JP2002204052A - Circuit connecting material and method for connecting circuit terminal using the same as well as connecting structure - Google Patents
Circuit connecting material and method for connecting circuit terminal using the same as well as connecting structureInfo
- Publication number
- JP2002204052A JP2002204052A JP2000399826A JP2000399826A JP2002204052A JP 2002204052 A JP2002204052 A JP 2002204052A JP 2000399826 A JP2000399826 A JP 2000399826A JP 2000399826 A JP2000399826 A JP 2000399826A JP 2002204052 A JP2002204052 A JP 2002204052A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- connection
- terminal
- terminals
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、接着剤組成物と導
電性粒子を用いた回路接続材料及び回路端子の製造方
法、接続構造に関する。The present invention relates to a circuit connecting material using an adhesive composition and conductive particles, a method for manufacturing a circuit terminal, and a connecting structure.
【０００２】[0002]
【従来の技術】エポキシ樹脂系接着剤は、高い接着強さ
が得られ、耐水性や耐熱性に優れること等から、電気・
電子、建築、自動車、航空機等の各種用途に多用されて
いる。中でも一液型エポキシ樹脂系接着剤は、主剤と硬
化剤との混合が不必要であり使用が簡便なことから、フ
ィルム状、ペースト状、粉体状の形態で使用されてい
る。この場合、エポキシ樹脂と硬化剤及び変性剤との多
様な組み合わせにより、特定の性能を得ることが一般的
である（例えば、特開昭６２−１４１０８３号公報）。2. Description of the Related Art Epoxy resin adhesives have high adhesive strength and are excellent in water resistance and heat resistance.
It is frequently used in various applications such as electronics, architecture, automobiles, and aircraft. Among them, one-pack type epoxy resin-based adhesives are used in the form of a film, paste, or powder because they do not require mixing of a main agent and a curing agent and are easy to use. In this case, it is general to obtain a specific performance by various combinations of an epoxy resin, a curing agent and a modifying agent (for example, JP-A-62-141083).
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記回
路接続部材は接続する回路を構成する材料の種類により
接着強度が異なるという問題があった。特に、回路端子
を支持する基板がポリイミド樹脂等の有機絶縁物質やガ
ラスの場合、または回路部材表面が窒化シリコン、シリ
コーン樹脂、ポリイミド樹脂でコーティング、もしくは
これらの樹脂が回路部材表面に付着していた場合、著し
く接着強度が低下する問題があった。本発明の目的は、
回路端子を支持する基板が有機絶縁物質、ガラスから選
ばれる少なくとも一種からなる回路部材及び表面が窒化
シリコン、シリコーン樹脂、ポリイミド樹脂から選ばれ
る少なくとも一種でコーティングもしくは付着した回路
部材に対して特に良好な接着強度が得られる電気・電子
用の回路接続材料及びそれを用いた回路端子の接続方
法、接続構造を提供することにある。However, there has been a problem that the above-mentioned circuit connecting members have different adhesive strengths depending on the kind of material constituting the circuit to be connected. In particular, when the substrate supporting the circuit terminals is made of an organic insulating material such as polyimide resin or glass, or the circuit member surface is coated with silicon nitride, silicone resin, or polyimide resin, or these resins adhere to the circuit member surface. In this case, there was a problem that the adhesive strength was significantly reduced. The purpose of the present invention is
A circuit member supporting a circuit terminal is made of an organic insulating material, a circuit member made of at least one kind selected from glass, and a circuit member whose surface is coated or adhered with at least one kind selected from silicon nitride, silicone resin, and polyimide resin. An object of the present invention is to provide an electric / electronic circuit connection material capable of obtaining an adhesive strength, a method for connecting circuit terminals using the same, and a connection structure.
【０００４】[0004]
【課題を解決するための手段】本発明は、［１］相対向
する接続端子間に介在され、相対向する接続端子を加圧
し加圧方向の接続端子間を電気的に接続する接続材料で
あって、（１）ジシアノジアミド、（２）エポキシ樹
脂、（３）潜在性硬化剤を必須成分とし、さらに、
（４）フィルム形成材を含有することを特徴とする回路
接続材料である。［２］（１）、（２）、（３）、
（４）の成分とさらに（５）導電性粒子を必須成分とす
る上記〔１〕に記載の回路接続材料である。〔３〕
（６）アクリルゴムを含有することを特徴とする上記
〔１〕または上記〔２〕に記載の回路接続材料である。
〔４〕（２）エポキシ樹脂が、ビスフェノールＡ型エポ
キシ樹脂を含む上記〔１〕ないし上記〔３〕のいずれか
に記載の回路接続材料である。〔５〕イソシアネート基
を含有するシランカップリング剤を０．１〜１０重量部
含有することを特徴とする上記〔１〕ないし上記〔４〕
のいずれかに記載の回路接続材料である。また、本発明
は、〔６〕第一の接続端子を有する第一の回路部材と、
第二の接続端子を有する第二の回路部材とを、第一の接
続端子と第二の接続端子を対向して配置し、対向配置し
た第一の接続端子と第二の接続端子の間に上記〔１〕な
いし上記〔５〕のいずれかに記載の回路接続材料を介在
させ、加熱加圧して前記対向配置した第一の接続端子と
第二の接続端子を電気的に接続させる回路端子の接続方
法である。 〔７〕少なくとも一方の接続端子を支持する基板が有機
絶縁物質、ガラスから選ばれる少なくとも一種で構成さ
れる上記〔６〕に記載の回路端子の接続方法である。 〔８〕少なくとも一方の回路部材表面が窒化シリコン、
シリコーン化合物、ポリイミド樹脂から選ばれる少なく
とも一種でコーティングもしくは付着している上記
〔６〕または上記〔７〕に記載の回路端子の接続方法で
ある。さらに、本発明は、According to the present invention, there is provided [1] a connection material which is interposed between opposed connection terminals and presses the opposed connection terminals to electrically connect the connection terminals in the pressure direction. In addition, (1) dicyanodiamide, (2) an epoxy resin, and (3) a latent curing agent are essential components.
(4) A circuit connecting material characterized by containing a film forming material. [2] (1), (2), (3),
The circuit connecting material according to the above [1], wherein the component (4) and (5) conductive particles are essential components. [3]
(6) The circuit connection material according to the above [1] or [2], which contains an acrylic rubber.
[4] (2) The circuit connecting material according to any one of [1] to [3] above, wherein the epoxy resin contains a bisphenol A type epoxy resin. [5] The above-mentioned [1] to [4], which contains 0.1 to 10 parts by weight of a silane coupling agent containing an isocyanate group.
The circuit connection material according to any one of the above. Further, the present invention provides [6] a first circuit member having a first connection terminal,
A second circuit member having a second connection terminal, the first connection terminal and the second connection terminal are arranged facing each other, between the first connection terminal and the second connection terminal arranged facing each other. The circuit connection material according to any one of the above [1] to [5], wherein the first and second connection terminals are electrically connected by heating and pressing. The connection method. [7] The method for connecting circuit terminals according to [6], wherein the substrate supporting at least one connection terminal is made of at least one selected from an organic insulating material and glass. [8] at least one circuit member surface is silicon nitride,
The method of connecting a circuit terminal according to the above [6] or [7], wherein the circuit terminal is coated or adhered with at least one selected from a silicone compound and a polyimide resin. Further, the present invention provides
〔９〕上記〔６〕ないし上記
〔８〕のいずれかに記載の回路端子の接続方法で得られ
る回路端子の接続構造である。本発明の回路端子の接続
方法は、対向配置した第一の接続端子と第二の接続端子
の少なくとも一方の接続端子の表面が金、銀、白金族の
金属から選ばれる少なくとも一種で構成されると好まし
い。[9] A circuit terminal connection structure obtained by the circuit terminal connection method according to any one of [6] to [8]. In the method for connecting circuit terminals of the present invention, the surface of at least one of the first connection terminal and the second connection terminal that are opposed to each other is made of at least one selected from gold, silver, and platinum group metals. Is preferred.
【０００５】[0005]
【発明の実施の形態】本発明で使用する（２）エポキシ
樹脂としては、エピクロルヒドリンとビスフェノールＡ
やＦ、ＡＤ等から誘導されるビスフェノール型エポキシ
樹脂、エピクロルヒドリンとフェノールノボラックやク
レゾールノボラックから誘導されるエポキシノボラック
樹脂やナフタレン環を含んだ骨格を有するナフタレン系
エポキシ樹脂、グリシジルアミン、グリシジルエーテ
ル、ビフェニル、脂環式等の1分子内に２個以上のグリ
シジル基を有する各種のエポキシ化合物等を単独にある
いは２種以上を混合して用いることが可能である。これ
らのエポキシ樹脂は、不純物イオン（Ｎａ+、ＣＩ-等）
や、加水分解性塩素等を３００ｐｐｍ以下に低減した高
純度品を用いることがエレクトロンマイグレーション防
止のために好ましい。BEST MODE FOR CARRYING OUT THE INVENTION As the epoxy resin (2) used in the present invention, epichlorohydrin and bisphenol A
, F, bisphenol type epoxy resin derived from AD, epichlorohydrin and epoxy novolak resin derived from phenol novolak or cresol novolak or naphthalene-based epoxy resin having a skeleton containing a naphthalene ring, glycidylamine, glycidyl ether, biphenyl, Various epoxy compounds having two or more glycidyl groups in one molecule such as alicyclic compounds can be used alone or in combination of two or more. These epoxy resins have impurity ions (Na + , CI - etc.)
It is preferable to use a high-purity product in which hydrolyzable chlorine or the like is reduced to 300 ppm or less in order to prevent electron migration.
【０００６】本発明で使用する（３）潜在性硬化剤とし
ては、イミダゾール系、ヒドラジド系、三フッ化ホウ素
−アミン錯体、スルホニウム塩、アミンイミド、ポリア
ミンの塩、ジシアンジアミド等が挙げられる。これら
は、単独または混合して使用することができ、分解促進
剤、抑制剤等を混合して用いてもよい。また、これらの
硬化剤をポリウレタン系、ポリエステル系の高分子物質
等で被覆してマイクロカプセル化したものは、可使時間
が延長されるために好ましい。Examples of the latent curing agent (3) used in the present invention include imidazoles, hydrazides, boron trifluoride-amine complexes, sulfonium salts, amine imides, salts of polyamines and dicyandiamide. These may be used alone or as a mixture, and may be used in combination with a decomposition accelerator, an inhibitor and the like. A microcapsule obtained by coating these curing agents with a polyurethane-based or polyester-based polymer substance or the like is preferable because the pot life is extended.
【０００７】本発明で使用する（４）フィルム形成材と
しては、フェノキシ樹脂、ポリビニルホルマール樹脂、
ポリスチレン樹脂、ポリビニルブチラール樹脂、ポリエ
ステル樹脂、ポリアミド樹脂、キシレン樹脂、ポリウレ
タン樹脂、ポリイミド樹脂等が挙げられる。フィルム形
成材とは、液状物を固形化し、構成組成物をフィルム形
状とした場合に、そのフィルムの取扱いが容易で、容易
に裂けたり、割れたり、べたついたりしない機械特性等
を付与するものであり、通常の状態でフィルムとしての
取扱いができるものである。また、フィルム形成材がエ
ポキシ基を含有する場合、接着性、耐湿性が向上するた
め好ましい。フィルム形成材の中でも接着性、相溶性、
耐熱性、機械強度に優れることからフェノキシ樹脂が好
ましい。The (4) film-forming material used in the present invention includes phenoxy resin, polyvinyl formal resin,
Examples include polystyrene resin, polyvinyl butyral resin, polyester resin, polyamide resin, xylene resin, polyurethane resin, and polyimide resin. A film-forming material is a material that solidifies a liquid material and, when the constituent composition is formed into a film shape, provides easy mechanical handling of the film, and easily imparts mechanical properties that do not tear, break, or stick. Yes, it can be handled as a film under normal conditions. Further, it is preferable that the film-forming material contains an epoxy group because the adhesiveness and the moisture resistance are improved. Adhesion, compatibility,
Phenoxy resins are preferred because of their excellent heat resistance and mechanical strength.
【０００８】フェノキシ樹脂は2官能フェノール類とエ
ピハロヒドリンを高分子量まで反応させるか、又は２官
能エポキシ樹脂と２官能フェノール類を重付加させるこ
とにより得られる樹脂である。具体的には、２官能フェ
ノール類１モルとエピハロヒドリン０．９８５〜１．０
１５とをアルカリ金属水酸化物の存在下において非反応
性溶媒中で４０〜１２０℃の温度で反応させることによ
り得ることができる。また、樹脂の機械的特性や熱的特
性の点からは、特に２官能性エポキシ樹脂と２官能性フ
ェノール類の配合当量比をエポキシ基／フェノール水酸
基＝１／０．９〜１／１．１としアルカリ金属化合物、
有機リン系化合物、環状アミン系化合物等の触媒の存在
下で沸点が１２０℃以上のアミド系、エーテル系、ケト
ン系、ラクトン系、アルコール系等の有機溶剤中で反応
固形分が５０重量部以下で５０〜２００℃に加熱して重
付加反応させて得たものが好ましい。２官能エポキシ樹
脂としては、ビスフェノールＡ型エポキシ樹脂、ビスフ
ェノールＦ型エポキシ樹脂、ビスフェノールＡＤ型エポ
キシ樹脂、ビスフェノールＳ型エポキシ樹脂などが挙げ
られる。２官能フェノール類は２個のフェノール性水酸
基を持つもので、例えば、ハイドロキノン類、ビスフェ
ノールＡ、ビスフェノールＦ、ビスフェノールＡＤ、ビ
スフェノールＳ等のビスフェノール類などが挙げられ
る。フェノキシ樹脂はラジカル重合性の官能基により変
性されていてもよい。フェノキシ樹脂は、単独で用いて
も、２種類以上を混合して用いてもよい。The phenoxy resin is a resin obtained by reacting a bifunctional phenol and epihalohydrin to a high molecular weight or by polyaddition of a bifunctional epoxy resin and a bifunctional phenol. Specifically, 1 mol of bifunctional phenol and epihalohydrin 0.985 to 1.0
15 in the presence of an alkali metal hydroxide in a non-reactive solvent at a temperature of 40 to 120 ° C. In addition, from the viewpoint of the mechanical and thermal properties of the resin, in particular, the blending equivalent ratio of the bifunctional epoxy resin and the bifunctional phenol is adjusted so that epoxy group / phenol hydroxyl group = 1 / 0.9 to 1 / 1.1. And alkali metal compounds,
The reaction solid content is 50 parts by weight or less in an amide-based, ether-based, ketone-based, lactone-based, or alcohol-based organic solvent having a boiling point of 120 ° C. or more in the presence of a catalyst such as an organic phosphorus compound or a cyclic amine compound. What is obtained by heating at 50-200 degreeC and performing a polyaddition reaction is preferable. Examples of the bifunctional epoxy resin include a bisphenol A epoxy resin, a bisphenol F epoxy resin, a bisphenol AD epoxy resin, and a bisphenol S epoxy resin. Bifunctional phenols have two phenolic hydroxyl groups and include, for example, hydroquinones, bisphenols such as bisphenol A, bisphenol F, bisphenol AD, and bisphenol S. The phenoxy resin may be modified with a radically polymerizable functional group. The phenoxy resins may be used alone or as a mixture of two or more.
【０００９】ポリイミド樹脂としては、例えばテトラカ
ルボン酸二無水物とシロキサン骨格を有するジアミンの
付加反応により合成したポリアミック酸を加熱縮合させ
イミド化したものであり溶解性、フィルム形成性の点か
ら、重量平均分子量は１００００〜１５００００程度が
好ましい。また、酸二無水物とジアミンのどちらか一方
または両方がシロキサン骨格を有している場合、溶解性
が向上し、かつ柔軟性が向上するため、接着強度が向上
するため好ましい。この時、酸二無水物とジアミンは溶
剤への溶解性やエポキシ樹脂との相溶性の点から適宜選
択され、多成分を混合して用いることもできる。As the polyimide resin, for example, a polyamic acid synthesized by an addition reaction of a tetracarboxylic dianhydride and a diamine having a siloxane skeleton is heat-condensed and imidized to obtain a polyimide resin. The average molecular weight is preferably about 10,000 to 150,000. In addition, when one or both of the acid dianhydride and the diamine have a siloxane skeleton, the solubility is improved and the flexibility is improved, so that the adhesive strength is preferably improved. At this time, the acid dianhydride and the diamine are appropriately selected from the viewpoint of solubility in a solvent and compatibility with the epoxy resin, and a mixture of multiple components can be used.
【００１０】本発明の回路接続材料には、アクリル酸、
アクリル酸エステル、メタクリル酸エステルまたはアク
リロニトリルのうち少なくとも一つをモノマー成分とし
た重合体又は共重合体を使用することができ、グリシジ
ルエーテル基を含有するグリシジルアクリレートやグリ
シジルメタクリレートを含む共重合体系アクリルゴムを
併用した場合、応力緩和に優れるので好ましい。これら
（６）アクリルゴムの分子量（重量平均）は接着剤の凝
集力を高める点から２０万以上が好ましい。The circuit connection material of the present invention includes acrylic acid,
A copolymer or a copolymer containing at least one of acrylic acid ester, methacrylic acid ester and acrylonitrile as a monomer component can be used, and a copolymer acrylic rubber containing glycidyl acrylate or glycidyl methacrylate containing a glycidyl ether group can be used. The use of a combination of these is preferred because of excellent stress relaxation. The molecular weight (weight average) of these (6) acrylic rubbers is preferably 200,000 or more from the viewpoint of increasing the cohesive strength of the adhesive.
【００１１】本発明の回路接続材料には、さらに、充填
剤、軟化剤、促進剤、老化防止剤、難燃化剤、チキソト
ロピック剤、カップリング剤及びフェノール樹脂やメラ
ミン樹脂、イソシアネート類等を含有することもでき
る。The circuit connecting material of the present invention further contains a filler, a softener, an accelerator, an antioxidant, a flame retardant, a thixotropic agent, a coupling agent, a phenol resin, a melamine resin, and an isocyanate. It can also be contained.
【００１２】充填剤を含有した場合、接続信頼性等の向
上が得られるので好ましい。充填剤の最大径が導電性粒
子の粒径未満であれば使用でき、５〜６０体積部（接着
剤樹脂成分１００体積部に対して）の範囲が好ましい。
６０体積部を超えると信頼性向上の効果が飽和すること
があり、５体積部未満では添加の効果が少ない。It is preferable to include a filler, since the connection reliability and the like can be improved. It can be used as long as the maximum diameter of the filler is smaller than the particle diameter of the conductive particles, and is preferably in the range of 5 to 60 parts by volume (based on 100 parts by volume of the adhesive resin component).
If it exceeds 60 parts by volume, the effect of improving reliability may be saturated, and if it is less than 5 parts by volume, the effect of addition is small.
【００１３】 カップリング剤としてはイソシアネート
基を含有するシランカップリング剤が好ましく、０．１
〜１０重量部配合することが好ましい。０．１重量部未
満では、配合効果に乏しく、１０重量部を超えると配合
効果が飽和し、他の特性に悪影響するようになる。イソ
シアネート基を含有するシランカップリング剤以外に、
ケチミン、ビニル基、アクリル基、アミノ基及びエポキ
シ基含有物が、接着性の向上の点から好ましい。具体的
には、アミノ基を有するシランカップリング剤として、
N−β（アミノエチル）γ−アミノプロピルトリメトキ
シシラン、N−β（アミノエチル）γ−アミノプロピル
メチルジメトキシシラン、γ−アミノプロピルトリエト
キシシラン、N−フェニル−γ−アミノプロピルトリメ
トキシシラン等が挙げられる。ケチミンを有するシラン
カップリング剤として、上記のアミノ基を有するシラン
カップリング剤に、アセトン、メチルエチルケトン、メ
チルイソブチルケトン等のケトン化合物を反応させて得
られたものが挙げられる。As the coupling agent, a silane coupling agent containing an isocyanate group is preferable.
It is preferable to mix 10 to 10 parts by weight. If it is less than 0.1 part by weight, the compounding effect is poor, and if it exceeds 10 parts by weight, the compounding effect is saturated and other characteristics are adversely affected. In addition to silane coupling agents containing isocyanate groups,
Ketimine, a vinyl group, an acryl group, an amino group and an epoxy group-containing material are preferred from the viewpoint of improving the adhesiveness. Specifically, as a silane coupling agent having an amino group,
N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, etc. Is mentioned. Examples of the silane coupling agent having a ketimine include those obtained by reacting a silane coupling agent having an amino group with a ketone compound such as acetone, methyl ethyl ketone, and methyl isobutyl ketone.
【００１４】本発明において、回路接続材料中の（１）
ジシアノジアミド、（２）エポキシ樹脂、（３）潜在性
硬化剤、（４）フィルム形成材、（６）アクリルゴムに
ついて、（１）ジシアノジアミドが０．１〜２０重量
部、（２）エポキシ樹脂が、３０〜６０重量部、（３）
潜在性硬化剤が、１〜３０重量部（４）フィルム形成材
０〜４０重量部、（５）アクリルゴムが５〜４０重量部
を配合するのが好ましく、そのなかで適宜決定される。
また、（２）エポキシ樹脂として、ビスフェノールＡ型
エポキシ樹脂は、上記（２）エポキシ樹脂のうち５〜６
０％用いることで、接着強度向上に効果がある。 （１）ジシアノジアミドの配合量が０．１重量部未満で
は、接着強度向上の効果がない。また、２０重量部を超
えると、可使時間が低下する恐れがある。 （２）エポキシ樹脂の配合量は、３０重量部未満では、
硬化後の回路接続材料の機械的強度が低下する傾向にあ
り、６０重量部を超えると硬化前の回路接続材料のタッ
ク性が増し、取扱性に劣るようになる。 （３）潜在性硬化剤の配合量が、1重量部未満では、十
分な反応率を得ることができず良好な接着強度や小さな
接続抵抗が得られにくくなる傾向にある。配合量が３０
重量部を超えると、回路接続材料の流動性が低下した
り、接続抵抗が上昇したり、回路接続材料の可使時間が
短くなる傾向にある。また、（４）フィルム形成材の配
合量が、４０重量部を超えると回路接続材料の流動性が
低下したり、接続抵抗が上昇したりする傾向にある。好
ましくは、１〜40重量部である。 （６）アクリルゴムの配合量は５重量部未満の場合、接
着強度の向上に効果が無く、４０重量部を超えると回路
接続材料の流動性が低下したり、接続抵抗が上昇したり
する傾向にある。さらに本発明の回路接続材料には、充
填材、軟化剤、促進剤、老化防止剤、着色剤、難燃化
剤、チキソトロピック剤、カップリング剤等を含有する
こともできる。In the present invention, (1) in the circuit connection material
Dicyanodiamide, (2) epoxy resin, (3) latent curing agent, (4) film-forming material, (6) acrylic rubber, (1) 0.1 to 20 parts by weight of dicyanodiamide, (2) epoxy resin But 30 to 60 parts by weight, (3)
It is preferable that 1 to 30 parts by weight of the latent curing agent (4) 0 to 40 parts by weight of the film-forming material and (5) 5 to 40 parts by weight of the acrylic rubber are blended.
Further, as the epoxy resin (2), bisphenol A type epoxy resin is 5 to 6 of the epoxy resin (2).
Use of 0% is effective in improving the adhesive strength. (1) If the amount of dicyanodiamide is less than 0.1 part by weight, there is no effect of improving the adhesive strength. On the other hand, if the amount exceeds 20 parts by weight, the pot life may be reduced. (2) If the compounding amount of the epoxy resin is less than 30 parts by weight,
The mechanical strength of the circuit connection material after curing tends to decrease, and if it exceeds 60 parts by weight, the tackiness of the circuit connection material before curing increases, resulting in poor handling. (3) If the amount of the latent curing agent is less than 1 part by weight, a sufficient reaction rate cannot be obtained, and good adhesive strength and small connection resistance tend to be hardly obtained. The blending amount is 30
When the amount exceeds the weight part, the fluidity of the circuit connecting material tends to decrease, the connection resistance increases, and the usable time of the circuit connecting material tends to be short. If (4) the amount of the film-forming material exceeds 40 parts by weight, the fluidity of the circuit connecting material tends to decrease and the connection resistance tends to increase. Preferably, it is 1 to 40 parts by weight. (6) When the compounding amount of the acrylic rubber is less than 5 parts by weight, there is no effect in improving the adhesive strength, and when it exceeds 40 parts by weight, the fluidity of the circuit connecting material tends to decrease or the connection resistance tends to increase. It is in. Further, the circuit connecting material of the present invention may contain a filler, a softener, an accelerator, an antioxidant, a coloring agent, a flame retardant, a thixotropic agent, a coupling agent, and the like.
【００１５】本発明の回路接続材料は導電性粒子がなく
ても、接続時に相対向する接続端子の直接接触により接
続が得られるが、導電性粒子を含有した場合、より安定
した接続が得られる。導電性粒子としては、Ａｕ、Ａ
ｇ、Ｎｉ、Ｃｕ、はんだ等の金属粒子やカーボン等があ
る。また、Ｎｉなどの遷移金属類の表面をＡｕ等の貴金
属類で被覆したものでもよい。また、非導電性のガラ
ス、セラミック、プラスチック等に前記した導通層を被
覆等により形成し最外層に貴金属類を被覆したものでも
よい。プラスチックを核として金属を被覆した場合や熱
溶融金属粒子の場合、加熱加圧により変形性を有するの
で接続時に接続端子との接触面積が増加したり、厚みの
ばらつきを吸収し信頼性が向上するので好ましい。貴金
族類の被覆層の厚みは良好な抵抗を得るためには、１０
０Å以上が好ましい。導電性粒子は、接着剤成分１００
体積に対して０．１〜３０体積％の範囲で用途により使
い分ける。過剰な導電性粒子による隣接回路の短絡等を
防止するためには０．１〜１０体積％とするのがより好
ましい。また、本構成の回路接続材料を2層以上に分割
し、潜在性硬化剤を含有する層と導電性粒子を含有する
層に分離した場合、従来の高精細化可能の効果に加え
て、ポットライフの向上が得られる。Although the circuit connecting material of the present invention can be connected by direct contact of the connection terminals facing each other at the time of connection even without conductive particles, more stable connection can be obtained when the conductive particles are contained. . Au, A as the conductive particles
g, Ni, Cu, metal particles such as solder and carbon. Further, the surface of a transition metal such as Ni may be coated with a noble metal such as Au. Further, the conductive layer described above may be formed on a non-conductive glass, ceramic, plastic, or the like by coating or the like, and the outermost layer may be coated with a noble metal. When plastic is used as a core and metal is coated or hot-melted metal particles are deformable by heating and pressing, the contact area with the connection terminal increases at the time of connection, and variations in thickness are absorbed and reliability is improved. It is preferred. In order to obtain good resistance, the thickness of the coating layer
0 ° or more is preferred. The conductive particles are composed of the adhesive component 100
Depending on the application, it is used properly in the range of 0.1 to 30% by volume based on the volume. In order to prevent a short circuit or the like in an adjacent circuit due to excessive conductive particles, the content is more preferably 0.1 to 10% by volume. In addition, when the circuit connection material of this configuration is divided into two or more layers and separated into a layer containing a latent curing agent and a layer containing conductive particles, in addition to the conventional effect of enabling high definition, a pot is added. Life is improved.
【００１６】本発明の回路接続材料は、ＩＣチップとチ
ップ搭載基板との接着や電気回路相互の接着用のフィル
ム状接着剤としても有用である。すなわち、第一の接続
端子を有する第一の回路部材と、第二の接続端子を有す
る第二の回路部材とを、第一の接続端子と第二の接続端
子とを対向して配置し、前記対向配置した第一の接続端
子と第二の接続端子との間に本発明の回路接続材料（フ
ィルム状接着剤）を介在させ、加熱加圧して前記対向配
置した第一の接続端子と第二の接続端子を電気的に接続
させることができる。このような接続部材としては、半
導体チップ、低抗体チップ、コンデンサチップ等のチッ
プ部品、チップ搭載及び／またはレジスト処理が施され
たプリント基板、ＴＡＢテープにチップ搭載及びレジス
ト処理を施したＴＣＰ（テープキャリアパッケージ）、
液晶パネルなどが挙げられる。接続部材の材質は、半導
体チップ類のシリコーンやガリウム・ヒ素等や、ガラ
ス、セラミックス、ポリイミド樹脂、ガラス・エポキシ
樹脂複合体、プラスチック等がある。The circuit connecting material of the present invention is also useful as a film adhesive for bonding an IC chip to a chip mounting substrate and bonding electric circuits to each other. That is, a first circuit member having a first connection terminal, and a second circuit member having a second connection terminal, the first connection terminal and the second connection terminal are arranged facing each other, The circuit connection material (film adhesive) of the present invention is interposed between the first connection terminal and the second connection terminal disposed opposite to each other, and heated and pressurized, and the first connection terminal and the second connection terminal disposed opposite each other. The two connection terminals can be electrically connected. Examples of such connecting members include chip components such as a semiconductor chip, a low antibody chip, and a capacitor chip, a printed circuit board on which chip mounting and / or resist processing has been performed, and a TCP (tape) on which chip mounting and resist processing have been performed on a TAB tape. Carrier package),
And a liquid crystal panel. Examples of the material of the connection member include silicone, gallium, and arsenic of semiconductor chips, glass, ceramics, polyimide resin, glass-epoxy resin composite, and plastic.
【００１７】本発明の回路接続材料は、接続時に接着剤
が溶融流動し相対向する接続端子の接続を得た後、硬化
して接続を保持するものであり、接着剤の流動性は重要
な因子である。厚み０．７ｍｍ、１５ｍｍ×１５ｍｍの
ガラスを用いて、厚み３５μｍ、５ｍｍ×５ｍｍの回路
接続材料をこのガラスに挟み、２００℃、２ＭＰａ、１
０秒で加熱加圧を行った場合、初期の面積（Ａ）と加熱
加圧後の面積（Ｂ）を用いて表わされる流動性（Ｂ）／
〈Ａ〉の値は１．３〜３．０であることが好ましく、
１．５〜２．５であることがより好ましい。１．３未満
では流動性が悪く、良好な接続が得られず、３．０を超
える場合は、気泡が発生しやすく信頼性に劣る。本発明
の回路接続材料は、示差走査熱量計（ＤＳＣ）を用いて
昇温速度１０℃／分の測定において、発熱反応の立ち上
がり温度（Ｔａ）が９０〜１３０℃の範囲内で、ピーク
温度（Ｔｐ）がＴａ＋５〜３０℃であり、かつ終了温度
（Ｔｅ）が１８０℃以下であることが好ましい。このよ
うにすることにより、低温接続性、室温での保存安定性
を両立することができる。本発明の回路接続材料は、硬
化後の２５℃での貯蔵弾性率１００〜２５００ＭＰａが
好ましく、３００〜２０００ＭＰａがより好ましい。こ
の場合、接続後の樹脂の内部応力を低減し、接着力の向
上に有利であり、かつ、良好な導通特性が得られる。In the circuit connection material of the present invention, the adhesive melts and flows at the time of connection, and after the connection of the connection terminals facing each other is obtained, the adhesive is hardened to maintain the connection, and the fluidity of the adhesive is important. Is a factor. Using a glass having a thickness of 0.7 mm and a size of 15 mm × 15 mm, a circuit connecting material having a thickness of 35 μm and a size of 5 mm × 5 mm is sandwiched between the glasses, and is heated at 200 ° C.
When the heating and pressurizing is performed in 0 seconds, the fluidity (B) expressed by using the initial area (A) and the area after the heating and pressurizing (B) /
The value of <A> is preferably 1.3 to 3.0,
More preferably, it is 1.5 to 2.5. If it is less than 1.3, the fluidity is poor, and good connection cannot be obtained. If it is more than 3.0, bubbles are easily generated and the reliability is poor. The circuit connection material of the present invention has a peak temperature (Ta) within a range of 90 to 130 ° C. in a temperature rise rate of 10 ° C./min using a differential scanning calorimeter (DSC). Tp) is preferably Ta + 5 to 30 ° C., and the end temperature (Te) is preferably 180 ° C. or less. By doing so, both low-temperature connectivity and storage stability at room temperature can be compatible. The circuit connecting material of the present invention preferably has a storage elastic modulus at 25 ° C. after curing of 100 to 2500 MPa, more preferably 300 to 2000 MPa. In this case, the internal stress of the resin after the connection is reduced, which is advantageous for improving the adhesive strength, and good conduction characteristics can be obtained.
【００１８】本発明の回路端子の接続方法は、第一の接
続端子を有する第一の回路部材と、第二の接続端子を有
する第二の回路部材とを、第一の接続端子と第二の接続
端子を対向して配置し、前記対向配置した第一の接続端
子と第二の接続端子の間に前記の回路接続材料を介在さ
せ、加熱加圧して前記対向配置した第一の接続端子と第
二の接続端子を電気的に接続させる。接続端子を有する
回路部材として、半導体チップのシリコン、ガリウム・
ヒ素等、ガラス、セラミックス、ガラス・熱硬化性樹脂
の複合材料、プラスチックフィルム、プラスチックシー
ト等の絶縁基板に接着剤を介して導電性の金属箔を形成
し接続端子を含めた回路を形成したもの、絶縁基板にめ
っきや蒸着で導電性の回路を形成したもの、あるいは、
めっき触媒等の材料を塗布して導電性の回路を形成した
ものを例示することができ、ＴＡＢテープ、ＦＰＣ、Ｐ
ＷＢ、ＩＴＯ、接続パッドを有する半導体チップが代表
的なものである。According to the method for connecting circuit terminals of the present invention, a first circuit member having a first connection terminal and a second circuit member having a second connection terminal are connected to the first connection terminal and the second connection member. Are arranged facing each other, the circuit connecting material is interposed between the opposed first connecting terminal and the second connecting terminal, and heated and pressurized to form the opposed first connecting terminal. And the second connection terminal are electrically connected. Circuit members having connection terminals include semiconductor chip silicon and gallium.
Arsenic, glass, ceramics, composite material of glass and thermosetting resin, plastic film, plastic sheet, etc., formed a conductive metal foil via an adhesive on an insulating substrate to form a circuit including connection terminals A conductive circuit formed by plating or vapor deposition on an insulating substrate, or
Examples of a conductive circuit formed by applying a material such as a plating catalyst can be used. TAB tape, FPC, PPC
A typical example is a semiconductor chip having WB, ITO and connection pads.
【００１９】本発明の回路端子の接続方法においては、
少なくとも一方の接続端子がプラスチック上に直接存在
して構成されると好ましく、プラスチックがポリイミド
樹脂であることが好ましい。プラスチックとしては、ポ
リエチレンテレフタレート樹脂、ポリエチレンナフタレ
ート樹脂、ポリエーテルサルフォン樹脂、ポリカーボネ
ート樹脂、ポリイミド樹脂のフィルムやシートが挙げら
れ、これらを用いることにより回路板の厚みをより薄く
し、しかも軽量化することができる。本発明の回路接続
材料を使用することにより低温で接続が可能となるた
め、ガラス転移温度ないし融点が比較的低いプラスチッ
クを使用することができ、経済的に優れた回路板を得る
ことができる。薄型、軽量化には接続部材となるプラス
チックと導電材料の接続端子を接着剤で接着するよりも
接着剤を使用しない接続端子がプラスチック上に直接存
在して構成される回路部材であると好ましい。接着剤を
用いないで銅箔等の金属箔上に直接樹脂溶液を一定厚さ
に形成するダイレクトコート法により得られた金属箔付
ポリイミド樹脂が市販されており、好適に使用すること
ができる。その他に押出機等から直接フィルム形状に押
し出されたフィルムと金属箔を熱圧着したものも使用す
ることができる。In the method for connecting circuit terminals of the present invention,
It is preferable that at least one of the connection terminals is provided directly on the plastic, and the plastic is preferably a polyimide resin. Examples of the plastic include films and sheets of polyethylene terephthalate resin, polyethylene naphthalate resin, polyether sulfone resin, polycarbonate resin, and polyimide resin, and by using these, the thickness of the circuit board is made thinner and moreover, the weight is reduced. be able to. By using the circuit connection material of the present invention, connection can be made at a low temperature, so that plastic having a relatively low glass transition temperature or melting point can be used, and a circuit board excellent in economy can be obtained. In order to reduce the thickness and weight, it is preferable that the connection member be made of a connection member that does not use an adhesive, and that a connection terminal that does not use an adhesive is directly provided on the plastic, rather than bonding a connection terminal made of a conductive material with a plastic that is a connection member. A polyimide resin with a metal foil obtained by a direct coating method in which a resin solution is formed to a constant thickness directly on a metal foil such as a copper foil without using an adhesive is commercially available and can be suitably used. In addition, a material obtained by thermocompression bonding a film extruded directly from an extruder or the like into a film shape and a metal foil can also be used.
【００２０】 本発明においては、回路端子を支持する
基板が有機絶縁物質、ガラスから選ばれる少なくとも一
種からなる回路部材及び表面が窒化シリコン、シリコー
ン樹脂、シリコーン化合物、ポリイミド樹脂から選ばれ
る少なくとも一種でコーティングもしくは付着した回路
部材に対して特に良好な接着強度が得られる、電気・電
子用の回路接続材料及びそれを用いた回路端子の接続方
法の提供が可能となる。In the present invention, the substrate supporting the circuit terminals is a circuit member made of at least one selected from an organic insulating material and glass, and the surface is coated with at least one selected from silicon nitride, a silicone resin, a silicone compound, and a polyimide resin. Alternatively, it is possible to provide a circuit connecting material for electric and electronic devices and a method for connecting circuit terminals using the same, which can provide particularly good adhesive strength to the attached circuit member.
【００２１】[0021]
【実施例】以下、本発明を実施例に基づいて具体的に説
明する。 （実施例1） [フェノキシ樹脂の合成]ビスフェノールＡ型エポキシ樹
脂とビスフェノールＡからガラス転移温度が８０℃のフ
ェノキシ樹脂を常法により合成した。この樹脂５０ｇ
を、重量比でトルエン（沸点１１０．６℃）／酢酸エチ
ル（沸点７７．１℃）＝５０／５０の混合溶剤に溶解し
て、固形分４０重量％の溶液とした。 〔導電性粒子の作製〕ポリスチレンを核とする粒子の表
面に、厚み０．２μｍのニッケル層を設け、このニッケ
ル層の外側に、厚み０．０４μｍの金層を設け、平均粒
径１０μｍの導電性粒子を作製した。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on embodiments. (Example 1) [Synthesis of phenoxy resin] A phenoxy resin having a glass transition temperature of 80 ° C was synthesized from a bisphenol A type epoxy resin and bisphenol A by an ordinary method. 50 g of this resin
Was dissolved in a mixed solvent of toluene (boiling point 110.6 ° C.) / Ethyl acetate (boiling point 77.1 ° C.) = 50/50 in a weight ratio to obtain a solution having a solid content of 40% by weight. [Preparation of Conductive Particles] A nickel layer having a thickness of 0.2 μm was provided on the surface of particles having polystyrene as a core, and a gold layer having a thickness of 0.04 μm was provided outside the nickel layer. Particles were prepared.
【００２２】フィルム形成材として上記で合成したフェ
ノキシ樹脂４０重量部、エポキシ樹脂としてビスフェノ
ールＦ型エポキシ樹脂（油化シェルエポキシ株式会社
製、商品名：エピコートＹＬ−９８３ｕ）４０重量部、
潜在性硬化剤としてマイクロカプセル型潜在性硬化剤２
０重量部、ジシアノジアミド（和光純薬工業株式会社
製）５重量部となるように配合し、さらに導電性粒子を
３体積％配合分散させ、厚み８０μmの片面を表面処理
したＰＥＴ（ポリエチレンテレフテレート）フィルムに
塗工装置を用いて塗布し、７０℃、１０分の熱風乾燥に
より、接着剤層の厚みが３５μmの回路接続材料を得
た。40 parts by weight of the phenoxy resin synthesized above as a film forming material, 40 parts by weight of a bisphenol F type epoxy resin (trade name: Epicoat YL-983u, manufactured by Yuka Shell Epoxy Co., Ltd.) as an epoxy resin,
Microcapsule type latent curing agent 2 as latent curing agent
0 parts by weight and 5 parts by weight of dicyanodiamide (manufactured by Wako Pure Chemical Industries, Ltd.), and further 3% by volume of conductive particles were mixed and dispersed, and PET (polyethylene terephthalate) having a surface treated on one side with a thickness of 80 μm was used. Rate) A film was applied to the film using a coating apparatus, and dried with hot air at 70 ° C. for 10 minutes to obtain a circuit connection material having an adhesive layer thickness of 35 μm.
【００２３】〔回路の接続〕 ライン幅５０μm、ピッ
チ１００μm、厚み１８μｍの銅回路５００本をポリイ
ミドフィルム（厚み１００μｍ）上に形成したフレキシ
ブル回路板（２層ＦＰＣ）及び、ポリイミドとポリイミ
ドと銅箔を接着する接着剤及び厚み１８μｍの銅箔から
なる３層構成で、ライン幅５０μｍ、ピッチ１００μｍ
のフレキシブル回路板（３層ＦＰＣ）と厚み１．１ｍｍ
のガラス上にインジュウム−錫酸化物（ＩＴＯ）を蒸着
により形成したＩＴＯ基板（表面抵抗；＜２０Ω／□）
を上記回路接続材料を用い２００℃、３ＭＰａで１０秒
間加熱加圧して幅２ｍｍにわたり接続し回路板を得た。
このとき、回路接続材料が液状の接着剤組成物は、ＩＴ
Ｏ基板上に塗布し、フィルム状の接着剤組成物はあらか
じめＩＴＯ基板上に、接着剤組成物の接着面を貼り付け
た後、７０℃、０．５ＭＰａで5秒間加熱加圧して仮接
続し、その後、ＰＥＴフィルムを剥離してもう一方のＦ
ＰＣと接続した。[Circuit Connection] A flexible circuit board (two-layer FPC) in which 500 copper circuits having a line width of 50 μm, a pitch of 100 μm, and a thickness of 18 μm are formed on a polyimide film (thickness: 100 μm), and a polyimide, polyimide and copper foil A three-layer structure consisting of an adhesive to be bonded and a copper foil having a thickness of 18 μm, a line width of 50 μm and a pitch of 100 μm
Flexible circuit board (three-layer FPC) and thickness 1.1mm
ITO substrate formed by vapor deposition of indium-tin oxide (ITO) on glass (surface resistance; <20Ω / □)
Was heated and pressurized at 3 ° C. for 10 seconds at 200 ° C. using the above-mentioned circuit connection material, and connected over a width of 2 mm to obtain a circuit board.
At this time, the adhesive composition in which the circuit connection material is in a liquid state is
The adhesive composition in the form of a film is applied on an O substrate, and the adhesive surface of the adhesive composition is previously attached on the ITO substrate, and then temporarily connected by heating and pressing at 70 ° C. and 0.5 MPa for 5 seconds. Then, the PET film is peeled off and the other F
Connected to PC.
【００２４】（実施例２） 〔アクリルゴムの合成〕ブチルアクリレートを４０重量
部、エチルアクリレートを３０重量部、アクリロニトリ
ル３０重量部及びグリシジルメタクリレート３重量部を
共重合したアクリルゴム（分子量：８５万）１００ｇを
酢酸エチル３５０ｇに溶解し、２２重量％溶液を得た。
実施例１で合成したフェノキシ樹脂（固形分として）２
０ｇ、前記で合成したアクリルゴム（固形分として）を
２０gとした以外は、実施例1と同様にして回路接続材料
を得て、回路板を作製した。(Example 2) [Synthesis of acrylic rubber] Acrylic rubber obtained by copolymerizing 40 parts by weight of butyl acrylate, 30 parts by weight of ethyl acrylate, 30 parts by weight of acrylonitrile and 3 parts by weight of glycidyl methacrylate (molecular weight: 850,000) 100 g was dissolved in 350 g of ethyl acetate to obtain a 22% by weight solution.
Phenoxy resin synthesized in Example 1 (as solid content) 2
A circuit connecting material was obtained in the same manner as in Example 1, except that 0 g and 20 g of the acrylic rubber (as solid content) synthesized above were used, and a circuit board was produced.
【００２５】（実施例３）ビスフェノールＦ型エポキシ
樹脂３０重量部、ビスフェノールＡ型エポキシ樹脂（油
化シェルエポキシ株式会社製商品名；エピコートＹＬ−
９８０）１０重量部とした以外は実施例１と同様にして
回路接続材料を得て、回路板を作製した。Example 3 Bisphenol F type epoxy resin 30 parts by weight, bisphenol A type epoxy resin (trade name, manufactured by Yuka Shell Epoxy Co .; Epicoat YL-
980) A circuit connecting material was obtained in the same manner as in Example 1 except that the weight was changed to 10 parts by weight, and a circuit board was produced.
【００２６】（実施例４）実施例１の配合にさらにイソ
シアネート基含有シランカップリング剤（信越化学工業
株式会社製商品名；ＫＢＥ９００７）５重量部配合した
以外は実施例１と同様にして回路接続材料を得て、回路
板を作製した。Example 4 Circuit connection was performed in the same manner as in Example 1 except that 5 parts by weight of an isocyanate group-containing silane coupling agent (trade name: KBE9007, manufactured by Shin-Etsu Chemical Co., Ltd.) was further added to the composition of Example 1. After obtaining the material, a circuit board was manufactured.
【００２７】（実施例５）ＩＴＯガラスを、３５μmの
銅箔を有した積層基板をライン幅１００μm、ピッチ２
００μmに銅回路をパターニングし、レジスト処理を施
し銅箔表面に金メッキを施し作製したプリント基板（Ｐ
ＷＢ）とした他は実施例1と同様にして回路接続材料の
厚みが１５μmを用いた回路板を得た。(Example 5) A laminated substrate having a copper foil of 35 μm was made of ITO glass by using a line having a line width of 100 μm and a pitch of 2.
A printed circuit board (P) prepared by patterning a copper circuit to a thickness of 00 μm, applying a resist treatment, and applying a gold plating to the copper foil surface
A circuit board using a circuit connecting material having a thickness of 15 μm was obtained in the same manner as in Example 1 except that WB) was used.
【００２８】（比較例）フェノキシ樹脂４０重量部、ビ
スフェノールＦ型エポキシ樹脂（油化シェルエポキシ株
式会社製商品名；エピコートＹＬ−９８３ｕ）４０重量
部、潜在性硬化剤としてマイクロカプセル型潜在性硬化
剤２０重量部となるように配合し、さらに導電性粒子を
３体積％配合分散させ、厚み８０μmの片面を表面処理
したＰＥＴ（ポリエチレンテレフテレート）フィルムに
塗工装置を用いて塗布し、７０℃、１０分の熱風乾燥に
より、接着剤層の厚みが３５μmの回路接続材料を得
た。Comparative Example 40 parts by weight of a phenoxy resin, 40 parts by weight of a bisphenol F type epoxy resin (trade name, manufactured by Yuka Shell Epoxy Co., Ltd., Epicoat YL-983u), and a microcapsule-type latent curing agent as a latent curing agent 20 parts by weight, and further, 3% by volume of conductive particles were mixed and dispersed, and applied to a PET (polyethylene terephthalate) film having a thickness of 80 μm and a surface treated on one side using a coating apparatus, By hot air drying for 10 minutes, a circuit connection material having an adhesive layer thickness of 35 μm was obtained.
【００２９】上記実施例１〜５、比較例で得られた回路
接続材料及び回路板を用いて、接着力、接続抵抗、保存
性、絶縁性、回路接続材料の流動性、硬化後の弾性率、
ＤＳＣの測定を行い評価した。その結果を表1に示し
た。測定、評価方法は、下記のようにして行った。 （接着力の測定）上記で得られた回路端子の接続体（回
路板）を、９０度の方向に剥離速度５０ｍｍ／分で、剥
離し接着力を測定した。接着力は、回路板の作製初期
と、８５℃、８５％ＲＨの高温高湿槽中に５００時間保
持した後に測定した。 （接続抵抗の測定）上記の回路接続材料を用いて、ライ
ン幅１００μｍ、ピッチ２００μｍ、厚み１８μｍのＳ
ｎメッキした銅回路を１００本配置したフレキシブル回
路板（ＦＰＣ）とＩＴＯベタガラスを２００℃、３ＭＰ
ａで１０秒間加熱加圧して幅２ｍｍにわたり接続した。
この接続体の隣接回路間の抵抗値を、初期と、８５℃、
８５％ＲＨの高温高湿槽中に５００時間保持した後にマ
ルチメータで測定した。抵抗値は隣接回路間の抵抗５０
点の平均で示した。Using the circuit connection materials and circuit boards obtained in Examples 1 to 5 and Comparative Example, adhesive strength, connection resistance, preservability, insulation, fluidity of the circuit connection material, and elastic modulus after curing. ,
DSC was measured and evaluated. Table 1 shows the results. The measurement and evaluation methods were performed as follows. (Measurement of Adhesive Force) The connection body (circuit board) of the circuit terminal obtained above was peeled at a peeling speed of 50 mm / min in a direction of 90 °, and the adhesive force was measured. The adhesive strength was measured at the initial stage of the production of the circuit board and after the circuit board was kept in a high-temperature and high-humidity chamber at 85 ° C. and 85% RH for 500 hours. (Measurement of connection resistance) Using the above circuit connection material, S having a line width of 100 μm, a pitch of 200 μm, and a thickness of 18 μm was used.
Flexible circuit board (FPC) with 100 n-plated copper circuits and solid ITO glass at 200 ° C, 3MP
a and heated and pressed for 10 seconds to connect over a width of 2 mm.
The resistance value between the adjacent circuits of this connection body is initially set to 85 ° C.
After the sample was kept in an 85% RH high-temperature and high-humidity tank for 500 hours, the measurement was performed with a multimeter. The resistance value is the resistance 50 between adjacent circuits.
The average of points was shown.
【００３０】（保存性の評価）得られた回路接続材料を
３０℃の恒温槽で３０日間処理し、上記と同様にして回
路の接続を行い接続抵抗を測定し保存性を評価した。 （絶縁性の評価）得られた回路接続材料を用いて、ライ
ン幅１００μm、ピッチ２００μm、厚み１８μmの銅回
路を交互に２５０本配置した櫛形回路を有するプリント
基板とライン幅１００μm、ピッチ２００μm、厚み１８
μmの銅回路を５００本有するフレキシブル回路板（Ｆ
ＰＣ）を２００℃、３ＭＰａで１０秒間加熱加圧して幅
２ｍｍにわたり接続した。この接続体の櫛形回路に１０
０Ｖの電圧を印加し、作製初期と８５℃、８５％ＲＨの
高温高湿試験５００時間後の絶縁抵抗値を測定した。(Evaluation of Storage Property) The obtained circuit connection material was treated in a constant temperature bath at 30 ° C. for 30 days, the circuit was connected in the same manner as above, the connection resistance was measured, and the storage property was evaluated. (Evaluation of Insulation) Using the obtained circuit connection material, a printed circuit board having a comb-shaped circuit in which 250 copper circuits having a line width of 100 μm, a pitch of 200 μm, and a thickness of 18 μm were alternately arranged, a line width of 100 μm, a pitch of 200 μm, and a thickness 18
Flexible circuit board with 500 μm copper circuits (F
(PC) was heated and pressed at 200 ° C. and 3 MPa for 10 seconds and connected over a width of 2 mm. The comb-shaped circuit of this connection
A voltage of 0 V was applied, and the insulation resistance value was measured at the initial stage of the fabrication and after 500 hours of a high-temperature and high-humidity test at 85 ° C. and 85% RH.
【００３１】（回路接続材料の流動性評価）厚み３５μ
ｍ、５ｍｍ×５ｍｍの回路接続材料を用い、これを厚み
０．７ｍｍ、１５ｍｍ×１５ｍｍのガラスに挟み、２０
０℃、２ＭＰａ、１０秒で加熱加圧を行った。初期の面
積（Ａ）と加熱加圧後の面積（Ｂ）を用いて流動性
（Ｂ）／（Ａ）の値を求め流動性とした。 （硬化後の弾性率）回路接続材料を、２００℃のオイル
中に１分間浸漬して硬化させ、硬化したフィルムの貯蔵
弾性率を動的粘弾性測定装置を用いて測定し（昇温速度
５℃／分、１０Ｈｚ）、２５℃の弾性率を測定した。 （ＤＳＣの測定）得られた回路接続材料を用いて、示差
走査熱量計（ＤＳＣ、ＴＡインスツルメント社製商品名
９１０型）を用いて１０℃／分の測定において発熱反応
の立ち上がり温度（Ｔａ）、ピーク温度（Ｔｐ）、終了
温度（Ｔｅ）を求めた。(Evaluation of fluidity of circuit connection material) Thickness 35 μm
m, using a circuit connection material of 5 mm × 5 mm, sandwiching this between glass of 0.7 mm thickness and 15 mm × 15 mm,
Heating and pressurization were performed at 0 ° C., 2 MPa, and 10 seconds. The value of the fluidity (B) / (A) was determined using the initial area (A) and the area (B) after the heating and pressurization, and was defined as the fluidity. (Elastic Modulus After Curing) The circuit connecting material was immersed in oil at 200 ° C. for 1 minute to be cured, and the storage elastic modulus of the cured film was measured using a dynamic viscoelasticity measuring device (heating rate 5 ° C / min, 10 Hz) and the elastic modulus at 25 ° C. (Measurement of DSC) Using the obtained circuit connection material, the rising temperature of the exothermic reaction (Ta) was measured at 10 ° C./min using a differential scanning calorimeter (DSC, trade name 910, manufactured by TA Instruments). ), Peak temperature (Tp) and end temperature (Te) were determined.
【００３２】[0032]
【表１】 [Table 1]
【００３３】 いずれの実施例においても２層ＦＰＣの
接着力の初期値は７００〜１０００Ｎ／ｍ程度で、耐湿
試験後においても４００〜７００Ｎ／ｍ程度と接着強度
の著しい低下が無く良好な接着性を示した。比較例はジ
シアノジアミドを用いていないため接着強度に３００Ｎ
／ｍ程度と接着力が低かった。いずれの実施例において
も３層ＦＰＣの接着力の初期値は１０００〜１４００Ｎ
／ｍ程度で、耐湿試験後においても７００〜１０００Ｎ
／ｍ程度と接着強度の著しい低下が無く良好な接着性を
示した。比較例はジシアノジアミドを用いていないため
接着強度に８００Ｎ／ｍ程度と接着力が低かった。接続
抵抗では、実施例１で得られた回路接続材料は2層ＦＰ
Ｃ、３層ＦＰＣのいずれにおいても初期の接続抵抗も低
く、高温高湿試験後の抵抗の上昇もわずかであり、良好
な接続信頼性を示した。また、実施例２、３、４、５、
比較例の回路接続材料も同様に良好な接続信頼性が得ら
れた。保存性は、実施例１〜5において、３０℃の恒温槽
で３０日間処理しない状態（初期）と同等の接続結果が
得られた。絶縁抵抗は、実施例１〜５において、１．０
×１０9Ω以上の良好な絶縁性が得られ絶縁性の低下は
観察されなかった。流動性の測定結果、実施例１は２．
４であり、実施例２についても１．８であった。実施例
１の回路用接続材料の硬化後の２５℃での弾性率を測定
したところ１７００ＭＰａであった。実施例1の立ち上
がり温度は９８℃、ピーク温度は１１８℃、終了温度は
１５３℃であった。実施例２の立ち上がり温度は１０２
℃、ピーク温度は１２１℃、終了温度は１６３℃であっ
た。これより、より低温で硬化することが示され、ま
た、保存性の評価結果より保存性にも優れている。In each of the examples, the initial value of the adhesive strength of the two-layer FPC is about 700 to 1000 N / m, and even after the moisture resistance test, it is about 400 to 700 N / m. showed that. The comparative example does not use dicyanodiamide, so that the adhesive strength is 300N.
/ M and the adhesive strength was low. In any of the examples, the initial value of the adhesive force of the three-layer FPC is 1000 to 1400 N
/ M, 700-1000N even after the moisture resistance test
/ M and good adhesiveness without significant decrease in adhesive strength. Since the comparative example did not use dicyanodiamide, the adhesive strength was as low as about 800 N / m. As for the connection resistance, the circuit connection material obtained in Example 1 was a two-layer FP
C, the initial connection resistance was low in all of the three-layer FPCs, and the increase in resistance after the high-temperature and high-humidity test was slight, indicating good connection reliability. Examples 2, 3, 4, 5,
The circuit connection material of the comparative example also had good connection reliability. As for the storage stability, in Examples 1 to 5, a connection result equivalent to a state where no treatment was performed in a constant temperature bath at 30 ° C. for 30 days (initial) was obtained. The insulation resistance was 1.0 in Examples 1 to 5.
Good insulation of × 10 9 Ω or more was obtained, and no decrease in insulation was observed. As a result of the measurement of the fluidity, Example 1 shows 2.
4 and 1.8 for Example 2. When the elastic modulus at 25 ° C. after curing of the circuit connecting material of Example 1 was measured, it was 1700 MPa. The rise temperature of Example 1 was 98 ° C., the peak temperature was 118 ° C., and the end temperature was 153 ° C. The rising temperature in Example 2 was 102
° C, the peak temperature was 121 ° C, and the end temperature was 163 ° C. This indicates that the composition is cured at a lower temperature, and that the storage stability is superior to the storage stability evaluation result.
【００３４】[0034]
【発明の効果】以上詳述したように本発明によれば、従
来のエポキシ樹脂系よりも低温速硬化性に優れかつ可使
時間を有し、回路腐食性が少ない電気・電子用の回路接
続材料及びこれを用いた回路端子の接続方法、接続構造
の提供が可能となる。As described above in detail, according to the present invention, a circuit connection for electric and electronic use which has excellent low-temperature and fast-curing properties, has a long pot life, and has a low circuit corrosiveness, compared with the conventional epoxy resin system. A material, a method for connecting circuit terminals using the same, and a connection structure can be provided.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０５Ｋ 3/28 Ｈ０５Ｋ 3/28 Ｃ (72)発明者 小林 宏治 茨城県下館市大字五所宮1150番地 日立化 成工業株式会社五所宮事業所内 (72)発明者 中澤 孝 茨城県下館市大字五所宮1150番地 日立化 成工業株式会社五所宮事業所内 (72)発明者 小島 和良 茨城県下館市大字五所宮1150番地 日立化 成工業株式会社五所宮事業所内 Ｆターム(参考） 4J040 DB032 DD062 DD072 EC021 EC061 EC071 EC161 EC261 ED002 EE062 EF002 EG002 EH032 HC01 HC15 HC22 KA16 KA32 MA02 NA19 5E314 AA17 AA36 AA40 FF03 FF06 GG14 5E319 AC03 AC04 BB20 GG20 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H05K 3/28 H05K 3/28 C (72) Inventor Koji Kobayashi 1150 Goshomiya, Shimodate-shi, Ibaraki Pref. Hitachi Chemical (72) Inventor Takashi Nakazawa 1150 Goshomiya, Shimodate-shi, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Goshomiya Office (72) Inventor Kazuyoshi Kojima 1150 Goshomiya, Shimodate-shi, Ibaraki Hitachi Chemical Co., Ltd. Goshonomiya Works F-term (reference) 4J040 DB032 DD062 DD072 EC021 EC061 EC071 EC161 EC261 ED002 EE062 EF002 EG002 EH032 HC01 HC15 HC22 KA16 KA32 MA02 NA19 5E314 AA17 AA36 AA40 FF03 31920 AC04
Claims (9)
向する接続端子を加圧し加圧方向の接続端子間を電気的
に接続する接続材料であって、（１）ジシアノジアミ
ド、（２）エポキシ樹脂、（３）潜在性硬化剤を必須成
分とし、さらに（４）フィルム形成材を含有することを
特徴とする回路接続材料。1. A connection material interposed between opposed connection terminals and pressurizing the opposed connection terminals to electrically connect the connection terminals in the pressure direction, wherein (1) dicyanodiamide, (2) A) a circuit connection material comprising an epoxy resin, (3) a latent curing agent as an essential component, and (4) a film-forming material.
とさらに（５）導電性粒子を必須成分とする請求項１に
記載の回路接続材料。2. The circuit connection material according to claim 1, wherein the components (1), (2), (3) and (4) and (5) conductive particles are essential components.
徴とする請求項１または請求項２に記載の回路接続材
料。3. The circuit connection material according to claim 1, further comprising (6) an acrylic rubber.
エポキシ樹脂を含む請求項１ないし請求項３のいずれか
に記載の回路接続材料。4. The circuit connecting material according to claim 1, wherein (2) the epoxy resin contains a bisphenol A type epoxy resin.
プリング剤を０．１〜１０重量部含有することを特徴と
する請求項１ないし請求項４のいずれかに記載の回路接
続材料。5. The circuit connecting material according to claim 1, further comprising 0.1 to 10 parts by weight of a silane coupling agent containing an isocyanate group.
と、第二の接続端子を有する第二の回路部材とを、第一
の接続端子と第二の接続端子を対向して配置し、対向配
置した第一の接続端子と第二の接続端子の間に請求項１
ないし請求項５のいずれかに記載の回路接続材料を介在
させ、加熱加圧して前記対向配置した第一の接続端子と
第二の接続端子を電気的に接続させる回路端子の接続方
法。6. A first circuit member having a first connection terminal and a second circuit member having a second connection terminal are arranged with the first connection terminal and the second connection terminal facing each other. And between the first connection terminal and the second connection terminal which are arranged opposite to each other.
A method for connecting circuit terminals, wherein the circuit connection material according to any one of claims 5 to 5 is interposed, and the first and second connection terminals are electrically connected by heating and pressing.
板が有機絶縁物質、ガラスから選ばれる少なくとも一種
で構成される請求項６に記載の回路端子の接続方法。7. The method for connecting circuit terminals according to claim 6, wherein the substrate supporting at least one connection terminal is made of at least one selected from an organic insulating material and glass.
リコン、シリコーン化合物、ポリイミド樹脂から選ばれ
る少なくとも一種でコーティングもしくは付着している
請求項６または請求項７に記載の回路端子の接続方法。8. The circuit terminal connection method according to claim 6, wherein at least one of the circuit member surfaces is coated or adhered with at least one selected from silicon nitride, a silicone compound, and a polyimide resin.
載の回路端子の接続方法で得られる回路端子の接続構
造。9. A connection structure for circuit terminals obtained by the method for connecting circuit terminals according to claim 6. Description:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000399826A JP2002204052A (en) | 2000-12-28 | 2000-12-28 | Circuit connecting material and method for connecting circuit terminal using the same as well as connecting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000399826A JP2002204052A (en) | 2000-12-28 | 2000-12-28 | Circuit connecting material and method for connecting circuit terminal using the same as well as connecting structure |
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| JP2002204052A true JP2002204052A (en) | 2002-07-19 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006299025A (en) * | 2005-04-19 | 2006-11-02 | Sumitomo Electric Ind Ltd | Epoxy resin composition |
| JP2006319239A (en) * | 2005-05-16 | 2006-11-24 | Kaneka Corp | Laminate and printed wiring board |
| WO2007040090A1 (en) * | 2005-09-30 | 2007-04-12 | Sumitomo Electric Industries, Ltd. | Anisotropic conductive adhesive |
| JP2007177204A (en) * | 2005-12-01 | 2007-07-12 | Hitachi Chem Co Ltd | Adhesive composition, and spliced body and semiconductor device by using the same |
| JP2008034616A (en) * | 2006-07-28 | 2008-02-14 | Asahi Kasei Electronics Co Ltd | Bonding agent for circuit connection |
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| JP2008308682A (en) * | 2007-05-15 | 2008-12-25 | Hitachi Chem Co Ltd | Circuit connection material |
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| JP2010261003A (en) * | 2009-05-11 | 2010-11-18 | Asahi Kasei E-Materials Corp | Method for producing film adhesive for circuit connection |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62141083A (en) * | 1985-12-13 | 1987-06-24 | Sony Chem Kk | Thermosetting adhesive film |
| JPH0329209A (en) * | 1989-06-26 | 1991-02-07 | Sumitomo Bakelite Co Ltd | Anisotropically conductive film |
| JPH0625632A (en) * | 1992-07-10 | 1994-02-01 | Hitachi Chem Co Ltd | Adhesive composition and laminated film |
| JPH1161088A (en) * | 1997-08-25 | 1999-03-05 | Hitachi Chem Co Ltd | Adhesive for connecting circuit member |
| JPH11150155A (en) * | 1997-11-18 | 1999-06-02 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device and circuit board holding jig there for |
| JP2000080341A (en) * | 1998-06-22 | 2000-03-21 | Toshiba Chem Corp | Anisotrropic conductive adhesive and on-board device |
| JP2000286538A (en) * | 1999-03-30 | 2000-10-13 | Seiko Epson Corp | Manufacture of board equipped with electronic component and crimping device |
-
2000
- 2000-12-28 JP JP2000399826A patent/JP2002204052A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62141083A (en) * | 1985-12-13 | 1987-06-24 | Sony Chem Kk | Thermosetting adhesive film |
| JPH0329209A (en) * | 1989-06-26 | 1991-02-07 | Sumitomo Bakelite Co Ltd | Anisotropically conductive film |
| JPH0625632A (en) * | 1992-07-10 | 1994-02-01 | Hitachi Chem Co Ltd | Adhesive composition and laminated film |
| JPH1161088A (en) * | 1997-08-25 | 1999-03-05 | Hitachi Chem Co Ltd | Adhesive for connecting circuit member |
| JPH11150155A (en) * | 1997-11-18 | 1999-06-02 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device and circuit board holding jig there for |
| JP2000080341A (en) * | 1998-06-22 | 2000-03-21 | Toshiba Chem Corp | Anisotrropic conductive adhesive and on-board device |
| JP2000286538A (en) * | 1999-03-30 | 2000-10-13 | Seiko Epson Corp | Manufacture of board equipped with electronic component and crimping device |
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| JP4595646B2 (en) * | 2005-04-19 | 2010-12-08 | 住友電気工業株式会社 | Epoxy resin composition |
| JP2006299025A (en) * | 2005-04-19 | 2006-11-02 | Sumitomo Electric Ind Ltd | Epoxy resin composition |
| JP2006319239A (en) * | 2005-05-16 | 2006-11-24 | Kaneka Corp | Laminate and printed wiring board |
| WO2007040090A1 (en) * | 2005-09-30 | 2007-04-12 | Sumitomo Electric Industries, Ltd. | Anisotropic conductive adhesive |
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| JP2012151486A (en) * | 2006-01-16 | 2012-08-09 | Hitachi Chem Co Ltd | Conductive adhesive film |
| JP2008034616A (en) * | 2006-07-28 | 2008-02-14 | Asahi Kasei Electronics Co Ltd | Bonding agent for circuit connection |
| US9173302B2 (en) | 2006-08-29 | 2015-10-27 | Hitachi Chemical Company, Ltd. | Conductive adhesive film and solar cell module |
| TWI449186B (en) * | 2007-05-09 | 2014-08-11 | A method of connecting an electrical conductor, an electrical conductor connecting member, a connecting structure, and a solar cell module | |
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| KR101081706B1 (en) * | 2007-05-09 | 2011-11-09 | 히다치 가세고교 가부시끼가이샤 | Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module |
| US10186627B2 (en) | 2007-05-09 | 2019-01-22 | Hitachi Chemical Company, Ltd. | Conductor connection member, connection structure, and solar cell module |
| JP4941554B2 (en) * | 2007-05-09 | 2012-05-30 | 日立化成工業株式会社 | Film-like circuit connection material and circuit member connection structure |
| JPWO2008139996A1 (en) * | 2007-05-09 | 2010-08-05 | 日立化成工業株式会社 | Film-like circuit connection material and circuit member connection structure |
| CN101669258A (en) * | 2007-05-09 | 2010-03-10 | 日立化成工业株式会社 | Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module |
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| US9660131B2 (en) | 2007-05-09 | 2017-05-23 | Hitachi Chemical Company, Ltd. | Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module |
| WO2008139995A1 (en) * | 2007-05-09 | 2008-11-20 | Hitachi Chemical Company, Ltd. | Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module |
| CN101669258B (en) * | 2007-05-09 | 2016-04-13 | 日立化成株式会社 | The method of attachment of electric conductor, conductor connection member, syndeton and solar module |
| CN105826418A (en) * | 2007-05-09 | 2016-08-03 | 日立化成株式会社 | Manufacturing method for connecting and manufacturing method for solar cell module |
| JP2008308682A (en) * | 2007-05-15 | 2008-12-25 | Hitachi Chem Co Ltd | Circuit connection material |
| JP2010261003A (en) * | 2009-05-11 | 2010-11-18 | Asahi Kasei E-Materials Corp | Method for producing film adhesive for circuit connection |
| JP2011236295A (en) * | 2010-05-07 | 2011-11-24 | Kyoritsu Kagaku Sangyo Kk | Curable resin composition for adhering metal wiring layer onto substrate and method for producing metal wiring substrate using the same |
| JP7401361B2 (en) | 2020-03-17 | 2023-12-19 | リンテック株式会社 | thermoelectric conversion module |
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