CN101901971B - Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method - Google Patents
Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method Download PDFInfo
- Publication number
- CN101901971B CN101901971B CN2010102207605A CN201010220760A CN101901971B CN 101901971 B CN101901971 B CN 101901971B CN 2010102207605 A CN2010102207605 A CN 2010102207605A CN 201010220760 A CN201010220760 A CN 201010220760A CN 101901971 B CN101901971 B CN 101901971B
- Authority
- CN
- China
- Prior art keywords
- circuit
- adhesive layer
- insulating
- adhesive film
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002313 adhesive film Substances 0.000 title claims abstract description 118
- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000012790 adhesive layer Substances 0.000 claims abstract description 200
- 239000002245 particle Substances 0.000 claims abstract description 124
- 239000000758 substrate Substances 0.000 claims description 47
- 239000000853 adhesive Substances 0.000 claims description 43
- 230000001070 adhesive effect Effects 0.000 claims description 43
- 239000000155 melt Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- 239000003822 epoxy resin Substances 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 5
- 150000001451 organic peroxides Chemical class 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 230000007774 longterm Effects 0.000 abstract description 11
- 239000011248 coating agent Substances 0.000 description 33
- 238000000576 coating method Methods 0.000 description 33
- 238000009413 insulation Methods 0.000 description 31
- 229920002799 BoPET Polymers 0.000 description 28
- 239000010410 layer Substances 0.000 description 26
- 239000007788 liquid Substances 0.000 description 21
- 239000011521 glass Substances 0.000 description 19
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 18
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 11
- 229920001971 elastomer Polymers 0.000 description 10
- 239000010931 gold Substances 0.000 description 10
- 239000005060 rubber Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 239000007787 solid Substances 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 7
- 238000007602 hot air drying Methods 0.000 description 7
- 239000006087 Silane Coupling Agent Substances 0.000 description 6
- 229920006287 phenoxy resin Polymers 0.000 description 6
- 239000013034 phenoxy resin Substances 0.000 description 6
- 239000004925 Acrylic resin Substances 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 5
- 229930185605 Bisphenol Natural products 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229920002379 silicone rubber Polymers 0.000 description 5
- 239000004945 silicone rubber Substances 0.000 description 5
- 239000004793 Polystyrene Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011162 core material Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- -1 glycidyl amines Chemical class 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 150000004074 biphenyls Chemical class 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000004658 ketimines Chemical group 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention provides a circuit connecting adhesive film, a circuit member connecting structure and a circuit member connecting method. When the circuit connecting adhesive film is connected between the circuit members, the external flow of conductive particles is less on an electrode, the resolution is high, the long-term connection reliability is excellent, the right positioning of the conductive particles and the electrode is not needed thus the operationality is excellent. The thickness of at least one of a first insulating adhesive layer and a second insulating adhesive layer is 2.0-4.0 Mum; the height of at least one of a first circuit electrode and a second circuit electrode is below 3.0 Mum; the first insulating adhesive layer or the second insulating adhesive layer with the thickness of 2.0-4.0 in the circuit connecting adhesive film is configured to be at the circuit electrode side below 3.0 Mum.
Description
This application is a divisional application of the chinese patent application entitled "adhesive film for circuit connection, connection structure of circuit member, and connection method of circuit member" filed on 5/4/2007 as the application date of the original application, and application No. 200780013029.1.
Technical Field
The present invention relates to a circuit-connecting adhesive film, a circuit-member connecting structure, and a circuit-member connecting method, and more particularly, to a circuit-connecting adhesive film used for connecting circuit boards to each other or connecting an electronic component such as an IC chip to a wiring board, a circuit-member connecting structure using the same, and a circuit-member connecting method.
Background
When circuit boards are electrically connected to each other or electronic components such as IC chips are electrically connected to the circuit boards, an anisotropic conductive adhesive in which conductive particles are dispersed in an adhesive is used. That is, by disposing the anisotropic conductive adhesive between the electrodes of the circuit members facing each other as described above, and connecting the electrodes by heating and pressing, it is possible to provide electrical conductivity in the direction of pressing, and to provide insulation between the electrodes formed adjacent to each other, and to electrically connect only the opposing electrodes. As such an anisotropic conductive adhesive, for example, an epoxy resin-based adhesive for circuit connection has been proposed (for example, see patent document 1).
The basic idea for achieving high resolution with the above-described adhesive for circuit connection is as follows: the particle diameter of the conductive particles is made smaller than the insulating portion between the adjacent electrodes to ensure the insulation between the adjacent electrodes, and the conductivity between the opposing electrodes is obtained by making the content of the conductive particles to such an extent that the particles do not contact each other and by surely having the conductive particles on the electrodes.
However, in the above-described conventional method, if the particle diameter of the conductive particles is reduced, the surface area of the conductive particles is significantly increased, and the particles aggregate 2 times to cause connection, which tends to cause a problem that the insulation between adjacent electrodes cannot be maintained. Further, if the content of the conductive particles is reduced, the number of contact points is insufficient because the number of conductive particles on the electrode is also reduced, and a problem that sufficient conduction between electrodes to be connected cannot be obtained easily occurs. Thus, if the conventional method is used, it is difficult to achieve high resolution of the adhesive for circuit connection while maintaining the long-term connection reliability.
In particular, recent circuit boards have been accompanied by remarkable high resolution, that is, miniaturization of the electrode area and the space between adjacent electrodes, so that conductive particles on the electrodes are likely to flow out together with the adhesive between the adjacent electrodes due to heating and pressurization at the time of connection, which has prevented the high resolution of the adhesive for circuit connection.
In order to improve such a problem, the following methods have been proposed: an adhesive film having a multilayer structure in which a conductive particle-containing layer and an insulating adhesive layer are separated from each other is produced, and the efficiency of capturing conductive particles on electrodes is improved, thereby suppressing the outflow of conductive particles between adjacent electrodes and achieving high resolution (see, for example, patent documents 2 to 5).
In order to enable connection of electrodes and circuits with such fine-grained structure and to realize an adhesive for circuit connection with excellent connection reliability, an adhesive for circuit connection in which a region where conductive particles are densely packed is formed in a necessary portion in the plane direction has also been proposed (see, for example, patent document 6).
Patent document 1: japanese laid-open patent publication No. 3-16147
Patent document 2: japanese laid-open patent publication No. 1-236588
Patent document 3: japanese laid-open patent publication No. 2-18809
Patent document 4: japanese laid-open patent publication No. 4-366630
Patent document 5: japanese laid-open patent publication No. 8-279371
Patent document 6: japanese patent laid-open publication No. 2002-76607
Disclosure of Invention
Problems to be solved by the invention
However, the method described in patent document 2 has a high density of conductive particles in one electrode side, and cannot sufficiently meet the recent demand for a remarkable high resolution. Further, increasing the density of the conductive particles in one electrode side decreases the adhesion at the interface between the electrode and the circuit connecting adhesive, and interface peeling and deterioration in connection reliability are likely to occur.
In addition, the methods described in patent documents 3 to 5 have a problem that the connection reliability is deteriorated because the contact between the electrode and the conductive particles is not always sufficiently ensured and the connection resistance value is increased.
Further, the circuit connection adhesive described in patent document 6 can achieve connection of fine electrodes in a dot shape, but the adhesive is troublesome in the production method, and has a problem of poor workability because it is necessary to accurately position the dense region of the conductive particles and the electrodes when connecting the electrodes.
The present invention has been made in view of the above problems, and an object of the present invention is to provide an adhesive film for circuit connection that reduces outflow of conductive particles from electrodes when circuit members are connected to each other, has excellent high resolution and long-term connection reliability, and is excellent in workability because accurate positioning of the conductive particles and the electrodes is not required, and also to provide a circuit member connection structure and a circuit member connection method using the adhesive film for circuit connection.
Means for solving the problems
In order to achieve the above object, the present invention provides an adhesive film for circuit connection for connecting a first circuit member having a first circuit electrode formed on a main surface of a first substrate and a second circuit member having a second circuit electrode formed on a main surface of a second substrate in a state where the first circuit electrode and the second circuit electrode are arranged to face each other, the adhesive film comprising at least: a conductive adhesive layer containing conductive particles and an adhesive; an insulating first insulating adhesive layer formed on one surface of the conductive adhesive layer; and an insulating second insulating adhesive layer formed on a surface of the conductive adhesive layer opposite to the surface on which the first insulating adhesive layer is formed, wherein the thickness of at least one of the first insulating adhesive layer and the second insulating adhesive layer is 0.1 to 5.0 μm.
According to the circuit connecting adhesive film of the present invention, when connecting circuit members to each other, the outflow of conductive particles from the electrodes is reduced, and the particle capturing property is improved, so that the insulation between the adjacent electrodes and the conductivity between the electrodes to be connected can be sufficiently ensured even for a minute circuit electrode. Therefore, the adhesive film for circuit connection of the present invention can realize high resolution and long-term connection reliability at a high level. Further, the circuit-connecting adhesive film of the present invention does not require accurate positioning of the conductive particles and the electrodes, and therefore has excellent workability in connecting circuit members to each other.
Here, the above-described effects are obtained by the adhesive film for circuit connection according to the present invention, and are considered to be due to the following reasons. That is, by disposing the conductive particles only in the conductive adhesive layer, the outflow of the conductive particles from the electrode is reduced, and the particle capturing efficiency is improved. Thus, the conductive particles can be reliably present on the electrode without being brought into contact with each other, and the conductivity in the connecting portion can be sufficiently obtained. Further, by forming the insulating adhesive layer on both surfaces of the conductive adhesive layer, the insulating adhesive layer can be disposed between the circuit electrodes adjacent to each other, and the insulation between the adjacent circuit electrodes can be sufficiently ensured. Further, by setting the thickness of at least one of the insulating adhesive layers to 0.1 to 5 μm, it is possible to sufficiently ensure both the insulation between the adjacent electrodes and the contact between the electrodes and the conductive particles, and it is possible to sufficiently ensure the insulation between the adjacent electrodes and the conductivity between the electrodes to be connected.
In the circuit-connecting adhesive film according to the present invention, it is preferable that the adhesive contains a thermosetting resin, and the conductive adhesive layer has a higher melt viscosity at the time of connecting the first circuit member and the second circuit member than the first insulating adhesive layer and the second insulating adhesive layer. Thus, the number of particles captured can be increased by reducing the amount of conductive particles flowing out of the adhesive between adjacent circuit electrodes due to heating and pressurizing at the time of connection, and the insulation between the adjacent electrodes and the conductivity between the connected electrodes can be sufficiently ensured even for a minute circuit electrode.
In the circuit connecting adhesive film of the present invention, the conductive adhesive layer preferably further contains a film-forming polymer. Thus, the conductive particles can be held in a uniformly dispersed state while the film formation property of the conductive adhesive layer is improved. Further, the circuit connection adhesive film is excellent in workability because it is not necessary to accurately position the conductive particles and the electrodes, and is excellent in long-term connection reliability because the connection portion hardly contains air bubbles.
The present invention also provides a circuit member connection structure, wherein a first circuit member having a first circuit electrode formed on a main surface of a first substrate and a second circuit member having a second circuit electrode formed on a main surface of a second substrate are connected to each other so that the first circuit electrode and the second circuit electrode face each other and are electrically connected to each other by a circuit connection member including a cured product of the adhesive film for circuit connection of the present invention provided between the first and second circuit members.
In the connection structure of a circuit member according to the present invention, since the circuit connecting member includes the cured product of the circuit connecting adhesive film of the present invention, the outflow of conductive particles from the electrodes is small, the particle capturing property is good, the insulation between the adjacent electrodes and the conductivity between the electrodes to be connected can be sufficiently ensured, and high resolution and long-term connection reliability can be realized at a high level.
In the connection structure of the circuit member, it is preferable that at least one of the first circuit electrode and the second circuit electrode has a height of 3.0 μm or less, and the first insulating adhesive layer or the second insulating adhesive layer having a thickness of 0.1 to 5.0 μm in the adhesive film for circuit connection is disposed on the circuit electrode side having a height of 3.0 μm or less.
The connection structure of the circuit member can sufficiently ensure insulation between adjacent electrodes and conductivity between the connected electrodes with respect to minute circuit electrodes, and thus can meet the recent demand for remarkable high resolution at a high level.
The present invention also provides a method for connecting circuit members, wherein a first circuit member having a first circuit electrode formed on a main surface of a first substrate, the adhesive film for circuit connection of the present invention, and a second circuit member having a second circuit electrode formed on a main surface of a second substrate are laminated in this order so that the first circuit electrode and the second circuit electrode face each other, and are heated and pressurized to connect the first circuit member and the second circuit member to each other, thereby electrically connecting the first circuit electrode and the second circuit electrode.
According to the method for connecting circuit members of the present invention, by using the adhesive film for circuit connection of the present invention, it is possible to suppress the outflow of conductive particles from the electrodes, to improve the particle capturing property, and to sufficiently ensure the insulation between the adjacent electrodes and the conductivity between the electrodes to be connected. Therefore, a connection structure of circuit components that realizes high resolution and long-term connection reliability at a high level can be formed.
In the method for connecting circuit members according to the present invention, it is preferable that at least one of the first circuit electrode and the second circuit electrode has a height of 3.0 μm or less, the first insulating adhesive layer or the second insulating adhesive layer having a thickness of 0.1 to 5.0 μm in the adhesive film for circuit connection is disposed on the circuit electrode side having a height of 3.0 μm or less, and the first circuit electrode and the second circuit electrode are connected to each other by heating and pressurizing, thereby electrically connecting the first circuit electrode and the second circuit electrode.
According to the method for connecting a circuit member of the present invention, since the insulation between the adjacent electrodes and the conductivity between the electrodes to be connected can be sufficiently ensured, a circuit member connection structure that can achieve high resolution and long-term connection reliability at a high level can be formed.
Effects of the invention
According to the present invention, there can be provided an adhesive film for circuit connection which is excellent in workability because of little outflow of conductive particles from electrodes when circuit members are connected to each other, high resolution and excellent long-term connection reliability, and no need to accurately position the conductive particles and the electrodes, and a circuit member connection structure and a circuit member connection method using the adhesive film for circuit connection.
Drawings
Fig. 1 is a schematic cross-sectional view showing one preferred embodiment of the circuit-connecting adhesive film of the present invention.
Fig. 2 is a schematic cross-sectional view showing another preferred embodiment of the circuit-connecting adhesive film of the present invention.
Fig. 3 is a schematic cross-sectional view showing a preferred embodiment of the connection structure of circuit components according to the present invention.
Description of the symbols
Detailed Description
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same or corresponding portions are denoted by the same reference numerals, and redundant description is omitted. In addition, the dimensional ratios of the drawings are not limited to the illustrated ratios.
Fig. 1 is a schematic cross-sectional view showing a preferred embodiment of the circuit-connecting adhesive film (anisotropic conductive adhesive film) of the present invention. The circuit-connecting adhesive film 100 shown in fig. 1 includes: a conductive adhesive layer 3 containing conductive particles 1 and an adhesive 2; insulating adhesive layers 4 and 5 are formed on both surfaces of the conductive adhesive layer 3, and the thickness of the insulating adhesive layer 5 is in the range of 0.1 to 5.0 μm.
Fig. 2 is a schematic cross-sectional view showing another preferred embodiment of the circuit-connecting adhesive film of the present invention. The circuit-connecting adhesive film 110 shown in fig. 2 includes: a conductive adhesive layer 3 containing conductive particles 1 and an adhesive 2; and an insulating adhesive layer 5 formed on both surfaces of the conductive adhesive layer 3, wherein the thickness of the insulating adhesive layer 5 on both surfaces is in the range of 0.1 to 5.0 μm. Although not shown in fig. 1 and 2, a releasable substrate (support film) may be present on the surface of the circuit-connecting adhesive films 100 and 110 to improve the workability and prevent dust from adhering thereto. Hereinafter, the respective layers constituting the circuit-connecting adhesive film 100 will be described in detail using the circuit-connecting adhesive film 100 shown in fig. 1.
The conductive adhesive layer 3 is a layer containing the conductive particles 1 and the adhesive 2 as described above, and is a layer having anisotropic conductivity that exhibits conductivity in a direction connecting opposing circuit electrodes when circuit members having circuit electrodes are connected to each other, and that can electrically connect only the opposing circuit electrodes to each other. Here, the adhesive 2 preferably contains a reactive resin (thermosetting resin) that is cured by heat. As the thermosetting resin, a mixture of an epoxy resin and a latent curing agent such as an imidazole type, a hydrazide type, a boron trifluoride-amine complex, a sulfonium salt, an aminimide, a salt of polyamine, dicyandiamide, or a mixture of a radical reactive resin and an organic peroxide can be used.
Examples of the epoxy resin include bisphenol type epoxy resins derived from epichlorohydrin and bisphenol a or F, AD, epoxy novolac resins derived from epichlorohydrin and phenol novolac or cresol novolac, naphthalene type epoxy resins having a naphthalene ring-containing skeleton, glycidyl amines, glycidyl ethers, biphenyls, alicyclic epoxy compounds having two or more glycidyl groups in one molecule, and the like, and these can be used alone or in combination of two or more.
In these epoxy resins, it is preferable to use impurity ions (Na) from the viewpoint of preventing electron migration+、Cl-Etc.) or a high purity product having a content of hydrolyzable chlorine or the like reduced to 300ppm or less.
The conductive adhesive layer 3 contains and disperses conductive particles 1 for the purpose of positively imparting anisotropic conductivity, and absorbs variations in height of bumps, substrate electrodes, and the like of chips connected by the circuit-connecting adhesive film 100. The conductive particles 1 are particles having conductivity containing a metal such as Au, Ag, Ni, Cu, or solder, for example, and more preferably particles having a conductive layer made of a metal such as Au, Ag, Ni, Cu, or solder formed on the surface of a spherical core material made of a polymer such as polystyrene. The conductive particles 1 may be particles having a surface layer such as Su, Au, or solder formed on the surface of a conductive particle.
The particle diameter of the conductive particles 1 is required to be smaller than the minimum distance between electrodes of circuit members connected by the circuit-connecting adhesive film 100, and is preferably larger than the height fluctuation of the electrodes when the height fluctuation exists. The average particle diameter of the conductive particles 1 is preferably 1 to 10 μm, and more preferably 2 to 5 μm. If the average particle size is less than 1 μm, the conductivity between the electrodes tends not to decrease in accordance with the fluctuation in height of the electrodes, and if it exceeds 10 μm, the insulation between the adjacent electrodes tends to decrease easily.
The content of the conductive particles 1 in the conductive adhesive layer 3 is preferably 0.1 to 30 vol%, more preferably 0.2 to 20 vol%, based on the entire volume of the solid content in the conductive adhesive layer. If the content is less than 0.1 vol%, the number of contact points tends to be insufficient due to a decrease in the number of conductive particles on the electrodes to be connected, and the conductivity between the connected electrodes tends to be reduced, while if it exceeds 30 vol%, the particle surface area tends to increase significantly, and the particles aggregate 2 times, and are easily connected, and the insulation between the adjacent electrodes tends to be reduced.
From the viewpoint of further improving the film-forming property, a film-forming polymer may be incorporated into the conductive adhesive layer 3. Examples of the film-forming polymer include thermoplastic resins such as phenoxy resins, polyester resins, and polyamide resins. These film-forming polymers are effective in relaxing stress when the thermosetting resin is cured. In particular, when the film-forming polymer has a functional group such as a hydroxyl group, the adhesiveness is more preferably improved.
The insulating adhesive layers 4 and 5 constituting the circuit-connecting adhesive film 100 are layers having insulating properties. When the insulating adhesive layers 4 and 5 are disposed between adjacent circuit electrodes in the circuit component, the insulating adhesive layers may be sufficient as long as the insulating property between the adjacent electrodes is sufficiently ensured (the insulating resistance value between the adjacent electrodes is preferably 1 × 108Ω or more) is not particularly limited, and may be, for example, one derived from the conductive adhesive layer 3The composition of the conductive particles 1 was removed.
In addition, an inorganic filler or rubber particles may be further mixed and dispersed in the conductive adhesive layer 3 and the insulating adhesive layers 4 and 5. These may be mixed and dispersed in the conductive adhesive layer 3 together with the conductive particles 1, may be mixed and dispersed in the insulating adhesive layers 4 and 5 not using the conductive particles 1, and are particularly preferably mixed and dispersed in the conductive adhesive layer 3 using the conductive particles 1. By adding these inorganic filler and rubber particles to the conductive adhesive layer 3, the melt viscosity of the conductive adhesive layer 3 at the time of connecting circuit members can be easily and sufficiently increased to be higher than the melt viscosity of the insulating adhesive layers 4 and 5 at the time of connecting.
The inorganic filler is not particularly limited, and examples thereof include powders of fused silica, crystalline silica, calcium silicate, alumina, calcium carbonate, and the like. The average particle diameter of the inorganic filler is preferably 3 μm or less from the viewpoint of preventing conduction failure in the connecting portion.
The amount of the inorganic filler is preferably 5 to 100 parts by mass, based on 100 parts by mass of the adhesive 2 in the conductive adhesive layer 3 and the insulating adhesive layers 4 and 5. The larger the amount of the component is, the more effective the melt viscosity is.
The rubber particles are not particularly limited as long as they have a glass transition temperature of 25 ℃ or lower, and for example, butadiene rubber, acrylic rubber, styrene-butadiene-styrene rubber, nitrile rubber, silicone rubber, and the like can be used. The rubber particles are preferably those having an average particle diameter of 0.1 to 10 μm, and more preferably those having an average particle diameter of 80% or more of the particle diameter distribution. The average particle diameter of the rubber particles is more preferably 0.1 to 5 μm. Further, when the surface of the rubber particles is treated with a silane coupling agent, the dispersibility in the reactive resin can be improved, which is preferable.
Among the rubber particles, silicone rubber particles are excellent in dispersibility in addition to solvent resistance, and therefore can be preferably used as effective rubber particles. The silicone rubber particles can be obtained by a method of adding a silane compound, methyltrialkoxysilane, and/or a partially hydrolyzed condensate thereof to an aqueous alcohol solution adjusted to a pH of 9 or more with a basic substance such as caustic soda or ammonia, and performing hydrolysis and polycondensation, or by copolymerization of an organosiloxane. Silicone microparticles containing functional groups such as hydroxyl groups, epoxy groups, ketimine, carboxyl groups, and mercapto groups at the molecular terminals or in the intramolecular chain are preferable because they can improve dispersibility in the reactive resin.
The amount of rubber particles used is preferably 5 to 50 parts by mass based on 100 parts by mass of the adhesive 2 in the conductive adhesive layer 3 and the insulating adhesive layers 4 and 5.
The conductive adhesive layer 3 and the insulating adhesive layers 4 and 5 can be formed by the following method: an adhesive composition containing at least the adhesive 2 (reactive resin, latent curing agent, etc.) and the conductive particles 1 in the conductive adhesive layer 3 is dissolved or dispersed in an organic solvent to be liquefied to prepare a coating solution, the coating solution is applied to a releasable substrate (support film), and the solvent is removed at a temperature not higher than the activation temperature of the curing agent. The solvent used in this case is preferably a mixed solvent of an aromatic hydrocarbon-based solvent and an oxygen-containing solvent, from the viewpoint of improving the solubility of the material. Further, as the releasable substrate, a PET film surface-treated to have releasability, or the like can be suitably used.
Although not shown, a conductive adhesive layer or an insulating adhesive layer may be further provided on the outer side of the insulating adhesive layers 4 and 5.
As a method for producing the circuit-connecting adhesive film 100, for example, a known method such as a method of laminating the conductive adhesive layer 3 and the insulating adhesive layers 4 and 5 formed as described above, or a method of sequentially applying the respective layers can be used.
In the thus obtained circuit-connecting adhesive film 100, the thickness of the conductive adhesive layer 3 is preferably 3 to 15 μm, and more preferably 5 to 10 μm. If the thickness is less than 3 μm, the formability of the conductive adhesive layer tends to be reduced when conductive particles having an appropriate average particle diameter are used, and if the thickness exceeds 15 μm, the outflow of the conductive particles from the electrodes increases, and it tends to be difficult to sufficiently ensure the insulation between the adjacent electrodes and the conductivity between the electrodes to be connected.
The thickness of the insulating adhesive layer 5 is required to be 0.1 to 5.0. mu.m, preferably 1.0 to 5.0. mu.m, and more preferably 2.0 to 4.0. mu.m. If the thickness is less than 0.1 μm, when the conductive particles are disposed between adjacent circuit electrodes in the circuit member, the insulation between the adjacent electrodes cannot be sufficiently ensured, and if the thickness exceeds 5 μm, the outflow of the conductive particles from the electrodes increases, and the insulation between the adjacent electrodes and the conductivity between the connected electrodes cannot be sufficiently ensured.
The thickness of the insulating adhesive layer 4 is preferably equal to or less than the sum of the thickness of the first circuit electrodes formed on the main surface of the first substrate and the thickness of the second circuit electrodes formed on the main surface of the second substrate. If the thickness of the insulating adhesive layer 4 is larger than the sum of the thickness of the first circuit electrode and the thickness of the second circuit electrode, the outflow of the conductive particles from the electrodes increases, and it tends to be difficult to sufficiently ensure the insulation between the adjacent electrodes and the conductivity between the electrodes to be connected.
In the circuit-bonding adhesive film 100, the conductive adhesive layer 3 preferably has a higher melt viscosity when connecting circuit components than the insulating adhesive layers 4 and 5. Here, the melt viscosity at the time of connection is a melt viscosity at a heating temperature at the time of connecting circuit members to each other using the circuit-connecting adhesive film 100. The heating temperature at the time of connecting the circuit members is appropriately adjusted depending on the curability of the adhesive in the circuit-connecting adhesive film 100, and is usually in the range of 120 to 220 ℃. Therefore, in this temperature range, the melt viscosity of the conductive adhesive layer 3 is more preferably higher than the melt viscosity of the insulating adhesive layers 4 and 5.
The melt viscosity of the conductive adhesive layer 3 at the time of bonding is preferably 5.0 × 10, specifically at 120 ℃2～5.0×106Pa · s, more preferably 5.0X 103～5.0×105Pa·s。
The melt viscosity of the insulating adhesive layers 4 and 5 at the time of bonding is preferably 1.0 × 10, specifically at 120 ℃2～1.0×106Pa · s, more preferably 1.0X 103～1.0×105Pa·s。
Next, a circuit member connection structure of the present invention using the circuit connection adhesive film 110 of the present invention will be described.
Fig. 3 is a schematic cross-sectional view showing a preferred embodiment of the connection structure of circuit components according to the present invention. The circuit member connection structure 200 shown in fig. 3 is a structure in which a first circuit member 10 having a first substrate 11 and a first circuit electrode 12 formed on a main surface thereof and a second circuit member 20 having a second substrate 21 and a second circuit electrode 22 formed on a main surface thereof are connected by a circuit connection member 110a, and the circuit connection member 110a includes a cured product of the cured circuit connection adhesive film 110 of the present invention and is formed between the first and second circuit members 10 and 20. In the circuit member connection structure 200, the first circuit electrode 12 and the second circuit electrode 22 are opposed to each other and electrically connected to each other.
The circuit connecting member 110a is a member including a cured product obtained by curing the circuit connecting adhesive film 110 of the present invention, and is composed of a cured product 3a of the conductive adhesive layer 3 containing the cured product 2a of the adhesive 2 and the conductive particles 1 dispersed therein, and a cured product 5a of the insulating adhesive layer 5 formed on both surfaces thereof. The first circuit electrode 12 and the second circuit electrode 22 are electrically connected by the conductive particles 1. The cured product 5a of the insulating adhesive layer 5 is formed so as to cover at least the peripheries of the first and second circuit electrodes 12 and 22 on the first and second substrates 11 and 12 sides. This is because, when the first and second circuit members 10 and 20 are connected, the insulating adhesive layer 5 flows out from the upper surfaces (surfaces facing each other) of the first and second circuit electrodes 12 and 22 to the periphery thereof.
The first and second circuit members 10 and 20 are not particularly limited as long as they are formed with electrodes that need to be electrically connected. Specifically, glass or plastic substrates, printed circuit boards, ceramic wiring boards, flexible wiring boards, semiconductor silicon chips, and the like, which are used as electrodes of ITO and the like for liquid crystal displays, may be used in combination as necessary. As described above, in this embodiment, a material such as a printed wiring board or an organic material such as polyimide, a metal such as copper or aluminum, ITO (indium tin oxide), or silicon nitride (SiN)x) Silicon dioxide (SiO)2) And circuit members having various surface states such as inorganic materials.
The connection structure 200 of the circuit component can be obtained by: for example, the first circuit member 10, the circuit connecting adhesive film 110 of the present invention, and the second circuit member 20 are laminated in this order so that the first circuit electrode 11 and the second circuit electrode 21 face each other, and then heated and pressed to connect the first circuit member 10 and the second circuit member 20, thereby electrically connecting the first circuit electrode 11 and the second circuit electrode 21.
In this method, first, the circuit-connecting adhesive film 110 formed on the releasable substrate is heated and pressed in a state of being bonded to the second circuit member 20, the circuit-connecting adhesive film 110 is temporarily bonded, the releasable substrate is peeled, and then the first circuit member 10 is put on with the circuit electrodes positioned, whereby a laminate in which the second circuit member 20, the circuit-connecting adhesive film 110, and the first circuit member 10 are laminated in this order can be prepared.
The conditions for heating and pressing the laminate may be appropriately adjusted according to the curability of the adhesive in the circuit-connecting adhesive film, so that the circuit-connecting adhesive film is cured and a sufficient adhesive strength is obtained.
In the above description of the circuit member connection structure 200 and the method of manufacturing the same, the case of using the circuit-connecting adhesive film 110 has been described, but the circuit-connecting adhesive film 100 may be used instead of the circuit-connecting adhesive film 110.
Examples
Hereinafter, the present invention will be described more specifically based on examples and comparative examples, but the present invention is not limited to the following examples.
(example 1)
A coating liquid for forming an insulating adhesive layer having a solid content of 50 mass% was obtained by dissolving 32 parts by mass of a phenoxy resin (manufactured by Union carbide Co., Ltd., trade name: PKHC), 10 parts by mass of an acrylic particle-containing resin (manufactured by Nippon catalyst Co., Ltd., trade name: BPA328) in which 20 mass% of acrylic resin particles having an average particle diameter of 0.2 μm were dispersed in a bisphenol A-type epoxy resin, 20 parts by mass of a bisphenol A-type solid epoxy resin (manufactured by Okawa Kasei Co., Ltd., trade name: YL980), 35 parts by mass of an imidazole-based curing agent (manufactured by Asahi chemical Co., Ltd., trade name: NOVACURE HX-3941) and 3 parts by mass of a silane coupling agent (manufactured by Nikka Co., Japan, trade name: A187) in toluene as a solvent.
Subsequently, this coating liquid was applied to a 50 μm thick PET film whose one surface (the surface on which the coating liquid was applied) was subjected to a release treatment by using a coating apparatus, and hot air drying was performed at 70 ℃ for 10 minutes, thereby forming an insulating adhesive layer (a) having a thickness of 11 μm on the PET film. The melt viscosity of the insulating adhesive layer (a) was measured by a viscoelasticity measuring apparatus (manufactured by Rheometrics) at a temperature rise rate of 10 ℃ per minute, a frequency of 10Hz, and a temperature of 25 ℃ to 200 DEG CThe melt viscosity at 120 ℃ was 1.0X 10 as a result of the measurement under the conditions described above3Pa·s。
Further, the coating liquid for forming an insulating adhesive layer was applied to a PET film having a thickness of 25 μm, on one side (the side on which the coating liquid was applied) of which release treatment was performed, by using a coating apparatus, and hot air drying was performed at 70 ℃ for 10 minutes, thereby forming an insulating adhesive layer (b) having a thickness of 2 μm on the PET film. The melt viscosity of the insulating adhesive layer (b) was measured at a temperature rise rate of 10 ℃/min and a frequency of 10Hz and at 25 to 200 ℃ by using a viscoelasticity measuring apparatus (manufactured by Rheometrics), and as a result, the melt viscosity at 120 ℃ was 1.0X 103Pa·s。
Next, 32 parts by mass of a phenoxy resin (manufactured by Union carbide Co., Ltd., trade name: PKHC), 20 parts by mass of an acrylic particle-containing resin (manufactured by Nippon Kasei Co., Ltd., trade name: BPA328) in which 20% by mass of acrylic resin particles having an average particle diameter of 0.2 μm were dispersed in a bisphenol A type epoxy resin, 35 parts by mass of an imidazole-based curing agent (manufactured by Asahi Kasei Co., Ltd., trade name: NOVACURE HX-3941), 3 parts by mass of a silane coupling agent (manufactured by Nippon Youka Co., Ltd., trade name: A187) and 30 parts by mass of a silicone rubber (manufactured by Tolydo Corning Co., Ltd., trade name: E604) were dissolved in toluene as a solvent to prepare an adhesive solution having a solid content of 50% by mass. To 100 parts by mass of this adhesive solution, 20 parts by mass of conductive particles (average particle diameter: 3.2 μm) each having an Au layer formed on the surface of a polystyrene core body (diameter: 3 μm) were dispersed to obtain a coating solution for forming a conductive adhesive layer.
This coating liquid was applied to a 50 μm thick PET film whose one surface (the surface to which the coating liquid was applied) was subjected to a release treatment by using a coating apparatus, and hot air drying was performed at 70 ℃ for 10 minutes to form a 10 μm thick conductive adhesive layer (c) on the PET film. The melt viscosity of the conductive adhesive layer (c) was measured at a temperature rise rate of 10 ℃ per minute, a frequency of 10Hz, and a temperature range of 25 ℃ to 200 ℃ using a viscoelasticity measuring apparatus (manufactured by Rheometrics), and as a result, the melt viscosity at 120 ℃ was measuredMelt viscosity of 1.0X 104Pa·s。
The insulating adhesive layer (a) and the conductive adhesive layer (c) obtained above were laminated by a roll laminator while being heated at 40 ℃. Then, the PET film on the conductive adhesive layer (c) was peeled off from the conductive adhesive layer (c) side of the obtained laminated film, and the insulating adhesive layer (b) was laminated by a roll laminator while heating at 40 ℃ to obtain a 3-layer adhesive film for circuit connection, in which the thickness of the insulating adhesive layer (a) was 11 μm, the thickness of the conductive adhesive layer (c) was 10 μm, and the thickness of the insulating adhesive layer (b) was 2 μm.
(example 2)
An adhesive film for circuit connection having a 3-layer structure was obtained in the same manner as in example 1, except that the thickness of the insulating adhesive layer (a) was set to 8 μm, the thickness of the insulating adhesive layer (b) was set to 5 μm, and the thickness of the conductive adhesive layer (c) was set to 10 μm.
(example 3)
An adhesive film for circuit connection having a 3-layer structure was obtained in the same manner as in example 1, except that the thickness of the insulating adhesive layer (a) was set to 12 μm, the thickness of the insulating adhesive layer (b) was set to 0.1 μm, and the thickness of the conductive adhesive layer (c) was set to 10 μm.
(example 4)
An adhesive film for circuit connection having a 3-layer structure was obtained in the same manner as in example 1, except that the thickness of the insulating adhesive layer (a) was set to 3 μm, the thickness of the insulating adhesive layer (b) was set to 3 μm, and the thickness of the conductive adhesive layer (c) was set to 10 μm.
(example 5)
A phenoxy resin (product name: PKHC)32 parts by mass, an acrylic particle-containing resin (product name: BPA328, manufactured by Nippon Kasei corporation) 20 parts by mass in which 20% by mass of acrylic resin particles having an average particle diameter of 0.2 μm were dispersed in a bisphenol A type epoxy resin, an imidazole-based curing agent (product name: NOVACURE HX-3941, manufactured by Asahi Kasei corporation) 35 parts by mass, a silane coupling agent (product name: A187, manufactured by Nippon Youkang corporation) 3 parts by mass, and an organic silicone rubber (product name: E604, manufactured by Tolydo Corning Corp.) 30 parts by mass were dissolved in toluene as a solvent to obtain an insulating adhesive layer-forming coating liquid having a solid content of 50% by mass.
Subsequently, this coating liquid was applied to a 50 μm thick PET film whose one surface (the surface on which the coating liquid was applied) was subjected to a release treatment by using a coating apparatus, and hot air drying was performed at 70 ℃ for 10 minutes, thereby forming an insulating adhesive layer (a) having a thickness of 11 μm on the PET film. The melt viscosity of the insulating adhesive layer (a) was measured at a temperature rise rate of 10 ℃/min and a frequency of 10Hz and at 25 to 200 ℃ using a viscoelasticity measuring apparatus (manufactured by Rheometrics), and as a result, the melt viscosity at 120 ℃ was 1.0X 104Pa·s。
Further, the coating liquid for forming an insulating adhesive layer was applied to a PET film having a thickness of 25 μm, on one side (the side on which the coating liquid was applied) of which release treatment was performed, by using a coating apparatus, and hot air drying was performed at 70 ℃ for 10 minutes, thereby forming an insulating adhesive layer (b) having a thickness of 2 μm on the PET film. The melt viscosity of the insulating adhesive layer (b) was measured at a temperature rise rate of 10 ℃/min and a frequency of 10Hz and at 25 to 200 ℃ by using a viscoelasticity measuring apparatus (manufactured by Rheometrics), and as a result, the melt viscosity at 120 ℃ was 1.0X 104Pa·s。
Next, 32 parts by mass of a phenoxy resin (product name: PKHC) manufactured by Union carbide, 10 parts by mass of an acrylic particle-containing resin (product name: BPA328 manufactured by Nippon catalyst Co., Ltd.) in which 20% by mass of acrylic resin particles having an average particle diameter of 0.2 μm were dispersed in a bisphenol A type epoxy resin, 20 parts by mass of a bisphenol A type solid epoxy resin (product name: YL980 manufactured by Ouio Shell epoxy resin Co., Ltd.), 35 parts by mass of an imidazole-based curing agent (product name: HX-3941 manufactured by Asahi Kasei Co., Ltd.), and 3 parts by mass of a silane coupling agent (product name: A187 manufactured by Nieka Co., Ltd.) were dissolved in toluene as a solvent to prepare a binder solution having a solid content of 50% by mass. To 100 parts by mass of this adhesive solution, 20 parts by mass of conductive particles (average particle diameter: 3.2 μm) each having a Ni layer and an Au layer formed on the surface of a polystyrene-based nucleus body (diameter: 3 μm) were dispersed to obtain a coating solution for forming a conductive adhesive layer.
This coating liquid was applied to a 50 μm thick PET film, which had been subjected to a release treatment on one side (the side on which the coating liquid was applied), by using a coating apparatus, and hot air-dried at 70 ℃ for 10 minutes, thereby forming an insulating adhesive layer (c) having a thickness of 10 μm on the PET film. The melt viscosity of the conductive adhesive layer (c) was measured at a temperature rise rate of 10 ℃ per minute, a frequency of 10Hz, and a temperature range of 25 ℃ to 200 ℃ using a viscoelasticity measuring apparatus (manufactured by Rheometrics), and as a result, the melt viscosity at 120 ℃ was 1.0X 103Pa·s。
The insulating adhesive layer (a) and the conductive adhesive layer (c) obtained above were laminated by a roll laminator while being heated at 40 ℃. Then, the PET film on the conductive adhesive layer (c) was peeled off from the conductive adhesive layer (c) side of the obtained laminated film, and the insulating adhesive layer (b) was laminated by a roll laminator while heating at 40 ℃ to obtain a 3-layer adhesive film for circuit connection, in which the thickness of the insulating adhesive layer (a) was 11 μm, the thickness of the conductive adhesive layer (c) was 10 μm, and the thickness of the insulating adhesive layer (b) was 2 μm.
Comparative example 1
An adhesive film for circuit connection having a 3-layer structure was obtained in the same manner as in example 1, except that the thickness of the insulating adhesive layer (a) was set to 7 μm, the thickness of the insulating adhesive layer (b) was set to 7 μm, and the thickness of the conductive adhesive layer (c) was set to 9 μm.
Comparative example 2
A coating liquid for forming an insulating adhesive layer having a solid content of 50 mass% was obtained by dissolving 32 parts by mass of a phenoxy resin (manufactured by Union carbide Co., Ltd., trade name: PKHC), 10 parts by mass of an acrylic particle-containing resin (manufactured by Nippon catalyst Co., Ltd., trade name: BPA328) in which 20 mass% of acrylic resin particles having an average particle diameter of 0.2 μm were dispersed in a bisphenol A-type epoxy resin, 20 parts by mass of a bisphenol A-type solid epoxy resin (manufactured by Okawa Kasei Co., Ltd., trade name: YL980), 35 parts by mass of an imidazole-based curing agent (manufactured by Asahi chemical Co., Ltd., trade name: NOVACURE HX-3941) and 3 parts by mass of a silane coupling agent (manufactured by Nikka Co., Japan, trade name: A187) in toluene as a solvent.
Subsequently, this coating liquid was applied to a 50 μm thick PET film whose one surface (the surface on which the coating liquid was applied) was subjected to a release treatment by using a coating apparatus, and hot air drying was performed at 70 ℃ for 10 minutes, thereby forming an insulating adhesive layer (a) having a thickness of 13 μm on the PET film. The melt viscosity of the insulating adhesive layer (a) was measured at a temperature rise rate of 10 ℃/min and a frequency of 10Hz and at 25 to 200 ℃ using a viscoelasticity measuring apparatus (manufactured by Rheometrics), and as a result, the melt viscosity at 120 ℃ was 1.0X 103Pa·s。
Then, 20 parts by mass of conductive particles (average particle diameter: 3.2 μm) each having an Au layer formed on the surface of a polystyrene core (diameter: 3 μm) were dispersed in 100 parts by mass of the insulating adhesive layer-forming coating liquid to obtain a conductive adhesive layer-forming coating liquid. This coating liquid was applied to a 50 μm thick PET film whose one surface (the surface to which the coating liquid was applied) was subjected to a release treatment by using a coating apparatus, and hot air drying was performed at 70 ℃ for 10 minutes to form a 10 μm thick conductive adhesive layer (c) on the PET film. The melt viscosity of the conductive adhesive layer (c) was measured at a temperature rise rate of 10 ℃ per minute, a frequency of 10Hz, and a temperature range of 25 ℃ to 200 ℃ using a viscoelasticity measuring apparatus (manufactured by Rheometrics), and as a result, the melt viscosity at 120 ℃ was 1.0X 103Pa·s。
The insulating adhesive layer (a) and the conductive adhesive layer (c) obtained above were laminated by a roll laminator while being heated at 40 ℃ to obtain a 2-layer circuit connecting adhesive film.
Comparative example 3
An adhesive film for circuit connection having a 3-layer structure was obtained in the same manner as in example 1, except that the thickness of the insulating adhesive layer (a) was set to 12 μm, the thickness of the insulating adhesive layer (b) was set to 0.08 μm, and the thickness of the conductive adhesive layer (c) was set to 10 μm.
[ measurement of particle Capture number ]
Using the circuit-connecting adhesive films prepared in the above examples and comparative examples, a chip (1.2X 19mm, thickness: 500 μm) having gold bumps (area: 30X 50 μm, bump height: 15 μm, number of bumps: 300) and a glass substrate (thickness: 0.7mm, electrode height: 0.15 μm) having ITO circuits were connected as follows.
First, the mixture was passed through a reactor at 80 ℃ and 0.98MPa (10 kgf/cm)2) Under the conditions of (1) and (20) for 2 seconds, a circuit-connecting adhesive film (1.5X 20mm) was adhered to the ITO circuit-equipped glass substrate. In this case, the circuit connecting adhesive film having a 3-layer structure is formed by peeling off the PET film on the insulating adhesive layer (b) and then bonding the insulating adhesive layer (b) to the glass substrate, and the circuit connecting adhesive film having a 2-layer structure is formed by peeling off the PET film on the conductive adhesive layer (c) and then bonding the conductive adhesive layer (c) to the glass substrate.
Subsequently, the PET film was peeled off from the circuit-connecting adhesive film, the bumps of the chip and the glass substrate with ITO circuit were positioned, and then heated and pressed from above the chip at 190 ℃ and 40 g/bump for 10 seconds, thereby carrying out the main connection of the chip and the glass substrate via the circuit-connecting adhesive film.
At this time, the number of conductive particles captured by the gold bump (area 30X 50 μm) was measured by using a microscope with a magnification of 200 to 500 times. In this way, the minimum value of the number of particles captured by the gold bumps in the circuit connecting adhesive films produced in the above examples and comparative examples was obtained. The results are shown in Table 1.
[ measurement of insulation resistance value ]
Using the circuit-connecting adhesive films prepared in the above examples and comparative examples, a chip (1.9X 15mm, thickness: 500 μm) having gold bumps (area: 30X 100 μm, space between bumps 10 μm, height: 15 μm, number of bumps: 472) and a glass substrate (thickness: 0.7mm, electrode height: 0.15 μm) having ITO circuits were connected as follows.
First, the mixture was passed through a reactor at 80 ℃ and 0.98MPa (10 kgf/cm)2) Under the conditions of (1) was heated and pressed for 2 seconds, and an adhesive film (2.0X 20mm) for circuit connection was adhered to the glass substrate with ITO circuit. In this case, the circuit connecting adhesive film having a 3-layer structure is formed by peeling off the PET film on the insulating adhesive layer (b) and then bonding the insulating adhesive layer (b) to the glass substrate, and the circuit connecting adhesive film having a 2-layer structure is formed by peeling off the PET film on the conductive adhesive layer (c) and then bonding the conductive adhesive layer (c) to the glass substrate.
Subsequently, the PET film was peeled off from the circuit-connecting adhesive film, the bumps of the chip and the glass substrate with ITO circuit were positioned, and then heated and pressed from above the chip at 190 ℃ and 40 g/bump for 10 seconds, thereby carrying out the main connection of the chip and the glass substrate via the circuit-connecting adhesive film.
The connection sample thus obtained was subjected to the following energization moisture resistance test. That is, the ligation samples were subjected to DC15V application for 500 hours in an atmosphere of 85 ℃ and 85% RH.
The insulation resistance value of the connection sample after the conduction moisture resistance test was measured by using an insulation resistance meter under the conditions of a measurement voltage of 50V and a voltage application time of 60 seconds at room temperature, and the insulation resistance between the adjacent bumps was measured. Thus, whether the insulation characteristics between the adjacent bumps are good or not is judged. At this time goodGood insulation characteristics means that the insulation resistance value is 1X 108Omega or more, and insulation resistance value between all adjacent bumps is 1 × 108The sample with omega above is evaluated as A, and the insulation resistance value between adjacent bumps is less than 1 x 108The sample at the position of Ω is evaluated as B. The results and the minimum value of the insulation resistance value are shown in table 1.
[ measurement of connection resistance value ]
Using the circuit-connecting adhesive films prepared in the above examples and comparative examples, a chip (1.2X 19mm, thickness: 500 μm) having gold bumps (area: 30X 50 μm, bump height: 15 μm, number of bumps: 300) and a glass substrate (thickness: 0.7mm, electrode height: 0.15 μm) having ITO circuits were connected as follows.
By passing through a reactor at 80 ℃ and 0.98MPa (10 kgf/cm)2) Under the conditions of (1) and (20) for 2 seconds, a circuit-connecting adhesive film (1.5X 20mm) was adhered to the ITO circuit-equipped glass substrate. In this case, the circuit connecting adhesive film having a 3-layer structure is formed by peeling off the PET film on the insulating adhesive layer (b) and then bonding the insulating adhesive layer (b) to the glass substrate, and the circuit connecting adhesive film having a 2-layer structure is formed by peeling off the PET film on the conductive adhesive layer (c) and then bonding the conductive adhesive layer (c) to the glass substrate.
Subsequently, the PET film was peeled off from the circuit-connecting adhesive film, the bumps of the chip and the glass substrate with ITO circuit were positioned, and then heated and pressed from above the chip at 190 ℃ and 40 g/bump for 10 seconds, thereby carrying out the main connection of the chip and the glass substrate via the circuit-connecting adhesive film.
The connection sample thus obtained was subjected to the following moisture resistance test. That is, the connection sample was left to stand at 85 ℃ and 85% RH for 1000 hours.
The connection resistance value of the connection sample after the moisture resistance test was measured for each bump by a 4-terminal method using a digital multimeter. Thus, whether or not the conduction is good is determined. In this case, good conduction is evaluated as a connection resistance value of 20 Ω or less, a sample having a connection resistance value of 20 Ω or less in all bumps is evaluated as a, and a sample having a bump having a connection resistance value exceeding 20 Ω is evaluated as B. The results and the maximum values of the connection resistance values are shown in table 1.
TABLE 1
From the results shown in Table 1, it was confirmed that the adhesive films for circuit connection of examples 1 to 5, in which the thickness of the insulating adhesive layer on at least one side was in the range of 0.1 to 5.0. mu.m, had a sufficient number of particles trapped between the electrodes, and had both good insulation resistance values after the energization humidity resistance test and good connection resistance values after the humidity resistance test. On the other hand, it was confirmed that the insulating adhesive layer had a thickness of 7 μm on both sides, and the insulating resistance value after the moisture resistance test, the connection resistance value after the moisture resistance test, and the particle trapping number were inferior in the adhesive film for circuit connection of comparative example 1. In addition, it was confirmed that the insulating resistance value after the resistance to humidity test was poor in the circuit connecting adhesive film having a 2-layer structure (comparative example 2) comprising the conductive adhesive layer and the insulating adhesive layer. In comparative example 3 in which the thickness of the insulating adhesive layer was 0.08 μm, which was less than 0.1 μm, it was also confirmed that the insulation between the adjacent contact electrodes could not be sufficiently ensured, and the insulation resistance value after the energization moisture resistance test was deteriorated. As described above, it was confirmed that the adhesive film for circuit connection according to the present invention has less conductive particles flowing out from the electrodes when circuit members are connected to each other, and is excellent in high resolution and long-term connection reliability.
Industrial applicability of the invention
As described above, according to the present invention, it is possible to provide an adhesive film for circuit connection which is less in conductive particle outflow from an electrode when circuit members are connected to each other, excellent in high resolution and long-term connection reliability, and excellent in workability because it is not necessary to accurately position the conductive particles and the electrode, and a circuit member connection structure and a circuit member connection method using the adhesive film for circuit connection.
Claims (21)
1. An adhesive film for circuit connection, which is used for connecting a first circuit member having a first circuit electrode formed on a main surface of a first substrate with a second circuit member having a second circuit electrode formed on a main surface of a second substrate in a state where the first circuit electrode and the second circuit electrode are arranged to face each other,
at least comprising: a conductive adhesive layer containing conductive particles and an adhesive; an insulating first insulating adhesive layer formed on one surface of the conductive adhesive layer; an insulating second insulating adhesive layer formed on a surface of the conductive adhesive layer opposite to the surface on which the first insulating adhesive layer is formed,
at least one of the first insulating adhesive layer and the second insulating adhesive layer has a thickness of 2.0 to 4.0 μm;
at least one of the first circuit electrode and the second circuit electrode has a height of 3.0 μm or less, and the first insulating adhesive layer or the second insulating adhesive layer having a thickness of 2.0 to 4.0 μm in the adhesive film for circuit connection is disposed on the circuit electrode side having a height of 3.0 μm or less.
2. The circuit-connecting adhesive film according to claim 1, wherein the thickness of at least one of the first insulating adhesive layer and the second insulating adhesive layer is 2.0 to 3.0 μm.
3. The adhesive film for circuit connection according to claim 1, wherein the adhesive contains a thermosetting resin,
the conductive adhesive layer has a higher melt viscosity at the time of connecting the first circuit member and the second circuit member than the first insulating adhesive layer and the second insulating adhesive layer.
4. The circuit-connecting adhesive film according to claim 1 or 3, wherein the conductive adhesive layer further contains a film-forming polymer.
5. The adhesive film for circuit connection according to claim 1 or 3, wherein the adhesive contains a mixture of an epoxy resin and a latent curing agent, or a mixture of a radical reactive resin and an organic peroxide.
6. The circuit-connecting adhesive film according to claim 1 or 3, wherein the thickness of the conductive adhesive layer is 3 to 15 μm.
7. The circuit-connecting adhesive film according to claim 1 or 3, wherein the thickness of the conductive adhesive layer is 5 to 10 μm.
8. A circuit member connection structure, wherein a first circuit member having a first circuit electrode formed on a main surface of a first substrate and a second circuit member having a second circuit electrode formed on a main surface of a second substrate are electrically connected so that the first circuit electrode and the second circuit electrode are opposed to each other by a circuit connecting member comprising a cured product of the adhesive film for circuit connection according to any one of claims 1 to 7, the circuit connecting member being provided between the first and second circuit members; at least one of the first circuit electrode and the second circuit electrode has a height of 3.0 μm or less, and the first insulating adhesive layer or the second insulating adhesive layer having a thickness of 2.0 to 4.0 μm in the adhesive film for circuit connection is disposed on the circuit electrode side having a height of 3.0 μm or less.
9. A method for connecting circuit members, comprising laminating a first circuit member having a first circuit electrode formed on a main surface of a first substrate, the adhesive film for circuit connection according to any one of claims 1 to 7, and a second circuit member having a second circuit electrode formed on a main surface of a second substrate in this order so that the first circuit electrode and the second circuit electrode face each other, and heating and pressing the laminate to connect the first circuit member and the second circuit member so that the first circuit electrode and the second circuit electrode are electrically connected to each other; the height of at least one of the first circuit electrode and the second circuit electrode is 3.0 [ mu ] m or less, and the first insulating adhesive layer or the second insulating adhesive layer having a thickness of 2.0 to 4.0 [ mu ] m in the adhesive film for circuit connection is arranged on the circuit electrode side having a height of 3.0 [ mu ] m or less, and the first circuit member and the second circuit member are connected by heating and pressing, so that the first circuit electrode and the second circuit electrode are electrically connected.
10. A method of using an adhesive film for circuit connection, in which a first circuit member having a first circuit electrode formed on a main surface of a first substrate and a second circuit member having a second circuit electrode formed on a main surface of a second substrate are connected in a state in which the first circuit electrode and the second circuit electrode are arranged to face each other; wherein,
the adhesive film for circuit connection at least comprises:
a conductive adhesive layer containing conductive particles and an adhesive,
an insulating first insulating adhesive layer formed on one surface of the conductive adhesive layer,
an insulating second insulating adhesive layer formed on a surface of the conductive adhesive layer opposite to the surface on which the first insulating adhesive layer is formed;
at least one of the first insulating adhesive layer and the second insulating adhesive layer has a thickness of 2.0 to 4.0 μm;
it is characterized in that the preparation method is characterized in that,
a height of at least one of the first circuit electrode and the second circuit electrode is 3.0 μm or less;
the first insulating adhesive layer or the second insulating adhesive layer having a thickness of 2.0 to 4.0 [ mu ] m in the circuit-connecting adhesive film is disposed on the circuit-electrode side having a height of 3.0 [ mu ] m or less, and the first circuit member and the second circuit member are connected.
11. The method of using the adhesive film for circuit connection according to claim 10, wherein the thickness of at least one of the first insulating adhesive layer and the second insulating adhesive layer is 2.0 to 3.0 μm.
12. The method of using the adhesive film for circuit connection according to claim 10,
the adhesive is an adhesive containing thermosetting resin;
the conductive adhesive layer has a higher melt viscosity when the first circuit member and the second circuit member are connected to each other than the first insulating adhesive layer and the second insulating adhesive layer.
13. The method of using the adhesive film for circuit connection according to claim 12, wherein the conductive adhesive layer has a melt viscosity of 5.0 x 10 at 120 ℃2～5.0×106Pa·s。
14. The method of using the adhesive film for circuit connection according to claim 12, wherein the conductive adhesive layer has a melt viscosity of 5.0 x 10 at 120 ℃3～5.0×105Pa·s。
15. The method of using the adhesive film for circuit connection according to claim 12 or 13, wherein the first insulating adhesive layer and the second insulating adhesive layer have a melt viscosity of 1.0 x 10 at 120 ℃2～1.0×106Pa·s。
16. The method of using the adhesive film for circuit connection according to claim 12 or 13, wherein the first insulating adhesive layer and the second insulating adhesive layer have a melt viscosity of 1.0 x 10 at 120 ℃3～1.0×105Pa·s。
17. The method of using the circuit-connecting adhesive film according to claim 10 or 12, wherein the conductive adhesive layer further contains a film-forming polymer.
18. The method of using the adhesive film for circuit connection according to claim 17, wherein the film-forming polymer is a thermoplastic resin.
19. The method of using the adhesive film for circuit connection according to claim 10 or 12, wherein the adhesive contains a mixture of an epoxy resin and a latent curing agent, or a mixture of a radical reactive resin and an organic peroxide.
20. The method of using the adhesive film for circuit connection according to claim 10 or 12, wherein the thickness of the conductive adhesive layer is 3 to 15 μm.
21. The method of using the adhesive film for circuit connection according to claim 10 or 12, wherein the thickness of the conductive adhesive layer is 5 to 10 μm.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-109690 | 2006-04-12 | ||
| JP2006109690 | 2006-04-12 | ||
| JP2006213444 | 2006-08-04 | ||
| JP2006-213444 | 2006-08-04 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800130291A Division CN101421886B (en) | 2006-04-12 | 2007-04-05 | Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101901971A CN101901971A (en) | 2010-12-01 |
| CN101901971B true CN101901971B (en) | 2012-07-04 |
Family
ID=38624909
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102207605A Active CN101901971B (en) | 2006-04-12 | 2007-04-05 | Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
| CN2007800130291A Expired - Fee Related CN101421886B (en) | 2006-04-12 | 2007-04-05 | Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
| CN2010102207766A Expired - Fee Related CN101901972B (en) | 2006-04-12 | 2007-04-05 | Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800130291A Expired - Fee Related CN101421886B (en) | 2006-04-12 | 2007-04-05 | Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
| CN2010102207766A Expired - Fee Related CN101901972B (en) | 2006-04-12 | 2007-04-05 | Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4775377B2 (en) |
| KR (2) | KR101090561B1 (en) |
| CN (3) | CN101901971B (en) |
| TW (1) | TW200745308A (en) |
| WO (1) | WO2007123003A1 (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5186157B2 (en) * | 2007-08-24 | 2013-04-17 | デクセリアルズ株式会社 | Anisotropic conductive film and manufacturing method of connection structure using the same |
| JP2009194359A (en) * | 2008-01-16 | 2009-08-27 | Hitachi Chem Co Ltd | Adhesive film for circuit connection, and connection structure of circuit member and method of connecting circuit member using the same |
| JP2010241993A (en) * | 2009-04-08 | 2010-10-28 | Canon Chemicals Inc | Electroconductive adhesive |
| WO2011001895A1 (en) * | 2009-07-01 | 2011-01-06 | 日本化薬株式会社 | Liquid crystal sealing agent for liquid crystal dropping method and liquid crystal display cell using same |
| KR101351617B1 (en) * | 2010-12-23 | 2014-01-15 | 제일모직주식회사 | Anisotropic conductive film |
| KR20120076187A (en) * | 2010-12-29 | 2012-07-09 | 제일모직주식회사 | Anisotropic conductive film |
| JP5972844B2 (en) * | 2012-09-18 | 2016-08-17 | デクセリアルズ株式会社 | Anisotropic conductive film, method for manufacturing anisotropic conductive film, method for manufacturing connected body, and connection method |
| CN103596379A (en) * | 2013-10-26 | 2014-02-19 | 溧阳市东大技术转移中心有限公司 | Method for manufacturing double-layer flexible printed circuit board |
| JP6408759B2 (en) * | 2013-11-08 | 2018-10-17 | デクセリアルズ株式会社 | Adhesive composition and film winding body |
| JP6632618B2 (en) * | 2015-05-28 | 2020-01-22 | タツタ電線株式会社 | Conductive paste for mounting |
| TWI741973B (en) * | 2015-12-22 | 2021-10-11 | 美商英特爾股份有限公司 | Manufacturing method of laminated body, laminated body and multilayer circuit board |
| WO2017130789A1 (en) * | 2016-01-29 | 2017-08-03 | 日立化成株式会社 | Adhesive film, production process therefor, adhesive tape, and reel for adhesive film |
| CN108040425B (en) * | 2017-12-14 | 2019-09-20 | 广东长盈精密技术有限公司 | Electronic equipment and its circuit board |
| KR102254467B1 (en) * | 2018-07-12 | 2021-05-21 | 에이치엔에스하이텍(주) | Manufacturing method for anisotropic conductive adhesive film |
| KR102254470B1 (en) * | 2018-07-12 | 2021-05-21 | 에이치엔에스하이텍(주) | Manufacturing method for anisotropic conductive adhesive film |
| CN110875101A (en) * | 2018-08-31 | 2020-03-10 | 玮锋科技股份有限公司 | Anisotropic conductive film structure and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1125998A (en) * | 1993-06-08 | 1996-07-03 | 美国3M公司 | Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
| CN1193452A (en) * | 1995-06-07 | 1998-09-16 | 德克斯特公司 | Method for making a debossed conductive film composite |
| CN1224568A (en) * | 1997-04-25 | 1999-07-28 | 松下电器产业株式会社 | Apparatus for mfg. adhesive layer, apparatus for mfg. double-sided substrate, and apparatus for mfg. multi-layered substrate |
| CN1274950A (en) * | 1999-04-13 | 2000-11-29 | 松下电器产业株式会社 | Mounting structure, method of manufacturing the same and electrically conductive adhesive |
| CN1675754A (en) * | 2003-01-08 | 2005-09-28 | Lg电线株式会社 | Method of microelectrode connection and connected structure of use thereof |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61195179A (en) * | 1985-02-25 | 1986-08-29 | Matsushita Electric Ind Co Ltd | Anisotropically conductive adhesive sheet |
| JPH01236588A (en) * | 1988-03-17 | 1989-09-21 | Matsushita Electric Ind Co Ltd | Aeolotropic conductive adhesive body |
| JPH0636327B2 (en) * | 1988-07-06 | 1994-05-11 | 日東電工株式会社 | Conductive adhesive tape |
| JP2833111B2 (en) * | 1989-03-09 | 1998-12-09 | 日立化成工業株式会社 | Circuit connection method and adhesive film used therefor |
| JPH03107888A (en) * | 1989-09-21 | 1991-05-08 | Sharp Corp | Connecting structure for circuit board |
| JPH04366630A (en) * | 1991-06-13 | 1992-12-18 | Sharp Corp | Anisotropic conductive adhesive tape |
| JPH07230840A (en) * | 1994-02-17 | 1995-08-29 | Hitachi Chem Co Ltd | Connecting member and electrode connecting structure using the same |
| JP3656768B2 (en) * | 1995-02-07 | 2005-06-08 | 日立化成工業株式会社 | Connection member, electrode connection structure using the connection member, and connection method |
| JP2002076607A (en) * | 2000-08-25 | 2002-03-15 | Sekisui Chem Co Ltd | Method for transferring and disposing fine particles, fine particle disposing film, conductively connecting film and conductively connecting structure |
-
2007
- 2007-04-05 CN CN2010102207605A patent/CN101901971B/en active Active
- 2007-04-05 CN CN2007800130291A patent/CN101421886B/en not_active Expired - Fee Related
- 2007-04-05 KR KR1020087027564A patent/KR101090561B1/en active IP Right Grant
- 2007-04-05 KR KR1020117010921A patent/KR101150116B1/en active IP Right Grant
- 2007-04-05 WO PCT/JP2007/057667 patent/WO2007123003A1/en active Application Filing
- 2007-04-05 CN CN2010102207766A patent/CN101901972B/en not_active Expired - Fee Related
- 2007-04-05 JP JP2007528907A patent/JP4775377B2/en active Active
- 2007-04-11 TW TW096112733A patent/TW200745308A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1125998A (en) * | 1993-06-08 | 1996-07-03 | 美国3M公司 | Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
| CN1193452A (en) * | 1995-06-07 | 1998-09-16 | 德克斯特公司 | Method for making a debossed conductive film composite |
| CN1224568A (en) * | 1997-04-25 | 1999-07-28 | 松下电器产业株式会社 | Apparatus for mfg. adhesive layer, apparatus for mfg. double-sided substrate, and apparatus for mfg. multi-layered substrate |
| CN1274950A (en) * | 1999-04-13 | 2000-11-29 | 松下电器产业株式会社 | Mounting structure, method of manufacturing the same and electrically conductive adhesive |
| CN1675754A (en) * | 2003-01-08 | 2005-09-28 | Lg电线株式会社 | Method of microelectrode connection and connected structure of use thereof |
Non-Patent Citations (2)
| Title |
|---|
| JP特开平4-366630A 1992.12.18 |
| JP特开平7-230840A 1995.08.29 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080108615A (en) | 2008-12-15 |
| JP4775377B2 (en) | 2011-09-21 |
| CN101901971A (en) | 2010-12-01 |
| WO2007123003A1 (en) | 2007-11-01 |
| KR20110063586A (en) | 2011-06-10 |
| CN101901972B (en) | 2012-07-04 |
| KR101090561B1 (en) | 2011-12-08 |
| TWI367930B (en) | 2012-07-11 |
| CN101421886A (en) | 2009-04-29 |
| CN101901972A (en) | 2010-12-01 |
| KR101150116B1 (en) | 2012-06-08 |
| CN101421886B (en) | 2010-12-15 |
| TW200745308A (en) | 2007-12-16 |
| JPWO2007123003A1 (en) | 2009-09-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101901971B (en) | Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method | |
| JP2009194359A (en) | Adhesive film for circuit connection, and connection structure of circuit member and method of connecting circuit member using the same | |
| KR101063710B1 (en) | Anisotropic conductive adhesive composition, anisotropic conductive film, the connection structure of a circuit member, and the manufacturing method of a coating particle | |
| JP4978493B2 (en) | Circuit connection material, connection structure and manufacturing method thereof | |
| JP4640532B2 (en) | Coated conductive particles | |
| JP4640531B2 (en) | Conductive particles | |
| WO2011002084A1 (en) | Conductive particle | |
| JP2009074020A (en) | Anisotropic conductive film | |
| JP6237855B2 (en) | Adhesive film, circuit member connection structure, and circuit member connection method | |
| JP5029691B2 (en) | Film adhesive for circuit connection | |
| KR20140035993A (en) | Circuit-connecting material and connected circuit board structure | |
| JP2002204052A (en) | Circuit connecting material and method for connecting circuit terminal using the same as well as connecting structure | |
| JP4254995B2 (en) | Anisotropic conductive adhesive and circuit board | |
| JP2010278025A (en) | Anisotropic conductive film | |
| JP4110589B2 (en) | Circuit connection member and circuit board manufacturing method | |
| JP2006233202A (en) | Anisotropically electroconductive adhesive film for circuit connection | |
| JP4687576B2 (en) | Film adhesive for circuit connection | |
| JP2012023338A (en) | Adhesive film for circuit connection, circuit connection structure using the same, and circuit member connection method | |
| JP4055583B2 (en) | Adhesive composition for circuit connection, circuit terminal connection method using the same, and circuit terminal connection structure | |
| JP2016076338A (en) | Conductive particle |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Lishennoco Co.,Ltd. Address before: Tokyo, Japan Patentee before: HITACHI CHEMICAL Co.,Ltd. Address after: Tokyo, Japan Patentee after: HITACHI CHEMICAL Co.,Ltd. Address before: Tokyo, Japan Patentee before: HITACHI CHEMICAL Co.,Ltd. |