KR20080103462A - 접착제 조성물 - Google Patents
접착제 조성물 Download PDFInfo
- Publication number
- KR20080103462A KR20080103462A KR1020080048080A KR20080048080A KR20080103462A KR 20080103462 A KR20080103462 A KR 20080103462A KR 1020080048080 A KR1020080048080 A KR 1020080048080A KR 20080048080 A KR20080048080 A KR 20080048080A KR 20080103462 A KR20080103462 A KR 20080103462A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive composition
- formula
- urethane resin
- adhesive
- resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (4)
- (A) 측쇄에 (메트)아크릴레이트기를 가지고, 중량 평균 분자량이 10,000 내지 500,000인 우레탄 수지, 및(B) 광 조사 또는 가열에 의해 유리 라디칼을 발생시키는 경화제를 함유하고,상기 (A) 우레탄 수지가 하기 화학식 I로 표시되는 공중합체를 포함하는 것인 접착제 조성물.<화학식 I>[식 I 중, X는 디이소시아네이트 잔기를 나타내고, Y는 디올 잔기를 나타내고, n은 1 내지 100의 정수를 나타내며, 단, Y로 표시되는 디올 잔기 중 10 내지 90 몰%는 하기 화학식 II로 표시되는 구조를 갖는 기이면서 Y로 표시되는 디올 잔기 중 10 내지 90 몰%는 중량 평균 분자량 500 이상의 디올 잔기이다.]<화학식 II>[식 II 중, Z는 2가의 유기기를 나타내고, R1 및 R2는 각각 독립적으로 수소 원자 또는 메틸기를 나타낸다.]
- 제1항에 있어서, (C) 열가소성 수지 및/또는 열가소성 엘라스토머를 더 함유하는 접착제 조성물.
- 제1항 또는 제2항에 있어서, (D) 라디칼 중합성 물질을 더 함유하는 접착제 조성물.
- 제1항 또는 제2항에 있어서, (E) 도전 입자를 더 함유하는 접착제 조성물.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2007-00137790 | 2007-05-24 | ||
JP2007137790 | 2007-05-24 | ||
JPJP-P-2007-00259101 | 2007-10-02 | ||
JP2007259101A JP5067101B2 (ja) | 2007-05-24 | 2007-10-02 | 接着剤組成物 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100136474A Division KR20110003306A (ko) | 2007-05-24 | 2010-12-28 | 접착제 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080103462A true KR20080103462A (ko) | 2008-11-27 |
KR101081290B1 KR101081290B1 (ko) | 2011-11-08 |
Family
ID=40288815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080048080A KR101081290B1 (ko) | 2007-05-24 | 2008-05-23 | 접착제 조성물 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101081290B1 (ko) |
-
2008
- 2008-05-23 KR KR1020080048080A patent/KR101081290B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR101081290B1 (ko) | 2011-11-08 |
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