TW200745308A - Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method - Google Patents

Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method

Info

Publication number
TW200745308A
TW200745308A TW096112733A TW96112733A TW200745308A TW 200745308 A TW200745308 A TW 200745308A TW 096112733 A TW096112733 A TW 096112733A TW 96112733 A TW96112733 A TW 96112733A TW 200745308 A TW200745308 A TW 200745308A
Authority
TW
Taiwan
Prior art keywords
circuit
circuit member
member connecting
adhesive layer
adhesive film
Prior art date
Application number
TW096112733A
Other languages
Chinese (zh)
Other versions
TWI367930B (en
Inventor
Yukihisa Hirosawa
Tadamitsu Iimura
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200745308A publication Critical patent/TW200745308A/en
Application granted granted Critical
Publication of TWI367930B publication Critical patent/TWI367930B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

A circuit connecting adhesive film is provided for connecting a first circuit member, in which a first circuit electrode is formed on the main plane of a first substrate, with a second circuit member, in which a second circuit electrode is formed on the main plane of a second substrate, in a status where the first and the second circuit electrodes are arranged to face each other. The film is provided with at least a conductive adhesive layer (3) containing conductive particles (1) and an adhesive (2); a first insulating adhesive layer (4) formed on one plane of the conductive adhesive layer (3); and a second insulating adhesive layer (5) formed on the conductive adhesive layer (3) on the plane opposite to the plane whereupon the first insulating adhesive layer (4) is formed. The thickness of at least one layer of the first and the second insulating adhesive layers (4, 5) is 0.1-5.0 μm.
TW096112733A 2006-04-12 2007-04-11 Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method TW200745308A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006109690 2006-04-12
JP2006213444 2006-08-04

Publications (2)

Publication Number Publication Date
TW200745308A true TW200745308A (en) 2007-12-16
TWI367930B TWI367930B (en) 2012-07-11

Family

ID=38624909

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096112733A TW200745308A (en) 2006-04-12 2007-04-11 Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method

Country Status (5)

Country Link
JP (1) JP4775377B2 (en)
KR (2) KR101150116B1 (en)
CN (3) CN101421886B (en)
TW (1) TW200745308A (en)
WO (1) WO2007123003A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI464228B (en) * 2010-12-23 2014-12-11 Cheil Ind Inc Anisotropic conductive film and apparatus including the same
TWI491663B (en) * 2009-07-01 2015-07-11 Nippon Kayaku Kk A liquid crystal sealant for liquid crystal dropping, and a liquid crystal display unit using the sealant
TWI557208B (en) * 2012-09-18 2016-11-11 Dexerials Corp An anisotropic conductive film, an anisotropic conductive film manufacturing method, a method for manufacturing a connecting body, and a connecting method
TWI666657B (en) * 2015-05-28 2019-07-21 日商拓自達電線股份有限公司 Mounting conductive paste
TWI741973B (en) * 2015-12-22 2021-10-11 美商英特爾股份有限公司 Manufacturing method of laminated body, laminated body and multilayer circuit board

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5186157B2 (en) * 2007-08-24 2013-04-17 デクセリアルズ株式会社 Anisotropic conductive film and manufacturing method of connection structure using the same
JP2009194359A (en) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd Adhesive film for circuit connection, and connection structure of circuit member and method of connecting circuit member using the same
JP2010241993A (en) * 2009-04-08 2010-10-28 Canon Chemicals Inc Electroconductive adhesive
KR20120076187A (en) * 2010-12-29 2012-07-09 제일모직주식회사 Anisotropic conductive film
CN103596379A (en) * 2013-10-26 2014-02-19 溧阳市东大技术转移中心有限公司 Method for manufacturing double-layer flexible printed circuit board
JP6408759B2 (en) * 2013-11-08 2018-10-17 デクセリアルズ株式会社 Adhesive composition and film winding body
CN114196334A (en) * 2016-01-29 2022-03-18 昭和电工材料株式会社 Adhesive tape, method for producing same, and reel for adhesive film
CN108040425B (en) * 2017-12-14 2019-09-20 广东长盈精密技术有限公司 Electronic equipment and its circuit board
KR102254470B1 (en) * 2018-07-12 2021-05-21 에이치엔에스하이텍(주) Manufacturing method for anisotropic conductive adhesive film
KR102254467B1 (en) * 2018-07-12 2021-05-21 에이치엔에스하이텍(주) Manufacturing method for anisotropic conductive adhesive film
CN110875101A (en) * 2018-08-31 2020-03-10 玮锋科技股份有限公司 Anisotropic conductive film structure and manufacturing method thereof

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JPS61195179A (en) * 1985-02-25 1986-08-29 Matsushita Electric Ind Co Ltd Anisotropically conductive adhesive sheet
JPH01236588A (en) * 1988-03-17 1989-09-21 Matsushita Electric Ind Co Ltd Aeolotropic conductive adhesive body
JPH0636327B2 (en) * 1988-07-06 1994-05-11 日東電工株式会社 Conductive adhesive tape
JP2833111B2 (en) * 1989-03-09 1998-12-09 日立化成工業株式会社 Circuit connection method and adhesive film used therefor
JPH03107888A (en) * 1989-09-21 1991-05-08 Sharp Corp Connecting structure for circuit board
JPH04366630A (en) * 1991-06-13 1992-12-18 Sharp Corp Anisotropic conductive adhesive tape
US5401913A (en) * 1993-06-08 1995-03-28 Minnesota Mining And Manufacturing Company Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
JPH07230840A (en) * 1994-02-17 1995-08-29 Hitachi Chem Co Ltd Connecting member and electrode connecting structure using the same
JP3656768B2 (en) * 1995-02-07 2005-06-08 日立化成工業株式会社 Connection member, electrode connection structure using the connection member, and connection method
US5718789A (en) * 1995-06-07 1998-02-17 The Dexter Corporation Method for making a debossed conductive film composite
JP3914606B2 (en) * 1997-04-25 2007-05-16 松下電器産業株式会社 Adhesive layer manufacturing device, double-sided substrate manufacturing device and multilayer substrate manufacturing device
EP1045437A3 (en) * 1999-04-13 2004-09-01 Matsushita Electric Industrial Co., Ltd. Mounting structure for electronic component, method of producing the same, and electrically conductive adhesive used therein
JP2002076607A (en) * 2000-08-25 2002-03-15 Sekisui Chem Co Ltd Method for transferring and disposing fine particles, fine particle disposing film, conductively connecting film and conductively connecting structure
KR100559937B1 (en) * 2003-01-08 2006-03-13 엘에스전선 주식회사 Method of microelectrode connection and connected srtucture thereby

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI491663B (en) * 2009-07-01 2015-07-11 Nippon Kayaku Kk A liquid crystal sealant for liquid crystal dropping, and a liquid crystal display unit using the sealant
TWI464228B (en) * 2010-12-23 2014-12-11 Cheil Ind Inc Anisotropic conductive film and apparatus including the same
TWI557208B (en) * 2012-09-18 2016-11-11 Dexerials Corp An anisotropic conductive film, an anisotropic conductive film manufacturing method, a method for manufacturing a connecting body, and a connecting method
TWI666657B (en) * 2015-05-28 2019-07-21 日商拓自達電線股份有限公司 Mounting conductive paste
TWI741973B (en) * 2015-12-22 2021-10-11 美商英特爾股份有限公司 Manufacturing method of laminated body, laminated body and multilayer circuit board

Also Published As

Publication number Publication date
TWI367930B (en) 2012-07-11
JP4775377B2 (en) 2011-09-21
CN101421886A (en) 2009-04-29
KR101090561B1 (en) 2011-12-08
WO2007123003A1 (en) 2007-11-01
KR20080108615A (en) 2008-12-15
KR101150116B1 (en) 2012-06-08
JPWO2007123003A1 (en) 2009-09-03
CN101901971A (en) 2010-12-01
CN101901972A (en) 2010-12-01
KR20110063586A (en) 2011-06-10
CN101901972B (en) 2012-07-04
CN101421886B (en) 2010-12-15
CN101901971B (en) 2012-07-04

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