로기판의 제조방법 |
JP2006073763A (ja) * | 2004-09-01 | 2006-03-16 | Denso Corp | 多層基板の製造方法 |
US9572258B2 (en) * | 2004-12-30 | 2017-02-14 | Intel Corporation | Method of forming a substrate core with embedded capacitor and structures formed thereby |
KR20070112274A (ko) * | 2005-03-15 | 2007-11-22 | 씨-코어 테크놀로지즈, 인코포레이티드 | 인쇄배선기판 내에 억제 코어 재료를 구성하는 방법 |
JP3914239B2 (ja) * | 2005-03-15 | 2007-05-16 | 新光電気工業株式会社 | 配線基板および配線基板の製造方法 |
US7286366B2 (en) * | 2005-03-24 | 2007-10-23 | Motorola, Inc. | Multilayer circuit board with embedded components and method of manufacture |
US7372126B2 (en) * | 2005-03-31 | 2008-05-13 | Intel Corporation | Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same |
US7288459B2 (en) * | 2005-03-31 | 2007-10-30 | Intel Corporation | Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same |
US20060228817A1 (en) * | 2005-04-07 | 2006-10-12 | Ho-Ching Yang | Dispensable capacitor manufacturing process |
US7730613B2 (en) * | 2005-08-29 | 2010-06-08 | Stablcor, Inc. | Processes for manufacturing printed wiring boards |
USRE45637E1 (en) | 2005-08-29 | 2015-07-28 | Stablcor Technology, Inc. | Processes for manufacturing printed wiring boards |
US7619872B2 (en) * | 2006-05-31 | 2009-11-17 | Intel Corporation | Embedded electrolytic capacitor |
JP4862641B2 (ja) * | 2006-12-06 | 2012-01-25 | 株式会社デンソー | 多層基板及び多層基板の製造方法 |
US7669985B2 (en) * | 2007-04-23 | 2010-03-02 | Xerox Corporation | Jetstack plate to plate alignment |
CN101321430B (zh) * | 2007-06-04 | 2010-11-10 | 鸿富锦精密工业(深圳)有限公司 | 电路板组件及其制造方法 |
US9341272B2 (en) | 2007-06-11 | 2016-05-17 | Cameron International Corporation | Gate-coating process |
US20100024210A1 (en) * | 2007-07-31 | 2010-02-04 | Harris Corporation | Product Optimization Process for Embedded Passives |
US8314343B2 (en) * | 2007-09-05 | 2012-11-20 | Taiyo Yuden Co., Ltd. | Multi-layer board incorporating electronic component and method for producing the same |
CN101594740B (zh) * | 2008-05-27 | 2012-06-06 | 华通电脑股份有限公司 | 嵌埋电子器件的电路板及其方法 |
JPWO2009147936A1 (ja) * | 2008-06-02 | 2011-10-27 | イビデン株式会社 | 多層プリント配線板の製造方法 |
DE102008002532A1 (de) * | 2008-06-19 | 2009-12-24 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektronischen Baugruppe |
CN101677486A (zh) * | 2008-09-19 | 2010-03-24 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板及其制作方法 |
KR101055471B1 (ko) * | 2008-09-29 | 2011-08-08 | 삼성전기주식회사 | 전자소자 내장형 인쇄회로기판 및 그 제조방법 |
TWI405311B (zh) * | 2008-11-04 | 2013-08-11 | 半導體裝置、嵌埋電子元件之封裝結構、及其製法 | |
US8072764B2 (en) | 2009-03-09 | 2011-12-06 | Apple Inc. | Multi-part substrate assemblies for low profile portable electronic devices |
US8859424B2 (en) * | 2009-08-14 | 2014-10-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor wafer carrier and method of manufacturing |
US8390083B2 (en) * | 2009-09-04 | 2013-03-05 | Analog Devices, Inc. | System with recessed sensing or processing elements |
US8339798B2 (en) | 2010-07-08 | 2012-12-25 | Apple Inc. | Printed circuit boards with embedded components |
JP2012069734A (ja) * | 2010-09-24 | 2012-04-05 | Toshiba Corp | 半導体装置の製造方法 |
US9407997B2 (en) | 2010-10-12 | 2016-08-02 | Invensense, Inc. | Microphone package with embedded ASIC |
US9232302B2 (en) | 2011-05-31 | 2016-01-05 | Apple Inc. | Microphone assemblies with through-silicon vias |
US9129908B2 (en) * | 2011-11-15 | 2015-09-08 | Cisco Technology, Inc. | Manufacturing a semiconductor package including an embedded circuit component within a support structure of the package |
US20130015557A1 (en) * | 2011-07-13 | 2013-01-17 | Zhiping Yang | Semiconductor package including an external circuit element |
CN103797575B (zh) * | 2011-07-13 | 2017-05-03 | 思科技术公司 | 制造包括封装的支持结构内的嵌入式电路组件的半导体封装 |
KR101326999B1 (ko) * | 2012-03-07 | 2013-11-13 | 엘지이노텍 주식회사 | 인쇄회로기판 및 그의 제조 방법 |
CN103716999A (zh) * | 2012-09-29 | 2014-04-09 | 深南电路有限公司 | 印刷电路板加工方法和印刷电路板 |
KR20140071755A (ko) * | 2012-12-04 | 2014-06-12 | 삼성전기주식회사 | 인쇄회로기판 및 이의 제조방법 |
US9055701B2 (en) * | 2013-03-13 | 2015-06-09 | International Business Machines Corporation | Method and system for improving alignment precision of parts in MEMS |
KR101514518B1 (ko) * | 2013-05-24 | 2015-04-22 | 삼성전기주식회사 | 전자부품 내장 인쇄회로기판 및 그 제조방법 |
CN104576883B (zh) | 2013-10-29 | 2018-11-16 | 普因特工程有限公司 | 芯片安装用阵列基板及其制造方法 |
US9332632B2 (en) | 2014-08-20 | 2016-05-03 | Stablcor Technology, Inc. | Graphene-based thermal management cores and systems and methods for constructing printed wiring boards |
EP3216050B1 (en) | 2014-11-05 | 2021-09-08 | Corning Incorporated | Bottom-up electrolytic via plating method |
US9666558B2 (en) | 2015-06-29 | 2017-05-30 | Point Engineering Co., Ltd. | Substrate for mounting a chip and chip package using the substrate |
US9839131B2 (en) * | 2015-10-21 | 2017-12-05 | International Business Machines Corporation | Embedding a discrete electrical device in a printed circuit board |
CN105517343A (zh) * | 2016-01-25 | 2016-04-20 | 东莞联桥电子有限公司 | 一种微波印制电路板上电阻集成方法 |
US9673179B1 (en) | 2016-07-20 | 2017-06-06 | International Business Machines Corporation | Discrete electronic device embedded in chip module |
US10559486B1 (en) * | 2018-01-10 | 2020-02-11 | Facebook Technologies, Llc | Method for polymer-assisted chip transfer |
US10586725B1 (en) * | 2018-01-10 | 2020-03-10 | Facebook Technologies, Llc | Method for polymer-assisted chip transfer |
US10917966B2 (en) | 2018-01-29 | 2021-02-09 | Corning Incorporated | Articles including metallized vias |
US10790241B2 (en) | 2019-02-28 | 2020-09-29 | Advanced Semiconductor Engineering, Inc. | Wiring structure and method for manufacturing the same |
CN211045436U (zh) * | 2019-07-07 | 2020-07-17 | 深南电路股份有限公司 | 线路板 |
EP4156873A4 (en) | 2020-07-07 | 2024-02-28 | Shennan Circuits Co., Ltd. | INTEGRATED PRINTED CIRCUIT BOARD AND RELATED MANUFACTURING METHOD |
KR20220067630A (ko) | 2020-11-17 | 2022-05-25 | 삼성전자주식회사 | 반도체 패키지 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4758922A (en) * | 1986-11-14 | 1988-07-19 | Matsushita Electric Industrial Co., Ltd. | High frequency circuit having a microstrip resonance element |
US5603847A (en) * | 1993-04-07 | 1997-02-18 | Zycon Corporation | Annular circuit components coupled with printed circuit board through-hole |
JP2513443B2 (ja) * | 1993-06-11 | 1996-07-03 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 多層回路基板組立体 |
JPH0883980A (ja) * | 1994-09-13 | 1996-03-26 | Toagosei Co Ltd | 多層プリント配線板の製造方法 |
JPH08186383A (ja) * | 1994-12-29 | 1996-07-16 | Cmk Corp | 多層プリント配線板とその製造方法 |
JP3513827B2 (ja) * | 1996-07-01 | 2004-03-31 | 日立化成工業株式会社 | 多層プリント配線板用塑性流動シート及びそれを用いた多層プリント配線板の製造方法 |
US5834994A (en) * | 1997-01-17 | 1998-11-10 | Motorola Inc. | Multilayer lowpass filter with improved ground plane configuration |
JPH10215042A (ja) * | 1997-01-28 | 1998-08-11 | Kyocera Corp | 多層配線基板 |
US5977850A (en) * | 1997-11-05 | 1999-11-02 | Motorola, Inc. | Multilayer ceramic package with center ground via for size reduction |
US6218729B1 (en) * | 1999-03-11 | 2001-04-17 | Atmel Corporation | Apparatus and method for an integrated circuit having high Q reactive components |
JP2001053447A (ja) * | 1999-08-05 | 2001-02-23 | Iwaki Denshi Kk | 部品内蔵型多層配線基板およびその製造方法 |
US6470545B1 (en) * | 1999-09-15 | 2002-10-29 | National Semiconductor Corporation | Method of making an embedded green multi-layer ceramic chip capacitor in a low-temperature co-fired ceramic (LTCC) substrate |
JP3246502B2 (ja) * | 2000-01-27 | 2002-01-15 | 松下電器産業株式会社 | 部品内蔵両面配線板の製造方法、及び電子回路構成体の製造方法 |
JP3930222B2 (ja) * | 2000-03-27 | 2007-06-13 | 株式会社東芝 | 半導体装置の製造方法 |
JP4778148B2 (ja) * | 2001-01-26 | 2011-09-21 | 日本特殊陶業株式会社 | 多層配線基板 |
US6443179B1 (en) * | 2001-02-21 | 2002-09-03 | Sandia Corporation | Packaging of electro-microfluidic devices |
JP2002252534A (ja) * | 2001-02-26 | 2002-09-06 | Matsushita Electric Ind Co Ltd | 高周波フィルタ |
JP2003017856A (ja) * | 2001-06-29 | 2003-01-17 | Kyocera Chemical Corp | 多層プリント配線板及びその製造方法 |
US6750737B2 (en) * | 2001-10-02 | 2004-06-15 | Matsushita Electric Industrial Co., Ltd. | High frequency switch and radio communication apparatus with layered body for saw filter mounting |
JP3649183B2 (ja) * | 2001-12-27 | 2005-05-18 | ソニー株式会社 | フィルタ回路装置及びその製造方法 |
-
2003
- 2003-07-24 US US10/626,058 patent/US6928726B2/en not_active Expired - Lifetime
-
2004
- 2004-07-20 CN CNB2004800203316A patent/CN100490611C/zh not_active Expired - Lifetime
- 2004-07-20 JP JP2006521183A patent/JP2006528839A/ja active Pending
- 2004-07-20 MX MXPA06000842A patent/MXPA06000842A/es active IP Right Grant
- 2004-07-20 WO PCT/US2004/023292 patent/WO2005011343A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US20050016763A1 (en) | 2005-01-27 |
WO2005011343A2 (en) | 2005-02-03 |
WO2005011343A3 (en) | 2005-06-02 |
CN100490611C (zh) | 2009-05-20 |
CN1823555A (zh) | 2006-08-23 |
US6928726B2 (en) | 2005-08-16 |
JP2006528839A (ja) | 2006-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MXPA06000842A (es) | Tarjeta de circuito impreso con componentes empotrados y metodo de fabricacion. | |
HK1089328A1 (en) | Method for manufacturing an electronic module and an electronic module | |
MY128015A (en) | Multilayer printed circuit board and multilayer printed circuit board manufacturing method | |
EP1041633A4 (en) | SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE | |
SG170113A1 (en) | Integrated circuit package with open substrate | |
TW200509368A (en) | Circuit module and manufacturing method thereof | |
EP1484952A4 (en) | MULTILAYER CONDUCTOR PLATE, BASE FOR A MULTIPLE PCB, PRINTED PCB AND METHOD FOR THE PRODUCTION THEREOF | |
SG81960A1 (en) | Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument | |
TW200621114A (en) | Structure and method for embedded passive component assembly | |
MY136587A (en) | Method for producing an electrical circuit | |
TW200642554A (en) | Multilayer circuit board with embedded components and method of manufacture | |
TW200610458A (en) | Circuit board and method for the production of such a circuit board | |
TW200614883A (en) | Circuitized substrate with internal organic memory device, method of making same, electrical assembly utilizing same and information handling system utilizing same | |
TW200629998A (en) | Printed circuit board and forming method thereof | |
TW200742518A (en) | Flexible printed circuit board and method for manufacturing the same | |
TW200640315A (en) | Electrically connecting structure of circuit board and method for fabricating same | |
TW200518647A (en) | Printed wiring board and method of manufacturing same | |
WO2004038798A3 (en) | Stacked electronic structures including offset substrates | |
TW200718299A (en) | Wiring board, wiring material, copper-clad laminate, and wiring board fabrication method | |
TW200520656A (en) | Printed wiring board manufacturing method and printed wiring board | |
EP1069811A3 (en) | Multi-layer wiring board and method for manufacturing the same | |
WO2007043972A8 (en) | Device carrying an integrated circuit/components and method of producing the same | |
TW200504899A (en) | Wiring board and the manufacturing method thereof | |
TW200601917A (en) | Method for fabricating electrical connection structure of circuit board | |
EP1278404A4 (en) | PCB AND METHOD FOR THE PRODUCTION THEREOF |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration | ||
GB | Transfer or rights |