JP2008311667A - 回路接続用異方導電性接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 - Google Patents
回路接続用異方導電性接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 Download PDFInfo
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- JP2008311667A JP2008311667A JP2008163711A JP2008163711A JP2008311667A JP 2008311667 A JP2008311667 A JP 2008311667A JP 2008163711 A JP2008163711 A JP 2008163711A JP 2008163711 A JP2008163711 A JP 2008163711A JP 2008311667 A JP2008311667 A JP 2008311667A
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Abstract
【解決手段】(1)接着剤組成物表面の表面張力の極性成分(γsv,p)が、1〜6dyne/cm、(2)表面が有機高分子化合物で被覆された導電粒子を必須成分として含有する回路接続用異方導電性接着剤組成物。第一の接続端子を有する第一の回路部材と、第二の接続端子を有する第二の回路部材とを、第一の接続端子と第二の接続端子を対向して配置し、前記対向配置した第一の接続端子と第二の接続端子の間に前記の回路接続用異方導電性接着剤組成物を介在させ、加熱加圧して前記対向配置した第一の接続端子と第二の接続端子を電気的に接続させる回路端子の接続方法。
【選択図】なし
Description
ビスフェノールA型エポキシ樹脂と9,9’−ビス(4−ヒドロキシフェニル)フルオレンからガラス転移温度が80℃のフェノキシ樹脂を合成した。この樹脂50gを重量比でトルエン/酢酸エチル=50/50の混合溶剤に溶解して、固形分40重量%の溶液とした。固形重量比でフェノキシ樹脂60g、ジシクロペンテニルジアルコールジアクリレート39g、リン酸エステル型アクリレート1g、t−ヘキシルパーオキシ−2−エチルヘキサノネート5gとなるように配合し、表面を有機高分子化合物(ポリビニルアルコールを使用)で0.01〜0.2μmとなるように被覆した導電粒子(ポリスチレンを核とする粒子の表面に、厚み0.2μmのニッケル層を設け、このニッケル層の外側に、厚み0.04μmの金層を設け、平均粒径5μmの導電粒子を使用)を5体積%配合分散させ、厚み80μmの片面を表面処理したPET(ポリエチレンテレフタレート)フィルムに塗工装置を用いて塗布し、70℃、10分の熱風乾燥により、接着剤層の厚みが10μmのフィルム状接着剤組成物を得た。また、固形重量比でフェノキシ樹脂60g、ジシクロペンテニルジアルコールジアクリレート39g、リン酸エステル型アクリレート1g、t−ヘキシルパーオキシ−2−エチルヘキサノネート5gとなるように配合し、厚み80μmの片面を表面処理したPET(ポリエチレンテレフタレート)フィルムに塗工装置を用いて塗布し、70℃、10分の熱風乾燥により、接着剤層の厚みが10μmのフィルム状接着剤組成物を得た。これらの接着剤組成物をラミネーターを用い貼り合わせ、二層構成のフィルム状接着剤組成物を得た。
固形重量比でフェノキシ樹脂50g、ジシクロペンテニルジアルコールジアクリレート49gとなるように配合した他は実施例1と同様にしてフィルム状接着剤組成物を得た。
導電粒子に、表面を有機高分子化合物で被覆しない導電粒子を用いた他は実施例1と同様にしてフィルム状接着剤組成物を得た。
固形重量比でフェノキシ樹脂40g、マイクロカプセル型潜在性硬化剤を含有する液状エポキシ樹脂(エポキシ当量185)60gとなるように配合した他は実施例1と同様にしてフィルム状接着剤組成物を得た。
バンプ面積50μm×50μm、ピッチ100μm、高さ20μmの金バンプを配置したICチップと厚み1.1mmのガラス上にインジユウム−錫酸化物(ITO)を蒸着により形成したITO基板(表面抵抗<20Ω/□)とを、上記接着剤組成物を用い、石英ガラスと加圧ヘッドで挟み、200℃、100MPa(金バンプ面積換算)で10秒間加熱加圧して接続した。このとき、フィルム状接着剤組成物はあらかじめITO基板上に、接着剤組成物の導電粒子がある接着面を70℃、0.5MPaで5秒間加熱加圧して貼り付け,その後、PETフィルムを剥離してICチップと接続した。
5mm×5mmの回路接続用樹脂組成物からなる回路接続用異方導電性接着剤組成物の表面に、水及びジヨードメタンを滴下し(23℃)、接触角を測定することで接着剤組成物における表面張力の極性成分の植を求めた。
回路の接続後上記接続部の電気抵抗値を、初期と、−40℃/30minと100/30minの温度サイクル槽中に500サイクル保持した後に2端子測定法を用いマルチメータで測定した。
回路の接続後上記接続部に、直流(DC)50Vの電圧を1分間印加し、印加後の絶縁抵抗を、2端子測定法を用いマルチメータで測定した。それらの結果を纏めて表1に示した。
Claims (11)
- (1)接着剤組成物表面の表面張力の極性成分(γsv,p)が、1〜6dyne/cm、(2)表面が有機高分子化合物で被覆された導電粒子を必須成分として含有する回路接続用異方導電性接着剤組成物。
- 回路接続用異方導電性接着剤組成物が、(1)加熱により遊離ラジカルを発生する硬化剤、(2)ラジカル重合性物質、(3)フィルム形成材からなる請求項1に記載の回路接続用異方導電性接着剤組成物。
- フィルム形成材がフェノキシ樹脂である請求項2に記載の回路接続用異方導電性接着剤組成物。
- フェノキシ樹脂が、分子内に多環芳香族化合物に起因する分子構造を有する請求項3に記載の回路接続用異方導電性接着剤組成物。
- 多環芳香族化合物に起因する分子構造が、フルオレン環である請求項4に記載の回路接続用異方導電性接着剤組成物。
- 第一の接続端子を有する第一の回路部材と、第二の接続端子を有する第二の回路部材とを、第一の接続端子と第二の接続端子を対向して配置し、前記対向配置した第一の接続端子と第二の接続端子の間に請求項1ないし請求項5のいずれかに記載の回路接続用異方導電性接着剤組成物を介在させ、加熱加圧して前記対向配置した第一の接続端子と第二の接続端子を電気的に接続させる回路端子の接続方法。
- 請求項6に記載の回路端子の接続方法により得られる回路接続構造体であって、回路端子に直流50V印加した際に隣接電極間の絶縁抵抗が109Ω以上である回路接続構造体。
- 少なくとも一方の接続端子を有する回路部材が、ICチップである請求項7に記載の回路接続構造体。
- ICチップの接続端子と、第二の回路部材上との接続端子間の接続抵抗が、1Ω以下である請求項7または請求項8に記載の回路接続構造体。
- 少なくとも一方の接続端子の表面が金、銀、錫、白金族の金属、インジユウム−錫酸化物(ITO)から選ばれる少なくとも一種で構成される請求項7ないし請求項9のいずれかに記載の回路接続構造体。
- 少なくとも一方の回路部材表面が窒化シリコン、シリコーン化合物、ポリイミド樹脂から選ばれる少なくとも一種でコーティングまたは付着されている請求項7ないし請求項10のいずれかに記載の回路接続構造体。
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JP2000067647A (ja) * | 1998-08-25 | 2000-03-03 | Sekisui Chem Co Ltd | 絶縁被覆導電性微粒子、異方性導電接着剤及び導電接続構造体 |
JP2000129157A (ja) * | 1998-10-21 | 2000-05-09 | Sekisui Chem Co Ltd | 絶縁被覆導電性微粒子、異方性導電接着剤及び導電接続構造体 |
JP2001323224A (ja) * | 2000-05-17 | 2001-11-22 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP2002052333A (ja) * | 2000-08-09 | 2002-02-19 | Sekisui Chem Co Ltd | 微粒子の被覆方法、被覆微粒子、異方性導電接着剤、異方性導電接合膜及び導電接続構造体 |
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JP2000067647A (ja) * | 1998-08-25 | 2000-03-03 | Sekisui Chem Co Ltd | 絶縁被覆導電性微粒子、異方性導電接着剤及び導電接続構造体 |
JP2000129157A (ja) * | 1998-10-21 | 2000-05-09 | Sekisui Chem Co Ltd | 絶縁被覆導電性微粒子、異方性導電接着剤及び導電接続構造体 |
JP2001323224A (ja) * | 2000-05-17 | 2001-11-22 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
JP2002052333A (ja) * | 2000-08-09 | 2002-02-19 | Sekisui Chem Co Ltd | 微粒子の被覆方法、被覆微粒子、異方性導電接着剤、異方性導電接合膜及び導電接続構造体 |
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