JPS6420197A - Portable medium - Google Patents

Portable medium

Info

Publication number
JPS6420197A
JPS6420197A JP62175957A JP17595787A JPS6420197A JP S6420197 A JPS6420197 A JP S6420197A JP 62175957 A JP62175957 A JP 62175957A JP 17595787 A JP17595787 A JP 17595787A JP S6420197 A JPS6420197 A JP S6420197A
Authority
JP
Japan
Prior art keywords
module
section
base material
housing channel
chip housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62175957A
Other languages
Japanese (ja)
Inventor
Hidetaka Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62175957A priority Critical patent/JPS6420197A/en
Publication of JPS6420197A publication Critical patent/JPS6420197A/en
Pending legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent a base material of a portable medium from being deformed caused by the heated IC module by inserting high thermal conductivity materials between a housing section on the base material and an IC module embedded in the housing. CONSTITUTION: A plurality of aluminum foils 4 comprising heat dissipation materials are between the bottom section of a chip housing channel 5 on a plastic card 3 comprising the base material, and an IC module 1 fitted on an insulating substrate 2 to be inserted in the chip housing channel 5. The heat released from the IC module 1 via a mold section 9 is more uniformly released via a surrounding wall of the chip housing channel 5 owing to the excellent thermal conductivity of the aluminum foil 4. The heat is made uniform in a space of the chip housing channel 5 by the excellent reflection characteristics of the aluminum foil 4. It is possible to prevent the local high temperature portion from being caused around the upper section of the IC housing section 5, which results in precluding the deformation of the plastic card 3.
JP62175957A 1987-07-16 1987-07-16 Portable medium Pending JPS6420197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62175957A JPS6420197A (en) 1987-07-16 1987-07-16 Portable medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62175957A JPS6420197A (en) 1987-07-16 1987-07-16 Portable medium

Publications (1)

Publication Number Publication Date
JPS6420197A true JPS6420197A (en) 1989-01-24

Family

ID=16005212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62175957A Pending JPS6420197A (en) 1987-07-16 1987-07-16 Portable medium

Country Status (1)

Country Link
JP (1) JPS6420197A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917923A (en) * 1995-05-18 1999-06-29 Bose Corporation Satellitic compact electroacoustical transducing
US8127997B2 (en) * 2003-05-13 2012-03-06 Nagraid S.A. Method for mounting an electronic component on a substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917923A (en) * 1995-05-18 1999-06-29 Bose Corporation Satellitic compact electroacoustical transducing
US8127997B2 (en) * 2003-05-13 2012-03-06 Nagraid S.A. Method for mounting an electronic component on a substrate

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