TWI398880B - Circuit connection material and circuit connection structure - Google Patents
Circuit connection material and circuit connection structure Download PDFInfo
- Publication number
- TWI398880B TWI398880B TW098122278A TW98122278A TWI398880B TW I398880 B TWI398880 B TW I398880B TW 098122278 A TW098122278 A TW 098122278A TW 98122278 A TW98122278 A TW 98122278A TW I398880 B TWI398880 B TW I398880B
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- circuit
- conductive particles
- particles
- conductive
- electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
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- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
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JP2008172265 | 2008-07-01 |
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TW201015588A TW201015588A (en) | 2010-04-16 |
TWI398880B true TWI398880B (zh) | 2013-06-11 |
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TW098122278A TWI398880B (zh) | 2008-07-01 | 2009-07-01 | Circuit connection material and circuit connection structure |
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JP (1) | JP4862921B2 (ja) |
KR (1) | KR20110019392A (ja) |
CN (1) | CN102047347B (ja) |
TW (1) | TWI398880B (ja) |
WO (1) | WO2010001900A1 (ja) |
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JP5375374B2 (ja) * | 2009-07-02 | 2013-12-25 | 日立化成株式会社 | 回路接続材料及び回路接続構造体 |
JP5476168B2 (ja) * | 2010-03-09 | 2014-04-23 | 積水化学工業株式会社 | 導電性粒子、異方性導電材料及び接続構造体 |
JP5668636B2 (ja) * | 2010-08-24 | 2015-02-12 | 日立化成株式会社 | 回路接続構造体の製造方法 |
JP5184612B2 (ja) * | 2010-11-22 | 2013-04-17 | 日本化学工業株式会社 | 導電性粉体、それを含む導電性材料及びその製造方法 |
JP2014149918A (ja) * | 2011-06-06 | 2014-08-21 | Hitachi Chemical Co Ltd | フィルム状回路接続材料及び回路接続構造体 |
JP6165626B2 (ja) * | 2012-01-20 | 2017-07-19 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
JP6079425B2 (ja) * | 2012-05-16 | 2017-02-15 | 日立化成株式会社 | 導電粒子、異方性導電接着剤フィルム及び接続構造体 |
CN104380392B (zh) * | 2012-07-03 | 2016-11-23 | 积水化学工业株式会社 | 带绝缘性粒子的导电性粒子、导电材料及连接结构体 |
JP6119130B2 (ja) * | 2012-07-11 | 2017-04-26 | 日立化成株式会社 | 複合粒子及び異方導電性接着剤 |
JP5636118B2 (ja) * | 2012-10-02 | 2014-12-03 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
JP6149683B2 (ja) * | 2013-10-18 | 2017-06-21 | 日立化成株式会社 | フィルム状回路接続材料及びこれを用いた接続構造体 |
JP6119718B2 (ja) * | 2013-11-19 | 2017-04-26 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
WO2015076234A1 (ja) | 2013-11-19 | 2015-05-28 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
KR20160106004A (ko) * | 2014-01-08 | 2016-09-09 | 세키스이가가쿠 고교가부시키가이샤 | 백 콘택트 방식의 태양 전지 모듈용 도전성 입자, 도전 재료 및 태양 전지 모듈 |
JPWO2015105120A1 (ja) * | 2014-01-08 | 2017-03-23 | 積水化学工業株式会社 | バックコンタクト方式の太陽電池モジュール用導電性粒子、導電材料及び太陽電池モジュール |
CN105940461B (zh) * | 2014-02-05 | 2018-06-15 | 国立研究开发法人科学技术振兴机构 | 伸缩性导电体及其制造方法和伸缩性导电体形成用糊料 |
KR102430609B1 (ko) * | 2014-03-31 | 2022-08-08 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 및 그 제조 방법 |
JP6523794B2 (ja) * | 2014-06-06 | 2019-06-05 | 積水化学工業株式会社 | 導電材料及び接続構造体 |
KR102529562B1 (ko) * | 2015-05-20 | 2023-05-09 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 점착재 및 도전성 기재 부착 도전성 점착재 |
CN107709414B (zh) * | 2015-11-11 | 2021-12-28 | 积水化学工业株式会社 | 粒子、粒子材料、连接材料及连接结构体 |
JP6652513B2 (ja) * | 2016-03-03 | 2020-02-26 | 信越化学工業株式会社 | 生体電極の製造方法 |
CN106367016A (zh) * | 2016-08-29 | 2017-02-01 | 无锡万能胶粘剂有限公司 | 一种粉胶浆 |
CN113078486B (zh) * | 2016-10-24 | 2023-10-20 | 迪睿合株式会社 | 各向异性导电膜的制造方法 |
JP7077963B2 (ja) * | 2017-01-27 | 2022-05-31 | 昭和電工マテリアルズ株式会社 | 絶縁被覆導電粒子、異方導電フィルム、異方導電フィルムの製造方法、接続構造体及び接続構造体の製造方法 |
JPWO2018230470A1 (ja) * | 2017-06-12 | 2020-03-19 | 積水化学工業株式会社 | 樹脂粒子、導電性粒子、導電材料、接着剤、接続構造体及び液晶表示素子 |
JP7358065B2 (ja) * | 2019-04-10 | 2023-10-10 | 日本化学工業株式会社 | 被覆粒子 |
JP6836729B2 (ja) * | 2019-09-18 | 2021-03-03 | 日立金属株式会社 | 圧着端子、端子付き電線及び端子付き電線の製造方法 |
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2009
- 2009-06-30 WO PCT/JP2009/061974 patent/WO2010001900A1/ja active Application Filing
- 2009-06-30 JP JP2009155513A patent/JP4862921B2/ja active Active
- 2009-06-30 CN CN2009801200765A patent/CN102047347B/zh not_active Expired - Fee Related
- 2009-06-30 KR KR1020107029715A patent/KR20110019392A/ko active Search and Examination
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WO2007099965A1 (ja) * | 2006-02-27 | 2007-09-07 | Hitachi Chemical Company, Ltd. | 回路接続材料、これを用いた回路部材の接続構造及びその製造方法 |
WO2008053873A1 (en) * | 2006-10-31 | 2008-05-08 | Hitachi Chemical Company, Ltd. | Circuit connection structure |
Also Published As
Publication number | Publication date |
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CN102047347B (zh) | 2012-11-28 |
TW201015588A (en) | 2010-04-16 |
KR20110019392A (ko) | 2011-02-25 |
JP2010034045A (ja) | 2010-02-12 |
CN102047347A (zh) | 2011-05-04 |
WO2010001900A1 (ja) | 2010-01-07 |
JP4862921B2 (ja) | 2012-01-25 |
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