CN108040425B - Electronic equipment and its circuit board - Google Patents
Electronic equipment and its circuit board Download PDFInfo
- Publication number
- CN108040425B CN108040425B CN201711371299.1A CN201711371299A CN108040425B CN 108040425 B CN108040425 B CN 108040425B CN 201711371299 A CN201711371299 A CN 201711371299A CN 108040425 B CN108040425 B CN 108040425B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- insulating film
- flexible insulating
- silica gel
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 19
- 239000000741 silica gel Substances 0.000 claims description 19
- 229910002027 silica gel Inorganic materials 0.000 claims description 19
- 238000005452 bending Methods 0.000 claims description 8
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 108010025899 gelatin film Proteins 0.000 claims 1
- 239000000945 filler Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structure Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Abstract
The present invention provides a kind of electronic equipment and its circuit board, the circuit board includes flexible insulating film, conductive contact blade and compliant conductive medium, wherein, conductive contact blade is set to the end of flexible insulating film, and conductive contact blade includes the built-in part being set to inside flexible insulating film and the expose portion being exposed to outside flexible insulating film；Compliant conductive media filler is in contact inside flexible insulating film and with built-in part.Electronic equipment and its board structure of circuit provided by the invention are novel, easy to use, carry out conduction by using compliant conductive medium, further improve flexible ability on the basis of can be conductive, have better applicability in circuit connection.
Description
Technical field
The present invention relates to electronic technology fields, in particular to a kind of electronic equipment and its circuit board.
Background technique
In the circuit system of electronic equipment, it is often necessary to be electrically connected electronic component using conducting wire.
For example, common integrated circuit line is using copper foil as conductive base in mobile phone, and in the appearance of copper foil
Circumferential surface cladding hinders electric film, is however, keeping away end present in the integrated circuit line, copper foil as metal, scalability compared with
Difference, need often carry out bending electrical connection operating condition in, the too long then occupied space of integrated circuit line is too short, be not easy bending and
It is easy to lose.
Specifically, also referring to Fig. 1 to Fig. 3, the circuit board that provides in the prior art includes hindering electric film 11 and built-in
Copper sheet 12.
Since the scalability of copper sheet 12 is poor, in the electrical connection operating condition for needing often to carry out bending, the circuit board mistake
Long then occupied space, it is too short, it is not easy bending and is easy to lose.
Summary of the invention
The present invention provides a kind of electronic equipment and its circuit board, with solve in the prior art circuit board due to scalability compared with
Difference will lead to the too long then occupied space of circuit board, too short, is not easy bending and is easy to lose problem.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: a kind of circuit board is provided, comprising:
Flexible insulating film；
Conductive contact blade, set on the end of flexible insulating film, the conductive contact blade includes being set to inside the flexible insulating film
Built-in part and the expose portion that is exposed to outside the flexible insulating film；
Compliant conductive medium is filled in inside the flexible insulating film and is in contact with the built-in part.
A specific embodiment according to the present invention, the flexible insulating film use high-temperature insulation pellosil.
A specific embodiment according to the present invention, the compliant conductive medium use liquid metal.
A specific embodiment according to the present invention, the circuit board further comprise electric silica gel band, the electric silica gel band
It is in contact in the compliant conductive medium and with the built-in part.
A specific embodiment according to the present invention, in abnormally-structured, the electric silica gel belt surface is set the electric silica gel band
There have medium channel to be disconnected to prevent the compliant conductive medium to be blocked in the circuit board bending.
A specific embodiment according to the present invention, the electric silica gel band include:
Main body；
Spacer bar, interval are set to the first surface of the main body to form the medium channel.
A specific embodiment according to the present invention, the electric silica gel band further comprises support bar, and interval is set to the master
The second surface of body.
A specific embodiment according to the present invention, the circuit board are equipped with location hole, and the location hole is through described flexible exhausted
Velum, the location hole are used to carry out positioning assembly and are positioning the level of stretch for limiting the circuit board when assembly.
A specific embodiment according to the present invention, the flexible insulating film is interior equipped with compliant conductive medium described in multiple groups, described
The both ends of compliant conductive medium are equipped with the conductive contact blade.
In order to solve the above technical problems, another technical solution used in the present invention is: a kind of electronic equipment is provided, it is described
Electronic equipment includes above-mentioned circuit board.
The beneficial effects of the present invention are: being in contrast to the prior art, electronic equipment and its circuit provided by the invention
It is plate structure novel, easy to use, it carries out by using compliant conductive medium conductive, further be promoted on the basis of can be conductive
Flexible ability has better applicability in circuit connection.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing, in which:
Fig. 1 is a kind of simplification schematic perspective view of circuit board in the prior art；
Fig. 2 is the side structure schematic diagram of circuit board shown in Fig. 1；
Fig. 3 is the cross section structure schematic diagram of circuit board shown in Fig. 1；
Fig. 4 is the simplification schematic perspective view for the circuit board that one embodiment of the invention provides；
Fig. 5 is the partial cross-sectional structural diagram of circuit board shown in Fig. 4；
Fig. 6 is the cross section structure schematic diagram of circuit board shown in Fig. 4；And
Fig. 7 is the enlarged partial cross-sectional structural schematic diagram of circuit board shown in Fig. 4.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that the described embodiments are merely a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Referring to Figure 4 together to Fig. 7, the embodiment of the present invention provides a kind of circuit board 100, which mainly includes
Flexible insulating film 110, conductive contact blade 120 and compliant conductive medium 130.
Wherein, conductive contact blade 120 is set to the end of flexible insulating film 110, and conductive contact blade 120 includes being set to flexible insulating film
Built-in part 122 inside 110 and the expose portion 124 being exposed to outside flexible insulating film 110；Compliant conductive medium 130 is filled out
It fills in 110 inside of flexible insulating film and is in contact with built-in part 122.
In a specific embodiment of the invention, high-temperature insulation pellosil is can be used in flexible insulating film 110, and compliant conductive is situated between
Liquid metal can be used in matter 130, and liquid metal is used its resistance can be made to subtract as far as possible with the conductive contact area of increasing circuit
It is small, while fever can also be reduced, play the role of good radiating and cooling.
In a specific embodiment of the invention, circuit board 100 further comprises electric silica gel band 140, electric silica gel band 140
It is in contact in compliant conductive medium 130 and with built-in part 122.
Specifically, electric silica gel band 140 can in abnormally-structured, 140 surface of electric silica gel band be equipped with medium channel 141 with
Compliant conductive medium 130 is prevented to be blocked when 100 bending of circuit board disconnected.
As shown in Figure 7, electric silica gel band 140 includes main body 142 and spacer bar 144, and the interval of spacer bar 144 is set to main body
142 first surface is to form medium channel 141.
Wherein, the concrete shape of the quantity of spacer bar 144 and medium channel 141 is not limited to shown in attached drawing.
Preferably, electric silica gel band 140 further comprises support bar 146, and the interval of support bar 146 is set to the of main body 142
Two surfaces.The section of support bar 146 can be triangular in shape, to reduce the contact area with flexible insulating film 110, so that flexibility is led
Dielectric 130 is also present between multiple support bars 146.
In addition, the circuit board 100 that one embodiment of the invention provides is additionally provided with location hole 150, location hole 150 is through flexible exhausted
Velum 110, location hole 150 are used to carry out positioning assembly and limit the level of stretch of circuit board 100 when positioning assembly.
In a specific embodiment of the invention, multiple groups compliant conductive medium 130 is equipped in flexible insulating film 110, flexibility is led
The both ends of dielectric 130 are equipped with conductive contact blade 120.
The present invention also provides a kind of electronic equipment 10, which includes weighing above-mentioned circuit board 100.
In conclusion this field skill personnel are readily appreciated that, 100 structure of electronic equipment and its circuit board provided by the invention is new
It is clever, easy to use, conduction is carried out by using compliant conductive medium 130, further improves and stretches on the basis of can be conductive
Contracting ability has better applicability in circuit connection.
The above is only the embodiment of the present invention, are not intended to limit the scope of the invention, all to be said using the present invention
Equivalent structure or equivalent flow shift made by bright book and accompanying drawing content is applied directly or indirectly in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (9)
1. a kind of circuit board characterized by comprising
Flexible insulating film；
Conductive contact blade, set on the end of flexible insulating film, the conductive contact blade includes interior inside the flexible insulating film
Embedding part and the expose portion being exposed to outside the flexible insulating film；
Compliant conductive medium is filled in inside the flexible insulating film and is in contact with the built-in part；
Electric silica gel band, the electric silica gel band are set in the compliant conductive medium and are in contact with the built-in part.
2. circuit board according to claim 1, which is characterized in that the flexible insulating film uses high-temperature insulation silica gel
Film.
3. circuit board according to claim 1, which is characterized in that the compliant conductive medium uses liquid metal.
4. circuit board according to claim 1, which is characterized in that the electric silica gel band is in abnormally-structured, the conduction
It is disconnected to prevent the compliant conductive medium to be blocked in the circuit board bending that silica gel belt surface is equipped with medium channel.
5. circuit board according to claim 4, which is characterized in that the electric silica gel band includes:
Main body；
Spacer bar, interval are set to the first surface of the main body to form the medium channel.
6. circuit board according to claim 5, which is characterized in that the electric silica gel band further comprises support bar,
Every the second surface for being set to the main body.
7. circuit board according to claim 1, which is characterized in that the circuit board is equipped with location hole, and the location hole passes through
The flexible insulating film is worn, the location hole is used to carry out positioning assembly and is positioning the stretching for limiting the circuit board when assembly
Degree.
8. circuit board according to claim 1, which is characterized in that be equipped with flexibility described in multiple groups in the flexible insulating film and lead
The both ends of dielectric, the compliant conductive medium are equipped with the conductive contact blade.
9. a kind of electronic equipment, which is characterized in that the electronic equipment includes that claim is wanted described in any one of 1 to 8
Circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711371299.1A CN108040425B (en) | 2017-12-14 | 2017-12-14 | Electronic equipment and its circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711371299.1A CN108040425B (en) | 2017-12-14 | 2017-12-14 | Electronic equipment and its circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108040425A CN108040425A (en) | 2018-05-15 |
| CN108040425B true CN108040425B (en) | 2019-09-20 |
Family
ID=62099726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711371299.1A Active CN108040425B (en) | 2017-12-14 | 2017-12-14 | Electronic equipment and its circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108040425B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101901971A (en) * | 2006-04-12 | 2010-12-01 | 日立化成工业株式会社 | Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
| CN202218474U (en) * | 2011-07-13 | 2012-05-09 | 青岛海信移动通信技术股份有限公司 | Main circuit board of mobile terminal and mobile terminal |
| CN103687275A (en) * | 2012-09-26 | 2014-03-26 | 富士胶片株式会社 | Multi-layered board and semiconductor package |
| JPWO2013065099A1 (en) * | 2011-10-31 | 2015-04-02 | 株式会社メイコー | Method for manufacturing component-embedded substrate and component-embedded substrate manufactured using this method |
| CN105430866A (en) * | 2014-09-03 | 2016-03-23 | 三星显示有限公司 | Flexible Circuit Board And Electronic Device Including The Same |
-
2017
- 2017-12-14 CN CN201711371299.1A patent/CN108040425B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101901971A (en) * | 2006-04-12 | 2010-12-01 | 日立化成工业株式会社 | Circuit connecting adhesive film, circuit member connecting structure and circuit member connecting method |
| CN202218474U (en) * | 2011-07-13 | 2012-05-09 | 青岛海信移动通信技术股份有限公司 | Main circuit board of mobile terminal and mobile terminal |
| JPWO2013065099A1 (en) * | 2011-10-31 | 2015-04-02 | 株式会社メイコー | Method for manufacturing component-embedded substrate and component-embedded substrate manufactured using this method |
| CN103687275A (en) * | 2012-09-26 | 2014-03-26 | 富士胶片株式会社 | Multi-layered board and semiconductor package |
| CN105430866A (en) * | 2014-09-03 | 2016-03-23 | 三星显示有限公司 | Flexible Circuit Board And Electronic Device Including The Same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108040425A (en) | 2018-05-15 |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |