MX2020002098A - Estructura de multicapa para alojar componentes electronicos y metodo de fabricacion relacionado. - Google Patents

Estructura de multicapa para alojar componentes electronicos y metodo de fabricacion relacionado.

Info

Publication number
MX2020002098A
MX2020002098A MX2020002098A MX2020002098A MX2020002098A MX 2020002098 A MX2020002098 A MX 2020002098A MX 2020002098 A MX2020002098 A MX 2020002098A MX 2020002098 A MX2020002098 A MX 2020002098A MX 2020002098 A MX2020002098 A MX 2020002098A
Authority
MX
Mexico
Prior art keywords
substrate film
multilayer structure
manufacture
related method
circuitry
Prior art date
Application number
MX2020002098A
Other languages
English (en)
Inventor
Mikko Heikkinen
Antti Keränen
Ronald Haag
Original Assignee
Tactotek Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tactotek Oy filed Critical Tactotek Oy
Publication of MX2020002098A publication Critical patent/MX2020002098A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Casings For Electric Apparatus (AREA)
  • Recrystallisation Techniques (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

Una estructura multicapa integrada (100, 200, 300, 400, 500, 600, 700) que comprende una primera película de sustrato (102) que tiene un primer lado (102A), dicha primera película de sustrato comprende material aislante sustancialmente eléctricamente, dicha primera película de sustrato preferiblemente es una capa plástica (112) formable y opcionalmente termoplástica, moldeada sobre dicho primer lado de la primera película de sustrato a modo de por lo menos cubrirla parcialmente, y un conjunto de circuitos (104, 106, 204, 205), que comprende opcionalmente un componente electrónico, electromecánico y/o electro-óptico, proporcionado en el segundo lado de la primera película de sustrato, dicho conjunto de circuitos está conectado funcionalmente al primer lado de la primera película de sustrato.
MX2020002098A 2017-08-25 2018-08-23 Estructura de multicapa para alojar componentes electronicos y metodo de fabricacion relacionado. MX2020002098A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/687,095 US10667396B2 (en) 2017-08-25 2017-08-25 Multilayer structure for hosting electronics and related method of manufacture
PCT/FI2018/050599 WO2019038479A1 (en) 2017-08-25 2018-08-23 MULTILAYER STRUCTURE FOR HOUSING ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING SAME

Publications (1)

Publication Number Publication Date
MX2020002098A true MX2020002098A (es) 2020-07-20

Family

ID=63517914

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2020002098A MX2020002098A (es) 2017-08-25 2018-08-23 Estructura de multicapa para alojar componentes electronicos y metodo de fabricacion relacionado.

Country Status (8)

Country Link
US (2) US10667396B2 (es)
EP (1) EP3673719A1 (es)
JP (2) JP2020532132A (es)
KR (1) KR20200042913A (es)
CN (1) CN111052885A (es)
MX (1) MX2020002098A (es)
TW (1) TWI816691B (es)
WO (1) WO2019038479A1 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA3083463A1 (en) * 2019-06-14 2020-12-14 Hutchinson Aeronautique & Industrie Ltee Composite panel comprising an integrated electrical circuit and manufacturing method thereof
CN110769611B (zh) * 2019-10-28 2022-05-20 江苏上达电子有限公司 一种具有结合机构的cof产品的制造方法
CN111524883B (zh) * 2020-04-29 2022-09-20 业成科技（成都）有限公司 膜内电子组件及其制备方法
US10849235B1 (en) * 2020-05-20 2020-11-24 Tactotek Oy Method of manufacture of a structure and structure
KR102394587B1 (ko) * 2021-07-19 2022-05-06 인탑스 주식회사 다중 ime 구조 및 그 제조 방법
CN114247225B (zh) * 2021-11-17 2023-05-16 江苏百维能源科技有限公司 一种电能计量器具柜
WO2023249292A1 (ko) * 2022-06-24 2023-12-28 삼성전자 주식회사 웨어러블 전자 장치
US20240123104A1 (en) * 2022-10-14 2024-04-18 B/E Aerospace, Inc. Embedded near-ultraviolet self-cleaning electronics for passenger control unit (pcu)

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Also Published As

Publication number Publication date
US10667396B2 (en) 2020-05-26
EP3673719A1 (en) 2020-07-01
US10455702B2 (en) 2019-10-22
KR20200042913A (ko) 2020-04-24
JP2020532132A (ja) 2020-11-05
US20190069408A1 (en) 2019-02-28
JP2024063212A (ja) 2024-05-10
TW201922066A (zh) 2019-06-01
TWI816691B (zh) 2023-10-01
WO2019038479A1 (en) 2019-02-28
US20190069409A1 (en) 2019-02-28
CN111052885A (zh) 2020-04-21

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