JP2019065062A - 導電性接着フィルム - Google Patents
導電性接着フィルム Download PDFInfo
- Publication number
- JP2019065062A JP2019065062A JP2017188172A JP2017188172A JP2019065062A JP 2019065062 A JP2019065062 A JP 2019065062A JP 2017188172 A JP2017188172 A JP 2017188172A JP 2017188172 A JP2017188172 A JP 2017188172A JP 2019065062 A JP2019065062 A JP 2019065062A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive film
- conductive adhesive
- conductive
- filler
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002313 adhesive film Substances 0.000 title claims abstract description 82
- 239000002245 particle Substances 0.000 claims abstract description 80
- 239000012790 adhesive layer Substances 0.000 claims abstract description 43
- 239000000945 filler Substances 0.000 claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- 239000000126 substance Substances 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052745 lead Inorganic materials 0.000 claims description 3
- 229920000620 organic polymer Polymers 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 36
- 230000001070 adhesive effect Effects 0.000 abstract description 35
- 229920005989 resin Polymers 0.000 abstract description 21
- 239000011347 resin Substances 0.000 abstract description 21
- -1 whiskers Substances 0.000 description 27
- 239000010408 film Substances 0.000 description 18
- 150000003254 radicals Chemical class 0.000 description 14
- 239000010931 gold Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229920003192 poly(bis maleimide) Polymers 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 229910000510 noble metal Inorganic materials 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 239000011888 foil Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000007771 core particle Substances 0.000 description 4
- 230000002209 hydrophobic effect Effects 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 229910052723 transition metal Inorganic materials 0.000 description 4
- 150000003624 transition metals Chemical class 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 150000002978 peroxides Chemical class 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000010944 silver (metal) Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- SEILKFZTLVMHRR-UHFFFAOYSA-N 2-phosphonooxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOP(O)(O)=O SEILKFZTLVMHRR-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229960003328 benzoyl peroxide Drugs 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000012933 diacyl peroxide Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 150000003014 phosphoric acid esters Chemical group 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- DLYUQMMRRRQYAE-UHFFFAOYSA-N tetraphosphorus decaoxide Chemical compound O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- JXCAHDJDIAQCJO-UHFFFAOYSA-N (1-tert-butylperoxy-2-ethylhexyl) hydrogen carbonate Chemical compound CCCCC(CC)C(OC(O)=O)OOC(C)(C)C JXCAHDJDIAQCJO-UHFFFAOYSA-N 0.000 description 1
- WRXCBRHBHGNNQA-UHFFFAOYSA-N (2,4-dichlorobenzoyl) 2,4-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1Cl WRXCBRHBHGNNQA-UHFFFAOYSA-N 0.000 description 1
- TUGAMVVIFZLKTI-UHFFFAOYSA-N (3-methoxy-3-methylbutoxy)peroxycarbonyl (3-methoxy-3-methylbutyl)peroxy carbonate Chemical compound COC(C)(C)CCOOOC(=O)OC(=O)OOOCCC(C)(C)OC TUGAMVVIFZLKTI-UHFFFAOYSA-N 0.000 description 1
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 1
- FYRCDEARNUVZRG-UHFFFAOYSA-N 1,1,5-trimethyl-3,3-bis(2-methylpentan-2-ylperoxy)cyclohexane Chemical compound CCCC(C)(C)OOC1(OOC(C)(C)CCC)CC(C)CC(C)(C)C1 FYRCDEARNUVZRG-UHFFFAOYSA-N 0.000 description 1
- VBQCFYPTKHCPGI-UHFFFAOYSA-N 1,1-bis(2-methylpentan-2-ylperoxy)cyclohexane Chemical compound CCCC(C)(C)OOC1(OOC(C)(C)CCC)CCCCC1 VBQCFYPTKHCPGI-UHFFFAOYSA-N 0.000 description 1
- OTMBZPVYOQYPBE-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclododecane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCCCCCCCC1 OTMBZPVYOQYPBE-UHFFFAOYSA-N 0.000 description 1
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- PYTZZNUKESXWLN-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C(F)(F)F)(C(F)(F)F)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O PYTZZNUKESXWLN-UHFFFAOYSA-N 0.000 description 1
- XAZPKEBWNIUCKF-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O XAZPKEBWNIUCKF-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
a≧b …(1)
図1は、本発明の導電性接着フィルムの一実施形態を示す模式断面図である。図1に示すように、本実施形態の導電性接着フィルム10は、接着剤成分2と、導電粒子4と、フィラー6とを含有する接着剤層1からなる。本実施形態の導電性接着フィルム10は、相対峙する電極間に介在され、相対向する電極を加圧し、加圧方向の電極間を電気的に接続する材料である。
a≧b ・・・(1)
(d)ラジカル重合性物質として、ウレタンアクリレート(製品名:UN−5500、新中村化学工業株式会社製)20質量部、ビス(アクリロキシエチル)イソシアヌレート(製品名:M−215、東亞合成株式会社製)20質量部、ジメチロールトリシクロデカンジアクリレート(製品名:DCP−A、共栄社化学株式会社製)10質量部、及び2−メタクリロイロキシエチルアッシドフォスフェート(製品名:P−2M、共栄社化学株式会社製)3質量部、(c)遊離ラジカル発生剤としてベンゾイルパーオキサイド(製品名:ナイパーBMT−K、日油株式会社製)4質量部、並びに、フィルム形成材としてポリエステルウレタン樹脂(製品名:UR8240、東洋紡績株式会社製)をトルエン/メチルエチルケトン=50/50(質量比)の混合溶剤に溶解して得られた23質量%の溶液60質量部、を混合及び攪拌し、接着剤成分とした。ここに、疎水性シリカフィラー(製品名:R104、日本アエロジル株式会社製、平均粒径12μm)を分散させた。更に、ポリスチレンを核とした粒子の表面に、厚み0.2μmのニッケル層を設け、このニッケル層の外側に、厚み0.04μmの金層を設けた平均粒径20μmの導電粒子(10%圧縮弾性率(K値):410Kgf/mm2)を接着剤成分100質量部に対して10質量部分散させ、分散液を得た。この分散液を厚み50μmの片面を表面処理したPETフィルムに塗工装置を用いて塗布し、70℃で10分間熱風乾燥することにより、厚みが20μmの異方導電性の接着剤層(幅15cm、長さ70m)をPETフィルム上に備える導電性接着フィルムを得た。ここで、疎水性シリカフィラーの添加量は、接着剤層の全質量を基準(100質量%)として10質量%となる量とした。得られた導電性接着フィルムを3.0mm幅に裁断し、内径40mm、外径48mmのプラスチック製リールの側面(厚み3.4mm)に接着剤層面を内側にして50m巻きつけ、テープ状の導電性接着フィルムを得た。
疎水性シリカフィラーの添加量を表1のように変化させた以外は実施例1と同様にして、テープ状の導電性接着フィルムを得た。
接着剤層の厚みを表1のように変化させた以外は実施例3と同様にして、テープ状の導電性接着フィルムを得た。
実施例及び比較例で得られた導電性接着フィルム(直径1.0mmの円形形状)の接着剤層面を、70℃、0.5MPaで2秒間加熱加圧して薄膜ガラス(厚み0.7mm、15mm×15mm)に転写し、PETフィルムを剥離した。この接着剤層上に厚み0.7mm、15mm×15mmのガラス板を配置して2枚のガラス板で接着剤層を挟み、140℃、1.0MPa、10秒の条件で加熱加圧を行った。加熱加圧前の初期の接着剤層の主面の面積(A)mm2と加熱加圧後の接着剤層の主面の面積(B)mm2とを用いて表される流動値(B)/(A)を求めた。流動値(B)/(A)は異なるサンプル5個の測定値を平均して求めた。得られた結果を表1に示す。
接続抵抗の測定には、次のようにして得られた接続体を用いた。実施例、比較例で得られた導電性接着フィルム(幅3.0mm、長さ3.0mm)の接着剤層面を、70℃、0.5MPaで2秒間加熱加圧してアルミニウム箔(幅3.0mm、長さ40mm、厚み20μm)に転写し、PETフィルムを剥離した(図3の(a)及び(b)参照)。次いで、転写した接着剤層上に銅箔(幅3.0mm、長さ40mm、厚み20μm)を置き、24℃、0.5MPaで1秒間加圧して仮固定した。このとき、アルミニウム箔の長さ方向と銅箔の長さ方向とが直交するように配置した(図3の(c)参照)。この銅箔が仮固定されたアルミニウム箔を本圧着装置に設置し、200μm厚みのシリコーンゴムをクッション材として、アルミニウム箔側から、ヒートツールによって140℃、1.0MPaで10秒間加熱加圧して幅3.0mm、長さ3.0mmにわたり接続し、図3の(d)に示したような構造を有する評価用接続体1を得た。
本圧着時の加熱加圧条件を、140℃、0.5MPaで10秒間の低圧力条件とした以外は評価用接続体1の作製と同様にして、アルミニウム箔と銅箔とを接着剤層を介して幅3.0mm、長さ3.0mmにわたり接続し、図3の(d)に示したような構造を有する評価用接続体2を得た。
上述の評価用接続体1,2の接続部を含むアルミニウム箔と銅箔間の二端子間の抵抗値を、マルチメータ(装置名:TR6845、株式会社アドバンテスト製)で測定した。抵抗値は異なるサンプル5個の測定値を平均して求めた。得られた結果を表1に示す。
上述の評価用接続体1を剥離速度50mm/minで剥離することにより接着力の測定を行った。接着力は、引っ張り試験機(オリエンテック株式会社製)により測定した。結果を表1に示す。
Claims (9)
- 相対向する電極間に介在され、相対向する電極間を電気的に接続する導電性接着フィルムであって、
フィラー及び導電粒子を含有する接着剤層を備え、
前記フィラーの含有量が前記接着剤層の全質量を基準として5質量%以上30質量%未満であり、
前記導電粒子の平均粒径a(μm)と前記接着剤層の厚みb(μm)とが下記式(1)の関係を満たす、導電性接着フィルム。
a≧b …(1) - 前記導電粒子の平均粒径が1〜35μmである、請求項1に記載の導電性接着フィルム。
- 前記接着剤層が、加熱又は光によりラジカルを発生する硬化剤、ラジカル重合性物質、及び、フィルム形成材を更に含有する、請求項1又は2に記載の導電性接着フィルム。
- 前記導電粒子は、その表面の一部又は全部が、Au、Ni及びPbからなる群より選択される少なくとも1種を含む金属により被覆されている、請求項1〜3のいずれか一項に記載の導電性接着フィルム。
- 前記導電粒子が、核体と前記核体表面の一部又は全部を被覆する金属層とを有する、請求項1〜4のいずれか一項に記載の導電性接着フィルム。
- 前記核体が有機高分子化合物を含む、請求項5に記載の導電性接着フィルム。
- 前記フィラーが、シリカ及びアルミナからなる群より選択される少なくとも1種のフィラーを含む、請求項1〜6のいずれか一項に記載の導電性接着フィルム。
- 前記導電粒子の一部が、導電性接着フィルムの表面に露出している、請求項1〜7のいずれか一項に記載の導電性接着フィルム。
- 相対向する電極の少なくとも一方がアルミニウムを含む金属からなる電極である、請求項1〜8のいずれか一項に記載の導電性接着フィルム。
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WO2020067394A1 (ja) * | 2018-09-28 | 2020-04-02 | 日榮新化株式会社 | 粘着フィルム、複合膜、全固体電池及び複合膜の製造方法 |
WO2022202560A1 (ja) * | 2021-03-26 | 2022-09-29 | タツタ電線株式会社 | 導電性接着剤層 |
WO2024195597A1 (ja) * | 2023-03-23 | 2024-09-26 | デクセリアルズ株式会社 | フィラー含有フィルム、接合体及びその製造方法 |
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JP2016131152A (ja) * | 2015-01-13 | 2016-07-21 | デクセリアルズ株式会社 | 異方導電性フィルム |
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JP2009170898A (ja) * | 2007-12-17 | 2009-07-30 | Hitachi Chem Co Ltd | 回路接続材料及び回路部材の接続構造 |
JP2016131152A (ja) * | 2015-01-13 | 2016-07-21 | デクセリアルズ株式会社 | 異方導電性フィルム |
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WO2020067394A1 (ja) * | 2018-09-28 | 2020-04-02 | 日榮新化株式会社 | 粘着フィルム、複合膜、全固体電池及び複合膜の製造方法 |
JPWO2020067394A1 (ja) * | 2018-09-28 | 2021-09-02 | 日榮新化株式会社 | 粘着フィルム、複合膜、全固体電池及び複合膜の製造方法 |
JP7324517B2 (ja) | 2018-09-28 | 2023-08-10 | 日榮新化株式会社 | 粘着フィルム、複合膜、全固体電池及び複合膜の製造方法 |
WO2022202560A1 (ja) * | 2021-03-26 | 2022-09-29 | タツタ電線株式会社 | 導電性接着剤層 |
WO2024195597A1 (ja) * | 2023-03-23 | 2024-09-26 | デクセリアルズ株式会社 | フィラー含有フィルム、接合体及びその製造方法 |
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