TW200924569A - Circuit member connecting structure - Google Patents

Abstract

In a circuit member connecting structure (1), a circuit connecting material containing a plurality of conductive particles (12) is arranged between a first circuit member (30) having a first circuit electrode (32) and a second circuit member (40), which faces the first circuit member (30) and has a second circuit electrode (42), and a current is carried between the first circuit electrode (32) and the second circuit electrode (42). Furthermore, the circuit member connecting structure (1) is provided with at least one connection area where a current is carried between the first circuit electrode (32) and the second circuit electrode (42) through two conductive particles (12). A part of the outermost layer (22) of the conductive particle (12) is protruded outward and a plurality of protruding sections (14) are formed. The outermost layer (22) is made of a metal having a Vickers hardness of 300HV or more.

Description

200924569 IX. Description of the Invention [Technical Field of the Invention] The present invention relates to a connection structure of a circuit member. [Prior Art] A connection between a liquid crystal display and a TaPe Carrier Package (TCP), a connection between a flexible printed circuit (FPC) and a TCP, or a mutual circuit in which an FPC and a printed wiring board are connected When connecting the members, a circuit connecting material (for example, an anisotropic conductive adhesive) that disperses the conductive particles in the adhesive is used. Further, recently, when a semiconductor germanium wafer is mounted on a substrate, the semiconductor germanium wafer is directly mounted on the substrate, that is, flip-chip mounting, in order to connect the circuit members to each other without using wire bonding. In the flip chip mounting, a circuit connecting material such as an anisotropic conductive adhesive is used when the circuit members are connected to each other (e.g., Patent Documents 1 to 5). Patent Document 1: Japanese Laid-Open Patent Publication No. JP-A No. SHO-A No. SHO-A No. SHO-A No. s. In the recent years, the miniaturization of the electronic device has been reduced in thickness, and the circuit formed in the circuit member has been thinned in recent years. Patent Publication No. JP-A No. 2001-189171. With the progress of high density, the width of the circuit electrode is extremely narrow between the adjacent circuit electrodes, and the surface area of the circuit electrode tends to decrease. When the surface area of the circuit electrode is reduced, the number of conductive particles collected between the opposing circuit electrodes is also reduced, so that the connection resistance between the circuit electrodes is increased, resulting in a problem of poor connection between the circuit electrodes. As a method for canceling the above-described connection failure between the circuit electrodes, it is considered to increase the amount of the conductive particles in the circuit connecting material, and to increase the number of conductive particles collected between the circuit electrodes. However, when the amount of the conductive particles is increased, short-circuiting occurs when the conductive particles which are not electrically connected between the circuit electrodes are brought into contact with the conductive particles collected between the adjacent circuit electrodes. As a method for canceling the above-described short-circuiting, a method of coating the surface of the conductive particles with an electrically insulating film is disclosed (for example, Patent Document 6 mentioned above). However, when conductive particles having an insulating coating on the surface are used, the connection resistance between the circuit electrodes tends to be higher than when the conductive particles without the coating are used. Therefore, in order to obtain a stable connection resistance, the number of conductive particles collected between the opposing circuit electrodes must be increased. As a result, the amount of conductive particles in the circuit connection material becomes excessive, so that the manufacturing cost of the circuit connection material is increased. . SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides a connection structure of a circuit member capable of achieving a good electrical connection between opposing circuit electrodes and capable of sufficiently improving long-term reliability of electrical characteristics between circuit electrodes. For its purpose. The inventors of the present invention have found that the surface shape of the conductive particles and the material of the outermost layer affect the electrical connection and electrical characteristics of the circuit electrodes in a long-term reliability. That is, the inventors have found that the surface of the conductive particles contained in the circuit connecting material of the prior art is flat. Therefore, when the circuit is connected, the surface of the conductive particles affects the pressure of the adhesive composition, and the conductive particles and the electrodes cannot be sufficiently excluded. The adhesive composition between them causes the conductive particles to fail to make sufficient contact with the circuit electrodes, resulting in insufficient electrical connection between the circuit electrodes. Further, the inventors have found that the outermost layer of the conductive particles contained in the circuit connecting material of the prior art is an Au film of a soft metal, so that the outermost layer of the circuit electrode and the conductive particles is deformed, and the outermost layer is less likely to enter the circuit electrode. On the other hand, the inventors have found that the provision of the protrusions on the surface (outermost layer) of the conductive particles defines the hardness of the outermost layer, and the necessary minimum number of conductive particles are interposed between the circuit electrodes, thereby achieving good between the circuit electrodes. The present invention can be completed by electrically connecting and simultaneously improving the long-term reliability of electrical characteristics between circuit electrodes. The connection structure (connection structure) of the circuit member according to the present invention is characterized in that the second circuit member having the first circuit electrode and the second circuit member having the second circuit electrode facing the second circuit member are characterized by In a connection structure of a circuit member in which a first circuit electrode and a second circuit electrode are energized by a circuit connecting material including a plurality of conductive particles, at least a connection between a first circuit electrode and a second circuit electrode through which two conductive particles are energized is provided. In one place, a part of the outermost layer of the conductive particles protrudes from the outer side, and a plurality of protrusions are formed, and the outermost layer is made of a metal having a Vickers hardness of 300 volts or more. In the present invention, the conductive particles affect the adhesive group in the circuit connecting material. The pressure of the resultant is concentrated on the protrusions, so that the conductive particles lacking the protrusions are larger than the pressure of the adhesive composition. Therefore, it is easy to make the protruding portion penetrate the adhesive composition and to contact the first and second circuit electrodes. Further, when the material of the outermost layer of the conductive particles is made of a metal having a Vickers hardness of 3 〇〇Hv or more, the protruding portion is less likely to enter the circuit electrode, so that the conductive particles and the circuit electrode can be surely contacted, and the conductive particles are in contact with the circuit electrode. The area becomes larger. As a result, even if the number of conductive particles in contact with the two circuit electrodes is two at the junction between the first and second circuit electrodes, good electrical connection between the circuit electrodes can be achieved, and the circuit electrodes can be improved. Long-term reliability of electrical characteristics. In the connection structure of the circuit member of the present invention, the particle diameter of the conductive particles is preferably 1 to 4 // m. The inventors have found that not only the surface shape of the conductive particles but also the particle diameter of the conductive particles affect the electrical connection between the circuit electrodes. That is, the inventors have found that when the particle diameter of the conductive particles contained in the circuit connecting material is large, the surface area of the conductive particles becomes large, and the amount of the adhesive composition sandwiched between the conductive particles and the circuit electrode becomes large, so the circuit When the electrodes are connected, the adhesive composition between the conductive particles and the circuit electrodes cannot be sufficiently excluded. Therefore, in the present invention, by limiting the particle diameter of the conductive particles to 1 to 4 // m, the surface area of the conductive particles can be reduced, and the amount of the adhesive composition sandwiched between the conductive particles and the circuit electrodes can be reduced. Therefore, when the circuit connecting material is press-hardened between the circuit members and the circuit electrodes are connected, it is easy to exclude the adhesive composition between the conductive particles and the circuit electrodes, and the connection resistance between the circuit electrodes is easily reduced. -8 - 200924569 In the connection structure of the circuit member of the present invention, the outermost layer is preferably made of Ni. When the outermost layer is made of Ni of a metal having a Vickers hardness of 3 〇〇 Hv or more, the effects of the present invention can be easily obtained. In the connection structure of the circuit member of the present invention, the thickness of the outermost layer is preferably 65 to 125 nm. When the thickness of the outermost layer is made to be in this range, the connection resistance between the circuit electrodes can be easily reduced. In the connection structure of the circuit member of the present invention, the height of the projections is preferably 50 to 500 nm. When the height of the protrusion is less than 50 nm, the connection resistance tends to change after the high temperature tube is wetted. On the other hand, if the height is larger than 500 nm, the contact area between the conductive particles and the circuit electrode becomes smaller, so that the connection resistance tends to become higher. . In the connection structure of the circuit member of the present invention, the distance between the adjacent projections is preferably 1 000 nm or less. Thereby, it is difficult to enter the adhesive composition between the conductive particles and the circuit electrode, and it is easy to increase the connection resistance. In the connection structure of the circuit member of the present invention, the first or second circuit electrode is preferably indium-tin oxide (ITO) or indium-zinc oxide (IZO). When the circuit electrode is made of ITO or IZO, the effect of long-term reliability of electrical connection and electrical characteristics between the electrodes of the circuit is remarkably enhanced. The present invention can provide a connection structure of a circuit member which can achieve a good electrical connection between opposing circuit electrodes and can sufficiently improve the electrical characteristics of the circuit electrodes with long-term reliability. [Embodiment] [Best Mode for Carrying Out the Invention] -9- 200924569 Hereinafter, a detailed description of a preferred embodiment of the present invention will be made with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are given to the same reference numerals, and the repeated description is omitted. Further, the ratio of the dimensions of the drawings is not necessarily the same as the description. [Connection structure of circuit member] An embodiment of the connection structure of the circuit member of the present invention will be described in detail. As shown in Fig. 1, the connection structure 1 of the circuit member of the present embodiment includes the first circuit member 30 and the second circuit member 40 and the circuit connecting material 10 which face each other. The table 1 circuit member 30 includes a first circuit board 31 and a first circuit electrode 32 formed on the main surface 31a of the circuit board 31. The second circuit member 40 has a circuit board 41 and a second circuit electrode 42 formed on the main surface 41a of the second circuit board 41. The first circuit electrode 32 formed on the principal surface 31a of the first circuit board 31 and the second circuit electrode 42 formed on the principal surface 41a of the second circuit board 41 face each other. In the circuit boards 31 and 41, the surfaces of the circuit electrodes 32 and 42 are flat, respectively. Further, the "the surface of the circuit electrode is flat" in the present invention means that the unevenness of the surface of the circuit electrode is not less than 2 nm. The circuit connecting material i ’ is connected between the main surface 31a of the first circuit member 30 and the main surface 41a of the second circuit member 4'. The circuit connecting material i is formed by curing a film-like circuit connecting material to be described later. The circuit connecting material 10 includes an insulating material 丨i and conductive particles 丨2. The portion of the outermost layer (metal layer 2 2 ) of the conductive particles 1 2 protrudes outside, and a plurality of protrusions 14 are formed (Figs. 1 and 2). -10-200924569 The connection structure 1 of the circuit member includes a connection where the first circuit electrode 32 and the second circuit electrode 42 are opposed to each other, and the conductive particles 12 included in the circuit connection material 10 are electrically connected. That is, the two conductive particles 12 at the joint are directly in contact with both of the first circuit electrode 3 2 and the second circuit electrode 42. Specifically, the protruding portion 14 formed on the metal layer 22 of each of the conductive particles 12 penetrates the insulating material 1 and reliably contacts both of the first circuit electrode 32 and the second circuit electrode 42. When the circuit members 30, 40 are connected, the conductive particles 12 affect the pressure of the adhesive composition (the insulating material 1 1 before hardening), and the pressure is concentrated on the protrusions 14 and is larger than the conductive particles of the prior art (the lack of the protrusions 1) The conductive particles of 4 affect the pressure of the adhesive composition. Therefore, the connection resistance between the circuit electrodes 3, 42 can be sufficiently reduced, so that the circuit electrodes 3, 42 can be electrically connected. Therefore, the current flows of the circuit electrodes 32 and 42 can be smoothly performed, and the functions of the circuit can be fully utilized. Further, since the number of the conductive particles 12 to be energized at the junction between the first circuit electrode 32 and the second circuit electrode 42 is two, the amount of the conductive particles 12 in the circuit connecting material 10 is as small as necessary. In short, the manufacturing cost of the connection structure of the circuit connecting material and the circuit member can be reduced. Further, in the present embodiment, "the first circuit electrode 32 and the second circuit electrode 42 are electrically connected to each other by the conductive particles 12 included in the circuit connecting material 1", and the composite meter is used at a temperature of 2 3 ± 1 °. C. The connection resistance 値 between the first circuit electrode 32 and the second circuit electrode 42 was measured at a measurement current of 1 mA in an environment of a humidity of 60 ± 10%, and the connection resistance 値' and 500 hours in the initial state were respectively measured. After the high-temperature and high-humidity treatment (85 °C 8 5 % RH), the connection resistance 値' is changed from the initial state to the high-temperature and high-humidity treatment. The change rate of the connection resistance -11-11 - 200924569 is 20% or less. In the connection structure of the circuit members, even if the conductive particles contained in the circuit connection material are electrically connected between the circuit electrodes, the change rate of the connection resistance is less than 20%. It is difficult to obtain electrical characteristics between the circuit electrodes. In the present embodiment, the rate of change of the connection resistance 値 can be made 20% or less, and the long-term reliability of the electrical characteristics between the circuit electrodes can be obtained. The thickness of the first circuit electrode 32 or the second circuit electrode 42 Preferably, when the thickness is less than 50 nm, the protrusions 14 on the surface of the conductive particles contained in the circuit connecting material are delayed by the mutual circuit members, and the circuit electrodes 3 2, 4 2 and the circuit substrate 3 1 are penetrated. Contacting 41 to reduce the contact area between the circuit electrodes 32 and 42 and the conductive particles 12, and to increase the connection resistance, as a material of the circuit electrodes 32 and 42, such as Au, Ag, Sn, Pt metal or indium. - Examples of tin oxide (ITO), indium-zinc oxide (IZO), Al, Cr, and ITO or IZO are preferred. When the circuit electrodes 32, 42 are formed of ITO or IZO, the circuit electrode is obviously lifted. The electrical connection between the electrical connection and the long-term reliability of the electrical characteristics. The circuit electrodes 32 and 42 are integrally formed of the above-described materials, and only the surface of the circuit electrode may be formed of the above-mentioned materials. The material is not particularly limited, and is generally: an organic insulating material, glass, or sand. Specific examples of the first circuit member 30 and the second circuit member 40 are semiconductor wafers, resistor wafers, capacitor chips, and the like. Wafer component,印-12-200924569 Example of a substrate such as a brush substrate. In many of these circuit members, circuit electrodes (circuit terminals) are usually provided. In addition, circuit electrodes may be provided in a single number in a circuit member. The configuration of the structure 1 is, for example, a connection structure between an IC chip and a wafer mounting substrate, and an example of a connection structure of electric circuits. The surface area of at least one of the first circuit electrode 32 or the second circuit electrode 42 is 1,500 0 // The connection structure 1 of the circuit member may have a connection of three or more average conductive particles between the first circuit electrode 32 and the second circuit electrode 42. Here, the average number of conductive particles means the average number of conductive particles 12 per one circuit electrode. In the present embodiment, the first circuit electrode 32 and the second circuit electrode 42 can be stably energized by the two conductive particles in the joint, and the connection structure 1 of the circuit member further includes three average conductive particles. The above connection can more fully reduce the connection resistance between the circuit electrodes. Further, when the average number of conductive particles between the circuit electrodes 32 and 42 is one, the connection resistance will be too high, so that the electronic circuit cannot operate normally. [Circuit Connection Material] The film-like circuit connection material (the circuit connection material 硬化 before curing) is formed by forming a circuit connection material into a film shape, for example, the circuit connection material can be applied to the support by a coating device (PET) (polyethylene terephthalate vinegar) film, etc.) is made by drying with hot air at a specific time. The film-like circuit connecting material is composed of conductive particles 丨2 and an adhesive composition. The adhesive composition has adhesiveness and is hardened by hardening treatment (Figs. 1, 2). The film-like circuit connecting material is interposed between the first and second circuit members 30 and 4'. The first circuit electrode 32 of the circuit member 30 and the second circuit electrode 42 of the second circuit member 40 are energized. (Electrically conductive particles) The conductive particles contained in the film-like circuit connecting material are as shown in Fig. 2 (a), and the core body 2 1 made of an organic polymer compound and the outermost layer formed on the surface of the core body 2 1 (Metal layer 22) is formed. The core body 21 is composed of a core portion 2 1 a and a core side protrusion portion 2 1 b formed on the surface of the core portion 21a. The core body 21 can be formed on the surface of the core portion 21a by a plurality of core side protrusion portions 21b having a diameter smaller than that of the core portion 21a. After a portion of the metal layer 22 protrudes outside, a plurality of protrusions 14 are formed. The particle diameter Φ of the entire conductive particles 12 including the protrusions 14 is preferably 1 to 4/m, and more preferably 3/zm. When the particle diameter φ is as small as described above, the surface area of the conductive particles is also small, and the amount of the adhesive composition sandwiched between the conductive particles 12 and the circuit electrodes 32 and 42 is also small. Therefore, the circuit connecting material is press-hardened between the circuit members 30 and 4, and when the circuit electrodes 32 and 42 are connected, the adhesive composition between the conductive particles 12 and the circuit electrodes 32 and 42 is easily removed, which is liable to be lowered. The connection resistance of the circuit electrodes 32, 42. When the particle diameter φ is less than 1/im, after the first circuit electrode 32 is connected to the second circuit electrode 42, the connection between the circuit electrodes 3, 42 is heated, and the expansion ratio of the circuit connecting material is increased. The diameter Φ, which leads to the connection between the circuit electrodes, is believed to be 14 - 200924569. On the other hand, when the particle diameter of the conductive particles 1 2 exceeds 4 # m, the surface area of the conductive particles 12 becomes larger. 挟 The amount of the adhesive composition sandwiched between the conductive particles 12 and the circuit electrodes 32 and 42 is increased, so that the circuit electrode 3 2 is formed. When the connection of 42 is made, the adhesive composition between the conductive particles 1 2 and the circuit electrodes 3 2, 4 2 cannot be sufficiently excluded, and the electrical connection between the circuit electrodes 3 2, 4 2 tends to be insufficient. The metal layer 22 (outermost layer) is made of a metal having conductivity and a Vickers hardness of 300 Hv or more. The metal layer 22 composed of a metal having a Vickers hardness of 300 Hv or more is harder than the outermost layer of Au of the prior art, so that the protrusions 14 protruded from the metal layer 22 are more likely to penetrate the circuit electrode 3 than the prior art. 42, increasing the contact area of the conductive particles 12 with the circuit electrodes 32, 42. Further, after the circuit connecting material is subjected to the hardening treatment, the state of the contact area between the conductive particles 12 and the circuit electrodes 32, 42 can be sufficiently ensured for a long period of time. Therefore, the first electrode and the second electrode are easily energized by the two conductive particles. Examples of the organic polymer compound constituting the core portion 21a of the core body 21, such as an acrylic resin, a styrene resin, a benzoguanamine resin, a polyoxyxylene resin, a polybutadiene resin, or the like, These cross-linkers can also be used. Further, the average particle diameter of the core portion 21 a in the core body 2 1 is preferably 1 to 4 μm. Examples of the organic polymer compound constituting the core side protrusion portion 21b of the core body 21 include an acrylic resin, a styrene resin, a benzoguanamine resin, a polyoxyxylene resin, a polybutadiene resin, or the like. You can also use these cross-linkers. The organic polymer compound constituting the core-side protrusion 2 1 b may be the same as the organic polymer compound constituting the core portion 21 a, and may be different from -15 to 200924569. Further, it is preferable that the average particle diameter of the core-side protrusions 2 1 b is 50 to 50,000 nm. The hardness of the conductive particles 12 is almost controlled by the hardness of the core body 21 of the conductive particles 12. The hardness of the conductive particles 12 depends on the distance between the molecular structure constituting the core body 21 and its crosslinking point, and the degree of crosslinking. Benzoguanamine is equal to a rigid structure in the molecule, and the distance between the crosslinking points is also short. Therefore, the higher the proportion of the benzoguanamine or the like which constitutes the total molecule of the core body 21, the harder the conductivity can be obtained. After the particles 12 are raised and the degree of crosslinking of the core body 21 of the conductive particles 12 is increased, the hard conductive particles 12 can be obtained. The distance between the crosslinking points of acrylate, allyl phthalate and the like becomes longer, so the proportion of acrylate, allyl phthalate, etc., which constitutes the total molecule of the core body 21, is higher. The softer conductive particles 12 are obtained, and the degree of crosslinking becomes lower, whereby the soft conductive particles 1 2 can be obtained. The metal layer 22 is made of a metal having a Vickers hardness of 300 Hv or more, such as Cu, Ni or a Ni alloy, Ag or an Ag alloy, and particularly preferably made of Ni. The metal layer 22 can be made of a metal having a Vickers hardness of 300 volts or more (for the core body 21, it is formed by electroless plating, and the thickness of the metal layer 22 (thickness of plating) is 65 〜 Preferably, the 125 nm is preferably 75 to 100 nm, and particularly preferably 80 to 100 nm. When the thickness of the metal layer 22 is set to the range, the connection resistance between the circuit electrodes 32 and 42 is more easily lowered. When the thickness is less than 65 nm, the thickness of the layer is reduced to cause a defect in plating, and the connection resistance tends to increase. On the other hand, if the thickness exceeds 125 nm, condensation occurs between the conductive particles, and the adjacent circuit electrodes are interposed. The tendency of the short circuit occurs. The thickness of the metal layer 22 of the conductive particles 12 in the present specification refers to the average thickness of the metal layer 22 without the protrusions 14 from -16 to 200924569, which can be observed by an electron microscope to determine the cross section of the conductive particles 12. The height Η of the protrusion 14 is preferably 50 to 500 nm, more preferably 1 to 300 nm. When the height of the protrusion is less than 50 nm, the connection structure of the circuit member is subjected to high temperature and high humidity treatment. Connection resistance has changed If the distance exceeds 500 nm, the contact area between the conductive particles 12 and the circuit electrodes 32 and 42 will be small, and the connection resistance 値 will be increased. The distance S between the adjacent protrusions 14 is preferably 100 nm or less, and more preferably. The distance S between the adjacent protrusions 14 is such that the adhesive composition is not disposed between the conductive particles 12 and the circuit electrodes 32 and 42 so that the conductive particles 12 and the circuit electrodes 32 and 42 are provided. The sufficient contact is at least 50 nm or more. Further, the height Η of the protrusions 14 of the conductive particles 12 and the distance S between the adjacent protrusions 14 can be measured by an electron microscope. Conductive in the film-like circuit connecting material The blending amount of the particles 12 is preferably 1 to 3 parts by volume for 100 parts by volume of the adhesive composition. The compounding amount can be used according to the use thereof. By preventing the passage of the excess conductive particles 12 It is preferable that the amount of the conductive particles 12 is 0.1 to 10 parts by volume from the viewpoint of the short circuit of the circuit electrodes 32 and 42. Further, the conductive particles 1 2 may be as shown in Fig. 2 (b), and the core body 2 1 is only It is composed of the core part 21a. The conductive particles 12 can be obtained by metal plating on the surface of the core body 21 after the metal layer 22 is formed on the surface of the core body 21. Further, the protrusion portion 14 can be changed after the plating condition is changed after the metal plating is applied. The thickness of the metal layer 22 is formed. In addition, the 'change of plating conditions' can be made by adding a plating solution higher than this concentration in the plating solution used in the first -17-200924569. After the unevenness is performed, the mixing ratio of the particles in which the metal layer 22 is completely peeled off by the core body 21 is less than 5% of the total conductive particles (about 250,000), preferably less than 1%. The better is less than 0.1%. When the particle mixing ratio of the metal layer 22 completely peeled off by the core body 21 is within this range, the circuit electrodes 32 and 42 can be surely energized. When the particle mixing ratio of the metal layer 2 2 completely separated by the core body 21 is 5% or more, the connection resistance is likely to increase when particles which are not related to the conduction exist on the circuit electrodes 32 and 42. The coverage of the metal layer 22 of the core body 21 is preferably 70% or more, and more preferably 80 to 100%. When the coverage of the metal layer 22 is within this range, the connection resistance between the circuit electrodes 3, 42 can be made more desirable. When the coverage of the metal layer 22 is less than 70%, the energization area of the surface of the conductive particles becomes small, so that the connection resistance becomes large. (Adhesive Composition) The composition of the adhesive agent contained in the film-like circuit connecting material is a composition containing a latent curing agent of an epoxy resin and an epoxy resin (hereinafter referred to as "the first composition"), and contains freely. The composition of the base polymerizable substance and the curing agent which generates free radicals by heating (hereinafter referred to as "second composition") or the mixture of the first composition and the second composition is preferable. Examples of the epoxy resin contained in the first composition include bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenolic epoxy resin for phenol paint, and cresol paint. Phenolic epoxy resin, bisphenol A lacquer phenol-18- 200924569 aldehyde type epoxy resin, phenolic epoxy resin for bisphenol F paint, alicyclic resin, glycidyl ester type epoxy resin, glycidylamine type Examples of epoxy hydantoin epoxy resin, trimeric isocyanate type epoxy resin, and fat epoxy resin. These epoxy resins may be halogenated, or may be used in combination of two or more kinds of epoxy resins such as hydrogen. As the latent curing agent contained in the first composition, as long as the oxygen resin is cured, the latent curing agent such as an anionic catalyst type hardener or a cationic polymerizable catalyst type hardener is polymerized. Examples of hardeners and the like. These may be used alone or in combination of two or more. Among them, 'the catalyst having a good rate of hardenability, no need to consider the chemical equivalent surface' and an anionic or cationic polymerizable catalyst is used as an anionic or cationic polymerizable catalyst type hardener. Examples of the boron trifluoride-amine complex, the phosphonium salt, the amine amine, the diamine maleimonitrile, the melamine and its derivatives, the polyamine salt, the guanamine, and the like can also be used. Examples of the addition polymerization type include polyamines, polythiols, polyphenols, and acid anhydrides. When the third-stage amine azole of the anionic polymerization type catalyst-type hardener is blended, the epoxy resin is cured at a moderate temperature of 1,600 to 20,000 ° C and heated for several hours. Therefore, the usable time (applicable to a longer one is ideal. As a cationic polymerization type, the hard type of the catalyst is as follows: the photosensitive light which is hardened by the irradiation of the energy ray (aromatic diazole salt, aromatic)鎏 salt and the like are the main users.) Heating other than the energy ray irradiation causes the activated epoxy resin to be 'having an aliphatic sulfonium salt. The hardener has a quick-curing special epoxy resin and a chain-like chain. The viewpoint of the polymerization of the ring and the use of the force α is preferred. For example, the hardening of the quinone dicyanoquinone, the 10 second period of the microphone is suitable for the salt of the gun. Hardening levy, pole -19- 200924569 is ideal. The polymerizable material such as a polyurethane material or a polyester material, a metal film such as nickel or copper, or an inorganic material such as calcium citrate may be used to form a microcapsule. It is extremely desirable to use time. The radically polymerizable substance containing the second composition is a substance having a functional group polymerized via a free radical. Examples of the radical polymerizable substance include an acrylate compound (including a corresponding methacrylate, the same applies hereinafter), and a propylene methoxy group (including the corresponding methacryloxy group. The same applies hereinafter). Examples of the compound, the maleic anhydride imide compound, the citrate imine resin, and the phenol diamine quinone imide resin. The radically polymerizable substance can be used in the form of a monomer or an oligomer, and a monomer and an oligomer can also be used. Specific examples of the acrylate compound include methyl acrylate, ethyl acrylate, propyl acrylate, butyl isoacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, and trimethylolpropyl propyl. Triacrylate, tetramethylol methane tetraacrylate, 2-hydroxy-1,3-dipropenyloxypropane, 2,2-bis[4-(acryloxymethoxy)phenyl]propane, 2,2-bis[4-(acryloxypolyethoxy)phenyl]propane, dicyclopentenyl propionate, tricyclodecenyl acrylate, tris(propylene decyloxyethyl) Examples of trimeric isocyanate, undecyl acrylate, and the like. These may be used alone or in combination of two or more. Further, as the radical polymerizable substance, a polymerization stopper such as hydroquinone or methyl ether hydroquinone may be used as occasion demands. Further, from the viewpoint of improving heat resistance, the acrylate compound is preferably a substituent having at least one group selected from the group consisting of a dicyclopentenyl group, a tricyclodecenyl group, and a triazine ring. -20- 200924569 The maleic anhydride imide contains at least two or more maleic anhydride imine groups in the molecule. As the maleic anhydride imide compound, for example, l-methyl-2,4-dimaleic anhydride imide benzene, N,N'-m-phenylene bismaleimide, N, N'-p-phenylene bismaleimide, N,N'-m-toluene bismaleimide, imine, Ν'-4,4'-diphenyl bismalehydride Imine, hydrazine, Ν'-4,4-(3,3'.dimethyl bisphenylene) bismaleic acid imide, hydrazine, Ν'-4,4-(3,3'-dimethyl Diphenylmethane) bis-maleic anhydride imine, hydrazine, Ν'-4,4-(3,3'-diethyldiphenylmethane) bis-maleic anhydride imine, hydrazine, Ν-4,4 -Diphenylmethane bismaleimide imide, hydrazine, hydrazine-4,4-diphenylpropane bis-maleic anhydride imide, hydrazine, Ν'-3,3'-diphenyl maple double maleic anhydride Amine, hydrazine, Ν'-4,4-diphenyl ether bis-maleic anhydride imide, 2,2-bis(4-(4-maleic anhydride) phenyloxy)phenyl)propane, 2, 2-Bis(3-s-butyl-4,8-(4-_maleic anhydride acetimidate)phenyl)propane, 1,1-bis(4-(4-maleic anhydride) Phenoxy)phenyl)decane, 4,4'-cyclohexylene-bis(1-(4-maleic anhydride)-phenoxy)-2- Examples of hexylbenzene, 2,2-bis(4-(4-maleic anhydride)- phenyloxy)phenyl)hexafluoropropane, etc. These may be used alone or in combination of two or more. The amine resin is obtained by polymerizing a citraconazole compound having at least one citrate imine group in the molecule, and is exemplified as a phenyl sulphate compound such as phenyl citrate imine, 1 -Methyl-2,4-bis-citraconazole, N,N'-m-phenylene sulphate, hydrazine, Ν'-Ρ-phenylene bis citrate, N, N'- 4,4-Diphenylene bis citrate, hydrazine, Ν'-4,4-(3,3-dimethyldiphenylene) bis citrate, hydrazine, Ν'- 4,4-(3,3-dimethyldiphenylmethane) bis citrate, >^,1^,-4,4-(3,3 stomach diethyldiphenyl-21 - 200924569 Methane) Sodium citrate, N,N'-4,4-diphenylmethane bis citrate, N,N'-4,4-diphenylpropane, Sodium citrate, N,N'-4,4-diphenyl ether bis citrate, N,N'-4,4-diphenyl bis quinone quinone, 2,2- bis (4- (4- Resveratide phenoxy)phenyl)propane, 2,2-bis(3-s-butyl_3,4-(4-limacetam) Iminophenoxy)phenyl)propane, 1,1-bis(4-(4-carbolineiminephenoxy)phenyl)decane, 4,4'-cyclohexylene-bis(1- (4-Carbofuranimine phenoxy)phenoxy)-2-cyclohexylbenzene, 2,2-bis(4-(4- citraconeimimine phenoxy)phenyl)hexafluoropropane, etc. For example, these may be used alone or in combination of two or more. The naphthol diamine quinone imine resin is obtained by polymerizing a naphthol diamine quinone imine compound having at least one naphthol diamine quinone imine group in a molecule. As a naphthol diamine quinone imine compound, such as: phenyl naphthol diamine quinone imine, l-methyl-2,4-bis naphthol diamine quinone imine benzene, N, N'-m- Benzene bis-naphthol diamine quinone imine, hydrazine, Ν'-ρ-phenyl bis-naphthol diamine quinone imine, hydrazine, Ν-4,4-biphenyl bis-naphthol diamine quinone imine, hydrazine ,Ν'-4,4-(3,3-dimethylbiphenylene) bisnaphtholdiamine quinone imine, hydrazine, Ν'-4,4-(3,3-dimethyldiphenylmethane Bis-naphthol diamine quinone imine, N, N'-4,4-(3,3-diethyldiphenylmethane) bis-naphthol diamine quinone imine, hydrazine, Ν '-4,4- Diphenylmethane bis naphthol diamine quinone imine, hydrazine, Ν '-4,4-diphenylpropane bis naphthol diamine quinone imine, hydrazine, Ν '-4,4-diphenyl ether bis naphthalene Phenoldiamine quinone imine, hydrazine, Ν'-4,4-diphenyl bisnaphthol diamine quinone imine, 2,2-bis(4-(4-naphthyldiamine quinone imine phenoxy) Phenyl) propane, 2,2-bis(3-s-butyl- 3,4-(4-naphthyldiamine quinoneimidophenoxy)phenyl)propane, 1,1-bis(4-( 4-naphthol diamine quinone imine phenoxy) phenyl) decane, 4,4'-cyclohexylene bis(1-(4-naphthyldiamine quinone imine-22- 200924569 phenoxy) An example of a phenoxy)-2-cyclohexylbenzene or a 2,2-bis(4-(4-naphtholdiamine oximeiminophenoxy)phenyl)hexafluoropropane. These may be used alone or in combination of two or more. Further, in the radically polymerizable material, a radical polymerizable substance having a phosphate structure represented by the following formula (1) is preferably used. This @ enhances the adhesion strength to the surface of the inorganic material such as metal, and is suitable for the adhesion of the circuit electrodes 32, 42 to each other. Mi , _ 〇 0 ch3

II II I (HO+3.P ΟΟΗ2〇Η2~Ό_〇-〇^-CH2 * ' ' (I) [In the formula, n represents an integer of 1 to 3] a radically polymerizable substance having a phosphate structure It is obtained by reacting phosphoric anhydride with 2-hydroxyethyl (meth) acrylate. As a radically polymerizable substance having a phosphate structure, a specific example is: mono(2-methylpropenyloxy) The acid phosphate salt, the bis(2-methylpropenyloxyethyl) acid phosphorus salt, etc. These may be used alone or in combination of two or more. The phosphate structure represented by the general formula (I) is used. The amount of the radically polymerizable substance is preferably from 1 to 50 parts by mass, more preferably from 0.5 to 5, based on 100 parts by mass of the total of the radically polymerizable material and the film-forming material to be blended. The radically polymerizable substance may also be used in combination with allyl acrylate. In this case, the amount of the allyl acrylate is the same as that of the film forming material which is required for the radically polymerizable substance and -23-200924569. The total amount is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, based on 100 parts by mass. (2) The curing agent which generates free radicals by heating contained in the composition means a curing agent which generates free radicals by heating, and examples of the curing agent include peroxidic compounds and azo compounds. The hardener is appropriately selected according to the connection temperature, the connection time, the pot life, etc. of the purpose. From the viewpoint of high reactivity and improvement of the pot life, the temperature at a half-life of 10 hours is 40 ° C or more, and the half life is The organic peroxide having a temperature of 1 to 80 ° C for 1 minute is preferable, and an organic peroxide having a half-life of 10 hours and a temperature of 60 ° C or more and a half-life of 1 minute and having a temperature of 170 ° C or less is preferable. When the bonding time is 25 seconds or less, the total amount of the radically polymerizable material and the film forming material to be blended is preferably 10 to 10 parts by mass, more preferably 2 to 10 parts by mass. The amount is preferably 4 to 8 parts by mass, whereby a sufficient reaction rate can be obtained. Further, the amount of the hardening agent at the time of connection is not limited, and the film is formed of a radically polymerizable substance and a desired film. It is preferably 0.05 to 20 parts by mass, more preferably 0.1 to 10 parts by mass, based on 100 parts by mass. Specific examples of the curing agent which generates free radicals by heating as contained in the second composition are as follows: Examples of dimercapto peroxide, peroxydicarbonate, peroxyester ketal, peroxydialkylate, peroxyhydride, peroxoate, etc. Also, by suppressing circuit electrodes 3 2, 4 2 The viewpoint of corrosion is that the hardener containing a chloride ion or an organic acid having a concentration of 5000 ppm or less is preferably a hardener which is less than the organic acid produced by the decomposition of heat - 24 - 200924569. The specific oxidized dialkylate of the hardener, the peroxyhydride, and the peroxyester obtained by the high reactivity can be used after being moderately mixed. As examples of peroxyesters, such as: peroxy 1,1,3,3-tetramethylbutyl peroxy neodecanoate, benzyl peroxyethylene phthalate, t-peroxyhexyl neomethyl acetate, 1,1,3,3-tetramethylbutyl 2,5-dimethyl-2,5-di(2-ethylhexyldecyl-1-methylethylperoxy-2-ethyl Hexanoyl hexanoate, t-butylperoxy-2-ethylhexanoate, 1,1-bis(t-butylperoxy)isopropyl monocarbonate, t-butyl Oxy-3-butylperoxylaurate, 2,5-dimethyloxy)hexane, t-butylperoxyisopropyl-2-ethylhexyl monocarbonate, t-hexyl Examples of peroxyacetate and the like. As a peroxydialkylated compound, 'female oxy) diisopropylbenzene, diisopropyl peroxide (t-butylperoxy) hexane, t-butyl _ as a peroxyhydride For example, such as: cumene hydroperoxide and the like. As the dithiol peroxide, such as: dichlorobenzhydryl peroxide, 3, 5, 5 • such as: peroxyester, peroxydecane, etc., a better choice of hardener. In addition, cumene neodecanoate, alcohol, 1-cyclohexyl-1-methylacetate, t-peroxybutyltriperoxy 2-ethylhexanoate, peroxy) Hexane, 1-cyclohexyl ester, t-hexylperoxy-2-ethylate, t-butylperoxyisocyclohexane, t-hexylperoxys5,5-trimethylhexanoic acid Ester, t--2,5-di(m-tolylperidocarbonate, t-butylperoxy!oxybenzoate, t-butyl): α, α 'double (t-butyl) Examples of benzyl, 2,5-dimethyl-2,5-di- cumene, etc. Hydrogenated diisopropylbenzene, perisobutyl peroxide, 2,4-methylhexyl Peroxide, -25- 200924569 Octyl peroxide, lauryl peroxide, stearyl peroxide, amber-based peroxide, benzhydryl peroxytoluene, benzamidine peroxidation Examples of peroxydicarbonate such as: di-n-propylperoxydicarbonate, diisopropylperoxydicarbonate, bis(4-dibutylcyclohexyl)peroxy Dicarbonate, di-2-ethoxymethoxy peroxydicarbonate, di(2-ethylhexylperoxy)dicarbonate, dimethyl Examples of butyl peroxydicarbonate, bis(3-methyl-3-methoxybutylperoxy) dicarbonate, etc. Examples of peroxyketal such as 1,1-di (Buhexylperoxy)·3,3,5-trimethylcyclohexane, 1,1-bis(t-hexylperoxy)cyclohexane, 1,1-bis(1-butylperoxy) Examples of the radicals such as -3,3,5-trimethylcyclohexane, 1,1-(dibutylperoxy)cyclolazone, 2,2-bis(t-butylperoxy)decane An oxonated product such as t-butyltrimethyl peroxydecane, bis(t-butyl)dimethyl peroxydecane, t-butyltrivinylperoxylate, double (t -butyl)divinyl peroxydecane, tris(t-butyl)ethyl bromide peroxidation, t-butyldipropyl propylperoxylate, bis(t-butyl) Examples of the diallyl peroxydecane compound and the tri(t-butyl)allyl peroxydecane compound. These curing agents may be used singly or in combination of two or more kinds, and may also be combined with a decomposition accelerator, an inhibitor, or the like. It can also be used as a polymer material such as a polyurethane or a polyester. After the hardening agent, the microencapsulation is carried out, and the hardening agent for microencapsulation is prolonged in use, so it is considered to be -26-200924569. The film-like circuit connecting material of the present embodiment may be added as necessary. The film forming material is used in the form of a film which is formed by solidifying the liquid material into a film shape, thereby making it easy to use the film to impart mechanical properties such as non-cracking, cut, and stickiness. It can be used as a film in a general state (normal temperature and normal pressure). As a film forming material, such as phenoxy resin, polyvinyl acetal resin, polystyrene resin, polyvinyl butyral resin, poly Examples of the ester resin, the polyamide resin, the xylene resin, the polyurethane resin, and the like. Among these, from the viewpoints of good adhesion, mutual solubility, heat resistance, and mechanical strength, a phenoxy resin is preferred. The phenoxy resin is a resin obtained by reacting a bifunctional phenol with an epihalohydrin until it is polymerized, or a bifunctional epoxy resin and a bifunctional phenol are obtained by addition polymerization. The phenoxy resin is a 2-functional phenol 1 molar and an epoxy halopropane 0.985 to 1.015 in a non-reactive solvent at a temperature of 40 to 120 ° C in the presence of a catalyst such as an alkali metal hydroxide. Mohr was obtained after the reaction. Further, as a phenoxy resin, the compounding equivalent ratio of the bifunctional epoxy resin to the bifunctional phenol is particularly determined as the epoxy group/phenolic hydroxyl group 1 / from the viewpoint of the mechanical properties and thermal properties of the resin. 〇· 9~ 1 /1 · 1, a guanamine type, an ether type, or a ketone having a boiling point of 1 2 〇 ° C or more in the presence of a catalyst such as an alkali metal compound, an organic phosphorus compound or a cyclic amine compound In an organic solvent such as a lactone system or an alcohol system, it is preferable to carry out the addition polymerization reaction after heating at 5 〇 to 2 ° C under the condition that the reaction solid content is 50% by mass or less. -27 - 200924569 As the bifunctional epoxy resin, such as bisphenol a epoxy resin, bisphenol F epoxy resin, bisphenol Ad epoxy resin, bisphenol S epoxy resin, biphenyl Examples of diglycidyl ether, methyl substituted biphenyl diglycidyl ether, and the like. The bifunctional phenol has two phenolic hydroxyl groups. Examples of bifunctional phenols such as hydroquinone, bisphenol A, bisphenol F, bisphenol AD, bisphenol S, bisphenol oxime, methyl substituted bisphenol quinone, dihydroxybiphenyl, methyl Examples of bisphenols such as dihydroxybiphenyl groups are substituted. The phenoxy resin may also be modified by a radical polymerizable functional group or other reactive compound (e.g., epoxy group modification). The phenoxy resin may be used singly or in combination of two or more. The film-form circuit connecting material of the present embodiment may further contain a polymer or a copolymer in which at least one of acrylic acid, acrylate, methacrylate and acrylonitrile is used as a monomer component. Among them, a good stress relaxation surface is preferred as the use of a glycidyl acrylate-containing glycidyl acrylate or a glycidyl methacrylate-containing copolymer-based acrylic rubber. The weight average molecular weight of these acrylic rubbers is considered to be more than 200,000 from the viewpoint of improving the cohesive force of the adhesive. The film-like circuit connecting material of the present embodiment may further contain rubber fine particles, a chelating agent, a softening agent, an accelerator, an anti-aging agent, a coloring agent, a flame retarding agent, a thixotropic agent, a coupling agent, a phenol resin, and a melamine resin. , isocyanates, and the like. The average particle diameter of the rubber fine particles is twice or less the average particle diameter of the conductive particles 12, and the storage elastic modulus at room temperature (25 ° C) is stored at room temperature of the conductive particles 12 and the adhesive composition. The elastic modulus of 1 /2 or less can be -28-200924569. In particular, the fine particles of the rubber fine particles are polyfluorene oxide, acrylic latex, SBR, NBR, and polybutadiene rubber, and may be used alone or in combination of two or more. These rubber fine particles which are three-dimensionally crosslinked have good solvent resistance and are easily dispersed in the adhesive composition. Further, the circuit connecting material may also contain a chelating agent. Thereby, the connection reliability and the like of the electrical characteristics between the circuit electrodes 32 and 42 are improved. The maximum diameter of the chelating agent can be used as long as it is 1 / 2 or less of the particle diameter of the conductive particles. In addition, when particles having no conductivity are used, they may be used as long as they have no diameter of the conductive particles. The amount of the chelating agent is preferably from 5 to 60 parts by volume based on 1 part by volume of the adhesive composition. When the compounding amount exceeds 60 parts by volume, the connection reliability improvement effect tends to be saturated. On the contrary, if the amount is less than 5 volume parts, the effect of insufficient addition of the sputum agent tends to be insufficient. As the coupling agent, for example, a compound containing a vinyl group, a propylene group, an epoxy group or an isocyanate group is preferable in that the adhesion can be improved. (Manufacturing Method of Connection Structure of Circuit Member) Next, a method of manufacturing the connection structure 1 of the above-described circuit member will be described. First, the first circuit member 30 and the second circuit member 40 are connected to a circuit connecting material. For the material, a film-like circuit connecting material is prepared. The film-like circuit connecting material has a thickness of 10 to 50 "m. Further, the first circuit member 30 is loaded with a film-like circuit connecting material. The circuit electrode 32 of 30 overlaps with the circuit electrode 42 of the second circuit member 40, and the second circuit member 40 is placed on the film-like circuit connecting material -29-200924569. Thus, the film-like circuit connecting material is deposited in Between the first circuit member 30 and the second circuit member 40. At this time, the thin film-like circuit connecting material is in the form of a film and is easy to use. Therefore, when the first circuit member 30 and the second circuit member 40 are connected, it is easy to be interposed. In the meantime, the connection between the first circuit member 30 and the second circuit member 40 can be easily performed. The film-like circuit connecting material is heated by the first circuit member 3A and the second circuit member 40'. After the pressurization, the hardening treatment is performed to form the circuit connecting material 10 between the first circuit member 30 and the second circuit member 40. The hardening treatment can be carried out by a general method. The method is appropriately selected depending on the adhesive composition. In the hardening treatment of the film-like circuit connecting material of the embodiment, the protruding portion 14 protruding from the metal layer 22 of the conductive particles 12 penetrates the adhesive composition and penetrates the outermost layer of the first or second circuit electrodes 32, 42 (electrode surface) Therefore, the conductive particles 12 and the circuit electrodes 32 and 42 are surely contacted, and the contact area between the conductive particles 12 and the circuit electrodes 32 and 42 is increased. In this state, after the adhesive composition is hardened, not only the first one is realized. The high adhesion strength of the circuit member 30 and the second circuit member 40 does not depend on the presence or absence of irregularities on the surface of the circuit electrodes 3 2, 4 2 , and the connection resistance between the opposing circuit electrodes 32 and 42 can be sufficiently reduced. The reliability of the electrical characteristics between the circuit electrodes 32 and 42 is maintained for a long period of time. The above is a preferred embodiment of the dielectric body magnet composition of the present invention, but the present invention is not affected by the present invention. In the above embodiment, in the above embodiment, a film-like circuit connecting material is used to manufacture a connection structure of a circuit member, and a non-film-like circuit may be used to connect a material of -30-200924569. For example, a solvent is dissolved in a circuit. The solution of the connection material is applied to one of the first circuit member 30 or the second circuit member 40, and dried, and the circuit component is placed on the coated substrate by the other circuit member. Between the second circuit members 30 and 40. The insulating layer is not provided in the connection structure 1 of the circuit member, and the first insulating layer may be formed adjacent to the first circuit electrode 32 in the first circuit member 30. Or, in the second circuit member 40, the second insulating layer is formed adjacent to the second circuit electrode 42. The insulating layer is not particularly limited as long as it is made of an insulating material, and is usually composed of an organic insulating material, cerium oxide or tantalum nitride. [Examples] (Production of Conductive Particles No. 1) The mixing ratio of tetramethylol methane tetraacrylate, divinylbenzene, and styrene monomer was changed, and the benzamidine peroxide of the polymerization initiator was used for suspension. After polymerization, the obtained polymer was classified to obtain a core body having a particle diameter of about 3 /zm. Electroless Ni plating is performed on the surface of the obtained core body to form a Ni layer (metal layer) having a uniform thickness of 1 〇〇 nm. Further, Au is replaced by 2 5! 1111, and conductive particles are obtained. 1. (Production of Conductive Particles No. 2) The electroless Ni plating treatment was performed on the same nuclear body as the conductive particles No. 1. The amount of plating solution to be placed in the absence of the shovel Ni treatment. The treatment temperature and the treatment time are adjusted as appropriate, and the plating thickness is set to a specific ’ after the acquisition - 31 - 200924569

The surface of the core body has the conductive layer I formed by the Ni-plated protrusion, and the target film thickness of the Ni-plated metal layer without the protrusion is 90 nm (the production of the conductive particles Νο·3). The Au is made on the conductive particles Νο·2. The conductive particles n (the preparation of the conductive particles No. 4) in which the Au is formed by the protrusions formed by the protrusions are replaced by a 25 nm substitution. The mixing ratio of tetramethylol methane tetraacrylate, divinylbenzene, and the body is changed. The benzamidine-based peroxidation suspension polymerization of the polymerization initiator is used to classify the obtained polymer, and the nucleus of the m-particle size is taken. On the surface of the obtained core body, a Ni layer (metal ruthenium) having a uniform thickness of 10 nm was formed without treatment, and after plating with 25 nm, the conductive particles N〇.4 were obtained. Using an electron microscope (S-8〇Q, manufactured by Hitachi, Ltd.), each conductive particle No. 1 to 4, the particle diameter φ of the conductive particles, the thickness, the height of the protrusion (the height 突起 of the protrusion), and the adjacent distance were measured. (distance S between the protrusions). The results are shown in Table 1. : 子Ν 〇 . 2. Degree is 80~ After 'Get 〇.3. Styrene monomer, carried out with about 5 electrolytically plated Ni, so that Au can be observed by the above metal layer between the protrusions -32- 200924569 [Table i]

Conductive particle size (β m) Height of metal layer protrusion (nm) Distance between protrusions (nm) Type thickness (nm) No.l 3.1 Au/Ni 25/100 ίκ /n\ /frrr τΤΤΓ No.2 3 Ni 80 120 600 No.3 3.1 Au/Ni 25/80 145 700 No.4 5 Au/Ni 25/100 M and > » \N (Production of circuit connection material A) 〇〇 之 phenoxy resin (The product name: PKHC, manufactured by Unioncarbyde Co., Ltd.) was dissolved in a mixed solvent of toluene/ethyl acetate = 50/50 (mass ratio) to prepare a phenoxy resin solution having a solid content of 40% by mass. 1 g of acrylic rubber (40 parts by mass of butyl acrylate - 30 parts by mass of ethyl acrylate - copolymer of acrylonitrile - 3 parts by mass of glycidyl methacrylate, molecular weight: 850,000) was dissolved in toluene After the mixed solvent of ethyl acetate = 5 〇 / 5 Torr (mass ratio), an acrylic rubber resin solution having a solid content of 15% by mass was prepared. Then, 30 g of a liquid epoxy group (manufactured by Asahi Kasei Corporation, "nova qua HX-3941HP") containing a microcapsule-type latent curing agent was added to the solution and stirred to prepare an adhesive-containing composition. Liquid. Further, for 100 parts by volume of the liquid containing the adhesive composition, 0.5 parts by volume of conductive particles Νο·2 were dispersed to obtain a solution for film coating. The liquid (film-coating solution) containing the circuit-connecting material was applied to a PET film having a thickness of 50/m on one surface by a coating device, and dried by air drying at 80 ° C for 3 minutes. After the dec, the thickness of the film obtained on the pe τ film was 18# film-like circuit connecting material A. -33- 200924569 (Production of circuit connecting material B) A liquid containing an adhesive composition is prepared in the same manner as the circuit connecting material A. For 100 parts by volume of the liquid containing the adhesive composition, dispersion is performed in 5 parts by volume. Particle No. 1 modulates a liquid containing a circuit connecting material. Further, the liquid containing the circuit connecting material was applied and dried in the same manner as the circuit connecting material A, and then a film-like circuit connecting material B having a thickness of 18 μm on the PET film was obtained. (Production of circuit connecting material C) The liquid containing the adhesive composition was prepared in the same manner as the circuit connecting material A. For 100 parts by volume of the liquid of the adhesive composition, 0.5 parts by volume of conductive particles Νο·3 were dispersed and prepared. A liquid containing a circuit connecting material. Further, the liquid containing the circuit connecting material was coated and dried in the same manner as the circuit connecting material, and a film-like circuit connecting material C having a thickness of 18 μm on the PET film was obtained. (Production of circuit connecting material D) A liquid containing an adhesive composition was prepared in the same manner as the circuit connecting material A, and 0.5 parts by volume of conductive particles No. 4 was dispersed for 100 parts by volume of the liquid containing the adhesive composition. A liquid containing a circuit connecting material. Further, the liquid containing the circuit connecting material was applied in the same manner as the circuit connecting material A, and after coating and drying, a film-like circuit connecting material D having a thickness of 18/zm on the PET film was obtained. -34- 200924569 (Example 1) A double layer formed of a polyimide film (thickness: 38 μm) and a Sn-plated copper foil (Sn thickness: 2//m, thickness of Cu foil: 6#11 准备) was prepared. The flexible circuit board (hereinafter referred to as FPC) is a first circuit member. The circuit line width of the fpc is 1 8 β m and the pitch is 50 // m. Next, the surface is provided with ITO (outermost layer). A glass substrate (thickness: 1.1 mm) of a circuit electrode (surface circuit < 20 Ω) composed of a double layer having a film thickness of 50 nm)/Cr (thickness: 200 nm) is a second circuit member. A circuit relating to the second circuit member , the line width is 2 5 /zm, the spacing is 5 0 // m. Then attach the circuit connection material A cut into a specific size (1.0x30mm) on the second circuit component at 7 ° C, 1.0 MPa After the PET film is peeled off, the PET film is peeled off, and the film-like circuit connecting material is placed between the fpc and the second circuit member to arrange the FPC, and the circuit positions of the FPC circuit and the second circuit member are performed. In addition, after the circuit is dislocated, the connection area between the first and second circuit electrodes is reduced, and the electrode is increased or decreased. The number of conductive particles is set. Also, at 180 °C, (for the area of the circuit connecting material) 3 Μ P a, 1 5 seconds, using the calendering tool above the FPC, heating the 'pressurized FPC and the second The circuit member is connected in a formal manner. Thus, the connection structure of the circuit member of the first embodiment is obtained. (Example 2) The FPC which is the same as that of the first embodiment is prepared as a first circuit member. Next, an IZO circuit electrode (film thickness) is prepared on the surface. A glass substrate (thickness 1.1 mm) having a surface resistance of 20 nm and a surface resistance of 20 Ω is a second circuit member. The circuit of the second circuit member of the -35-200924569 has a line width of 25 #m and a pitch of 50 / In the same manner as in the connection method of the first embodiment, the first and second circuit members using the circuit connecting material A were temporarily connected and connected, and the connection structure of the circuit member of the second embodiment was obtained. (Comparative Example 1) The FPC was prepared as the first circuit member in the same manner as in Example 1. Then, the glass substrate having the ITO/Cr circuit electrode of the same manner as in Example 1 was prepared as the second circuit member, and the connection method was the same as in the first embodiment. Using circuit connections The first and second circuit members of the material B were temporarily connected and connected to each other to obtain the connection structure of the circuit member of Comparative Example 1. (Comparative Example 2) The FPC of the first embodiment was prepared as the first circuit member. A glass substrate having the same ITO/Cr circuit electrode as in Example 1 was prepared as the second circuit member, and the first and second circuit members using the circuit connecting material c were further subjected to the same connection method as in the first embodiment. Connection and formal connection 'The connection structure of the circuit member of the comparative example 2 was acquired. (Comparative Example 3) An FPC similar to that of Example 1 was prepared as the first circuit member. Next, a glass substrate having the same ITO/Cr circuit electrode as in Example 1 was prepared as the second circuit member. Further, in the same manner as in the connection method of the first embodiment, the temporary connection of the first and second circuit members using the circuit connecting material D and the connection of the first and second circuit members were carried out, and the connection structure of the circuit member of Comparative Example 3 was obtained. (Number of conductive particles present on the circuit electrodes) The differential connection interference microscope was used to visually observe the connection structure of each of the circuit members of Examples 1 and 2 and Comparative Examples 1 to 3 at the electrode where the connection resistance was measured (circuit electrode) The number of conductive particles (number of particles on the electrode) of each collector at the junction is measured (n = 3 8 ). (Measurement of the connection resistance) The connection structure of the circuit members of the first and second embodiments and the comparative examples 1 to 3 was measured by a composite meter (manufactured by the company ADC, product name "data/composite meter 746 1 A"). The connection resistance 値 between the circuit electrode and the circuit electrode of the second circuit member. The measurement environment was a temperature of 23 ± 1 ° C, a humidity of 60 ± 10%, and a measurement current of 1 m A. As the connection resistance, it is measured after the connection of the resistance 値 (initial resistance 値) and the high temperature and high humidity tank of 80 ° C, 95% RH for 250 hours and 500 hours (after high temperature and high humidity treatment) ) The resistance 値 (after processing 値). Further, the measurement of the connection resistance after the high-temperature and high-humidity treatment was carried out by taking out the connection structure of the circuit member from the test tank, and then placing it in the measurement environment for 30 minutes. Further, the measured resistance enthalpy was averaged by n = 3 in the number of particles on each electrode. Next, the initial rate of change in resistance was obtained. The initial resistance change rate is such that the increase from the initial resistance 値 to the post-treatment resistance 被 is divided by the initial resistance 値 as a percentage, and the formula (after treatment 値-initial resistance 値) / initial resistance 値X Calculated by 1 00. The smaller the rate of change of the resistance, the better the electrical connection between the opposing circuit electrodes of -37-200924569, and the long-term reliability of the electrical characteristics between the circuit electrodes. 3 to 7 show the initial rate of change (%) of the number of particles on each of the electrodes of Examples 1 and 2 and Comparative Examples 1 to 3. That is, in Figs. 3 to 7, the number of conductive particles existing at the junction 1 between the circuit electrodes and the rate of change in resistance at the junction are shown. The number of particles on the electrode at which the resistance change rate after the treatment of the high-temperature and high-humidity treatment for 500 hours is less than 20% is the number of particles on the electrode which can be energized between the circuit electrodes. As shown in FIGS. 3 and 5 to 7, the connection structure of the first embodiment in which the circuit member composed of ITO is connected by the circuit connecting material A and the circuit member B to D are connected to the same circuit member. After the connection structure of Comparative Examples 1 to 3, the resistance change rate after the treatment for 500 hours in the high-temperature and high-humidity treatment was 20% or less, and the number of particles on the electrode was 4, which was the minimum in Comparative Example 1 (Fig. 5). In Comparative Example 2 (Fig. 6), the minimum must be three, the comparative example 3 (Fig. 7) must be a minimum of five, and the first embodiment (Fig. 3) is a minimum of two, compared with the comparative examples 1 to 3. It is determined that the number of conductive particles is small, and the energization between the electrodes can be stably performed. Further, as shown in FIG. 4, in the connection structure of the second embodiment in which the circuit connecting material A is used to connect the connection members of the circuit electrodes of IZO, even if the number of particles on the electrode is at least two, it is determined that the electrodes are stably performed. Power on. It is proved from the above that the circuit component composed of the IT circuit and the outermost layer of the whole circuit electrode or the outermost layer has a conductive particle diameter of 1 to 4 A m and a plurality of protrusions on the surface (outermost layer) of the conductive particle, and When the outermost layer of the circuit connecting material containing Ni conductive particles is connected, as long as two conductive particles are present on the electrode -38-200924569 (every part of the connection of the circuit electrodes), the circuit electrodes can be energized. That is, in the connection structures of the first and second embodiments, even in a high-temperature and high-humidity environment, it is possible to obtain a stable connection reliability with a minimum number of conductive particles on the electrode in a thermal impact test or the like. [Industrial Applicability] As described above, the present invention can provide a circuit component that can achieve a good electrical connection between the opposing circuit electrodes while sufficiently enhancing the electrical characteristics between the circuit electrodes. Connection structure. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] A schematic cross-sectional view showing a preferred embodiment of a connection structure of a circuit member of the present invention. 2(a) and 2(b) are schematic cross-sectional views showing conductive particles in a preferred embodiment of the circuit connecting material of the present invention. Fig. 3 is a graph showing the rate of change in resistance at the initial stage of the number of particles on each electrode of Example 1. Fig. 4 is a graph showing the rate of change in resistance at the initial stage of the number of particles on each electrode of Example 2. Fig. 5 is a graph showing the rate of change in resistance at the initial stage of the number of particles on each electrode of Comparative Example 1. Fig. 6 is a graph showing the rate of change in resistance at the initial stage of the number of particles on each electrode of Comparative Example 2. Fig. 7 is a graph showing the change rate of electric resistance of -39 to 200924569 at the beginning of the number of particles on each electrode of Comparative Example 3. [Description of main component symbols] 1 : Connection structure of circuit components 1 0 : Circuit connection material (adhesive composition after hardening) 1 1 : Insulating substance 1 2 : Conductive particles 1 4 : Projection 21 : Nuclei 2 1 a _core portion 2 1 b : core side protrusion portion 22 : outermost layer (metal layer) 3 0 : first circuit member 3 1 : first circuit board 3 1 a : main surface 3 2 : first circuit electrode 4 0 : Second circuit member 41: second circuit board 4 1 a : main surface 42: second circuit electrode Η : height 5 of protrusion of conductive particles: distance between adjacent protrusions Φ : integral conductive particles including protrusions Diameter-40-

Claims (1)

200924569 X. Patent Application No. 1 - A connection structure of a circuit member, characterized in that a first circuit member having a first circuit electrode and a second circuit member having a second circuit electrode facing the first circuit member The first circuit electrode and the second circuit electrode are transmitted through the two conductive particles in a connection structure between the first circuit electrode and the second circuit electrode through a circuit connecting material including a plurality of conductive particles. At least one portion of the connection portion for energization is provided, and a portion of the outermost layer of the conductive particles protrudes outside, and a plurality of protrusion portions are formed, and the outermost layer is made of a metal having a Vickers hardness of 300 volts or more. . 2. The connection structure of the circuit member according to the first aspect of the invention, wherein the conductive particles have a particle diameter of 1 to 4 am. 3. The connection structure of the circuit member according to claim 1, wherein the outermost layer is made of Ni. 4. The connection structure of the circuit member according to claim 1, wherein the outermost layer has a thickness of 65 to 125 nm. 5. The connection structure of the circuit member according to claim 1, wherein the height of the protrusion portion is 50 to 500 nm. [6] The connection structure of the circuit member according to the first aspect of the patent application, wherein the distance between the adjacent protrusion portions is 1 〇〇〇 nm or less. 7. The connection structure of the circuit member according to the first aspect of the patent application, -41 - 200924569 wherein the first or second circuit electrode is an indium-tin oxide. 8. The connection structure of a circuit member according to the first aspect of the invention, wherein the first or second circuit electrode is an indium-zinc oxide. -42-