CN101901972B - Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method - Google Patents

Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method Download PDF

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Publication number
CN101901972B
CN101901972B CN2010102207766A CN201010220776A CN101901972B CN 101901972 B CN101901972 B CN 101901972B CN 2010102207766 A CN2010102207766 A CN 2010102207766A CN 201010220776 A CN201010220776 A CN 201010220776A CN 101901972 B CN101901972 B CN 101901972B
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CN
China
Prior art keywords
circuit
insulating properties
electrode
bond layer
adhesive film
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Expired - Fee Related
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CN2010102207766A
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CN101901972A (en
Inventor
广泽幸寿
饭村忠光
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Showa Denko Materials Co ltd
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Hitachi Chemical Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer

Abstract

The invention provides a circuit connecting adhesive film, a circuit member connecting structure and a circuit member connecting method. When the circuit connecting adhesive film is connected between the circuit members, the external flow of conductive particles is less on an electrode, the resolution is high, the long-term connection reliability is excellent, the right positioning of the conductive particles and the electrode is not needed thus the operationality is excellent. Compared with a first insulating adhesive layer and a second insulating adhesive layer, the fusion viscosity of a conductive adhesive layer is high when connecting a first circuit part and a second circuit part; the fusion viscosity of the conductive adhesive layer at 120 DEG C is 5.0*102-5.0*106Pa.S; the thickness of at least one layer of the first insulating adhesive layer and the second insulating adhesive layer is 1.0-4.0 Mum.

Description

The syndeton of circuit connecting adhesive film, circuit block and circuit member connecting method
The application is to be on April 5th, 2007 applying date of original application, and application number is 200780013029.1, and denomination of invention is divided an application for the one Chinese patent application of " syndeton of circuit connecting adhesive film, circuit block and circuit member connecting method ".
Technical field
The present invention relates to the syndeton and the circuit member connecting method of circuit connecting adhesive film, circuit block; In more detail, relate to each other or the circuit connecting adhesive film of use in electronic unit such as IC chip and being connected of wiring substrate etc., use the syndeton and the circuit member connecting method of its circuit block at circuit substrate.
Background technology
With circuit substrate each other or electronic unit such as IC chip when being electrically connected with circuit substrate, use always lets conducting particles be scattered in the anisotropically conducting adhesive of bonding agent.Promptly; This anisotropically conducting adhesive is disposed between the electrode of the aforesaid circuit block of face-off mutually; And the heating with the pressurization electrode is connected each other, thereby, can on compression aspect, have conductivity; Simultaneously to adjacent and electrode that form is given insulating properties each other, and only between opposed electrode, be electrically connected.As such anisotropically conducting adhesive, it for example is the adhesive for circuit connection (for example, with reference to patent documentation 1) of matrix with epoxy resin that the someone has proposed.
Be used for above-mentioned adhesive for circuit connection is realized that high-resolution basic idea is following: the particle diameter through making conducting particles assigns to guarantee the insulating properties between the adjacent electrode less than adjacent interelectrode insulation division; And let the content of conducting particles be the discontiguous each other degree of particle; And, obtain the conduction between the opposed electrode through on electrode, positively there being conducting particles.
But, in the above-mentioned method in the past,, then increase and cause that particle produces 2 aggegations and causes linking owing to the surface area of conducting particles is remarkable if reduce the particle diameter of conducting particles, be easy to generate the problem that can not keep the insulating properties between the adjacent electrode.In addition,, then contact the deficiency of counting, be easy to generate the problem of the conducting between the electrode that can not fully obtain connecting because the quantity of the conducting particles on the electrode also reduces to make if reduce the content of conducting particles.Like this, if with in the past method, then be difficult to the high-resolution that not only keeps long-term connection reliability but also realize adhesive for circuit connection.
Especially because the significant high-resolutionization of circuit substrate in recent years; It is the miniaturization in the space between electrode area, the adjacent electrode; Make the heating and pressurizing of conducting particles when connecting on the electrode outflow between adjacent electrode with bonding agent easily, this situation hampers the high-resolutionization of adhesive for circuit connection.
In order to improve this problem; Someone has proposed following method: process the bonding film that contains the sandwich construction that the conducting particles layer separates with the insulating properties bond layer; Improve the capturing efficiency of the conducting particles on the electrode, thereby, conducting particles suppressed to adjacent interelectrode outflow; Realize high-resolutionization (for example, with reference to patent documentation 2～5).
In addition; The possibility that is connected to become for the electrode that makes miniaturization as above-mentioned or circuit; And the excellent adhesive for circuit connection of realization connection reliability; Also the someone has proposed to have formed in the necessary part of face direction the adhesive for circuit connection (for example, with reference to patent documentation 6) of conducting particles close quarters.
Patent documentation 1: japanese kokai publication hei 3-16147 communique
Patent documentation 2: japanese kokai publication hei 1-236588 communique
Patent documentation 3: japanese kokai publication hei 2-18809 communique
Patent documentation 4: japanese kokai publication hei 4-366630 communique
Patent documentation 5: japanese kokai publication hei 8-279371 communique
Patent documentation 6: TOHKEMY 2002-76607 communique
Summary of the invention
The problem that invention will solve
But, in the method for above-mentioned patent documentation 2 records, the increase in density of the conducting particles in electrode side, fully correspondence is in recent years for the requirement of significant high-resolutionization.In addition,, can reduce the bonding force at the interface of electrode and adhesive for circuit connection, be easy to generate the deterioration of interface peel, connection reliability owing to increase the density of a conducting particles in the electrode side.
In addition, in the method for above-mentioned patent documentation 3～5 records,, connect resistance value and increase, so have the problem of connection reliability variation owing to may not guarantee contacting of electrode and conducting particles fully.
In addition; Adhesive for circuit connection in above-mentioned patent documentation 6 records; Though can realize the connection of the micro-electrode of point-like, the manufacturing approach trouble of bonding agent, simultaneously; When carrying out interelectrode connection, need carry out correct positioning, thereby have the problem of operability difference the close quarters and the electrode of conducting particles.
The present invention is in view of the above problems and the invention of accomplishing; Purpose is to provide a kind of circuit connecting adhesive film; This circuit connecting adhesive film when circuit block connects each other, make the outflow of conducting particles from the electrode less, high-resolution and long-term connection reliability be excellent, need not carry out correct positioning to conducting particles and electrode; Therefore operability is excellent, and the present invention also provides the syndeton and the circuit member connecting method of the circuit block that uses this circuit connecting adhesive film.
The method of dealing with problems
To achieve these goals; The present invention provides a kind of circuit connecting adhesive film; It is first circuit block that is used on the interarea of first substrate, being formed with first circuit electrode; With the second circuit parts that on the interarea of second substrate, are formed with the second circuit electrode; So that the circuit connecting adhesive film that the state of said first circuit electrode and said second circuit electrode contraposition configuration is connected is characterized in that having at least: the conductive adhesive layer that contains conducting particles and bonding agent; The first insulating properties bond layer of the insulating properties that on the single face of above-mentioned conductive adhesive layer, forms; With the face of the face opposition side of the above-mentioned first insulating properties bond layer of being formed with of above-mentioned conductive adhesive layer on the second insulating properties bond layer of the insulating properties that forms, the thickness of at least one side's in said first insulating properties bond layer and the said second insulating properties bond layer layer is 0.1～5.0 μ m.
According to related circuit connecting adhesive film; When being used for circuit block connected each other; Make conducting particles few, and particle seizure property is good, like this from the outflow on the electrode; For small circuit electrode, also can fully guarantee adjacent interelectrode insulating properties and the electrode that should connect between conduction.Therefore, circuit connecting adhesive film of the present invention can be realized high-resolution and long-term connection reliability with high level.In addition, circuit connecting adhesive film of the present invention, owing to need not carry out correct positioning to conducting particles and electrode, therefore, the operability when circuit block is connected each other is excellent.
Here, why play above-mentioned effect, be considered to because following reason through circuit connecting adhesive film of the present invention.That is,, make conducting particles few, and improve the particle capturing efficiency from the outflow on the electrode through conducting particles only is configured in the conductive adhesive layer.Like this, for conducting particles, this conducting particles is contacted each other, and it positively is present on the electrode, can obtain the conductivity in the coupling part fully.In addition,, the insulating properties bond layer is configured between the adjacent circuit electrode, guarantees the insulating properties between the adjacent electrode fully through on the two sides of conductive adhesive layer, forming the insulating properties bond layer.And; The thickness of the insulating properties bond layer through making at least one side is 0.1～5 μ m; Both can fully guarantee the insulating properties between the adjacent electrode; Can fully guarantee contacting of electrode and conducting particles again, can fully guarantee the insulating properties between the adjacent electrode and the electrode that should connect between conductivity.
In addition; With regard to circuit connecting adhesive film of the present invention; Preferred above-mentioned bonding agent contains thermosetting resin; And above-mentioned conductive adhesive layer is compared with above-mentioned first insulating properties bond layer and the above-mentioned second insulating properties bond layer, and the melt viscosity when above-mentioned first circuit block is connected with above-mentioned second circuit parts is high.Like this; Heating and pressurizing in the time of can reducing owing to connection causes conducting particles along with bonding agent flow to the situation between the adjacent circuit electrode outward; Can improve particle thus and catch number; For small circuit electrode, also can guarantee the insulating properties between the adjacent electrode fully and the electrode that should connect between conductivity.
In addition, with regard to circuit connecting adhesive film of the present invention, preferred above-mentioned conductive adhesive layer further contains film formation property macromolecule.Like this, the film that can make the conductive adhesive layer form property become good in, can keep conducting particles with homodisperse state again.And, the circuit connecting adhesive film that relates to, because need be to not carrying out correct positioning between conducting particles and the electrode, so operability is excellent, because connecting portion is difficult to contain bubble, therefore long-term connection reliability is excellent.
The present invention also provides a kind of syndeton of circuit block; It is characterized in that; At first circuit block that is formed with first circuit electrode on the interarea of first substrate and the second circuit parts that on the interarea of second substrate, are formed with the second circuit electrode; The circuit connecting section part of the solidfied material of the circuit connecting adhesive film through between above-mentioned first and second circuit blocks, being provided with, comprising the invention described above stands facing each other with above-mentioned second circuit electrode and the mode that is electrically connected connects with above-mentioned first circuit electrode mutually.
The syndeton of related circuit block; Because the circuit connecting section part comprises the solidfied material of circuit connecting adhesive film of the present invention; Therefore conducting particles is few from the outflow on the electrode; And it is good that particle is caught property, can guarantee the insulating properties between the adjacent electrode fully and the electrode that should connect between conduction, can realize high-resolution and long-term connection reliability with high level.
In addition; With regard to the syndeton of foregoing circuit parts; The height of at least one side's in preferred above-mentioned first circuit electrode and the above-mentioned second circuit electrode circuit electrode is below the 3.0 μ m; Thickness in the foregoing circuit connecting adhesive film is above-mentioned first insulating properties bond layer or the above-mentioned second insulating properties bond layer of 0.1～5.0 μ m, and being configured in highly is the foregoing circuit electrode side below the 3.0 μ m.
The syndeton of related circuit block; For small circuit electrode; Therefore conductivity between the electrode that can guarantee the insulating properties between the adjacent electrode fully and should connect, can reach in recent years the requirement for significant high-resolutionization with high level.
The present invention also provides a kind of circuit member connecting method; It is characterized in that; Through will and on the interarea of second substrate, being formed with the second circuit parts of second circuit electrode at the circuit connecting adhesive film of first circuit block that is formed with first circuit electrode on the interarea of first substrate, the invention described above; Carry out range upon range of with the mode that above-mentioned second circuit electrode stands facing each other mutually with said sequence with above-mentioned first circuit electrode; And heating and pressurization, connect above-mentioned first circuit block and above-mentioned second circuit parts, make above-mentioned first circuit electrode be connected with above-mentioned second circuit electrode electricity.
According to related circuit member connecting method; The circuit connecting adhesive film of the application of the invention; Can suppress the outflow of conducting particles from the electrode; And it is good to make particle catch property, can guarantee the insulating properties between the adjacent electrode fully and the electrode that should connect between conduction.Therefore, can form the syndeton that realizes the high-resolution and the circuit block of long-term connection reliability with high level.
In addition; With regard to the circuit member connecting method of the invention described above; The height of at least one side's among preferred above-mentioned first circuit electrode and the above-mentioned second circuit electrode circuit electrode is below the 3.0 μ m; Through being that the above-mentioned first insulating properties bond layer or the above-mentioned second insulating properties bond layer of 0.1～5.0 μ m be configured in the thickness in the foregoing circuit connecting adhesive film highly is the foregoing circuit electrode side below the 3.0 μ m; And heating and pressurization, connect above-mentioned first circuit block and above-mentioned second circuit parts, make above-mentioned first circuit electrode be connected with above-mentioned second circuit electrode electricity.
According to related circuit member connecting method; Because the conductivity between the electrode that can guarantee the insulating properties between the adjacent electrode fully and should connect; Therefore, can form the syndeton that realizes the high-resolution and the circuit block of long-term connection reliability with high level.
The invention effect
According to the present invention; A kind of circuit connecting adhesive film can be provided; The outflow of conducting particles from the electrode less when circuit block connects each other, high-resolution and long-term connection reliability be excellent for this circuit connecting adhesive film, need not carry out correct positioning to conducting particles and electrode; Therefore operability is excellent, and the present invention also provides the syndeton and the circuit member connecting method of the circuit block that uses this circuit connecting adhesive film.
Description of drawings
Fig. 1 is the constructed profile of a suitable execution mode of expression circuit connecting adhesive film of the present invention.
Fig. 2 is the constructed profile of an other suitable execution mode of expression circuit connecting adhesive film of the present invention.
Fig. 3 is the constructed profile of a suitable execution mode of the syndeton of the circuit block that obtained by the present invention of expression.
Symbol description
The 1st, conducting particles, the 2nd, bonding agent, the 3rd, conductive adhesive layer, the 4th, insulating properties bond layer; The 5th, the insulating properties bond layer, 10 is first circuit blocks, and 11 is first substrates, and 12 is first circuit electrodes; The 20th, the second circuit substrate, 21 is second substrates, is 22 to be second circuit electrodes; 100, the 110th, circuit connecting adhesive film, 110a are the circuit connecting section parts, the 200th, and the syndeton of circuit block.
Embodiment
Below, with reference to accompanying drawing suitable execution mode of the present invention is elaborated.In the accompanying drawings, identical or considerable part is marked as same-sign, omits repeat specification.In addition, the dimensional ratios of accompanying drawing is not limited to illustrated ratio.
Fig. 1 is the constructed profile of a suitable execution mode of expression circuit connecting adhesive film of the present invention (the bonding film of anisotropic conductive).Circuit connecting adhesive film 100 shown in Figure 1 possesses: the conductive adhesive layer 3 that contains conducting particles 1 and bonding agent 2; The insulating properties bond layer 4,5 of the insulating properties that on the two sides of conductive adhesive layer 3, forms, and the thickness of insulating properties bond layer 5 is in the scope of 0.1～5.0 μ m.
In addition, Fig. 2 is the constructed profile of an other suitable execution mode of expression circuit connecting adhesive film of the present invention.Circuit connecting adhesive film 110 shown in Figure 2 possesses: the conductive adhesive layer 3 that contains conducting particles 1 and bonding agent 2; The insulating properties bond layer 5 of the insulating properties that on the two sides of conductive adhesive layer 3, forms, and the thickness of the insulating properties bond layer 5 on two sides is all in the scope of 0.1～5.0 μ m.Though in Fig. 1 and 2, do not make diagram,, on the surface of circuit connecting adhesive film 100,110, can there be strippable fissility base material (support membrane), improve operability or prevent to adhere to dust being used for.Below, adopt circuit connecting adhesive film 100 shown in Figure 1, each layer that constitutes this circuit connecting adhesive film 100 is elaborated.
Conductive adhesive layer 3; It is the layer that contains conducting particles 1 and bonding agent 2 as stated; Be when the circuit block that will have circuit electrode connects each other, connect show on the opposed circuit electrode direction each other conductivity, can be only will this opposed circuit electrode be electrically connected each other have anisotropic conductive layer.Here, bonding agent 2 preferably contains the reaction resin (thermosetting resin) that is solidified by heat.As thermosetting resin; Can use the mixture of the potentiality curing agent such as salt, dicyandiamide of epoxy resin and imidazoles system, hydrazides system, boron trifluoride-amine complex, sulfonium salt, amine acid imide, polyamine, or the mixture of radical reaction property resin and organic peroxide etc.
As above-mentioned epoxy resin; The epoxy-Novolak resin that can enumerate the bisphenol-type epoxy resin of being derived by chloropropylene oxide and bisphenol-A or F, AD etc., derived by chloropropylene oxide and phenol novolaks or cresols novolaks, to have the naphthalene that contains the naphthalene nucleus skeleton be various epoxy compoundss of in a part, having plural glycidyl such as epoxy resin, glycidyl amine, glycidol ether, biphenyl, ester ring type etc., and these can use separately also can mix two or more the use.
These epoxy resin are considered from the viewpoint that prevents electron transfer, preferably use foreign ion (Na +, Cl -Deng) or the content of water-disintegrable chlorine etc. be reduced to the high-purity article below the 300ppm.
Be that purpose is sneaked into and is dispersed with conducting particles 1 actively to give anisotropic conductive in the conductive adhesive layer 3, be used for absorbing the fluctuation of height of salient point or the electrode of substrate etc. of the chip that connects by circuit connecting adhesive film 100.Conducting particles 1 is to contain the for example particle with conductivity of metals such as Au, Ag, Ni, Cu, scolder; More preferably on the surface of the spherical nuclear material that constitutes by macromolecules such as polystyrene, be formed with the particle of the conductive layer that constitutes by metals such as Au, Ag, Ni, Cu, scolders.In addition, conducting particles 1 can be on the surface of the particle with conductivity, is formed with the particle of superficial layers such as Su, Au, scolder.
The particle diameter of conducting particles 1 is necessary the minimum interval less than the electrode of the circuit block that is connected by circuit connecting adhesive film 100, and, when there is fluctuation in the height of electrode, be preferably greater than the fluctuation of its height.The average grain diameter of conducting particles 1 is preferably 1～10 μ m, more preferably 2～5 μ m.If average grain diameter is less than 1 μ m, the fluctuation of height that then can not counter electrode and have the tendency that reduces the conductivity between the electrode if surpass 10 μ m, then has the tendency that the insulating properties between the adjacent electrode reduces easily.
The content of the conducting particles 1 of conductive adhesive layer 3 is benchmark with the whole volume of the solid constituent in the conductive adhesive layer, is preferably 0.1～30 volume %, more preferably 0.2～20 volume %.If this content is less than 0.1 volume %; Then the quantity minimizing owing to the conducting particles on the electrode that should connect has the tendency that contacts the easy reduction of conductivity of counting between deficiency, the connection electrode; If surpass 30 volume %; Then significantly increase because of particle surface is long-pending, have particle produce 2 aggegations and link easily, tendency that the insulating properties between the adjacent electrode reduces easily.
From the better viewpoint of its film formation property is considered, also can cooperate film formation property macromolecule in the conductive adhesive layer 3.As film formation property macromolecule, can enumerate thermoplastic resins such as phenoxy resin, mylar, polyamide etc.Has effect aspect these films formation property macromolecule, the stress mitigation when thermosetting resin cured.Especially, when film forms the property macromolecule and has functional group such as hydroxyl, can improve cementability, therefore more preferably.
In addition, the insulating properties bond layer the 4, the 5th of forming circuit connecting adhesive film 100, layer with insulating properties.In the time of between the adjacent circuit electrode of insulating properties bond layer 4,5 in being configured in circuit block, as long as can guarantee fully that (preferably making the insulating resistance value between the adjacent electrode is 1 * 10 for insulating properties between this adjacent electrode 8More than the Ω), its composition does not have special restriction, for example, can for the identical composition of composition of from above-mentioned conductive adhesive layer 3, removing conducting particles 1.
In addition, in conductive adhesive layer 3 and insulating properties bond layer 4,5, can further sneak into and be dispersed with inanimate matter packing material, rubber particles.These can be sneaked into conducting particles 1 and be scattered in the conductive adhesive layer 3, also can sneak into to be scattered in the insulating properties bond layer 4,5 that does not use conducting particles 1, especially preferably sneak into to be scattered in the conductive adhesive layer 3 that uses conducting particles 1.Through these inanimate matter packing materials, rubber particles are made an addition in the conductive adhesive layer 3; Can be easily and improve the melt viscosity of conductive adhesive layer 3 when circuit block connects each other fully, make it be higher than the melt viscosity of insulating properties bond layer 4,5 when connecting.
As the inanimate matter packing material, do not have special restriction, can enumerate for example powder such as fused silica, crystalline silica, calcium silicates, aluminium oxide, calcium carbonate.The average grain diameter of inanimate matter packing material is considered from the viewpoint of the poor flow that prevents connecting portion, is preferably below the 3 μ m.
No matter use level when using the inanimate matter packing material is in conductive adhesive layer 3 and insulating properties bond layer 4,5, is 100 mass parts with the use level of bonding agent 2, is preferably 5～100 mass parts.When improving melt viscosity, this use level produces effect more greatly more.
As rubber particles, so long as being rubber particles below 25 ℃, glass transition temperature gets final product, do not have special restriction, can use for example butadiene rubber, acrylic rubber, s-B-S rubber, acrylonitrile-butadiene rubber, silicon rubber etc.As rubber particles, preferably using average grain diameter is the rubber particles of 0.1～10 μ m, and more preferably the particle below the average grain diameter accounts for the rubber particles more than 80% of particle size distribution.The average grain diameter of rubber particles is 0.1～5 μ m more preferably.In addition, when handling the rubber particles surface, can improve dispersiveness for reaction resin with silane coupling agent, therefore preferred.
In rubber particles, therefore the silicon rubber particle can be preferably used as effective rubber particles except the solvent resistance excellence is also excellent with heterodispersity.The silicon rubber particle; Can pass through silane compound, methyl trialkoxysilane and/or its partial hydrolysis condensation product; Make an addition to by alkaline matters such as caustic soda, ammonia and be adjusted in the alcohol solution more than the pH9, be hydrolyzed, the method for polycondensation or the copolymerization through organosiloxane wait and obtain.In addition, side chain contains the organosilicon particulate of functional groups such as hydroxyl, epoxy radicals, ketimide, carboxyl, sulfydryl in molecular end or molecule, can improve the dispersiveness for reaction resin, and is therefore preferred.
No matter use level when using rubber particles is in conductive adhesive layer 3 and insulating properties bond layer 4,5, is 100 mass parts with the use level of bonding agent 2, is preferably 5～50 mass parts.
The formation of conductive adhesive layer 3 and insulating properties bond layer 4,5; Can carry out through following method: will contain above-mentioned bonding agent 2 (reaction resin and potentiality curing agent etc.) at least, will further contain the adhesive composition of conducting particles 1 for conductive adhesive layer 3; Be dissolved or dispersed in the organic solvent, make its liquid stateization, be prepared into coating fluid; This coating fluid is coated on the fissility base material (support membrane), below the active temperature of curing agent, removes and desolvate.The solvent that use this moment is considered from the deliquescent viewpoint that improves material, is preferably aromatic hydrocarbon series solvent and the mixed solvent that contains the oxygen series solvent.In addition, as the fissility base material, can use the PET film etc. that is become to have release property by surface treatment aptly.
Though not shown, also conductive adhesive layer or insulating properties bond layer can further be set in the outside of insulating properties bond layer 4,5.
And, as the method for making of circuit connecting adhesive film 100, can adopt the method that for example will carry out lamination like formed conductive adhesive layer 3 of above-mentioned operation and insulating properties bond layer 4,5, perhaps be coated with the known method such as method of each layer successively.
In the circuit connecting adhesive film 100 that obtains like this, the thickness of conductive adhesive layer 3 is preferably 3～15 μ m, more preferably 5～10 μ m.If this thickness is less than 3 μ m; Then when using the suitable conducting particles of average grain diameter; Tendency with formation property reduction of conductive adhesive layer; If surpass 15 μ m, then conducting particles increases from the outflow on the electrode, has the tendency of the conductivity between the electrode that is difficult to guarantee the insulating properties between the adjacent electrode fully and should connects.
In addition, the thickness of insulating properties bond layer 5 need be 0.1～5.0 μ m, is preferably 1.0～5.0 μ m, more preferably 2.0～4.0 μ m.If this thickness is less than 0.1 μ m; In the time of then between the adjacent circuit electrode in being disposed at circuit block; Can not guarantee the insulating properties between this adjacent electrode fully; If surpass 5 μ m, then conducting particles increases from the outflow on the electrode, can not guarantee the insulating properties between the adjacent electrode fully and the electrode that should connect between conductivity.
In addition, the thickness of insulating properties bond layer 4 is preferably below the summation of the thickness of first circuit electrode that forms on the interarea of first substrate and the thickness of the second circuit electrode that is forming on the interarea of second substrate.If the thickness of insulating properties bond layer 4 is greater than the summation of the thickness of the thickness of first circuit electrode and second circuit electrode; Then conducting particles increases from the outflow on the electrode, has the tendency of the conductivity between the electrode that is difficult to fully to guarantee the insulating properties between the adjacent electrode and should connects.
In addition, circuit bonding with bonding film 100 in, conductive adhesive layer 3 is preferably, and compares with insulating properties bond layer 4,5, melt viscosity when circuit block connects each other is high.Here, the melt viscosity during said above-mentioned connection, the melt viscosity under the heating-up temperature when being to use 100 pairs of circuit blocks of circuit connecting adhesive film to connect each other.Heating-up temperature when circuit block is connected each other waits suitably according to the curable of the bonding agent in the circuit connecting adhesive film 100 and regulates, and is generally 120 ℃～220 ℃ scope.Thereby in this temperature range, more preferably the melt viscosity of conductive adhesive layer 3 is higher than the melt viscosity of insulating properties bond layer 4,5.
In addition, as the melt viscosity of conductive adhesive layer 3 when connecting, specifically, for example under 120 ℃, be preferably 5.0 * 10 2～5.0 * 10 6Pas, more preferably 5.0 * 10 3～5.0 * 10 5Pas.
In addition, as the melt viscosity of insulating properties bond layer 4,5 when connecting, specifically, for example under 120 ℃, be preferably 1.0 * 10 2～1.0 * 10 6Pas, more preferably 1.0 * 10 3～1.0 * 10 5Pas.
Then, the syndeton to the circuit block of the present invention that uses circuit connecting adhesive film 110 of the present invention describes.
Fig. 3 is the constructed profile of a suitable execution mode of the syndeton of the circuit block that obtained by the present invention of expression.The syndeton 200 of circuit block shown in Figure 3; Be have first substrate 11 and first circuit block 10 of first circuit electrode 12 that forms on its interarea, with the second circuit parts 20 of the second circuit electrode 22 that has second substrate 21 and on its interarea, form; The structure that connects through circuit connecting section part 110a; Said circuit connecting section part 110a comprises the solidfied material that the circuit connecting adhesive film 110 of the invention described above solidifies, and be formed on first and second circuit blocks 10, between 20.In the syndeton 200 of circuit block, first circuit electrode 12 stands facing each other with second circuit electrode 22 mutually, and is electrically connected.
Circuit connecting section part 110a is the parts that comprise the solidfied material of circuit connecting adhesive film 110 curing of the present invention; Be by solidfied material 2a that contains above-mentioned bonding agent 2 and the solidfied material 3a that is scattered in the conductive adhesive layer 3 of conducting particles 1 wherein, constitute with the solidfied material 5a of the insulating properties bond layer 5 that is formed on its two sides.And first circuit electrode 12 is electrically connected through conducting particles 1 with second circuit electrode 22.In addition, the solidfied material 5a of insulating properties bond layer 5 forms with the mode around the first and second substrates, 11,12 sides that cover first and second circuit electrodes 12,22 at least.This is because when first and second circuit blocks 10,20 connected, insulating properties bond layer 5 flow to around it outside (on the face opposite one another) from first and second circuit electrodes 12,22.
As first and second circuit blocks 10,20,, do not have special restriction so long as formation needs the parts of the electrode of electrical connection to get final product.Specifically, can enumerate glass or plastic base, printed circuit board (PCB), ceramic wiring board, flexible wiring sheet, semiconductor silicon chips of being formed electrode by ITO that is used for LCD etc. etc., these can make up use as required.Tin indium oxide), silicon nitride (SiN like this, in this execution mode, can use picture to be representative with printed circuit board (PCB) or by materials that organic substance was constituted such as polyimides, and metal such as copper, aluminium or ITO (indium tin oxide: x), silicon dioxide (SiO 2) wait inorganic like this, have the circuit block of diversified surface state.
The syndeton 200 of circuit block can obtain through following method: for example; Through circuit connecting adhesive film 110 and second circuit parts 20 with first circuit block 10, the invention described above; Carry out range upon range of with the mode that second circuit electrode 21 stands facing each other mutually with said sequence with first circuit electrode 11; And heating and pressurization, connect first circuit block 10 and second circuit parts 20, the circuit electrode 11 of winning is electrically connected with second circuit electrode 21.
With regard to this method; At first, to heating with the state on the second circuit parts 20 of fitting at the circuit connecting adhesive film 110 that forms on the fissility base material and pressurizeing temporary transient bonding circuit connecting adhesive film 110; Peel off the fissility base material; Then, on one side the positioning circuit electrode put first circuit block 10 on one side, just can be ready to second circuit parts 20, circuit connecting adhesive film 110 and first circuit block 10 are carried out range upon range of duplexer in proper order with this.
The condition that above-mentioned duplexer is heated and pressurizes can be carried out suitable adjusting according to curable of the bonding agent in the circuit connecting adhesive film etc., makes the circuit connecting adhesive film be cured and obtains enough adhesive strengths.
In the explanation of the syndeton 200 of foregoing circuit parts and manufacturing approach thereof, explained and used the situation of circuit connecting adhesive film 110, but also can use circuit connecting adhesive film 100 to replace circuit connecting adhesive film 110.
Embodiment
Below, come more specifically to explain the present invention based on embodiment and comparative example, but the present invention is not limited to following examples.
(embodiment 1)
(Union Carbide Corporation makes with phenoxy resin; Trade name: PKHC) 32 mass parts, (Japanese catalyst society makes in bisphenol A type epoxy resin, to be dispersed with the acrylic particles resin that contains of acrylic resin particle of average grain diameter 0.2 μ m of 20 quality %; Trade name: BPA328) 10 mass parts, bisphenol A-type solid epoxy resin (oiling shell epoxy manufactured; Trade name: YL980) 20 mass parts, imidazoles are that (industry society of Asahi Chemical Industry makes curing agent; Trade name: NOVACURE HX-3941) (Uni-Charm Co., Ltd. makes for 35 mass parts and silane coupling agent; Trade name: A187) 3 mass parts, be dissolved in the toluene as solvent, the insulating properties bond layer that obtains solid constituent 50 quality % forms uses coating fluid.
Then; Adopt apparatus for coating; This coating fluid is coated on the single face face of coating fluid (coating) has implemented on the PET film of the thickness 50 μ m that the demoulding handles,, thereby on the PET film, form the insulating properties bond layer (a) of thickness 11 μ m 70 ℃ of heated-air dryings of carrying out 10 minutes.Melt viscosity to this insulating properties bond layer (a); Use determination of viscoelasticity device (Rheometrics manufactured); Under the condition till 10 ℃/minute of the programming rates, frequency 10Hz, 25 ℃～200 ℃, measure, the result, the melt viscosity under 120 ℃ is 1.0 * 10 3Pas.
Further; Adopt apparatus for coating; Above-mentioned insulating properties bond layer formed be coated on single face (face of coating coating fluid) with coating fluid and implemented on the PET film of the thickness 25 μ m that the demoulding handles; 70 ℃ of heated-air dryings of carrying out 10 minutes, thereby on the PET film, form the insulating properties bond layer (b) of thickness 2 μ m.Melt viscosity to this insulating properties bond layer (b); Use determination of viscoelasticity device (Rheometrics manufactured); Under the condition till 10 ℃/minute of the programming rates, frequency 10Hz, 25 ℃～200 ℃, measure, the result, the melt viscosity under 120 ℃ is 1.0 * 10 3Pas.
Then; (Union Carbide Corporation makes with phenoxy resin; Trade name: PKHC) 32 mass parts, (Japanese catalyst society makes in bisphenol A type epoxy resin, to be dispersed with the acrylic particles resin that contains of acrylic resin particle of average grain diameter 0.2 μ m of 20 quality %; Trade name: BPA328) 20 mass parts, imidazoles are that (industry society of Asahi Chemical Industry makes curing agent; Trade name: NOVACURE HX-3941) (Uni-Charm Co., Ltd. makes, trade name: A187) (Dong Li Dow Corning Corporation makes, trade name: E604) 30 mass parts for 3 mass parts and organic silicon rubber for 35 mass parts, silane coupling agent; Be dissolved in the toluene as solvent, prepare the adhesive solution of solid constituent 50 quality %.In these adhesive solution 100 mass parts, (diameter: (average grain diameter: 20 mass parts 3.2 μ m) obtain the conductive adhesive layer and form and to use coating fluid to be formed with the conducting particles of Au layer on the surface 3 μ m) to be dispersed in the polystyrene nucleome.
Adopt apparatus for coating, this coating fluid is coated on single face (face of coating coating fluid) has implemented on the PET film of the thickness 50 μ m that the demoulding handles,, thereby on the PET film, form the conductive adhesive layer (c) of thickness 10 μ m 70 ℃ of heated-air dryings of carrying out 10 minutes.Melt viscosity to this conductive adhesive layer (c); Use determination of viscoelasticity device (Rheometrics manufactured); Under the condition till 10 ℃/minute of the programming rates, frequency 10Hz, 25 ℃～200 ℃, measure, the result, the melt viscosity under 120 ℃ is 1.0 * 10 4Pas.
To at above-mentioned insulating properties bond layer (a) that obtains and conductive adhesive layer (c), on one side 40 ℃ down heating carry out lamination with the roll laminating machine on one side, obtain stacked film.Then; Conductive adhesive layer (c) side at the stacked film that obtains; After the PET film on having peeled off conductive adhesive layer (c); With the above-mentioned insulating properties bond layer (b) that obtains, on one side 40 ℃ down heating carry out lamination with the roll laminating machine on one side, the thickness that obtains insulating properties bond layer (a) is that the thickness of 11 μ m, conductive adhesive layer (c) is that the thickness of 10 μ m, insulating properties bond layer (b) is the circuit connecting adhesive film of the 3-tier architecture of 2 μ m.
(embodiment 2)
The thickness that makes insulating properties bond layer (a) is 8 μ m; The thickness that makes insulating properties bond layer (b) is 5 μ m, and the thickness that further makes conductive adhesive layer (c) is 10 μ m, in addition; Operate equally with embodiment 1, obtain the circuit connecting adhesive film of 3-tier architecture.
(embodiment 3)
The thickness that makes insulating properties bond layer (a) is 12 μ m; The thickness that makes insulating properties bond layer (b) is 0.1 μ m, and the thickness that further makes conductive adhesive layer (c) is 10 μ m, in addition; Operate equally with embodiment 1, obtain the circuit connecting adhesive film of 3-tier architecture.
(embodiment 4)
The thickness that makes insulating properties bond layer (a) is 3 μ m; The thickness that makes insulating properties bond layer (b) is 3 μ m, and the thickness that further makes conductive adhesive layer (c) is 10 μ m, in addition; Operate equally with embodiment 1, obtain the circuit connecting adhesive film of 3-tier architecture.
(embodiment 5)
(Union Carbide Corporation makes with phenoxy resin; Trade name: PKHC) 32 mass parts, (Japanese catalyst society makes in bisphenol A type epoxy resin, to be dispersed with the acrylic particles resin that contains of acrylic resin particle of average grain diameter 0.2 μ m of 20 quality %; Trade name: BPA328) 20 mass parts, imidazoles are that (industry society of Asahi Chemical Industry makes curing agent; Trade name: NOVACURE HX-3941) (Uni-Charm Co., Ltd. makes for 35 mass parts, silane coupling agent; Trade name: A187) (Dong Li Dow Corning Corporation makes for 3 mass parts and organic silicon rubber; Trade name: E604) 30 mass parts, be dissolved in the toluene as solvent, the insulating properties bond layer that obtains solid constituent 50 quality % forms uses coating fluid.
Then; Adopt apparatus for coating; This coating fluid is coated on the single face face of coating fluid (coating) has implemented on the PET film of the thickness 50 μ m that the demoulding handles,, thereby on the PET film, form the insulating properties bond layer (a) of thickness 11 μ m 70 ℃ of heated-air dryings of carrying out 10 minutes.Melt viscosity to this insulating properties bond layer (a); Use determination of viscoelasticity device (Rheometrics manufactured); Under the condition till 10 ℃/minute of the programming rates, frequency 10Hz, 25 ℃～200 ℃, measure, the result, the melt viscosity under 120 ℃ is 1.0 * 10 4Pas.
Further; Adopt apparatus for coating; Above-mentioned insulating properties bond layer formed be coated on single face (face of coating coating fluid) with coating fluid and implemented on the PET film of the thickness 25 μ m that the demoulding handles; 70 ℃ of heated-air dryings of carrying out 10 minutes, thereby on the PET film, form the insulating properties bond layer (b) of thickness 2 μ m.Melt viscosity to this insulating properties bond layer (b); Use determination of viscoelasticity device (Rheometrics manufactured); Under the condition till 10 ℃/minute of the programming rates, frequency 10Hz, 25 ℃～200 ℃, measure, the result, the melt viscosity under 120 ℃ is 1.0 * 10 4Pas.
Then; (Union Carbide Corporation makes with phenoxy resin; Trade name: PKHC) 32 mass parts, (Japanese catalyst society makes in bisphenol A type epoxy resin, to be dispersed with the acrylic particles resin that contains of acrylic resin particle of average grain diameter 0.2 μ m of 20 quality %; Trade name: BPA328) 10 mass parts, bisphenol A-type solid epoxy resin (oiling shell epoxy manufactured; Trade name: YL980) 20 mass parts, imidazoles are that (industry society of Asahi Chemical Industry makes trade name: HX-3941) (Uni-Charm Co., Ltd. makes curing agent, trade name: A187) 3 mass parts for 35 mass parts, silane coupling agent; Be dissolved in the toluene as solvent, prepare the adhesive solution of solid constituent 50 quality %.In these adhesive solution 100 mass parts, (diameter: (average grain diameter: 20 mass parts 3.2 μ m) obtain the conductive adhesive layer and form and to use coating fluid to be formed with the conducting particles of Ni and Au layer on the surface 3 μ m) to be dispersed in the polystyrene nucleome.
Adopt apparatus for coating, this coating fluid is coated on single face (face of coating coating fluid) has implemented on the PET film of the thickness 50 μ m that the demoulding handles,, thereby on the PET film, form the insulating properties bond layer (c) of thickness 10 μ m 70 ℃ of heated-air dryings of carrying out 10 minutes.Melt viscosity to this conductive adhesive layer (c); Use determination of viscoelasticity device (Rheometrics manufactured); Under the condition till 10 ℃/minute of the programming rates, frequency 10Hz, 25 ℃～200 ℃, measure, the result, the melt viscosity under 120 ℃ is 1.0 * 10 3Pas.
To at above-mentioned insulating properties bond layer (a) that obtains and conductive adhesive layer (c), on one side 40 ℃ down heating carry out lamination with the roll laminating machine on one side, obtain stacked film.Then; Conductive adhesive layer (c) side at the stacked film that obtains; After the PET film on having peeled off conductive adhesive layer (c); With the above-mentioned insulating properties bond layer (b) that obtains, on one side 40 ℃ down heating carry out lamination with the roll laminating machine on one side, the thickness that obtains insulating properties bond layer (a) is that the thickness of 11 μ m, conductive adhesive layer (c) is that the thickness of 10 μ m, insulating properties bond layer (b) is the circuit connecting adhesive film of the 3-tier architecture of 2 μ m.
(comparative example 1)
The thickness that makes insulating properties bond layer (a) is 7 μ m, and the thickness that makes insulating properties bond layer (b) is 7 μ m, and to make the thickness of conductive adhesive layer (c) be 9 μ m, in addition, operates equally with embodiment 1, obtains the circuit connecting adhesive film of 3-tier architecture.
(comparative example 2)
(Union Carbide Corporation makes with phenoxy resin; Trade name: PKHC) 32 mass parts, (Japanese catalyst society makes in bisphenol A type epoxy resin, to be dispersed with the acrylic particles resin that contains of acrylic resin particle of average grain diameter 0.2 μ m of 20 quality %; Trade name: BPA328) 10 mass parts, bisphenol A-type solid epoxy resin (oiling shell epoxy manufactured; Trade name: YL980) 20 mass parts, imidazoles are that (industry society of Asahi Chemical Industry makes curing agent; Trade name: NOVACURE HX-3941) (Uni-Charm Co., Ltd. makes for 35 mass parts and silane coupling agent; Trade name: A187) 3 mass parts, be dissolved in the toluene as solvent, the insulating properties bond layer that obtains solid constituent 50 quality % forms uses coating fluid.
Then; Adopt apparatus for coating; This coating fluid is coated on the single face face of coating fluid (coating) has implemented on the PET film of the thickness 50 μ m that the demoulding handles,, thereby on the PET film, form the insulating properties bond layer (a) of thickness 13 μ m 70 ℃ of heated-air dryings of carrying out 10 minutes.Melt viscosity to this insulating properties bond layer (a); Use determination of viscoelasticity device (Rheometrics manufactured); Under the condition till 10 ℃/minute of the programming rates, frequency 10Hz, 25 ℃～200 ℃, measure, the result, the melt viscosity under 120 ℃ is 1.0 * 10 3Pas.
Then; In above-mentioned insulating properties bond layer forms with coating fluid 100 mass parts; (diameter: (average grain diameter: 20 mass parts 3.2 μ m) obtain the conductive adhesive layer and form and to use coating fluid to be formed with the conducting particles of Au layer on the surface 3 μ m) to be dispersed in the polystyrene nucleome.Adopt apparatus for coating, this coating fluid is coated on single face (face of coating coating fluid) has implemented on the PET film of the thickness 50 μ m that the demoulding handles,, thereby on the PET film, form the conductive adhesive layer (c) of thickness 10 μ m 70 ℃ of heated-air dryings of carrying out 10 minutes.Melt viscosity to this conductive adhesive layer (c); Use determination of viscoelasticity device (Rheometrics manufactured); Under the condition till 10 ℃/minute of the programming rates, frequency 10Hz, 25 ℃～200 ℃, measure, the result, the melt viscosity under 120 ℃ is 1.0 * 10 3Pas.
To at above-mentioned insulating properties bond layer (a) that obtains and conductive adhesive layer (c), on one side 40 ℃ down heating carry out lamination with the roll laminating machine on one side, obtain the circuit connecting adhesive film of 2 layers of structure.
(comparative example 3)
The thickness that makes insulating properties bond layer (a) is 12 μ m; The thickness that makes insulating properties bond layer (b) is 0.08 μ m, and to make the thickness of conductive adhesive layer (c) be 10 μ m, in addition; Operate equally with embodiment 1, obtain the circuit connecting adhesive film of 3-tier architecture.
[particle is caught the mensuration of number]
Be employed in the circuit connecting adhesive film of making in the foregoing description and the comparative example; To have au bump (area: 30 * 50 μ m, bump height: 15 μ m, salient point number: chip 300) (1.2 * 19mm, thickness: 500 μ m); With the glass substrate that has the ITO circuit (thickness: 0.7mm; Electrode height: 0.15 μ m), shown in following, connect.
At first, through at 80 ℃, 0.98MPa (10kgf/cm 2) condition under carry out the heating and pressurizing in 2 seconds, (1.5 * 20mm) are attached on the glass substrate that has the ITO circuit with the circuit connecting adhesive film.At this moment; The circuit connecting adhesive film of 3-tier architecture; Be behind the PET film that peels off on the insulating properties bond layer (b), this insulating properties bond layer (b) be attached on the glass substrate circuit connecting adhesive film of 2 layers of structure; Be behind the PET film that peels off on the conductive adhesive layer (c), this conductive adhesive layer (c) is attached on the glass substrate.
Then; Peel off the PET film from the circuit connecting adhesive film; After the salient point of chip and the glass substrate that has the ITO circuit positioned; Under 190 ℃, 40g/ salient point, the condition in 10 seconds, heat, pressurize from the chip top, carry out chip and the formal of glass substrate is connected through the circuit connecting adhesive film.
At this moment, the employing magnification ratio is 200～500 times a microscope, measures the conducting particles number of being caught by au bump (area 30 * 50 μ m).Like this, obtain the minimum value of the particle seizure number of the au bump in the circuit connecting adhesive film of in the foregoing description and comparative example, making.The result is shown in Table 1.
[mensuration of insulating resistance value]
Be employed in the circuit connecting adhesive film of making in the foregoing description and the comparative example; To have au bump (area: space 10 μ m between 30 * 100 μ m, salient point, highly: 15 μ m, salient point number: chip 472) (1.9 * 15mm, thickness: 500 μ m); With the glass substrate that has the ITO circuit (thickness: 0.7mm; Electrode height: 0.15 μ m), shown in following, connect.
At first, through at 80 ℃, 0.98MPa (10kgf/cm 2) condition under carry out the heating and pressurizing in 2 seconds, (2.0 * 20mm) are attached on the glass substrate that has the ITO circuit with the circuit connecting adhesive film.At this moment; The circuit connecting adhesive film of 3-tier architecture; Be behind the PET film that peels off on the insulating properties bond layer (b), this insulating properties bond layer (b) be attached on the glass substrate circuit connecting adhesive film of 2 layers of structure; Be behind the PET film that peels off on the conductive adhesive layer (c), this conductive adhesive layer (c) is attached on the glass substrate.
Then; Peel off the PET film from the circuit connecting adhesive film; After the salient point of chip and the glass substrate that has the ITO circuit positioned; Under 190 ℃, 40g/ salient point, the condition in 10 seconds, heat, pressurize from the chip top, carry out chip and the formal of glass substrate is connected through the circuit connecting adhesive film.
For obtaining connecting sample like this, carry out following energising humidity test.That is, to connecting sample, under 85 ℃, the environment of 85%RH, apply the processing of 500 hours DC15V.
Insulating resistance value for the connection sample after the energising humidity test adopts insulating-resistance meter, at room temperature, measuring under voltage 50V, 60 seconds the condition of voltage application time, measures the insulation resistance between the adjacent salient point.Like this, judge whether the insulation characterisitic between the adjacent salient point is good.This moment, the good insulation performance characteristic was meant that insulating resistance value is 1 * 10 8More than the Ω, be 1 * 10 with the insulating resistance value between whole adjacent salient points 8The above sample of Ω is evaluated as A, will contain insulating resistance value between the adjacent salient point less than 1 * 10 8The sample in the site of Ω is evaluated as B.The minimum value of its result and insulating resistance value is shown in Table 1.
[mensuration that connects resistance value]
Be employed in the circuit connecting adhesive film of making in the foregoing description and the comparative example; To have au bump (area: 30 * 50 μ m, bump height: 15 μ m, salient point number: chip 300) (1.2 * 19mm, thickness: 500 μ m); With the glass substrate that has the ITO circuit (thickness: 0.7mm; Electrode height: 0.15 μ m), shown in following, connect.
Through at 80 ℃, 0.98MPa (10kgf/cm 2) condition under carry out the heating and pressurizing in 2 seconds, (1.5 * 20mm) are attached on the glass substrate that has the ITO circuit with the circuit connecting adhesive film.At this moment; The circuit connecting adhesive film of 3-tier architecture; Be behind the PET film that peels off on the insulating properties bond layer (b), this insulating properties bond layer (b) be attached on the glass substrate circuit connecting adhesive film of 2 layers of structure; Be behind the PET film that peels off on the conductive adhesive layer (c), this conductive adhesive layer (c) is attached on the glass substrate.
Then; Peel off the PET film from the circuit connecting adhesive film; After the salient point of chip and the glass substrate that has the ITO circuit positioned; Under 190 ℃, 40g/ salient point, the condition in 10 seconds, heat, pressurize from the chip top, carry out chip and the formal of glass substrate is connected through the circuit connecting adhesive film.
For obtaining connecting sample like this, carry out following humidity test.That is,, carry out 85 ℃, 1000 hours the processing of environment held of 85%RH to connecting sample.
For the connection resistance value of the connection sample after the humidity test, adopt digital multimeter, measure the connection resistance of each salient point with 4 terminal methods.Like this, judge whether conducting is good.Good conducting this moment is meant that connecting resistance value is below 20 Ω, is that sample below 20 Ω is evaluated as A with the connection resistance value of whole salient points, will contain to connect the sample that resistance value surpasses the salient point of 20 Ω and be evaluated as B.Its result is shown in Table 1 with the maximum that is connected resistance value.
Table 1
Figure BSA00000177531800191
Can confirm from the result shown in the table 1; In the circuit connecting adhesive film of the embodiment 1～5 of thickness in 0.1～5.0 mu m range of the insulating properties bond layer of single face at least; It is abundant that particle between the electrode is caught number, after the insulating resistance value after the energising humidity test and the humidity test to be connected resistance value all good.Can confirm on the other hand, the thickness of insulating properties bond layer all is in the circuit connecting adhesive film of comparative example 1 of 7 μ m on the two sides, and it is all relatively poor that insulating resistance value, the connection resistance value after the humidity test and the particle after the energising humidity test caught number.In addition, also can confirm, in the circuit connecting adhesive film (comparative example 2) of 2 layers of structure that constituted by conductive adhesive layer and insulating properties bond layer, the insulation resistance value difference after the energising humidity test.In addition, also can confirm, be in the comparative example 3 less than the 0.08 μ m of 0.1 μ m at the thickness of insulating properties bond layer, owing to can not guarantee the insulating properties between the adjacent electrode fully, makes that the insulating resistance value after the energising humidity test worsens.To sum up, can confirm, connecting adhesive film in a circuit according to the invention, when circuit block connected each other, conducting particles was few from the outflow on the electrode, and high-resolution is excellent with long-term connection reliability.
Applicability on the industry
Like the above explanation of doing,, a kind of circuit connecting adhesive film can be provided according to the present invention; This circuit connecting adhesive film is because when circuit block connects each other; Conducting particles is few from the outflow on the electrode, and high-resolution is excellent with long-term connection reliability, need not carry out correct positioning to conducting particles and electrode; So operability is excellent, the present invention can also provide the syndeton and the circuit member connecting method of the circuit block that uses this circuit connecting adhesive film.

Claims (18)

1. circuit connecting adhesive film; It is first circuit block that is used on the interarea of first substrate, being formed with first circuit electrode; With the second circuit parts that on the interarea of second substrate, are formed with the second circuit electrode; So that the circuit connecting adhesive film that the state of said first circuit electrode and said second circuit electrode contraposition configuration is connected is characterized in that
At least have: the conductive adhesive layer that contains conducting particles and bonding agent; The first insulating properties bond layer of the insulating properties that on the single face of said conductive adhesive layer, forms; With the face of the face opposition side of the said first insulating properties bond layer of being formed with of said conductive adhesive layer on the second insulating properties bond layer of the insulating properties that forms,
Said bonding agent contains thermosetting resin;
Said conductive adhesive layer is compared with said first insulating properties bond layer and the said second insulating properties bond layer, and the melt viscosity when said first circuit block is connected with said second circuit parts is high;
The melt viscosity at 120 ℃ of said conductive adhesive layer is 5.0 * 10 2～5.0 * 10 6Pas;
The thickness of at least one side's in said first insulating properties bond layer and the said second insulating properties bond layer layer is 1.0～4.0 μ m;
The height of at least one side's in said first circuit electrode and the said second circuit electrode circuit electrode is below the 3.0 μ m; Thickness in the said circuit connecting adhesive film is said first insulating properties bond layer or the said second insulating properties bond layer of 1.0～4.0 μ m, and being configured in highly is the said circuit electrode side below the 3.0 μ m.
2. circuit connecting adhesive film according to claim 1 is characterized in that, the melt viscosity at 120 ℃ of said conductive adhesive layer is 5.0 * 10 3～5.0 * 10 5Pas.
3. circuit connecting adhesive film according to claim 1 and 2 is characterized in that, the melt viscosity at 120 ℃ of said first insulating properties bond layer and the said second insulating properties bond layer is 1.0 * 10 2～1.0 * 10 6Pas.
4. circuit connecting adhesive film according to claim 1 and 2 is characterized in that, the melt viscosity at 120 ℃ of said first insulating properties bond layer and the said second insulating properties bond layer is 1.0 * 10 3～1.0 * 10 5Pas.
5. circuit connecting adhesive film according to claim 1 is characterized in that, said conductive adhesive layer further contains film formation property macromolecule.
6. according to claim 1 or 3 described circuit connecting adhesive films, it is characterized in that said bonding agent contains the mixture of epoxy resin and potentiality curing agent, or the mixture of radical reaction property resin and organic peroxide.
7. according to claim 1 or 3 described circuit connecting adhesive films, it is characterized in that the thickness of said conductive adhesive layer is 3～15 μ m.
8. according to claim 1 or 3 described circuit connecting adhesive films, it is characterized in that the thickness of said conductive adhesive layer is 5～10 μ m.
9. the syndeton of a circuit block; It is characterized in that; At first circuit block that is formed with first circuit electrode on the interarea of first substrate and the second circuit parts that on the interarea of second substrate, are formed with the second circuit electrode; Through between said first and second circuit blocks, being provided with, comprising the circuit connecting section part of the solidfied material of each described circuit connecting adhesive film in the claim 1～8, stand facing each other mutually with said second circuit electrode and the mode that is electrically connected connects with said first circuit electrode;
The height of at least one side's in said first circuit electrode and the said second circuit electrode circuit electrode is below the 3.0 μ m; Thickness in the said circuit connecting adhesive film is said first insulating properties bond layer or the said second insulating properties bond layer of 1.0～4.0 μ m, and being configured in highly is the said circuit electrode side below the 3.0 μ m.
10. circuit member connecting method; It is characterized in that; Each described circuit connecting adhesive film and on the interarea of second substrate, be formed with the second circuit parts of second circuit electrode in first circuit block through will on the interarea of first substrate, being formed with first circuit electrode, the claim 1～8; Carry out range upon range of with the mode that said second circuit electrode stands facing each other mutually with said sequence with said first circuit electrode; And heating and pressurization, connect said first circuit block and said second circuit parts, make said first circuit electrode be connected with said second circuit electrode electricity;
The height of at least one side's in said first circuit electrode and the said second circuit electrode circuit electrode is below the 3.0 μ m; Through being that the said first insulating properties bond layer or the said second insulating properties bond layer of 1.0～4.0 μ m be configured in the thickness in the said circuit connecting adhesive film highly is the said circuit electrode side below the 3.0 μ m; And heating and pressurization; Connect said first circuit block and said second circuit parts, make said first circuit electrode be connected with said second circuit electrode electricity.
11. the method for using of a circuit connecting adhesive film; It is first circuit block that is used on the interarea of first substrate, being formed with first circuit electrode; With the second circuit parts that on the interarea of second substrate, are formed with the second circuit electrode, the method for using of the circuit connecting adhesive film that the state that disposes with said first circuit electrode and said second circuit electrode contraposition is connected; Wherein,
This circuit connecting adhesive film has at least:
The conductive adhesive layer that contains conducting particles and bonding agent,
The first insulating properties bond layer of the insulating properties that on the single face of said conductive adhesive layer, forms,
With the face of the face opposition side of the said first insulating properties bond layer of being formed with of said conductive adhesive layer on the second insulating properties bond layer of the insulating properties that forms;
Said bonding agent is the bonding agent that contains thermosetting resin;
Compare with said first insulating properties bond layer and the said second insulating properties bond layer, the melt viscosity of said conductive adhesive layer when said first circuit block is connected with said second circuit parts is high;
The melt viscosity of said conductive adhesive layer under 120 ℃ is 5.0 * 10 2～5.0 * 10 6Pas;
The thickness of at least one side's in said first insulating properties bond layer and the said second insulating properties bond layer layer is 1.0～4.0 μ m;
It is characterized in that,
The height of at least one side's in said first circuit electrode and the said second circuit electrode circuit electrode is below the 3.0 μ m;
With the thickness in the said circuit connecting adhesive film is said first insulating properties bond layer or the said second insulating properties bond layer of 1.0～4.0 μ m; Being configured in highly is the said circuit electrode side below the 3.0 μ m, connects said first circuit block and said second circuit parts.
12. the method for using of circuit connecting adhesive film according to claim 11 is characterized in that, the melt viscosity of said conductive adhesive layer under 120 ℃ is 5.0 * 10 3～5.0 * 10 5Pas.
13. the method for using according to claim 11 or 12 described circuit connecting adhesive films is characterized in that, said first insulating properties bond layer and the melt viscosity of the said second insulating properties bond layer under 120 ℃ are 1.0 * 10 2～1.0 * 10 6Pas.
14. the method for using according to claim 11 or 12 described circuit connecting adhesive films is characterized in that, said first insulating properties bond layer and the melt viscosity of the said second insulating properties bond layer under 120 ℃ are 1.0 * 10 3～1.0 * 10 5Pas.
15. the method for using of circuit connecting adhesive film according to claim 11 is characterized in that, said conductive adhesive layer also contains film formation property macromolecule.
16. the method for using of circuit connecting adhesive film according to claim 11 is characterized in that, said bonding agent contains the mixture of epoxy resin and potentiality curing agent, or the mixture of radical reaction property resin and organic peroxide.
17. the method for using of circuit connecting adhesive film according to claim 11 is characterized in that, the thickness of said conductive adhesive layer is 3～15 μ m.
18. the method for using of circuit connecting adhesive film according to claim 11 is characterized in that, the thickness of said conductive adhesive layer is 5～10 μ m.
CN2010102207766A 2006-04-12 2007-04-05 Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method Expired - Fee Related CN101901972B (en)

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