KR20110063586A - Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method - Google Patents

Abstract

The adhesive film for circuit connection of this invention uses the 1st circuit member which the 1st circuit member in which the 1st circuit electrode was formed on the main surface of the 1st board | substrate, and the 2nd circuit member in which the 2nd circuit electrode was formed on the main surface of the 2nd board | substrate. It is an adhesive film for circuit connection for connecting in the state which has arrange | positioned 2 circuit electrodes, and is formed in the one side of the conductive adhesive layer 3 and the conductive adhesive layer 3 containing the electroconductive particle 1 and the adhesive agent 2 At least the insulating first insulating adhesive layer 4 and the insulating second insulating adhesive layer 5 formed on the side opposite to the surface on which the first insulating adhesive layer 4 of the conductive adhesive layer 3 is formed. The thickness of at least one of the first and second insulating adhesive layers 4 and 5 is 0.1 to 5.0 µm.

Description

Adhesive film for circuit connection, connection structure of circuit member and connection method of circuit member {CIRCUIT CONNECTING ADHESIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND CIRCUIT MEMBER CONNECTING METHOD}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to an adhesive film for circuit connection, a connection structure of a circuit member, and a connection method of a circuit member. It relates to an adhesive film, a connection structure of a circuit member using the same, and a connection method of the circuit member.

When electrically connecting circuit boards or electronic components, such as an IC chip, and a circuit board, the anisotropic conductive adhesive which disperse | distributed electroconductive particle to the adhesive agent is used. In other words, the anisotropic conductive adhesive is disposed between the electrodes of the circuit members facing each other as described above, and the electrodes are connected by heating and pressurization, thereby providing conductivity in the pressing direction, and the electrodes formed adjacent to each other. By providing insulation, electrical connection between only opposing electrodes can be performed. As such an anisotropically conductive adhesive agent, the adhesive agent for circuit connection based on an epoxy resin is proposed, for example (for example, refer patent document 1).

The basic concept for high resolution of the adhesive for circuit connection is to make the particle size of the conductive particles smaller than the insulating portions between adjacent electrodes to ensure insulation between adjacent electrodes, and to contact the contents of the conductive particles with each other. By making it impossible to do so and reliably present a conductive particle on an electrode, the electroconductivity between opposing electrodes is acquired.

However, in the above conventional method, when the particle diameter of the conductive particles is reduced, there is a tendency that the particles are caused to undergo secondary aggregation by a significant increase in the surface area of the conductive particles, whereby the insulation between adjacent electrodes cannot be maintained. In addition, if the content of the conductive particles is reduced, the number of conductive particles on the electrode is also reduced, so that the number of contact points is insufficient, so that there is a problem that the conduction between the electrodes to be connected is not sufficiently obtained. As described above, in the conventional method, it is difficult to increase the resolution of the adhesive for circuit connection while maintaining the connection reliability for a long time.

In particular, with the recent remarkable high resolution of circuit boards, i.e., the miniaturization of the electrode area or the space between adjacent electrodes, the conductive particles on the electrodes tend to leak out between the adjacent electrodes together with the adhesive by heating and pressing at the time of connection, It hindered the high resolution of the adhesive agent for connection.

In order to improve such a problem, the adhesive film of the multilayered structure which isolate | separated the electrically-conductive particle containing layer and the insulating adhesive layer is manufactured, and the outflow of the electrically-conductive particle between adjacent electrodes is improved by raising the trapping efficiency of the electrically-conductive particle on an electrode. The method of suppressing and making high resolution is proposed (for example, refer patent document 2-5).

Moreover, in order to enable the connection of the electrode or circuit refined | miniaturized as mentioned above, and to implement | achieve the circuit connection adhesive which was excellent in connection reliability, the circuit connection adhesive agent which formed the dense area of the electroconductive particle in the necessary part of the surface direction The proposal of is also made (for example, refer patent document 6).

Patent Document 1: Japanese Patent Application Laid-Open No. 3-16147

Patent Document 2: Japanese Patent Application Laid-Open No. 1-236588

Patent Document 3: Japanese Patent Application Laid-Open No. 2-18809

Patent Document 4: Japanese Patent Application Laid-Open No. 4-366630

Patent Document 5: Japanese Patent Application Laid-Open No. 8-279371

Patent Document 6: Japanese Patent Application Laid-Open No. 2002-76607

However, in the method described in Patent Document 2, the density of the conductive particles on one electrode side is increased, and it is not sufficient to meet the recent demand for remarkable high resolution. Moreover, when the density of the electroconductive particle in one electrode side becomes high, the adhesive force of the interface of an electrode and the adhesive agent for circuit connections will fall, and interface peeling or deterioration of connection reliability will arise easily.

Moreover, in the method of the said patent documents 3-5, the contact of an electrode and an electroconductive particle is not necessarily fully secured, but there exists a problem that connection reliability deteriorates because connection resistance value becomes high.

Further, in the adhesive for circuit connection described in Patent Document 6, the connection of the dot-shaped fine electrode becomes possible, but the manufacturing method of the adhesive is cumbersome, and the precise position alignment of the dense region of the conductive particles and the electrode is performed when the electrodes are connected. This necessitates a problem of poor workability.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has a small outflow of conductive particles from the electrodes when the circuit members are connected to each other, has excellent high resolution and long-term connection reliability, and does not require precise alignment of the conductive particles with the electrodes. Therefore, it aims at providing the adhesive film for circuit connections excellent in workability, the connection structure of a circuit member using the same, and the connection method of a circuit member.

In order to achieve the above object, the present invention provides a first circuit member having a first circuit electrode formed on the main surface of the first substrate and a second circuit member having a second circuit electrode formed on the main surface of the second substrate. An adhesive film for circuit connection for connecting in a state where the circuit electrode and the second circuit electrode are disposed to face each other, a conductive adhesive layer containing conductive particles and an adhesive, and an insulating first insulating adhesive formed on one side of the conductive adhesive layer. A layer and at least an insulating second insulating adhesive layer formed on a surface of the conductive adhesive layer opposite to the surface on which the first insulating adhesive layer is formed, and at least one of the first insulating adhesive layer and the second insulating adhesive layer. The adhesive film for circuit connections whose thickness of one layer is 0.1-5.0 micrometers is provided.

According to such an adhesive film for circuit connection, when it uses for the connection of circuit members, there exists little outflow of the electroconductive particle from an electrode, and the particle | grain trapping property is favorable, Therefore, even between a minute circuit electrode, between adjacent electrodes Insulation and the conductivity between the electrodes to be connected can be sufficiently secured. Therefore, the adhesive film for circuit connection of this invention can achieve high resolution and long-term connection reliability at high level. Moreover, since the adhesive film for circuit connection of this invention does not need accurate position alignment of an electroconductive particle and an electrode, it is excellent in the workability at the time of the connection of circuit members.

Here, it is thought that the said effect is exhibited by the adhesive film for circuit connections of this invention for the following reasons. That is, by disposing the conductive particles only in the conductive adhesive layer, there is little outflow of the conductive particles from the electrode and the particle trapping efficiency is improved. Accordingly, the conductive particles can be prevented from coming into contact with each other, and the conductive particles can be reliably present on the electrode, so that the conductivity at the connecting portion can be sufficiently obtained. Moreover, by forming an insulating adhesive layer on both surfaces of a conductive adhesive layer, an insulating adhesive layer is arrange | positioned between adjacent circuit electrodes, and the insulation between adjacent electrodes can fully be ensured. In addition, by setting the thickness of the at least one insulating adhesive layer to 0.1 to 5 µm, sufficient contact between the electrode and the conductive particles can be ensured while sufficiently securing insulation between adjacent electrodes, and the insulation between adjacent electrodes and the electrode to be connected The conductivity of the liver can be sufficiently secured.

Moreover, in the adhesive film for circuit connections of this invention, the said adhesive contains a thermosetting resin, and the said conductive adhesive layer has the said 1st circuit member rather than the said 1st insulating adhesive bond layer and the said 2nd insulating adhesive bond layer. It is preferable that the melt viscosity at the time of connection of the said 2nd circuit member is high. Thereby, the outflow of the electrically-conductive particle between adjacent circuit electrodes with an adhesive agent by the heating press at the time of connection can be reduced, and the number of particle capture | acquisitions improves by this, and the insulation between adjacent electrodes also with respect to a minute circuit electrode, and The conductivity between the electrodes to be connected can be sufficiently secured.

Moreover, in the adhesive film for circuit connections of this invention, it is preferable that the said conductive adhesive layer further contains a film formation polymer. Thereby, the film formability of a conductive adhesive layer can be made favorable, and it can hold | maintain in the state which disperse | distributed electroconductive particle uniformly. And such an adhesive film for circuit connection is excellent in workability because accurate positioning of an electrically conductive particle and an electrode is unnecessary, and it is excellent in long-term connection reliability because an air bubble is hard to be contained in a connection part.

The present invention also provides a first circuit member in which a first circuit electrode is formed on a main surface of a first substrate, and a second circuit member in which a second circuit electrode is formed on a main surface of a second substrate. Connection of the circuit member connected so that the said 1st circuit electrode and the said 2nd circuit electrode may be replaced and electrically connected by the circuit connection member containing the hardened | cured material of the adhesive film for circuit connections of the said invention provided between. Provide structure.

Since the circuit connection member contains the hardened | cured material of the adhesive bond film for circuit connections of this invention, such a circuit member connection structure has little outflow of the electroconductive particle from an electrode, and it has a favorable particle trapping property, and is insulating between adjacent electrodes. And the conductivity between the electrodes to be connected can be sufficiently secured, and high resolution and long-term connection reliability can be achieved at a high level.

Moreover, in the connection structure of the said circuit member, the height of at least one circuit electrode of the said 1st circuit electrode and the said 2nd circuit electrode is 3.0 micrometers or less, and the thickness in the said adhesive film for circuit connections is 0.1-5.0 micrometers. It is preferable that the said 1st insulating adhesive bond layer or the said 2nd insulating adhesive bond layer is arrange | positioned at the said circuit electrode side whose height is 3.0 micrometers or less.

Since the connection structure of such a circuit member can ensure sufficient insulation between adjacent electrodes and conductivity between electrodes to be connected with respect to a minute circuit electrode, the recent outstanding high resolution request can be achieved at a high level. have.

The present invention also provides a first circuit member in which a first circuit electrode is formed on a main surface of a first substrate, an adhesive film for circuit connection of the present invention, and a second circuit in which a second circuit electrode is formed on a main surface of a second substrate. The first circuit member and the second circuit electrode are electrically connected to each other so that the first circuit electrode and the second circuit electrode are electrically connected by stacking, heating, and pressing the member in the order so that the first circuit electrode and the second circuit electrode are opposed to each other. A method of connecting a circuit member for connecting a second circuit member is provided.

According to the connection method of such a circuit member, by using the adhesive film for circuit connection of this invention, the outflow | flow of the electroconductive particle from an electrode can be suppressed, and particle | grain trapping property can be made favorable, and insulation and the connection between adjacent electrodes should be made. It is possible to sufficiently secure the conductivity between the electrodes. Therefore, the connection structure of the circuit member with which high resolution and long term connection reliability were achieved at high level can be formed.

Moreover, in the connection method of the circuit member of the said invention, the height of at least one circuit electrode of the said 1st circuit electrode and the said 2nd circuit electrode is 3.0 micrometers or less, and the thickness in the said adhesive film for circuit connections is 0.1. The first circuit electrode and the second circuit electrode are electrically connected to each other by heating and pressurizing the first insulating adhesive layer or the second insulating adhesive layer having a thickness of 5.0 μm or less on the side of the circuit electrode having a height of 3.0 μm or less. It is preferable to connect the first circuit member and the second circuit member to be connected.

According to the connection method of such a circuit member, since the insulation between adjacent electrodes and the electroconductivity between the electrodes to be connected can fully be ensured, the connection structure of the circuit member with which high resolution and long-term connection reliability were achieved at a high level can be formed. have.

According to the present invention, there is less leakage of conductive particles from the electrodes when the circuit members are connected, and thus have excellent resolution and long-term connection reliability. The adhesive film for a connection, the connection structure of the circuit member using the same, and the connection method of a circuit member can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic cross section which shows one preferable embodiment of the adhesive film for circuit connections of this invention.
Fig. 2 is a schematic sectional view showing another preferred embodiment of the adhesive film for circuit connection of the present invention.
3 is a schematic sectional view showing one preferred embodiment of a connection structure of a circuit member according to the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described in detail, referring drawings. In addition, in drawing, the same code | symbol is attached | subjected to the same or equivalent part, and the overlapping description is abbreviate | omitted. In addition, the dimension ratio of drawing is not limited to the ratio shown.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic cross section which shows one preferable embodiment of the adhesive film (anisotropically conductive adhesive film) for circuit connection of this invention. The adhesive film 100 for circuit connection shown in FIG. 1 is a conductive adhesive layer 3 including conductive particles 1 and an adhesive 2, and an insulating insulating adhesive layer formed on both surfaces of the conductive adhesive layer 3. It is provided with (4) and (5), and the thickness of the insulating adhesive bond layer 5 exists in the range of 0.1-5.0 micrometers.

2 is a schematic cross-sectional view which shows another preferable embodiment of the adhesive film for circuit connections of this invention. The adhesive film 110 for a circuit connection shown in FIG. 2 is a conductive adhesive layer 3 including conductive particles 1 and an adhesive 2, and an insulating insulating adhesive layer formed on both surfaces of the conductive adhesive layer 3. (5), both the thicknesses of the insulating adhesive layer 5 on both sides are in the range of 0.1-5.0 micrometers. On the other hand, although not shown in FIGS. 1 and 2, a peelable base material (support film) may be present on the surfaces of the adhesive films 100 and 110 for circuit connection in order to improve workability or prevent dust adhesion. Hereinafter, each layer which comprises the adhesive film 100 for a circuit connection is demonstrated in detail using the adhesive film 100 for a circuit connection shown in FIG.

The conductive adhesive layer 3 is a layer containing the conductive particles 1 and the adhesive 2 as described above, and in the direction of connecting the opposing circuit electrodes when connecting the circuit members having the circuit electrodes. It is a layer which shows electroconductivity and has anisotropic conductivity which can electrically connect only the opposing circuit electrodes. Here, it is preferable that the adhesive agent 2 contains the reactive resin (heat curable resin) hardened | cured by heat. The thermosetting resin may be a mixture of an epoxy resin with a latent curing agent such as imidazole, hydrazide, boron trifluoride-amine complex, sulfonium salt, amineimide, salt of polyamine, dicyandiamide, or radical reactivity. Mixtures of resins and organic peroxides are used.

Examples of the epoxy resins include bisphenol type epoxy resins derived from epichlorohydrin and bisphenol A, F or AD, epoxy novolac resins derived from epichlorohydrin and phenol novolac or cresol novolac, and naphthalene rings. Naphthalene-based epoxy resin having a skeleton, glycidylamine, glycidyl ether, biphenyl, various epoxy compounds having two or more glycidyl groups in one molecule such as alicyclic, etc. alone or in combination of two or more It is possible to use.

For these epoxy resins, it is preferable to use high-purity products in which the content of impurity ions (Na ⁺ , Cl ^−, etc.) or hydrolyzable chlorine is reduced to 300 ppm or less from the viewpoint of preventing electron migration.

In order to absorb the fluctuation | variation of the height of bumps, a board | substrate electrode, etc. of the chip | tip connected by the adhesive film 100 for circuit connections, to the electrically conductive adhesive layer 3, electroconductive particle 1 for the purpose of actively giving anisotropic conductivity. This is mixed and dispersed. The electroconductive particle 1 is particle | grains with electroconductivity containing metals, such as Au, Ag, Ni, Cu, and solder, for example, and the surface of the spherical nuclear material containing polymers, such as polystyrene, Au, Ag It is more preferable that it is a particle | grain formed by forming the conductive layer containing metals, such as Ni, Cu, and solder. The conductive particles 1 may be formed by forming a surface layer of Su, Au, solder, or the like on the surface of the conductive particles.

The particle size of the electrically conductive particles 1 needs to be smaller than the minimum distance between the electrodes of the circuit member connected by the adhesive film 100 for circuit connection, and, if there is a variation in the height of the electrode, the particle size of the conductive particles 1 It is desirable to be large. It is preferable that it is 1-10 micrometers, and, as for the average particle diameter of the electroconductive particle 1, it is more preferable that it is 2-5 micrometers. If the average particle diameter is less than 1 µm, the electrode cannot cope with variations in the height and the conductivity between the electrodes tends to be lowered. If the average particle diameter exceeds 10 µm, the insulation between adjacent electrodes tends to be lowered.

It is preferable that it is 0.1-30 volume%, and, as for content of the electroconductive particle 1 in the conductive adhesive layer 3 based on the total volume of solid content in a conductive adhesive layer, it is more preferable that it is 0.2-20 volume%. Do. If the content is less than 0.1% by volume, the number of conductive particles on the electrode to be connected decreases, so the contact point is insufficient, and the conductivity between the connecting electrodes tends to be lowered. When the content exceeds 30% by volume, the particle surface area is remarkable. The particles tend to cause secondary agglomeration and are easily connected by the increase, and the insulation property between adjacent electrodes tends to decrease.

The film forming polymer can also be mix | blended with the electroconductive adhesive bond layer 3 from a viewpoint of making the film formation property more favorable. Examples of the film-forming polymer include thermoplastic resins such as phenoxy resins, polyester resins, and polyamide resins. These film-forming polymers are effective for stress relaxation at the time of hardening of a thermosetting resin. In particular, when the film-forming polymer has a functional group such as a hydroxyl group, it is more preferable because the adhesiveness is improved.

In addition, the insulating adhesive layers 4 and 5 which comprise the adhesive film 100 for circuit connection are layers which have insulation. When the insulating adhesive layers 4 and 5 are disposed between adjacent circuit electrodes in the circuit member, the insulating resistance values between the adjacent electrodes are sufficiently secured (preferably, the insulating resistance value between adjacent electrodes is 1 ×). The composition is not particularly limited as long as it is possible to be 10 ⁸ Ω or more. For example, the composition may be the same as the composition in which the conductive particles 1 are removed from the conductive adhesive layer 3 described above.

In addition, an inorganic filler or rubber particles can be mixed and dispersed in the conductive adhesive layer 3 and the insulating adhesive layers 4 and 5. These can be mixed and dispersed in the conductive adhesive layer 3 together with the conductive particles 1, and can also be mixed and dispersed in the insulating adhesive layers 4 and 5 in which the conductive particles 1 are not used. In particular, it is preferable to mix and disperse | distribute to the electrically conductive adhesive layer 3 which uses the electrically-conductive particle 1. By adding these inorganic fillers or rubber particles to the conductive adhesive layer 3, the melt viscosity at the time of connection of the circuit members of the conductive adhesive layer 3 is melted at the time of the connection of the insulating adhesive layers 4 and 5. The viscosity can be easily and sufficiently higher than that of the viscosity.

Although it does not specifically limit as an inorganic filler, For example, powder, such as fused silica, crystalline silica, calcium silicate, alumina, calcium carbonate, is mentioned. It is preferable that the average particle diameter of an inorganic filler is 3 micrometers or less from a viewpoint of preventing the conduction defect in a connection part.

It is preferable that the compounding quantity at the time of using an inorganic filler is 5-100 mass parts also in any of conductive adhesive layer 3, insulating adhesive layers 4, and (5), making compounding quantity of adhesive (2) 100 mass parts. On the other hand, in order to raise melt viscosity, it is more effective that the said compounding quantity is large.

The rubber particles are not particularly limited as long as the glass transition temperature is 25 ° C. or less, but for example, butadiene rubber, acrylic rubber, styrene-butadiene-styrene rubber, nitrile-butadiene rubber, silicone rubber, and the like can be used. . As a rubber particle, it is preferable to use the thing of 0.1-10 micrometers in average particle diameter, and the rubber particle whose particle | grains below average particle diameter occupy 80% or more of particle size distribution is more preferable. The average particle diameter of the rubber particles is more preferably 0.1 to 5 m. Moreover, when the surface of a rubber particle is processed with a silane coupling agent, since the dispersibility to reactive resin improves, it is more preferable.

Among the rubber particles, silicone rubber particles are not only excellent in solvent resistance but also excellent in dispersibility, and thus can be preferably used as effective rubber particles. On the other hand, the silicone rubber particles are added with a silane compound or methyltrialkoxysilane and / or a partial hydrolysis condensate thereof to an aqueous solution of alcohol adjusted to pH 9 or higher with a basic substance such as caustic soda or ammonia to hydrolyze and polycondensate. It can obtain by the method of combining, or copolymerization of organosiloxane. Moreover, silicone microparticles | fine-particles which contained functional groups, such as a hydroxyl group, an epoxy group, a ketimine, a carboxyl group, and a mercapto group, in a molecular terminal or an intramolecular side chain are preferable because dispersibility with respect to a reactive resin improves.

It is preferable that the compounding quantity at the time of using a rubber particle is 5-50 mass parts also in any of conductive adhesive layer 3, insulating adhesive layer 4, and (5), making compounding quantity of adhesive agent 2 100 mass parts.

Formation of the conductive adhesive layer 3 and the insulating adhesive layers 4 and 5 includes at least the adhesive 2 (reactive resin, latent curing agent and the like), and further with respect to the conductive adhesive layer 3. The adhesive composition containing the furnace conductive particles (1) is liquefied by dissolving or dispersing it in an organic solvent to prepare a coating liquid. The coating liquid is applied onto a peelable base material (support film), and the solvent is below the active temperature of the curing agent This can be done by removing. As a solvent used at this time, the mixed solvent of an aromatic hydrocarbon solvent and an oxygen containing solvent is preferable from a viewpoint of improving the solubility of a material. Moreover, as a peelable base material, the PET film etc. surface-treated so that it may have releasability is used preferably.

In addition, although not shown in figure, you may provide a conductive adhesive layer or an insulating adhesive layer further on the outer side of insulating adhesive layers 4 and 5.

And as a manufacturing method of the adhesive film 100 for circuit connections, the method of laminating | stacking the conductive adhesive layer 3 and insulating adhesive layers 4 and 5 which were formed as mentioned above, for example, or A well-known method, such as a method of coating each layer sequentially, can be employ | adopted.

In the adhesive film 100 for circuit connection obtained in this way, it is preferable that it is 3-15 micrometers, and, as for the thickness of the conductive adhesive layer 3, it is more preferable that it is 5-10 micrometers. When this thickness is less than 3 micrometers, when the electroconductive particle which is a preferable average particle diameter is applied, there exists a tendency for the formability of a conductive adhesive layer to fall, and when it exceeds 15 micrometers, the outflow of the electroconductive particle from an electrode will increase. There is a tendency that the insulation between adjacent electrodes and the conductivity between the electrodes to be connected are sufficiently secured.

Moreover, although the thickness of the insulating adhesive layer 5 needs to be 0.1-5.0 micrometers, it is preferable that it is 1.0-5.0 micrometers, and it is more preferable that it is 2.0-4.0 micrometers. When this thickness is less than 0.1 micrometer, when it is arrange | positioned between adjacent circuit electrodes in a circuit member, the insulation between the adjacent electrodes cannot fully be ensured, and when it exceeds 5 micrometers, the electroconductive particle will flow out from an electrode. This increases the insulation between the adjacent electrodes and the conductivity between the electrodes to be connected.

The thickness of the insulating adhesive layer 4 is preferably equal to or less than the sum of the thickness of the first circuit electrode formed on the main surface of the first substrate and the thickness of the second circuit electrode formed on the main surface of the second substrate. When the thickness of the insulating adhesive layer 4 is larger than the sum of the thickness of the first circuit electrode and the thickness of the second circuit electrode, the outflow of conductive particles from the electrode increases, resulting in insulation between adjacent electrodes and between electrodes to be connected. It tends to be difficult to sufficiently secure the conductivity.

Moreover, in the adhesive film 100 for circuit connections, it is preferable that the conductive adhesive layer 3 has a higher melt viscosity at the time of connection of circuit members than the insulating adhesive layers 4 and 5. Here, the melt viscosity at the time of the said connection is melt viscosity in the heating temperature at the time of connecting circuit members mutually using the adhesive film 100 for circuit connections. On the other hand, although the heating temperature at the time of connecting circuit members is adjusted suitably according to the hardenability of the adhesive agent in the adhesive film 100 for circuit connections, etc., it is 120 to 220 degreeC normally. Therefore, it is more preferable that the melt viscosity of the conductive adhesive layer 3 is higher than the melt viscosity of the insulating adhesive layers 4 and 5 within the temperature range.

In addition, the melt viscosity at the time of connection of the conductive adhesive layer 3 specifically, it is preferable that it is 5.0 * 10 <^2> -5.0 * 10 <^6> pa * s, for example at 120 degreeC, and it is 5.0 * 10 <^3> -5.0 *. It is more preferable that it is 10 ⁵ Pa.s.

In addition, the melt viscosity at the time of connection of the insulating adhesive bond layers 4 and 5 specifically, it is preferable that it is 1.0 * 10 <^2> -1.0 * 10 <^6> Pa * s, for example at 120 degreeC, and it is 1.0 * 10 <^3>. It is more preferable that it is -1.0 * 10 <^5> Pa * s.

Next, the connection structure of the circuit member of this invention using the adhesive film 110 for circuit connections of this invention is demonstrated.

3 is a schematic sectional view showing one preferred embodiment of a connection structure of a circuit member according to the present invention. The connection structure 200 of the circuit member shown in FIG. 3 includes a first circuit member 10 having a first substrate 11 and a first circuit electrode 12 formed on a main surface thereof, and a second substrate 21. And the 2nd circuit member 20 which has the 2nd circuit electrode 22 formed on the main surface contains the hardened | cured material by which the adhesive film 110 for circuit connection of this invention hardened | cured, and 1st and 2nd circuit It is connected by the circuit connection member 110a formed between the members 10 and 20. In the connection structure 200 of a circuit member, the 1st circuit electrode 12 and the 2nd circuit electrode 22 are replaced, and are electrically connected.

The circuit connection member 110a contains the hardened | cured material which the adhesive film 110 for circuit connection of this invention hardened | cured, and the hardened | cured material 2a of the adhesive agent 2 mentioned above, and the electroconductive particle 1 disperse | distributed to this It consists of the hardened | cured material 3a of the electroconductive adhesive bond layer 3 containing the (), and the hardened | cured material 5a of the insulating adhesive bond layer 5 formed in both surfaces. The first circuit electrode 12 and the second circuit electrode 22 are electrically connected to each other via the conductive particles 1. In addition, the hardened | cured material 5a of the insulating adhesive bond layer 5 may cover the circumference | surroundings of the at least 1st and 2nd board | substrates 11 and 21 side of the 1st and 2nd circuit electrodes 12,22. Formed. This is because, when the first and second circuit members 10 and 20 are connected, the insulating adhesive layer 5 is on the first and second circuit electrodes 12 and 22 (on the surface facing each other). This is because it flows out around it.

There is no restriction | limiting in particular as the 1st and 2nd circuit members 10 and 20 as long as the electrode which requires an electrical connection is formed. Specifically, glass or plastic substrates, printed wiring boards, ceramic wiring boards, flexible wiring boards, semiconductor silicon chips, etc., on which electrodes are formed of ITO or the like used in liquid crystal displays, may be used, and these are used in combination as necessary. As described above, in the present embodiment, a material containing organic materials such as a printed wiring board or polyimide, as well as metals such as copper and aluminum, or ITO (indium tin oxide), silicon nitride (SiN _X ), and silicon dioxide (SiO) ₂ ) circuit members having various surface states can be used, such as inorganic materials.

As for the connection structure 200 of a circuit member, the 1st circuit electrode 10 uses the 1st circuit member 10, the adhesive film 110 for circuit connections of this invention, and the 2nd circuit member 20, for example. The first circuit member 10 such that the first circuit electrode 12 and the second circuit electrode 22 are electrically connected by stacking, heating, and pressing in this order so that the 12 and the second circuit electrode 22 are opposed to each other. And the method of connecting the second circuit member 20 with each other.

In this method, first, the adhesive film 110 for a circuit connection is heated and pressed in the state which bonded the adhesive film 110 for circuit connections formed on the peelable base material on the 2nd circuit member 20, and the circuit connection adhesive film 110 is carried out. After temporarily sticking and peeling a peelable base material, the 1st circuit member 10 is mounted, carrying out the alignment of a circuit electrode, and the 2nd circuit member 20, the adhesive film 110 for a circuit connection, and the 1st circuit member ( 10) can be prepared a laminate laminated in this order.

The conditions for heating and pressurizing the laminate are appropriately adjusted in accordance with the curability of the adhesive in the adhesive film for circuit connection or the like so that the adhesive film for circuit connection is cured to obtain sufficient adhesive strength.

In addition, in the description of the connection structure 200 of the said circuit member and its manufacturing method, although the case where the adhesive film 110 for circuit connections was used was demonstrated, the adhesive film for circuit connections instead of the adhesive film 110 for circuit connections. 100 may also be used.

<Examples>

Hereinafter, although this invention is demonstrated further more concretely based on an Example and a comparative example, this invention is not limited to a following example.

(Example 1)

Acrylic particle-containing resin (Nihon Shokubai Co., Ltd. make, brand name) by which 20 mass% of acrylic resin particles of 0.2 micrometer of average particle diameters are disperse | distributed in 32 mass parts of phenoxy resins (The Union Carbide company make, brand name: PKHC) and bisphenol-A epoxy resin. : BPA328) 10 parts by mass, bisphenol A type solid epoxy resin (manufactured by Yuka Shell Epoxy Co., Ltd., brand name: YL980), 20 parts by mass, imidazole series curing agent (manufactured by Asahi Kasei Kogyo Co., Ltd., product name: Novacure HX-3941) 35 parts by mass And 3 mass parts of silane coupling agents (Nipbon Unicar Co., Ltd. brand name: A187) were melt | dissolved in toluene which is a solvent, and the coating liquid for insulating adhesive layer formation of 50 mass% of solid content was obtained.

Subsequently, this coating liquid was applied to a PET film having a thickness of 50 μm on which a release treatment was applied to one side (surface to which the coating liquid was applied) using a coating apparatus, and then hot-air dried at 70 ° C. for 10 minutes, onto the PET film. An insulating adhesive layer (a) having a thickness of 11 mu m was formed. When the melt viscosity of this insulating adhesive layer (a) was measured on the conditions of a temperature increase rate of 10 degree-C / min, a frequency of 10 Hz, and 25 degreeC-200 degreeC using a viscoelasticity measuring apparatus (made by Leometrics), at 120 degreeC The melt viscosity was 1.0 × 10 ³ Pa · s.

Furthermore, the coating liquid for insulating adhesive layer formation is apply | coated to 25-micrometer-thick PET film in which the mold release process was given to one side (surface to apply | coat a coating liquid) using a coating apparatus, and hot-air dried at 70 degreeC for 10 minutes. By this, the insulating adhesive layer (b) of thickness 2 micrometers was formed on PET film. When the melt viscosity of this insulating adhesive layer (b) was measured on the conditions of a temperature increase rate of 10 degree-C / min, a frequency of 10 Hz, and 25 degreeC-200 degreeC using a viscoelasticity measuring apparatus (made by Reimetrics company), Melt viscosity was 1.0 × 10 ³ Pa · s.

Next, acrylic particle-containing resin (Nihon Shokubai Co., Ltd.) in which 20 mass% of acrylic resin particles having an average particle diameter of 0.2 µm are dispersed in 32 parts by mass of a phenoxy resin (manufactured by Union Carbide, trade name: PKHC) and a bisphenol A type epoxy resin. Manufacture, brand name: BPA328) 20 parts by mass, 35 parts by mass of an imidazole series curing agent (manufactured by Asahi Kasei Kogyo Co., Ltd., Novacure HX-3941), 3 parts by mass of a silane coupling agent (manufactured by Nippon Unicar Company, brand name: A187), and silicone 30 mass parts of rubber | gum (Toray Dow Corning make, brand name: E604) was dissolved in toluene which is a solvent, and the adhesive solution of 50 mass% of solid content was produced. 20 mass parts of electroconductive particle (average particle diameter: 3.2 micrometers) formed by forming an Au layer on the surface of a polystyrene-type nuclide (diameter: 3 micrometers) was disperse | distributed to 100 mass parts of this adhesive agent solutions, and the coating liquid for conductive adhesive layer formation was obtained.

The coating liquid was applied to a PET film having a thickness of 50 µm on which one side (the surface on which the coating liquid was applied) on a PET film having a thickness of 50 μm using a coating apparatus, and dried by hot air at 70 ° C. for 10 minutes to give a thickness of 10 on the PET film. A micrometer conductive adhesive layer (c) was formed. When the melt viscosity of this conductive adhesive layer (c) was measured on the conditions of a temperature increase rate of 10 degree-C / min, a frequency of 10 Hz, and 25 degreeC-200 degreeC using a viscoelasticity measuring apparatus (made by Reimetrics company), Melt viscosity was 1.0 × 10 ⁴ Pa · s.

The insulating adhesive layer (a) and the conductive adhesive layer (c) obtained above were laminated | stacked by the roll laminator, heating at 40 degreeC, and the laminated | multilayer film was obtained. Subsequently, after peeling the PET film on a conductive adhesive layer (c) to the conductive adhesive layer (c) side of the obtained laminated | multilayer film, the insulating adhesive layer (b) obtained above is laminated | stacked with a roll laminator, heating at 40 degreeC, The adhesive film for circuit connection of the 3-layered structure whose thickness of an insulating adhesive layer (a) is 11 micrometers, the thickness of a conductive adhesive layer (c) is 10 micrometers, and the thickness of an insulating adhesive layer (b) is 2 micrometers was obtained.

(Example 2)

The thickness of the insulating adhesive layer (a) was 8 µm, the thickness of the insulating adhesive layer (b) was 5 µm, and the thickness of the conductive adhesive layer (c) was 10 µm. To obtain an adhesive film for a circuit connection having a three-layer structure.

(Example 3)

The thickness of the insulating adhesive layer (a) was 12 µm, the thickness of the insulating adhesive layer (b) was 0.1 µm, and the thickness of the conductive adhesive layer (c) was 10 µm. To obtain an adhesive film for a circuit connection having a three-layer structure.

(Example 4)

The thickness of the insulating adhesive layer (a) was 3 µm, the thickness of the insulating adhesive layer (b) was 3 µm, and the thickness of the conductive adhesive layer (c) was 10 µm, in the same manner as in Example 1. To obtain an adhesive film for a circuit connection having a three-layer structure.

(Example 5)

Acrylic particle containing resin (Nippon Shokubai company make, brand name :) by which 20 mass% of acrylic particle of average particle diameter 0.2 micrometer is disperse | distributed in 32 mass parts of phenoxy resins (the product of Union Carbide, brand name: PKHC) and bisphenol-A epoxy resin. BPA328) 20 parts by mass, 35 parts by mass of imidazole series curing agent (manufactured by Asahi Kasei Kogyo Co., Ltd., trade name: HX-3941), 3 parts by mass of a silane coupling agent (manufactured by Nippon Unicar Company, brand name: A187) and silicone rubber (Toray Dow Corning Corporation) Preparation, Brand name: E604) 30 mass parts was dissolved in toluene which is a solvent, and the coating liquid for insulating adhesive layer formation of 50 mass% of solid content was obtained.

Subsequently, this coating liquid was applied to a PET film having a thickness of 50 μm on which a release treatment was applied to one side (surface to which the coating liquid was applied) using a coating apparatus, and then hot-air dried at 70 ° C. for 10 minutes, onto the PET film. An insulating adhesive layer (a) having a thickness of 11 mu m was formed. When the melt viscosity of this insulating adhesive layer (a) was measured on the conditions of a temperature increase rate of 10 degree-C / min, a frequency of 10 Hz, and 25 degreeC-200 degreeC using a viscoelasticity measuring apparatus (made by Leometrics), at 120 degreeC The melt viscosity was 1.0 × 10 ⁴ Pa · s.

Furthermore, the coating liquid for insulating adhesive layer formation is apply | coated to 25-micrometer-thick PET film in which the mold release process was given to one side (surface to apply | coat a coating liquid) using a coating apparatus, and hot-air dried at 70 degreeC for 10 minutes. By this, the insulating adhesive layer (b) of thickness 2 micrometers was formed on PET film. When the melt viscosity of this insulating adhesive layer (b) was measured on the conditions of a temperature increase rate of 10 degree-C / min, a frequency of 10 Hz, and 25 degreeC-200 degreeC using a viscoelasticity measuring apparatus (made by Reimetrics company), Melt viscosity was 1.0 × 10 ⁴ Pa · s.

Next, acrylic particle containing resin (made by Nihon Shokubai Co., Ltd.) by which 20 mass% of acrylic particles with an average particle diameter of 0.2 micrometer are disperse | distributed in 32 mass parts of phenoxy resins (made by Union Carbide, brand name: PKHC), and a bisphenol-A epoxy resin. , Brand name: BPA328) 10 parts by mass, 20 parts by mass of bisphenol A type solid epoxy resin (manufactured by Yuka Shell Epoxy Co., Ltd., brand name: YL980), imidazole series curing agent (manufactured by Asahi Kasei Kogyo Co., Ltd., brand name: HX-3941) 35 parts by mass And 3 parts by mass of a silane coupling agent (Nipbon Unicar Co., Ltd., brand name: A187) were dissolved in toluene, which is a solvent, to prepare an adhesive solution having a solid content of 50% by mass. To 100 parts by mass of the adhesive solution, 20 parts by mass of conductive particles (average particle diameter: 3.2 μm) formed by forming Ni and Au layers on the surface of the polystyrene-based nucleus (diameter: 3 μm) were dispersed to provide a coating liquid for forming a conductive adhesive layer. Got it.

The coating liquid was applied to a PET film having a thickness of 50 µm on which one side (the surface on which the coating liquid was applied) on a PET film having a thickness of 50 μm using a coating apparatus, and dried by hot air at 70 ° C. for 10 minutes to give a thickness of 10 on the PET film. An insulating adhesive layer (c) of 탆 was formed. When the melt viscosity of this conductive adhesive layer (c) was measured on the conditions of a temperature increase rate of 10 degree-C / min, a frequency of 10 Hz, and 25 degreeC-200 degreeC using a viscoelasticity measuring apparatus (made by Leometrics), at 120 degreeC The melt viscosity was 1.0 × 10 ³ Pa · s.

The insulating adhesive layer (a) and the conductive adhesive layer (c) obtained above were laminated | stacked by the roll laminator, heating at 40 degreeC, and the laminated | multilayer film was obtained. Subsequently, after peeling the PET film on a conductive adhesive layer (c) to the conductive adhesive layer (c) side of the obtained laminated | multilayer film, the insulating adhesive layer (b) obtained above is laminated | stacked with a roll laminator, heating at 40 degreeC, The adhesive film for circuit connection of the 3-layered structure whose thickness of an insulating adhesive layer (a) is 11 micrometers, the thickness of a conductive adhesive layer (c) is 10 micrometers, and the thickness of an insulating adhesive layer (b) is 2 micrometers was obtained.

(Comparative Example 1)

The thickness of the insulating adhesive layer (a) was set to 7 µm, the thickness of the insulating adhesive layer (b) was set to 7 µm, and the thickness of the conductive adhesive layer (c) was set to 9 µm. To obtain an adhesive film for a circuit connection having a three-layer structure.

(Comparative Example 2)

Acrylic particle-containing resin (Nihon Shokubai company make, brand name) which disperse | distributes 20 mass% of acrylic resin particles with an average particle diameter of 0.2 micrometer in 32 mass parts and bisphenol-A type epoxy resins by phenoxy resin (made by Union Carbide, brand name: PKHC) : BPA328) 10 parts by mass, 20 parts by mass of a bisphenol A type solid epoxy resin (manufactured by Yuka Shell Epoxy, trade name: YL980), an imidazole series curing agent (manufactured by Asahi Kasei Kogyo Co., Ltd., product name: Novacure HX-3941) 35 parts by mass And 3 mass parts of silane coupling agents (Nipbon Unicar Co., Ltd. brand name: A187) were melt | dissolved in toluene which is a solvent, and the coating liquid for insulating adhesive layer formation of 50 mass% of solid content was obtained.

Subsequently, this coating liquid was applied to a PET film having a thickness of 50 μm on which a release treatment was applied to one side (surface to which the coating liquid was applied) using a coating apparatus, and then hot-air dried at 70 ° C. for 10 minutes, onto the PET film. An insulating adhesive layer (a) having a thickness of 13 mu m was formed. When the melt viscosity of this insulating adhesive layer (a) was measured on the conditions of a temperature increase rate of 10 degree-C / min, a frequency of 10 Hz, and 25 degreeC-200 degreeC using a viscoelasticity measuring apparatus (made by Leometrics), at 120 degreeC The melt viscosity was 1.0 × 10 ³ Pa · s.

Next, 20 parts by mass of conductive particles (average particle diameter: 3.2 μm) formed by forming an Au layer on the surface of the polystyrene-based nucleus (diameter: 3 μm) in 100 parts by mass of the coating liquid for forming an insulating adhesive layer was dispersed in the conductive adhesive layer. The coating liquid for formation was obtained. This coating liquid is applied to a PET film having a thickness of 50 μm on which one side (the surface to which the coating liquid is applied) is subjected to a release process using a coating apparatus, and dried on hot air at 70 ° C. for 10 minutes to give a thickness on the PET film. 10 micrometers of conductive adhesive layers (c) were formed. When the melt viscosity of this conductive adhesive layer (c) was measured on the conditions of a temperature increase rate of 10 degree-C / min, a frequency of 10 Hz, and 25 degreeC-200 degreeC using a viscoelasticity measuring apparatus (made by Leometrics), at 120 degreeC The melt viscosity was 1.0 × 10 ³ Pa · S.

The insulating adhesive layer (a) and conductive adhesive layer (c) obtained above were laminated | stacked with the roll laminator, heating at 40 degreeC, and the adhesive film for circuit connection of a two-layered structure was obtained.

(Comparative Example 3)

The thickness of the insulating adhesive layer (a) was 12 μm, the thickness of the insulating adhesive layer (b) was 0.08 μm, and the thickness of the conductive adhesive layer (c) was 10 μm. To obtain an adhesive film for a circuit connection having a three-layer structure.

[Measurement of Particle Capture Count]

Chips (1.2 × 19 mm, thickness :) with gold bumps (area: 30 × 50 μm, bump height: 15 μm, number of bumps: 300) using the adhesive films for circuit connection prepared in Examples and Comparative Examples. 500 micrometers) and the glass substrate (thickness: 0.7 mm, electrode height: 0.15 micrometer) with an ITO circuit were performed as shown below.

First, the adhesive film for circuit connection (1.5 * 20mm) was adhere | attached on the glass substrate with an ITO circuit by heating and pressing for 2 second on 80 degreeC and the conditions of 0.98 MPa (10 kgf / cm <2>). At this time, the adhesive film for circuit connection of a three-layered structure adheres an insulating adhesive layer (b) to a glass substrate after peeling off the PET film on this insulating adhesive layer (b), and the adhesive film for a circuit connection of a two-layered structure The conductive adhesive layer (c) was attached to the glass substrate after peeling off the PET film on the conductive adhesive layer (c).

Subsequently, after peeling a PET film from the adhesive film for circuit connections and positioning the bump of a chip and the glass substrate with an ITO circuit, it heats from the chip upper on 190 degreeC, 40 g / bump for 10 second, Pressurization was performed and main connection between the chip and the glass substrate via the adhesive film for circuit connection was performed.

At this time, the number of the electroconductive particles captured by the gold bump (area: 30x50 micrometer) was measured using the microscope of 200-500 times the magnification. Thereby, the minimum value of the number of particle | grains capture of the gold bump in the adhesive film for circuit connections manufactured by the said Example and the comparative example was calculated | required. The results are shown in Table 1.

[Measurement of Insulation Resistance]

Chips (1.9 ×) having gold bumps (area: 30 × 100 μm, space between bumps 10 μm, height: 15 μm, bump number: 472) using the adhesive films for circuit connection prepared in the examples and comparative examples. 15 mm, thickness: 500 micrometers, and the glass substrate (thickness: 0.7 mm, electrode height: 0.15 micrometer) with an ITO circuit were performed as shown below.

First, the adhesive film for circuit connection (2.0 * 20mm) was adhere | attached on the glass substrate with an ITO circuit by heat-pressing for 2 second on 80 degreeC and 0.98 MPa (10 kgf / cm <2>) conditions. At this time, the adhesive film for circuit connection of a three-layered structure adheres an insulating adhesive layer (b) to a glass substrate after peeling off the PET film on this insulating adhesive layer (b), and the adhesive film for a circuit connection of a two-layered structure The conductive adhesive layer (c) was bonded to the glass substrate after peeling off the PET film on the conductive adhesive layer (c).

Subsequently, after peeling a PET film from the adhesive film for circuit connections and positioning the bump of a chip and the glass substrate with an ITO circuit, it heats from the chip upper on 190 degreeC, 40 g / bump for 10 second, Pressurization was performed and main connection between the chip and the glass substrate via the adhesive film for circuit connection was performed.

Thus, the following energization moisture resistance test was done about the obtained connection sample. That is, the process which applied DC 15V for 500 hours to 85 degreeC and 85% RH was performed with respect to the connection sample.

About the insulation resistance value of the connection sample after an electricity supply humidity test, the insulation resistance between adjacent bumps was measured on the conditions of 50 V of measurement voltage and 60 second of voltage application time using the insulation ohmmeter. Accordingly, it was determined whether the insulation characteristics between adjacent bumps were good. In this case, the good insulation characteristics are 1 × 10 ⁸ Ω or more as an insulation resistance value, and the insulation resistance value between all adjacent bumps is 1 × 10 ⁸ Ω or more, and the insulation resistance value between adjacent bumps is less than 1 × 10 ⁸ Ω. What included the point was evaluated as B. The results and the minimum values of the insulation resistance are shown in Table 1.

[Measurement of connection resistance value]

Chips (1.2 × 19 mm, thickness :) with gold bumps (area: 30 × 50 μm, bump height: 15 μm, bump number: 300) using the adhesive films for circuit connection prepared in the examples and comparative examples. 500 micrometers) and the glass substrate (thickness: 0.7 mm, electrode height: 0.15 micrometer) with an ITO circuit were performed as described below.

First, the adhesive film for circuit connection (1.5 * 20mm) was adhere | attached on the glass substrate with an ITO circuit by heat-pressing for 2 second on the conditions of 80 degreeC and 0.98 MPa (10 kgf / cm <2>). At this time, the adhesive film for circuit connection of a three-layered structure adheres an insulating adhesive layer (b) to a glass substrate after peeling off the PET film on this insulating adhesive layer (b), and the adhesive film for a circuit connection of a two-layered structure The conductive adhesive layer (c) was attached to the glass substrate after peeling off the PET film on the conductive adhesive layer (c).

Subsequently, after peeling a PET film from the adhesive film for circuit connections and positioning the bump of a chip and the glass substrate with an ITO circuit, it heats from the chip upper on 190 degreeC, 40 g / bump for 10 second, Pressurization was performed and main connection between the chip and the glass substrate via the adhesive film for circuit connection was performed.

The following moisture resistance test was done about the connection sample obtained in this way. That is, the process which left a connection sample to stand for 1000 hours in 85 degreeC and 85% RH environment was performed.

About the connection resistance value of the connection sample after a moisture proof test, the connection resistance per bump was measured by the 4-probe method using the digital multimeter. Accordingly, it was determined whether the conduction was good. The good conduction in this case was made into 20 ohms or less by connection resistance value, and evaluated as A that the connection resistance value of all bumps is 20 ohms or less, and B containing bumps with more than 20 ohms of connection resistance value. The results and the maximum values of the connection resistance values are shown in Table 1.

As is clear from the results shown in Table 1, in the adhesive film for circuit connection of Examples 1 to 5 in which the thickness of the insulating adhesive layer on at least one side is in the range of 0.1 to 5.0 µm, the number of particles captured between the electrodes is sufficient, It was confirmed that both the insulation resistance value after the moisture resistance test and the connection resistance value after the moisture resistance test were good. On the other hand, in the adhesive film for circuit connections of the comparative example 1 whose thickness of an insulating adhesive bond layer is 7 micrometers on both surfaces, it was confirmed that both the insulation resistance value after an electricity supply moisture resistance test, the connection resistance value after a moisture resistance test, and particle | grain capture number fall. Moreover, in the adhesive film for circuit connection (comparative example 2) of the two-layered structure which consists of a conductive adhesive layer and an insulating adhesive bond layer, it was confirmed that the insulation resistance value after an electricity supply moisture resistance test fell. Moreover, in the comparative example 3 whose thickness of an insulating adhesive bond layer is 0.08 micrometers less than 0.1 micrometer, it was confirmed that the insulation resistance value after an electricity supply moisture resistance test deteriorates because the insulation between adjacent electrodes cannot fully be secured. As mentioned above, according to the adhesive film for circuit connections of this invention, it was confirmed that the outflow of the electroconductive particle from an electrode phase is small at the time of the connection of circuit members, and it was excellent in high resolution and long-term connection reliability.

Industrial availability

As described above, according to the present invention, since the outflow of the conductive particles from the electrodes is small when the circuit members are connected to each other, the high resolution and long-term connection reliability are excellent, and precise positioning of the conductive particles and the electrodes is unnecessary. The adhesive film for circuit connections excellent in workability, the connection structure of the circuit member using the same, and the connection method of a circuit member can be provided.

1: conductive particles
2: glue
3: conductive adhesive layer
4: insulating adhesive layer
5: insulating adhesive layer
10: first circuit member
11: first substrate
12: first circuit electrode
20: second circuit member
21: second substrate
22: second circuit electrode
100, 110: adhesive film for circuit connection
110a: circuit connection member
200: connection structure of the circuit member

Claims (11)

The first circuit member having the first circuit electrode formed on the main surface of the first substrate and the second circuit member having the second circuit electrode formed on the main surface of the second substrate facing the first circuit electrode and the second circuit electrode. It is the adhesive film for circuit connection for connecting in the state arrange | positioned,
A conductive adhesive layer containing conductive particles and an adhesive,
An insulating first insulating adhesive layer formed on one side of the conductive adhesive layer, and
An insulating second insulating adhesive layer formed on a surface on the side opposite to the surface on which the first insulating adhesive layer is formed of the conductive adhesive layer.
Have at least,
The thickness of at least one of the said 1st insulating adhesive bond layer and the said 2nd insulating adhesive bond layer is 1.0-4.0 micrometers,
The first insulating adhesive layer or the second having a height of at least one circuit electrode of the first circuit electrode and the second circuit electrode is 3.0 μm or less, and the thickness of the adhesive film for circuit connection is 1.0 to 4.0 μm. The adhesive film for circuit connections in which an insulating adhesive bond layer is arrange | positioned at the said circuit electrode side whose height is 3.0 micrometers or less. The method according to claim 1, wherein the adhesive contains a thermosetting resin,
The adhesive film for circuit connection whose said electroconductive adhesive bond layer has higher melt viscosity at the time of connection of a said 1st circuit member and a said 2nd circuit member than a said 1st insulating adhesive bond layer and a said 2nd insulating adhesive bond layer. The adhesive film for circuit connection of Claim 1 or 2 in which the said conductive adhesive layer further contains a film formation polymer. A first circuit member having a first circuit electrode formed on a main surface of a first substrate, and a second circuit member having a second circuit electrode formed on a main surface of a second substrate provided between the first and second circuit members; By the circuit connection member containing the hardened | cured material of the adhesive film for circuit connections of Claim 1 or 2, it is connected so that the said 1st circuit electrode and the said 2nd circuit electrode may be replaced and electrically connected,
The first insulating adhesive layer or the second having a height of at least one circuit electrode of the first circuit electrode and the second circuit electrode is 3.0 μm or less, and the thickness of the adhesive film for circuit connection is 1.0 to 4.0 μm. The connection structure of the circuit member in which the insulating adhesive bond layer is arrange | positioned at the said circuit electrode side whose height is 3.0 micrometers or less. A first circuit member having a first circuit electrode formed on a main surface of the first substrate,
The adhesive film for circuit connection of Claim 1 or 2, and
A second circuit member having a second circuit electrode formed on a main surface of a second substrate;
The first circuit electrode and the second circuit are laminated, heated, and pressurized by laminating the first circuit member, the adhesive film for connecting the circuit, and the second circuit member so that the first circuit electrode and the second circuit electrode are replaced. A method of connecting the first circuit member and the second circuit member so that a circuit electrode is electrically connected,
The first insulating adhesive layer or the second having a height of at least one circuit electrode of the first circuit electrode and the second circuit electrode is 3.0 μm or less, and the thickness of the adhesive film for circuit connection is 1.0 to 4.0 μm. The first circuit member and the second circuit member are disposed so that the first circuit electrode and the second circuit electrode are electrically connected by arranging an insulating adhesive layer on the side of the circuit electrode having a height of 3.0 μm or less and heating and pressing the insulating adhesive layer. A method of connecting a circuit member to be connected. The adhesive film for circuit connection of Claim 1 whose thickness of at least one layer of a said 1st insulating adhesive bond layer and a said 2nd insulating adhesive bond layer is 2.0-4.0 micrometers. The adhesive film for circuit connection of Claim 1 whose thickness of at least one layer of a said 1st insulating adhesive bond layer and a said 2nd insulating adhesive bond layer is 2.0-3.0 micrometers. The adhesive film for circuit connection of Claim 2 whose melt viscosity in 120 degreeC of the said conductive adhesive layer is 5.0 * 10 <^2> -5.0 * 10 <^6> Pa * s. The adhesive film for circuit connection of Claim 2 whose melt viscosity in 120 degreeC of the said conductive adhesive layer is 5.0 * 10 <^3> -5.0 * 10 <^5> Pa * s. The melt viscosity at 120 degreeC of the said 1st insulating adhesive bond layer and the said 2nd insulating adhesive bond layer is 1.0 * 10 <^2> -1.0 * 10 <^6> Pa *, in any one of Claims 2, 8 and 9. s Adhesive film for circuit connection. The melt viscosity at 120 degrees C of the said 1st insulating adhesive bond layer and the said 2nd insulating adhesive bond layer is 1.0 * 10 <^3> -1.0 * 10 <^5> Pa. s Adhesive film for circuit connection.

Images