JP5042627B2 - 基板への電子部品の実装方法 - Google Patents
基板への電子部品の実装方法 Download PDFInfo
- Publication number
- JP5042627B2 JP5042627B2 JP2006530807A JP2006530807A JP5042627B2 JP 5042627 B2 JP5042627 B2 JP 5042627B2 JP 2006530807 A JP2006530807 A JP 2006530807A JP 2006530807 A JP2006530807 A JP 2006530807A JP 5042627 B2 JP5042627 B2 JP 5042627B2
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- JP
- Japan
- Prior art keywords
- substrate
- electronic component
- conductor
- chip
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000011810 insulating material Substances 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims description 69
- 238000003475 lamination Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 7
- 230000003252 repetitive effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Radar Systems Or Details Thereof (AREA)
Description
前記電子部品(1)が、表面のうちの1つの面に接点を具備するチップ(2)で形成され、前記接点が、前記チップ(2)の接点を延長する前記導体領域(3)を構成する導体シートに付加され、前記チップ(2)の前記接点を具備する面と反対の面に絶縁材料(4)が被覆され、
‐ 作業面に前記基板(5)を置き、前記導線経路(6)を含む面を上に向ける工程と、
‐ 前記導線経路(6)の近傍にある前記基板(5)のスロット(7)内に前記電子部品(1)の前記チップ(2)を設置し、前記電子部品(1)の導体領域(3)が、前記基板(5)の面と同一平面になりかつ前記基板(5)の前記面に配置された前記対応する導線経路(6)に前記チップと接点と同じ高さで接触するように前記チップ(2)を被覆する前記絶縁材料(4)を前記スロット(7)に挿入する工程と、
‐ 絶縁層(8)を、積層プロセスにより、前記電子部品(1)と、前記電子部品(1)を囲む前記基板(5)の表面の少なくとも1つの部位の上に延びるように被せる工程と
を含み、
前記電子部品(1)への前記絶縁層(8)の押圧により、前記電子部品(1)の導体領域(3)と前記基板(5)の導線経路(6)との接触を維持して電気的接続がなされ、かつ前記積層プロセスの結果として繰り返し応力が前記基板に加えられるときに前記導体領域(3)を前記導線経路(6)に対して滑動可能に構成されたことを特徴とする方法により達成される。
Claims (2)
- 平坦な絶縁基板(5)の表面上に配置された導線経路(6)に接続される平坦な導体領域(3)を含む少なくとも1つの電子部品(1)の実装方法であって、
前記電子部品(1)が、表面のうちの1つの面に接点を具備するチップ(2)で形成され、前記接点が、前記チップ(2)の接点を延長する前記導体領域(3)を構成する導体シートに付加され、前記チップ(2)の前記接点を具備する面と反対の面に絶縁材料(4)が被覆され、
‐ 作業面に前記基板(5)を置き、前記導線経路(6)を含む面を上に向ける工程と、
‐ 前記導線経路(6)の近傍にある前記基板(5)のスロット(7)内に前記電子部品(1)の前記チップ(2)を設置し、前記電子部品(1)の導体領域(3)が、前記基板(5)の面と同一平面になりかつ前記基板(5)の前記面に配置された前記対応する導線経路(6)に前記チップと接点と同じ高さで接触するように前記チップ(2)を被覆する前記絶縁材料(4)を前記スロット(7)に挿入する工程と、
‐ 絶縁層(8)を、積層プロセスにより、前記電子部品(1)と、前記電子部品(1)を囲む前記基板(5)の表面の少なくとも1つの部位の上に延びるように被せる工程と
を含み、
前記電子部品(1)への前記絶縁層(8)の押圧により、前記電子部品(1)の導体領域(3)と前記基板(5)の導線経路(6)との接触を維持して電気的接続がなされ、かつ前記積層プロセスの結果として繰り返し応力が前記基板に加えられるときに前記導体領域(3)を前記導線経路(6)に対して滑動可能に構成されたことを特徴とする方法。 - 前記スロット(7)が切削加工された凹部又はスタンピング加工された窓であることを特徴とする、請求項1に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH8322003 | 2003-05-13 | ||
CH20030832/03 | 2003-05-13 | ||
PCT/IB2004/050645 WO2004102469A1 (fr) | 2003-05-13 | 2004-05-12 | Procédé d'assemblage d'un composant électronique sur un substrat |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007511811A JP2007511811A (ja) | 2007-05-10 |
JP2007511811A5 JP2007511811A5 (ja) | 2012-06-07 |
JP5042627B2 true JP5042627B2 (ja) | 2012-10-03 |
Family
ID=33438095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006530807A Expired - Fee Related JP5042627B2 (ja) | 2003-05-13 | 2004-05-12 | 基板への電子部品の実装方法 |
Country Status (18)
Country | Link |
---|---|
US (1) | US8127997B2 (ja) |
EP (1) | EP1623369B1 (ja) |
JP (1) | JP5042627B2 (ja) |
KR (1) | KR101158128B1 (ja) |
CN (1) | CN100468450C (ja) |
AT (1) | ATE353457T1 (ja) |
AU (1) | AU2004239501B2 (ja) |
BR (1) | BRPI0411163A (ja) |
CA (1) | CA2524673C (ja) |
DE (1) | DE602004004647T2 (ja) |
ES (1) | ES2281802T3 (ja) |
MX (1) | MXPA05011963A (ja) |
MY (1) | MY148205A (ja) |
PL (1) | PL1623369T3 (ja) |
PT (1) | PT1623369E (ja) |
RU (1) | RU2328840C2 (ja) |
TW (1) | TWI331497B (ja) |
WO (1) | WO2004102469A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2007263131B2 (en) | 2006-06-19 | 2012-02-16 | Nagravision S.A. | Method of fabricating cards each comprising an electronic module and intermediate products |
JP5395660B2 (ja) | 2006-06-19 | 2014-01-22 | ナグライデ・エス アー | 少なくとも1つの電子モジュールを備えるカードを製造する方法、本方法中に製作されるアセンブリ、及び中間生成物 |
US7967214B2 (en) | 2006-12-29 | 2011-06-28 | Solicore, Inc. | Card configured to receive separate battery |
US8181879B2 (en) | 2006-12-29 | 2012-05-22 | Solicore, Inc. | Mailing apparatus for powered cards |
ES2393884T3 (es) | 2007-02-09 | 2012-12-28 | Nagraid S.A. | Procedimiento de fabricación de tarjetas electrónicas comprendiendo al menos un motivo impreso |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
US9202162B2 (en) * | 2012-11-09 | 2015-12-01 | Maxim Integrated Products, Inc. | Embedded radio frequency identification (RFID) package |
RU2685973C2 (ru) | 2015-02-20 | 2019-04-23 | Нид Са | Способ изготовления устройства, содержащего по меньшей мере один электронный элемент, связанный с подложкой и антенной |
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DE4403753C1 (de) * | 1994-02-08 | 1995-07-20 | Angewandte Digital Elektronik | Kombinierte Chipkarte |
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
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CN1054573C (zh) * | 1994-09-22 | 2000-07-19 | 罗姆股份有限公司 | 非接触型ic卡及其制造方法 |
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-
2004
- 2004-04-14 MY MYPI20041362A patent/MY148205A/en unknown
- 2004-04-19 TW TW093110859A patent/TWI331497B/zh not_active IP Right Cessation
- 2004-05-12 BR BRPI0411163-0A patent/BRPI0411163A/pt not_active Application Discontinuation
- 2004-05-12 ES ES04732370T patent/ES2281802T3/es not_active Expired - Lifetime
- 2004-05-12 CA CA2524673A patent/CA2524673C/en not_active Expired - Fee Related
- 2004-05-12 PL PL04732370T patent/PL1623369T3/pl unknown
- 2004-05-12 WO PCT/IB2004/050645 patent/WO2004102469A1/fr active IP Right Grant
- 2004-05-12 PT PT04732370T patent/PT1623369E/pt unknown
- 2004-05-12 AT AT04732370T patent/ATE353457T1/de active
- 2004-05-12 RU RU2005134859/09A patent/RU2328840C2/ru not_active IP Right Cessation
- 2004-05-12 CN CNB2004800128885A patent/CN100468450C/zh not_active Expired - Fee Related
- 2004-05-12 JP JP2006530807A patent/JP5042627B2/ja not_active Expired - Fee Related
- 2004-05-12 AU AU2004239501A patent/AU2004239501B2/en not_active Ceased
- 2004-05-12 MX MXPA05011963A patent/MXPA05011963A/es active IP Right Grant
- 2004-05-12 KR KR1020057021437A patent/KR101158128B1/ko not_active IP Right Cessation
- 2004-05-12 DE DE602004004647T patent/DE602004004647T2/de not_active Expired - Lifetime
- 2004-05-12 US US10/556,398 patent/US8127997B2/en not_active Expired - Fee Related
- 2004-05-12 EP EP04732370A patent/EP1623369B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TW200501859A (en) | 2005-01-01 |
RU2005134859A (ru) | 2006-07-27 |
US20060226237A1 (en) | 2006-10-12 |
TWI331497B (en) | 2010-10-01 |
PT1623369E (pt) | 2007-05-31 |
CN1788275A (zh) | 2006-06-14 |
MY148205A (en) | 2013-03-15 |
MXPA05011963A (es) | 2006-02-02 |
RU2328840C2 (ru) | 2008-07-10 |
DE602004004647T2 (de) | 2007-11-08 |
DE602004004647D1 (de) | 2007-03-22 |
CN100468450C (zh) | 2009-03-11 |
KR101158128B1 (ko) | 2012-06-19 |
PL1623369T3 (pl) | 2007-07-31 |
AU2004239501B2 (en) | 2010-06-17 |
EP1623369B1 (fr) | 2007-02-07 |
US8127997B2 (en) | 2012-03-06 |
JP2007511811A (ja) | 2007-05-10 |
KR20060017779A (ko) | 2006-02-27 |
EP1623369A1 (fr) | 2006-02-08 |
BRPI0411163A (pt) | 2006-07-11 |
ATE353457T1 (de) | 2007-02-15 |
CA2524673C (en) | 2012-01-24 |
ES2281802T3 (es) | 2007-10-01 |
WO2004102469A1 (fr) | 2004-11-25 |
AU2004239501A1 (en) | 2004-11-25 |
CA2524673A1 (en) | 2004-11-25 |
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