JP2010034045A - 回路接続材料及び回路接続構造体 - Google Patents
回路接続材料及び回路接続構造体 Download PDFInfo
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- JP2010034045A JP2010034045A JP2009155513A JP2009155513A JP2010034045A JP 2010034045 A JP2010034045 A JP 2010034045A JP 2009155513 A JP2009155513 A JP 2009155513A JP 2009155513 A JP2009155513 A JP 2009155513A JP 2010034045 A JP2010034045 A JP 2010034045A
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- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
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- 125000003700 epoxy group Chemical group 0.000 description 1
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- MHCLJIVVJQQNKQ-UHFFFAOYSA-N ethyl carbamate;2-methylprop-2-enoic acid Chemical compound CCOC(N)=O.CC(=C)C(O)=O MHCLJIVVJQQNKQ-UHFFFAOYSA-N 0.000 description 1
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- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
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- 150000002500 ions Chemical class 0.000 description 1
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
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- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 229940059574 pentaerithrityl Drugs 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
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- 229920000768 polyamine Chemical class 0.000 description 1
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- POSICDHOUBKJKP-UHFFFAOYSA-N prop-2-enoxybenzene Chemical compound C=CCOC1=CC=CC=C1 POSICDHOUBKJKP-UHFFFAOYSA-N 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
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- 150000003839 salts Chemical class 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
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- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- 238000003786 synthesis reaction Methods 0.000 description 1
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- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
- C09D175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
- C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09D175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
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Abstract
【解決手段】 相対峙する回路電極間に介在され、相対向する回路電極を加圧し加圧方向の電極間を電気的に接続する回路接続材料であって、接着剤成分51と、表面の少なくとも一部が絶縁被覆体で被覆された第一の導電粒子10と、表面の少なくとも一部がNi又はその合金若しくは酸化物、或いは、ビッカース硬度300Hv以上の金属、合金又は金属酸化物で被覆され、且つ、突起を有する第二の導電粒子20と、を含有し、第一の導電粒子10と第二の導電粒子20との個数比(第一の導電粒子の個数/第二の導電粒子の個数)が0.4〜3である、回路接続材料。
【選択図】 図4
Description
ゲル分率(%)=(質量B/質量A)×100
[ウレタンアクリレートの合成]
重量平均分子量800のポリカプロラクトンジオール400質量部、2−ヒドロキシプロピルアクリレート131質量部、触媒としてのジブチル錫ジラウレート0.5質量部、及び、重合禁止剤としてのハイドロキノンモノメチルエーテル1.0質量部を、攪拌しながら50℃に加熱して混合した。
ジカルボン酸としてのテレフタル酸、ジオールとしてのプロピレングリコール、イソシアネートとしての4,4’−ジフェニルメタンジイソシアネートを、テレフタル酸/プロピレングリコール/4,4’−ジフェニルメタンジイソシアネートのモル比が1.0/1.3/0.25となるような量で用い、ポリエステルウレタン樹脂を以下の手順で調製した。
核となるポリスチレンからなる粒子の表面に、厚み0.2μmのニッケル層を設け、このニッケル層の外側に、厚み0.04μmの金層を設けた平均粒径4μmの導電粒子を準備した。一方、スチレン−(メタ)アクリル共重合体からなる絶縁性粒子を準備した。ハイブリダイザーを用いて、上記導電粒子の表面を上記絶縁性粒子で被覆し、第一の導電粒子aを準備した。この第一の導電粒子aのD2/D1は1/12であり、被覆率は50%であった。
核となるポリスチレンからなる粒子の表面に、厚み0.2μmのニッケル層を設け、このニッケル層の外側にNi突起を設けた、平均粒径4μmの第二の導電粒子aを準備した。この第二の導電粒子aのNiのビッカース硬度は350Hv、突起の高さは120nm、突起間距離は420nmであった。
ラジカル重合性物質としての上記ウレタンアクリレート30質量部及びイソシアヌレート型アクリレート(製品名:M−325、東亞合成社製)20質量部、2−メタクリロイロキシエチルアシッドホスフェート(製品名:P−2M、共栄社化学社製)1質量部、遊離ラジカル発生剤としてのベンゾイルパーオキサイド(製品名:ナイパーBMT−K40、日本油脂社製)3質量部、並びに、上記ポリエステルウレタン樹脂の20質量%メチルエチルケトン溶液60質量部(固形分:12質量部)を混合し、攪拌して接着剤成分とした。
第一の導電粒子a及び第二の導電粒子aの配合量を、表1に示すように変化させた以外は実施例1と同様にして、実施例2〜3のテープ状の回路接続材料を得た。
[第一の導電粒子bの作製]
核となるポリスチレンからなる粒子の表面に、厚み0.09μmのニッケル層を設け、このニッケル層の外側に、厚み0.03μmの金層を設けた平均粒径3μmの導電粒子を準備した。一方、スチレン−(メタ)アクリル共重合体からなる絶縁性粒子を準備した。ハイブリダイザーを用いて、上記導電粒子の表面を上記絶縁性粒子で被覆し、第一の導電粒子bを準備した。この第一の導電粒子bのD2/D1は1/15であり、被覆率は55%であった。
核となるポリスチレンからなる粒子の表面に、厚み0.1μmのニッケル層を設け、このニッケル層の外側にNi突起を設けた、平均粒径3μmの第二の導電粒子bを準備した。この第二の導電粒子bのNiのビッカース硬度は350Hv、突起の高さは100nm、突起間距離は200nmであった。
第一の導電粒子a及び第二の導電粒子aに代えて、第一の導電粒子b及び第二の導電粒子bを用い、それらの配合量を表1に示す量とした以外は実施例1と同様にして、実施例4〜6のテープ状の回路接続材料を得た。
[Au被覆導電粒子の作製]
核となるポリスチレンからなる粒子の表面に、厚み0.2μmのニッケル層を設け、このニッケル層の外側に厚み0.04μmの金層を設けた、平均粒径4μmのAu被覆導電粒子を準備した。このAu被覆導電粒子のAuのビッカース硬度は150Hvであった。
表2に示す導電粒子を同表に示す配合量で用いた以外は実施例1と同様にして、比較例1〜7のテープ状の回路接続材料を得た。
回路部材として、厚み0.7mmのITOコートガラス基板(15〜20Ω/□、全面電極)、及び、厚み0.7mmのCr/IZO[Al(2000Å)+Cr(500Å)+IZO(1000Å)、全面電極]コートガラス基板の2種類の回路部材を用意した。
得られた回路接続構造体について、FPCの回路電極と、該回路電極に対向するITOコートガラス基板又はCr/IZOコートガラス基板の回路電極との間の接続抵抗を、マルチメータ(装置名:TR6845、アドバンテスト社製)により測定した。接続抵抗は、対向する回路電極間の抵抗値40点を測定し、それらの平均値として求めた。得られた結果を表3〜4に示す。
厚み38μmのポリイミドフィルムと、ライン幅50μm、スペース幅50μm、厚み1000ÅのITO電極が50μmピッチで形成されたガラス基板とを、上記実施例及び比較例で得られた回路接続材料(幅1.5mm及び長さ3cm)を介して圧着した。このとき、ガラスエッジ部に導電粒子の凝集が発生した。図6は、ITO電極が形成されたガラス基板のエッジ部に導電粒子の凝集が発生した場合の外観を示す接続体写真である。図6は、接続体をガラス基板側から撮影した写真であり、ITO電極15が形成されたガラス基板のエッジ部17に導電粒子の凝集16が生じているのが確認できる。なお、図中の18は、基板外への樹脂フロー部である。そして、図6に示すように、ガラス基板のエッジ部17に導電粒子の凝集16が生じた場合、絶縁性の低い回路接続材料では隣接するITO電極15間で短絡が生じて接続抵抗が得られることになる。
Claims (11)
- 相対峙する回路電極間に介在され、相対向する回路電極を加圧し加圧方向の電極間を電気的に接続する回路接続材料であって、
接着剤成分と、
表面の少なくとも一部が絶縁被覆体で被覆された第一の導電粒子と、
表面の少なくとも一部がNi又はその合金若しくは酸化物で被覆され、且つ、突起を有する第二の導電粒子と、を含有し、
前記第一の導電粒子と前記第二の導電粒子との個数比(第一の導電粒子の個数/第二の導電粒子の個数)が0.4〜3である、回路接続材料。 - 相対峙する回路電極間に介在され、相対向する回路電極を加圧し加圧方向の電極間を電気的に接続する回路接続材料であって、
接着剤成分と、
表面の少なくとも一部が絶縁被覆体で被覆された第一の導電粒子と、
表面の少なくとも一部がビッカース硬度300Hv以上の金属、合金又は金属酸化物で被覆され、且つ、突起を有する第二の導電粒子と、を含有し、
前記第一の導電粒子と前記第二の導電粒子との個数比(第一の導電粒子の個数/第二の導電粒子の個数)が0.4〜3である、回路接続材料。 - 前記第一の導電粒子と前記第二の導電粒子との体積比(第一の導電粒子の体積/第二の導電粒子の体積)が0.4〜3である、請求項1又は2記載の回路接続材料。
- 前記第二の導電粒子において、前記突起の高さが50〜500nmであり、隣接する前記突起間の距離が1000nm以下である、請求項1〜3のいずれか一項に記載の回路接続材料。
- 前記第一の導電粒子において、被覆率が20〜70%となるように前記絶縁被覆体が設けられている、請求項1〜4のいずれか一項に記載の回路接続材料。
- 前記第一の導電粒子は、導電性を有する核粒子と、該核粒子の表面上に設けられた複数の絶縁性粒子を含む前記絶縁被覆体と、を備え、
前記絶縁性粒子の平均粒径(D2)と前記核粒子の平均粒径(D1)との比(D2/D1)が1/10以下である、請求項1〜5のいずれか一項に記載の回路接続材料。 - 前記第一の導電粒子は、導電性を有する核粒子と、該核粒子の表面上に設けられた有機高分子化合物を含有する絶縁性層を含む前記絶縁被覆体と、を備え、
前記絶縁性層の厚さ(T2)と前記核粒子の平均粒径(D1)との比(T2/D1)が1/10以下である、請求項1〜6のいずれか一項に記載の回路接続材料。 - 前記第一の導電粒子及び前記第二の導電粒子の平均粒径が、いずれも2〜6μmの範囲内である、請求項1〜7のいずれか一項に記載の回路接続材料。
- 第一の回路電極を有する第一の回路部材と、第二の回路電極を有する第二の回路部材とを、前記第一の回路電極と前記第二の回路電極とが対向するように配置し、対向配置した前記第一の回路電極と前記第二の回路電極との間に、請求項1〜8のいずれか一項に記載の回路接続材料を介在させ、加熱加圧することにより、対向配置した前記第一の回路電極と前記第二の回路電極とを電気的に接続させてなる、回路接続構造体。
- 前記第一の回路電極及び前記第二の回路電極の少なくとも一方がITO電極である、請求項9記載の回路接続構造体。
- 前記第一の回路電極及び前記第二の回路電極の少なくとも一方がIZO電極である、請求項9記載の回路接続構造体。
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JP2020173960A (ja) * | 2019-04-10 | 2020-10-22 | 日本化学工業株式会社 | 被覆粒子 |
JP7358065B2 (ja) | 2019-04-10 | 2023-10-10 | 日本化学工業株式会社 | 被覆粒子 |
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JP4862921B2 (ja) | 2012-01-25 |
KR20110019392A (ko) | 2011-02-25 |
WO2010001900A1 (ja) | 2010-01-07 |
CN102047347A (zh) | 2011-05-04 |
CN102047347B (zh) | 2012-11-28 |
TW201015588A (en) | 2010-04-16 |
TWI398880B (zh) | 2013-06-11 |
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