SG158842A1 - Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof - Google Patents

Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof

Info

Publication number
SG158842A1
SG158842A1 SG200908709-9A SG2009087099A SG158842A1 SG 158842 A1 SG158842 A1 SG 158842A1 SG 2009087099 A SG2009087099 A SG 2009087099A SG 158842 A1 SG158842 A1 SG 158842A1
Authority
SG
Singapore
Prior art keywords
circuit
connection material
film
manufacturing
same
Prior art date
Application number
SG200908709-9A
Other languages
English (en)
Inventor
Jun Taketatsu
Itsuo Watanabe
Yasushi Gotou
Kazuo Yamaguchi
Masaki Fujii
Aya Fujii
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004002308A external-priority patent/JP4380328B2/ja
Priority claimed from JP2004002305A external-priority patent/JP4380327B2/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG158842A1 publication Critical patent/SG158842A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
SG200908709-9A 2004-01-07 2005-01-06 Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof SG158842A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004002308A JP4380328B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2004002305A JP4380327B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Publications (1)

Publication Number Publication Date
SG158842A1 true SG158842A1 (en) 2010-02-26

Family

ID=34752086

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200908709-9A SG158842A1 (en) 2004-01-07 2005-01-06 Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof

Country Status (7)

Country Link
US (1) US20100025089A1 (zh)
EP (1) EP1702968A4 (zh)
KR (4) KR100996035B1 (zh)
CN (2) CN103409082A (zh)
SG (1) SG158842A1 (zh)
TW (4) TW200951201A (zh)
WO (1) WO2005066298A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4967482B2 (ja) * 2006-02-27 2012-07-04 日立化成工業株式会社 導電粒子、接着剤組成物及び回路接続材料
WO2008056773A1 (en) * 2006-11-10 2008-05-15 Hitachi Chemical Company, Ltd. Adhesive film, and connection structure and connecting method for circuit member
KR101302778B1 (ko) * 2007-08-02 2013-09-02 히타치가세이가부시끼가이샤 회로 접속 재료, 그것을 이용한 회로 부재의 접속 구조체 및 회로 부재의 접속 방법
US20100307805A1 (en) * 2007-10-29 2010-12-09 Hitachi Chemical Company, Ltd. Circuit connecting material, connection structure and method for producing the same
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
WO2011125414A1 (ja) * 2010-04-01 2011-10-13 株式会社村田製作所 電子部品及びその製造方法
JP5530571B1 (ja) * 2012-11-28 2014-06-25 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
GB2518363A (en) 2013-09-18 2015-03-25 Novalia Ltd Circuit board assembly
DE102013219688B3 (de) * 2013-09-30 2015-02-05 Robert Bosch Gmbh Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung
CN105295812B (zh) * 2014-07-22 2021-03-02 昭和电工材料株式会社 连接材料和太阳能电池模块
CN113053562B (zh) * 2017-01-27 2023-03-31 昭和电工材料株式会社 绝缘被覆导电粒子、各向异性导电膜及其制造方法、连接结构体及其制造方法
US10733136B1 (en) * 2019-03-01 2020-08-04 Western Digital Technologies, Inc. Vertical surface mount type C USB connector

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
US4999460A (en) * 1989-08-10 1991-03-12 Casio Computer Co., Ltd. Conductive connecting structure
JPH04115407A (ja) * 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JP3004042B2 (ja) * 1990-10-12 2000-01-31 綜研化学株式会社 金属含有樹脂粒子およびその用途
JP2748705B2 (ja) * 1991-02-14 1998-05-13 日立化成工業株式会社 回路の接続部材
JPH07105716A (ja) * 1993-10-05 1995-04-21 Soken Kagaku Kk 被覆粒子および異方導電性接着剤
JPH07133466A (ja) * 1993-11-09 1995-05-23 Soken Kagaku Kk 接着方法
TW277152B (zh) * 1994-05-10 1996-06-01 Hitachi Chemical Co Ltd
WO1996031574A1 (fr) * 1995-04-04 1996-10-10 Hitachi Chemical Company, Ltd. Adhesif, pellicule adhesive et feuille metallique a envers adhesif
EP0744884A3 (en) * 1995-05-23 1997-09-24 Hitachi Chemical Co Ltd Method of manufacturing a multilayer printed circuit board
KR100261793B1 (ko) * 1995-09-29 2000-07-15 니시무로 타이죠 고강도 고신뢰성 회로기판 및 그 제조방법
KR100483565B1 (ko) * 1999-02-08 2005-04-15 히다치 가세고교 가부시끼가이샤 회로접속재료
KR100660430B1 (ko) * 1999-08-25 2006-12-22 히다치 가세고교 가부시끼가이샤 배선단자 접속용 필름, 배선단자의 접속방법 및 배선구조체
MY124944A (en) * 2000-02-09 2006-07-31 Hitachi Chemical Co Ltd Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards
JP4788036B2 (ja) * 2000-11-29 2011-10-05 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4852785B2 (ja) * 2000-11-29 2012-01-11 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4752107B2 (ja) * 2000-11-29 2011-08-17 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
KR100589799B1 (ko) * 2003-05-06 2006-06-14 한화석유화학 주식회사 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품
US7393771B2 (en) * 2004-06-29 2008-07-01 Hitachi, Ltd. Method for mounting an electronic part on a substrate using a liquid containing metal particles

Also Published As

Publication number Publication date
TWI320427B (zh) 2010-02-11
KR20080065314A (ko) 2008-07-11
KR100996035B1 (ko) 2010-11-22
CN101944659B (zh) 2016-08-17
KR100865204B1 (ko) 2008-10-23
TW200951201A (en) 2009-12-16
TWI320575B (zh) 2010-02-11
TW200525005A (en) 2005-08-01
WO2005066298A1 (ja) 2005-07-21
EP1702968A1 (en) 2006-09-20
KR100908370B1 (ko) 2009-07-20
EP1702968A4 (en) 2010-08-25
KR20070012337A (ko) 2007-01-25
US20100025089A1 (en) 2010-02-04
TW200945373A (en) 2009-11-01
CN101944659A (zh) 2011-01-12
CN103409082A (zh) 2013-11-27
TW200942596A (en) 2009-10-16
KR100981483B1 (ko) 2010-09-10
TWI323276B (zh) 2010-04-11
KR20090064461A (ko) 2009-06-18
KR20090074778A (ko) 2009-07-07

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