TW200945373A - Circuit connection material, circuit member connection structure, and manufacturing method thereof - Google Patents
Circuit connection material, circuit member connection structure, and manufacturing method thereof Download PDFInfo
- Publication number
- TW200945373A TW200945373A TW098120264A TW98120264A TW200945373A TW 200945373 A TW200945373 A TW 200945373A TW 098120264 A TW098120264 A TW 098120264A TW 98120264 A TW98120264 A TW 98120264A TW 200945373 A TW200945373 A TW 200945373A
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- Prior art keywords
- circuit
- connecting material
- electrodes
- particles
- connection structure
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- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- KGQLBLGDIQNGSB-UHFFFAOYSA-N benzene-1,4-diol;methoxymethane Chemical compound COC.OC1=CC=C(O)C=C1 KGQLBLGDIQNGSB-UHFFFAOYSA-N 0.000 description 1
- JAHGTMJOPOCQIY-UHFFFAOYSA-N benzyl benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOCC1=CC=CC=C1 JAHGTMJOPOCQIY-UHFFFAOYSA-N 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
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- UPDZRIPMRHNKPZ-UHFFFAOYSA-N carboxyoxy 4,4-dimethoxybutyl carbonate Chemical compound COC(OC)CCCOC(=O)OOC(O)=O UPDZRIPMRHNKPZ-UHFFFAOYSA-N 0.000 description 1
- DFBPIORHJZWRMD-UHFFFAOYSA-N carboxyoxy diethoxymethoxy carbonate Chemical class CCOC(OCC)OOC(=O)OOC(O)=O DFBPIORHJZWRMD-UHFFFAOYSA-N 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
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- FNIATMYXUPOJRW-UHFFFAOYSA-N cyclohexylidene Chemical group [C]1CCCCC1 FNIATMYXUPOJRW-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
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- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
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- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
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- XRUBVIFOJBPLCN-UHFFFAOYSA-N methane;n-phenylaniline Chemical compound C.C=1C=CC=CC=1NC1=CC=CC=C1 XRUBVIFOJBPLCN-UHFFFAOYSA-N 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Combinations Of Printed Boards (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004002305A JP4380327B2 (ja) | 2004-01-07 | 2004-01-07 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
| JP2004002308A JP4380328B2 (ja) | 2004-01-07 | 2004-01-07 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200945373A true TW200945373A (en) | 2009-11-01 |
| TWI320575B TWI320575B (enExample) | 2010-02-11 |
Family
ID=34752086
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098120264A TW200945373A (en) | 2004-01-07 | 2005-01-07 | Circuit connection material, circuit member connection structure, and manufacturing method thereof |
| TW098120262A TW200951201A (en) | 2004-01-07 | 2005-01-07 | Circuit connection material, circuit member connection structure, and manufacturing method thereof |
| TW098120260A TW200942596A (en) | 2004-01-07 | 2005-01-07 | Film-shaped circuit connection material, circuit member connection structure, and manufacturing method thereof |
| TW094100507A TW200525005A (en) | 2004-01-07 | 2005-01-07 | Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098120262A TW200951201A (en) | 2004-01-07 | 2005-01-07 | Circuit connection material, circuit member connection structure, and manufacturing method thereof |
| TW098120260A TW200942596A (en) | 2004-01-07 | 2005-01-07 | Film-shaped circuit connection material, circuit member connection structure, and manufacturing method thereof |
| TW094100507A TW200525005A (en) | 2004-01-07 | 2005-01-07 | Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100025089A1 (enExample) |
| EP (1) | EP1702968A4 (enExample) |
| KR (4) | KR100908370B1 (enExample) |
| CN (2) | CN101944659B (enExample) |
| SG (1) | SG158842A1 (enExample) |
| TW (4) | TW200945373A (enExample) |
| WO (1) | WO2005066298A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4967482B2 (ja) * | 2006-02-27 | 2012-07-04 | 日立化成工業株式会社 | 導電粒子、接着剤組成物及び回路接続材料 |
| TW201217482A (en) * | 2006-11-10 | 2012-05-01 | Hitachi Chemical Co Ltd | Adhesive film, and connection structure and connecting method for circuit member |
| EP2178094A4 (en) * | 2007-08-02 | 2013-02-20 | Hitachi Chemical Co Ltd | SWITCHING CONNECTING MATERIAL AND CONNECTING STRUCTURE OF A SWITCHING ELEMENT AND CONNECTION METHOD OF A SWITCHING ELEMENT ON THE SWITCHING CONNECTING MATERIAL |
| EP2206756A1 (en) * | 2007-10-29 | 2010-07-14 | Hitachi Chemical Company, Ltd. | Circuit connecting material, connection structure and method for producing the same |
| JP5430093B2 (ja) * | 2008-07-24 | 2014-02-26 | デクセリアルズ株式会社 | 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法 |
| WO2011125414A1 (ja) * | 2010-04-01 | 2011-10-13 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| KR102095291B1 (ko) * | 2012-11-28 | 2020-03-31 | 세키스이가가쿠 고교가부시키가이샤 | 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체 |
| GB2518363A (en) | 2013-09-18 | 2015-03-25 | Novalia Ltd | Circuit board assembly |
| DE102013219688B3 (de) * | 2013-09-30 | 2015-02-05 | Robert Bosch Gmbh | Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung |
| CN105295812B (zh) * | 2014-07-22 | 2021-03-02 | 昭和电工材料株式会社 | 连接材料和太阳能电池模块 |
| KR102422589B1 (ko) * | 2017-01-27 | 2022-07-18 | 쇼와덴코머티리얼즈가부시끼가이샤 | 절연 피복 도전 입자, 이방 도전 필름, 이방 도전 필름의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법 |
| US10733136B1 (en) * | 2019-03-01 | 2020-08-04 | Western Digital Technologies, Inc. | Vertical surface mount type C USB connector |
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| US4999460A (en) * | 1989-08-10 | 1991-03-12 | Casio Computer Co., Ltd. | Conductive connecting structure |
| JPH04115407A (ja) * | 1990-09-03 | 1992-04-16 | Soken Kagaku Kk | 異方導電性接着剤組成物 |
| JP3004042B2 (ja) * | 1990-10-12 | 2000-01-31 | 綜研化学株式会社 | 金属含有樹脂粒子およびその用途 |
| JP2748705B2 (ja) * | 1991-02-14 | 1998-05-13 | 日立化成工業株式会社 | 回路の接続部材 |
| JPH07105716A (ja) * | 1993-10-05 | 1995-04-21 | Soken Kagaku Kk | 被覆粒子および異方導電性接着剤 |
| JPH07133466A (ja) * | 1993-11-09 | 1995-05-23 | Soken Kagaku Kk | 接着方法 |
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| US5965269A (en) * | 1995-04-04 | 1999-10-12 | Hitachi Chemical Company, Ltd. | Adhesive, adhesive film and adhesive-backed metal foil |
| EP0744884A3 (en) * | 1995-05-23 | 1997-09-24 | Hitachi Chemical Co Ltd | Method of manufacturing a multilayer printed circuit board |
| KR100261793B1 (ko) * | 1995-09-29 | 2000-07-15 | 니시무로 타이죠 | 고강도 고신뢰성 회로기판 및 그 제조방법 |
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| CN101037572A (zh) * | 1999-08-25 | 2007-09-19 | 日立化成工业株式会社 | 粘合剂,配线端子的连接方法和配线结构体 |
| MY124944A (en) * | 2000-02-09 | 2006-07-31 | Hitachi Chemical Co Ltd | Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards |
| JP4788036B2 (ja) * | 2000-11-29 | 2011-10-05 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 |
| JP4752107B2 (ja) * | 2000-11-29 | 2011-08-17 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 |
| JP4852785B2 (ja) * | 2000-11-29 | 2012-01-11 | 日立化成工業株式会社 | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 |
| TW557237B (en) * | 2001-09-14 | 2003-10-11 | Sekisui Chemical Co Ltd | Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure |
| KR100589799B1 (ko) * | 2003-05-06 | 2006-06-14 | 한화석유화학 주식회사 | 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품 |
| US7393771B2 (en) * | 2004-06-29 | 2008-07-01 | Hitachi, Ltd. | Method for mounting an electronic part on a substrate using a liquid containing metal particles |
-
2005
- 2005-01-01 US US10/585,461 patent/US20100025089A1/en not_active Abandoned
- 2005-01-06 KR KR1020087014740A patent/KR100908370B1/ko not_active Expired - Lifetime
- 2005-01-06 KR KR1020097008205A patent/KR100996035B1/ko not_active Expired - Lifetime
- 2005-01-06 WO PCT/JP2005/000070 patent/WO2005066298A1/ja not_active Ceased
- 2005-01-06 CN CN201010245654.2A patent/CN101944659B/zh not_active Expired - Lifetime
- 2005-01-06 CN CN2013103506129A patent/CN103409082A/zh active Pending
- 2005-01-06 KR KR1020067015544A patent/KR100865204B1/ko not_active Expired - Lifetime
- 2005-01-06 SG SG200908709-9A patent/SG158842A1/en unknown
- 2005-01-06 KR KR1020097008206A patent/KR100981483B1/ko not_active Expired - Lifetime
- 2005-01-06 EP EP05703338A patent/EP1702968A4/en not_active Withdrawn
- 2005-01-07 TW TW098120264A patent/TW200945373A/zh not_active IP Right Cessation
- 2005-01-07 TW TW098120262A patent/TW200951201A/zh not_active IP Right Cessation
- 2005-01-07 TW TW098120260A patent/TW200942596A/zh unknown
- 2005-01-07 TW TW094100507A patent/TW200525005A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100908370B1 (ko) | 2009-07-20 |
| KR100996035B1 (ko) | 2010-11-22 |
| CN103409082A (zh) | 2013-11-27 |
| US20100025089A1 (en) | 2010-02-04 |
| KR100981483B1 (ko) | 2010-09-10 |
| TW200525005A (en) | 2005-08-01 |
| CN101944659A (zh) | 2011-01-12 |
| KR100865204B1 (ko) | 2008-10-23 |
| SG158842A1 (en) | 2010-02-26 |
| CN101944659B (zh) | 2016-08-17 |
| TW200942596A (en) | 2009-10-16 |
| KR20090074778A (ko) | 2009-07-07 |
| TW200951201A (en) | 2009-12-16 |
| EP1702968A1 (en) | 2006-09-20 |
| TWI323276B (enExample) | 2010-04-11 |
| KR20070012337A (ko) | 2007-01-25 |
| EP1702968A4 (en) | 2010-08-25 |
| KR20090064461A (ko) | 2009-06-18 |
| KR20080065314A (ko) | 2008-07-11 |
| TWI320427B (enExample) | 2010-02-11 |
| TWI320575B (enExample) | 2010-02-11 |
| WO2005066298A1 (ja) | 2005-07-21 |
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