CN103409082A - 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法 - Google Patents
电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法 Download PDFInfo
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- CN103409082A CN103409082A CN2013103506129A CN201310350612A CN103409082A CN 103409082 A CN103409082 A CN 103409082A CN 2013103506129 A CN2013103506129 A CN 2013103506129A CN 201310350612 A CN201310350612 A CN 201310350612A CN 103409082 A CN103409082 A CN 103409082A
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- 230000004048 modification Effects 0.000 description 1
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- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Combinations Of Printed Boards (AREA)
- Non-Insulated Conductors (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004-002308 | 2004-01-07 | ||
| JP2004002308A JP4380328B2 (ja) | 2004-01-07 | 2004-01-07 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
| JP2004-002305 | 2004-01-07 | ||
| JP2004002305A JP4380327B2 (ja) | 2004-01-07 | 2004-01-07 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA200580001944XA Division CN1906265A (zh) | 2004-01-07 | 2005-01-06 | 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103409082A true CN103409082A (zh) | 2013-11-27 |
Family
ID=34752086
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103506129A Pending CN103409082A (zh) | 2004-01-07 | 2005-01-06 | 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法 |
| CN201010245654.2A Expired - Lifetime CN101944659B (zh) | 2004-01-07 | 2005-01-06 | 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010245654.2A Expired - Lifetime CN101944659B (zh) | 2004-01-07 | 2005-01-06 | 电路连接材料、使用其的薄膜状电路连接材料、电路构件的连接构造及其制造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100025089A1 (enExample) |
| EP (1) | EP1702968A4 (enExample) |
| KR (4) | KR100908370B1 (enExample) |
| CN (2) | CN103409082A (enExample) |
| SG (1) | SG158842A1 (enExample) |
| TW (4) | TW200525005A (enExample) |
| WO (1) | WO2005066298A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105295812A (zh) * | 2014-07-22 | 2016-02-03 | 日立化成株式会社 | 连接材料和太阳能电池模块 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4967482B2 (ja) * | 2006-02-27 | 2012-07-04 | 日立化成工業株式会社 | 導電粒子、接着剤組成物及び回路接続材料 |
| CN101536260B (zh) * | 2006-11-10 | 2012-01-11 | 日立化成工业株式会社 | 粘接膜、以及电路部件的连接结构和连接方法 |
| CN101689410B (zh) * | 2007-08-02 | 2013-10-16 | 日立化成株式会社 | 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法 |
| KR101238178B1 (ko) * | 2007-10-29 | 2013-02-28 | 히타치가세이가부시끼가이샤 | 회로 접속 재료, 접속 구조체 및 그의 제조 방법 |
| JP5430093B2 (ja) * | 2008-07-24 | 2014-02-26 | デクセリアルズ株式会社 | 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法 |
| CN102870208B (zh) * | 2010-04-01 | 2015-07-01 | 株式会社村田制作所 | 电子部件及其制造方法 |
| CN104584141B (zh) * | 2012-11-28 | 2017-04-12 | 积水化学工业株式会社 | 带有绝缘性粒子的导电性粒子、导电材料及连接结构体 |
| GB2518363A (en) * | 2013-09-18 | 2015-03-25 | Novalia Ltd | Circuit board assembly |
| DE102013219688B3 (de) * | 2013-09-30 | 2015-02-05 | Robert Bosch Gmbh | Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung |
| KR102422589B1 (ko) * | 2017-01-27 | 2022-07-18 | 쇼와덴코머티리얼즈가부시끼가이샤 | 절연 피복 도전 입자, 이방 도전 필름, 이방 도전 필름의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법 |
| US10733136B1 (en) * | 2019-03-01 | 2020-08-04 | Western Digital Technologies, Inc. | Vertical surface mount type C USB connector |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5162087A (en) * | 1990-09-03 | 1992-11-10 | Soken Chemical & Engineering Co., Ltd. | Anisotropic conductive adhesive compositions |
| CN1398279A (zh) * | 2000-02-09 | 2003-02-19 | 日立化成工业株式会社 | 树脂组合物、使用该树脂组合物的电路元件连接用粘接剂及电路板 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4999460A (en) * | 1989-08-10 | 1991-03-12 | Casio Computer Co., Ltd. | Conductive connecting structure |
| JP3004042B2 (ja) * | 1990-10-12 | 2000-01-31 | 綜研化学株式会社 | 金属含有樹脂粒子およびその用途 |
| JP2748705B2 (ja) * | 1991-02-14 | 1998-05-13 | 日立化成工業株式会社 | 回路の接続部材 |
| JPH07105716A (ja) * | 1993-10-05 | 1995-04-21 | Soken Kagaku Kk | 被覆粒子および異方導電性接着剤 |
| JPH07133466A (ja) * | 1993-11-09 | 1995-05-23 | Soken Kagaku Kk | 接着方法 |
| TW277152B (enExample) * | 1994-05-10 | 1996-06-01 | Hitachi Chemical Co Ltd | |
| WO1996031574A1 (en) * | 1995-04-04 | 1996-10-10 | Hitachi Chemical Company, Ltd. | Adhesive, adhesive film and adhesive-backed metal foil |
| EP0744884A3 (en) * | 1995-05-23 | 1997-09-24 | Hitachi Chemical Co Ltd | Method of manufacturing a multilayer printed circuit board |
| KR100261793B1 (ko) * | 1995-09-29 | 2000-07-15 | 니시무로 타이죠 | 고강도 고신뢰성 회로기판 및 그 제조방법 |
| AU2327400A (en) * | 1999-02-08 | 2000-08-25 | Hitachi Chemical Co. Ltd. | Adhesive, electrode-connecting structure, and method of connecting electrodes |
| US6939913B1 (en) * | 1999-08-25 | 2005-09-06 | Hitachi Chemical Company, Ltd. | Adhesive agent, method of connecting wiring terminals and wiring structure |
| JP4788036B2 (ja) * | 2000-11-29 | 2011-10-05 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 |
| JP4752107B2 (ja) * | 2000-11-29 | 2011-08-17 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 |
| JP4852785B2 (ja) * | 2000-11-29 | 2012-01-11 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 |
| TW557237B (en) * | 2001-09-14 | 2003-10-11 | Sekisui Chemical Co Ltd | Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure |
| KR100589799B1 (ko) * | 2003-05-06 | 2006-06-14 | 한화석유화학 주식회사 | 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품 |
| US7393771B2 (en) * | 2004-06-29 | 2008-07-01 | Hitachi, Ltd. | Method for mounting an electronic part on a substrate using a liquid containing metal particles |
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2005
- 2005-01-01 US US10/585,461 patent/US20100025089A1/en not_active Abandoned
- 2005-01-06 KR KR1020087014740A patent/KR100908370B1/ko not_active Expired - Lifetime
- 2005-01-06 SG SG200908709-9A patent/SG158842A1/en unknown
- 2005-01-06 CN CN2013103506129A patent/CN103409082A/zh active Pending
- 2005-01-06 CN CN201010245654.2A patent/CN101944659B/zh not_active Expired - Lifetime
- 2005-01-06 EP EP05703338A patent/EP1702968A4/en not_active Withdrawn
- 2005-01-06 KR KR1020097008206A patent/KR100981483B1/ko not_active Expired - Lifetime
- 2005-01-06 KR KR1020067015544A patent/KR100865204B1/ko not_active Expired - Lifetime
- 2005-01-06 KR KR1020097008205A patent/KR100996035B1/ko not_active Expired - Lifetime
- 2005-01-06 WO PCT/JP2005/000070 patent/WO2005066298A1/ja not_active Ceased
- 2005-01-07 TW TW094100507A patent/TW200525005A/zh not_active IP Right Cessation
- 2005-01-07 TW TW098120264A patent/TW200945373A/zh not_active IP Right Cessation
- 2005-01-07 TW TW098120260A patent/TW200942596A/zh unknown
- 2005-01-07 TW TW098120262A patent/TW200951201A/zh not_active IP Right Cessation
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| US5162087A (en) * | 1990-09-03 | 1992-11-10 | Soken Chemical & Engineering Co., Ltd. | Anisotropic conductive adhesive compositions |
| CN1398279A (zh) * | 2000-02-09 | 2003-02-19 | 日立化成工业株式会社 | 树脂组合物、使用该树脂组合物的电路元件连接用粘接剂及电路板 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105295812A (zh) * | 2014-07-22 | 2016-02-03 | 日立化成株式会社 | 连接材料和太阳能电池模块 |
Also Published As
| Publication number | Publication date |
|---|---|
| SG158842A1 (en) | 2010-02-26 |
| EP1702968A4 (en) | 2010-08-25 |
| TW200942596A (en) | 2009-10-16 |
| TWI320427B (enExample) | 2010-02-11 |
| US20100025089A1 (en) | 2010-02-04 |
| KR100908370B1 (ko) | 2009-07-20 |
| KR20090074778A (ko) | 2009-07-07 |
| TW200945373A (en) | 2009-11-01 |
| KR100981483B1 (ko) | 2010-09-10 |
| EP1702968A1 (en) | 2006-09-20 |
| CN101944659A (zh) | 2011-01-12 |
| TWI323276B (enExample) | 2010-04-11 |
| KR20090064461A (ko) | 2009-06-18 |
| KR20070012337A (ko) | 2007-01-25 |
| TWI320575B (enExample) | 2010-02-11 |
| TW200951201A (en) | 2009-12-16 |
| KR100865204B1 (ko) | 2008-10-23 |
| CN101944659B (zh) | 2016-08-17 |
| KR100996035B1 (ko) | 2010-11-22 |
| WO2005066298A1 (ja) | 2005-07-21 |
| KR20080065314A (ko) | 2008-07-11 |
| TW200525005A (en) | 2005-08-01 |
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