KR100908370B1 - 회로접속재료용 피복입자 - Google Patents

회로접속재료용 피복입자 Download PDF

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Publication number
KR100908370B1
KR100908370B1 KR1020087014740A KR20087014740A KR100908370B1 KR 100908370 B1 KR100908370 B1 KR 100908370B1 KR 1020087014740 A KR1020087014740 A KR 1020087014740A KR 20087014740 A KR20087014740 A KR 20087014740A KR 100908370 B1 KR100908370 B1 KR 100908370B1
Authority
KR
South Korea
Prior art keywords
circuit
connection
film
particle
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020087014740A
Other languages
English (en)
Korean (ko)
Other versions
KR20080065314A (ko
Inventor
준 다케타츠
이츠오 와타나베
야스시 고토우
카즈오 야마구치
마사키 후지이
아야 후지이
Original Assignee
히다치 가세고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004002305A external-priority patent/JP4380327B2/ja
Priority claimed from JP2004002308A external-priority patent/JP4380328B2/ja
Application filed by 히다치 가세고교 가부시끼가이샤 filed Critical 히다치 가세고교 가부시끼가이샤
Publication of KR20080065314A publication Critical patent/KR20080065314A/ko
Application granted granted Critical
Publication of KR100908370B1 publication Critical patent/KR100908370B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
KR1020087014740A 2004-01-07 2005-01-06 회로접속재료용 피복입자 Expired - Lifetime KR100908370B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00002305 2004-01-07
JPJP-P-2004-00002308 2004-01-07
JP2004002305A JP4380327B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2004002308A JP4380328B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
PCT/JP2005/000070 WO2005066298A1 (ja) 2004-01-07 2005-01-06 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020067015544A Division KR100865204B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 이것을 이용한 필름상 회로접속재료,회로부재의 접속구조 및 그 제조방법

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020097008205A Division KR100996035B1 (ko) 2004-01-07 2005-01-06 필름상 회로접속재료, 회로부재의 접속구조물 및 그 제조방법
KR1020097008206A Division KR100981483B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 회로부재의 접속구조 및 그 제조방법

Publications (2)

Publication Number Publication Date
KR20080065314A KR20080065314A (ko) 2008-07-11
KR100908370B1 true KR100908370B1 (ko) 2009-07-20

Family

ID=34752086

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020087014740A Expired - Lifetime KR100908370B1 (ko) 2004-01-07 2005-01-06 회로접속재료용 피복입자
KR1020097008205A Expired - Lifetime KR100996035B1 (ko) 2004-01-07 2005-01-06 필름상 회로접속재료, 회로부재의 접속구조물 및 그 제조방법
KR1020067015544A Expired - Lifetime KR100865204B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 이것을 이용한 필름상 회로접속재료,회로부재의 접속구조 및 그 제조방법
KR1020097008206A Expired - Lifetime KR100981483B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 회로부재의 접속구조 및 그 제조방법

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020097008205A Expired - Lifetime KR100996035B1 (ko) 2004-01-07 2005-01-06 필름상 회로접속재료, 회로부재의 접속구조물 및 그 제조방법
KR1020067015544A Expired - Lifetime KR100865204B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 이것을 이용한 필름상 회로접속재료,회로부재의 접속구조 및 그 제조방법
KR1020097008206A Expired - Lifetime KR100981483B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 회로부재의 접속구조 및 그 제조방법

Country Status (7)

Country Link
US (1) US20100025089A1 (enExample)
EP (1) EP1702968A4 (enExample)
KR (4) KR100908370B1 (enExample)
CN (2) CN101944659B (enExample)
SG (1) SG158842A1 (enExample)
TW (4) TW200945373A (enExample)
WO (1) WO2005066298A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4967482B2 (ja) * 2006-02-27 2012-07-04 日立化成工業株式会社 導電粒子、接着剤組成物及び回路接続材料
TW201217482A (en) * 2006-11-10 2012-05-01 Hitachi Chemical Co Ltd Adhesive film, and connection structure and connecting method for circuit member
EP2178094A4 (en) * 2007-08-02 2013-02-20 Hitachi Chemical Co Ltd SWITCHING CONNECTING MATERIAL AND CONNECTING STRUCTURE OF A SWITCHING ELEMENT AND CONNECTION METHOD OF A SWITCHING ELEMENT ON THE SWITCHING CONNECTING MATERIAL
EP2206756A1 (en) * 2007-10-29 2010-07-14 Hitachi Chemical Company, Ltd. Circuit connecting material, connection structure and method for producing the same
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
WO2011125414A1 (ja) * 2010-04-01 2011-10-13 株式会社村田製作所 電子部品及びその製造方法
KR102095291B1 (ko) * 2012-11-28 2020-03-31 세키스이가가쿠 고교가부시키가이샤 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체
GB2518363A (en) 2013-09-18 2015-03-25 Novalia Ltd Circuit board assembly
DE102013219688B3 (de) * 2013-09-30 2015-02-05 Robert Bosch Gmbh Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung
CN105295812B (zh) * 2014-07-22 2021-03-02 昭和电工材料株式会社 连接材料和太阳能电池模块
KR102422589B1 (ko) * 2017-01-27 2022-07-18 쇼와덴코머티리얼즈가부시끼가이샤 절연 피복 도전 입자, 이방 도전 필름, 이방 도전 필름의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
US10733136B1 (en) * 2019-03-01 2020-08-04 Western Digital Technologies, Inc. Vertical surface mount type C USB connector

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999460A (en) * 1989-08-10 1991-03-12 Casio Computer Co., Ltd. Conductive connecting structure
JPH04115407A (ja) * 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JP3004042B2 (ja) * 1990-10-12 2000-01-31 綜研化学株式会社 金属含有樹脂粒子およびその用途
JP2748705B2 (ja) * 1991-02-14 1998-05-13 日立化成工業株式会社 回路の接続部材
JPH07105716A (ja) * 1993-10-05 1995-04-21 Soken Kagaku Kk 被覆粒子および異方導電性接着剤
JPH07133466A (ja) * 1993-11-09 1995-05-23 Soken Kagaku Kk 接着方法
TW277152B (enExample) * 1994-05-10 1996-06-01 Hitachi Chemical Co Ltd
US5965269A (en) * 1995-04-04 1999-10-12 Hitachi Chemical Company, Ltd. Adhesive, adhesive film and adhesive-backed metal foil
EP0744884A3 (en) * 1995-05-23 1997-09-24 Hitachi Chemical Co Ltd Method of manufacturing a multilayer printed circuit board
KR100261793B1 (ko) * 1995-09-29 2000-07-15 니시무로 타이죠 고강도 고신뢰성 회로기판 및 그 제조방법
KR100483565B1 (ko) * 1999-02-08 2005-04-15 히다치 가세고교 가부시끼가이샤 회로접속재료
CN101037572A (zh) * 1999-08-25 2007-09-19 日立化成工业株式会社 粘合剂,配线端子的连接方法和配线结构体
MY124944A (en) * 2000-02-09 2006-07-31 Hitachi Chemical Co Ltd Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards
JP4788036B2 (ja) * 2000-11-29 2011-10-05 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4752107B2 (ja) * 2000-11-29 2011-08-17 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4852785B2 (ja) * 2000-11-29 2012-01-11 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
KR100589799B1 (ko) * 2003-05-06 2006-06-14 한화석유화학 주식회사 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품
US7393771B2 (en) * 2004-06-29 2008-07-01 Hitachi, Ltd. Method for mounting an electronic part on a substrate using a liquid containing metal particles

Also Published As

Publication number Publication date
KR100996035B1 (ko) 2010-11-22
CN103409082A (zh) 2013-11-27
US20100025089A1 (en) 2010-02-04
KR100981483B1 (ko) 2010-09-10
TW200525005A (en) 2005-08-01
CN101944659A (zh) 2011-01-12
KR100865204B1 (ko) 2008-10-23
SG158842A1 (en) 2010-02-26
CN101944659B (zh) 2016-08-17
TW200942596A (en) 2009-10-16
KR20090074778A (ko) 2009-07-07
TW200951201A (en) 2009-12-16
TW200945373A (en) 2009-11-01
EP1702968A1 (en) 2006-09-20
TWI323276B (enExample) 2010-04-11
KR20070012337A (ko) 2007-01-25
EP1702968A4 (en) 2010-08-25
KR20090064461A (ko) 2009-06-18
KR20080065314A (ko) 2008-07-11
TWI320427B (enExample) 2010-02-11
TWI320575B (enExample) 2010-02-11
WO2005066298A1 (ja) 2005-07-21

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