KR20110019392A - 회로 접속 재료 및 회로 접속 구조체 - Google Patents
회로 접속 재료 및 회로 접속 구조체 Download PDFInfo
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- KR20110019392A KR20110019392A KR1020107029715A KR20107029715A KR20110019392A KR 20110019392 A KR20110019392 A KR 20110019392A KR 1020107029715 A KR1020107029715 A KR 1020107029715A KR 20107029715 A KR20107029715 A KR 20107029715A KR 20110019392 A KR20110019392 A KR 20110019392A
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- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2008172265 | 2008-07-01 | ||
JPJP-P-2008-172265 | 2008-07-01 |
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KR20110019392A true KR20110019392A (ko) | 2011-02-25 |
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KR1020107029715A KR20110019392A (ko) | 2008-07-01 | 2009-06-30 | 회로 접속 재료 및 회로 접속 구조체 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4862921B2 (ja) |
KR (1) | KR20110019392A (ja) |
CN (1) | CN102047347B (ja) |
TW (1) | TWI398880B (ja) |
WO (1) | WO2010001900A1 (ja) |
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KR20200018377A (ko) * | 2017-06-12 | 2020-02-19 | 세키스이가가쿠 고교가부시키가이샤 | 수지 입자, 도전성 입자, 도전 재료, 접착제, 접속 구조체 및 액정 표시 소자 |
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JP5375374B2 (ja) * | 2009-07-02 | 2013-12-25 | 日立化成株式会社 | 回路接続材料及び回路接続構造体 |
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JP2014149918A (ja) * | 2011-06-06 | 2014-08-21 | Hitachi Chemical Co Ltd | フィルム状回路接続材料及び回路接続構造体 |
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JP6149683B2 (ja) * | 2013-10-18 | 2017-06-21 | 日立化成株式会社 | フィルム状回路接続材料及びこれを用いた接続構造体 |
JP6119718B2 (ja) * | 2013-11-19 | 2017-04-26 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
WO2015076234A1 (ja) | 2013-11-19 | 2015-05-28 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
KR20160106562A (ko) * | 2014-01-08 | 2016-09-12 | 세키스이가가쿠 고교가부시키가이샤 | 백 콘택트 방식의 태양 전지 모듈용 도전성 입자, 도전 재료 및 태양 전지 모듈 |
KR20160106004A (ko) * | 2014-01-08 | 2016-09-09 | 세키스이가가쿠 고교가부시키가이샤 | 백 콘택트 방식의 태양 전지 모듈용 도전성 입자, 도전 재료 및 태양 전지 모듈 |
US10176903B2 (en) | 2014-02-05 | 2019-01-08 | Japan Science And Technology Agency | Stretchable conductor, method for manufacturing same, and paste for forming stretchable conductor |
WO2015151874A1 (ja) * | 2014-03-31 | 2015-10-08 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
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JPH0371570A (ja) * | 1989-08-10 | 1991-03-27 | Casio Comput Co Ltd | 導電用結合剤および導電接続構造 |
JP3083535B2 (ja) * | 1990-06-01 | 2000-09-04 | 積水化学工業株式会社 | 導電性微粒子及び導電性接着剤 |
JP2004047228A (ja) * | 2002-07-10 | 2004-02-12 | Bridgestone Corp | 異方性導電フィルム及び電極付き基板の接着方法 |
JP2004265823A (ja) * | 2003-03-04 | 2004-09-24 | Asahi Kasei Electronics Co Ltd | 異方導電性フィルム及びその接続体 |
EP1608040A4 (en) * | 2003-03-26 | 2007-11-14 | Jsr Corp | ANISOTROPER CONDUCTIVE CONNECTOR, CONDUCTIVE PASTE COMPOSITION, SONDER, WAFER INSPECTION DEVICE AND WAFER SEARCH METHOD |
JP4387175B2 (ja) * | 2003-07-07 | 2009-12-16 | 積水化学工業株式会社 | 被覆導電性粒子、異方性導電材料及び導電接続構造体 |
JP5247968B2 (ja) * | 2003-12-02 | 2013-07-24 | 日立化成株式会社 | 回路接続材料、及びこれを用いた回路部材の接続構造 |
JP3914206B2 (ja) * | 2004-01-30 | 2007-05-16 | 積水化学工業株式会社 | 導電性微粒子及び異方性導電材料 |
JP4593302B2 (ja) * | 2005-02-03 | 2010-12-08 | 積水化学工業株式会社 | 導電性微粒子及び異方性導電材料 |
JP4860163B2 (ja) * | 2005-02-15 | 2012-01-25 | 積水化学工業株式会社 | 導電性微粒子の製造方法 |
CN101309993B (zh) * | 2005-11-18 | 2012-06-27 | 日立化成工业株式会社 | 粘接剂组合物、电路连接材料、连接结构及电路部件连接方法 |
JP4735229B2 (ja) * | 2005-12-12 | 2011-07-27 | 住友ベークライト株式会社 | 異方導電性フィルム |
TW200739612A (en) * | 2006-02-27 | 2007-10-16 | Hitachi Chemical Co Ltd | Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure |
JP2007287654A (ja) * | 2006-03-23 | 2007-11-01 | Alps Electric Co Ltd | 接続装置 |
JP4737177B2 (ja) * | 2006-10-31 | 2011-07-27 | 日立化成工業株式会社 | 回路接続構造体 |
-
2009
- 2009-06-30 JP JP2009155513A patent/JP4862921B2/ja active Active
- 2009-06-30 WO PCT/JP2009/061974 patent/WO2010001900A1/ja active Application Filing
- 2009-06-30 CN CN2009801200765A patent/CN102047347B/zh not_active Expired - Fee Related
- 2009-06-30 KR KR1020107029715A patent/KR20110019392A/ko active Search and Examination
- 2009-07-01 TW TW098122278A patent/TWI398880B/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170103673A (ko) * | 2016-03-03 | 2017-09-13 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 생체 전극 및 그 제조 방법 |
KR20200018377A (ko) * | 2017-06-12 | 2020-02-19 | 세키스이가가쿠 고교가부시키가이샤 | 수지 입자, 도전성 입자, 도전 재료, 접착제, 접속 구조체 및 액정 표시 소자 |
Also Published As
Publication number | Publication date |
---|---|
TWI398880B (zh) | 2013-06-11 |
CN102047347A (zh) | 2011-05-04 |
JP4862921B2 (ja) | 2012-01-25 |
WO2010001900A1 (ja) | 2010-01-07 |
CN102047347B (zh) | 2012-11-28 |
TW201015588A (en) | 2010-04-16 |
JP2010034045A (ja) | 2010-02-12 |
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