WO2009017001A1 - Circuit member connecting structure - Google Patents
Circuit member connecting structure Download PDFInfo
- Publication number
- WO2009017001A1 WO2009017001A1 PCT/JP2008/063170 JP2008063170W WO2009017001A1 WO 2009017001 A1 WO2009017001 A1 WO 2009017001A1 JP 2008063170 W JP2008063170 W JP 2008063170W WO 2009017001 A1 WO2009017001 A1 WO 2009017001A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit
- circuit member
- connecting structure
- electrode
- circuit electrode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Combinations Of Printed Boards (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200880022959.8A CN101690425A (en) | 2007-07-27 | 2008-07-23 | Circuit member connecting structure |
JP2009525351A JPWO2009017001A1 (en) | 2007-07-27 | 2008-07-23 | Circuit member connection structure |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-195764 | 2007-07-27 | ||
JP2007195764 | 2007-07-27 | ||
JP2008-144852 | 2008-06-02 | ||
JP2008144852 | 2008-06-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009017001A1 true WO2009017001A1 (en) | 2009-02-05 |
Family
ID=40304233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/063170 WO2009017001A1 (en) | 2007-07-27 | 2008-07-23 | Circuit member connecting structure |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2009017001A1 (en) |
KR (1) | KR20100039419A (en) |
CN (1) | CN101690425A (en) |
TW (1) | TW200924569A (en) |
WO (1) | WO2009017001A1 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011012180A (en) * | 2009-07-02 | 2011-01-20 | Hitachi Chem Co Ltd | Circuit connecting material and circuit connection structure |
JP2011066015A (en) * | 2010-12-21 | 2011-03-31 | Sony Chemical & Information Device Corp | Conductive particle, anisotropic conductive material, and connection structure |
JP2012155950A (en) * | 2011-01-25 | 2012-08-16 | Sekisui Chem Co Ltd | Conductive particle, anisotropic conductive material and connection structure |
EP2230687A3 (en) * | 2009-03-18 | 2012-12-05 | Smartrac IP B.V. | Switching assembly, method for electric and/or mechanical connection and device for applying connection elements |
WO2018168627A1 (en) * | 2017-03-14 | 2018-09-20 | パナソニックIpマネジメント株式会社 | Touch sensor |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11092620B2 (en) * | 2016-08-08 | 2021-08-17 | Sekisui Chemical Co., Ltd. | Conduction inspection device member and conduction inspection device |
CN114371578A (en) * | 2021-12-23 | 2022-04-19 | 长沙惠科光电有限公司 | Display panel and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000171823A (en) * | 1998-12-03 | 2000-06-23 | Casio Comput Co Ltd | Liquid crystal display element |
JP2000340926A (en) * | 1999-05-26 | 2000-12-08 | Process Lab Micron:Kk | Manufacture of metal/plastic hybrid structure printing plate |
JP2005166438A (en) * | 2003-12-02 | 2005-06-23 | Hitachi Chem Co Ltd | Circuit connecting material, and connection structure of circuit member using it |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007242307A (en) * | 2006-03-06 | 2007-09-20 | Sekisui Chem Co Ltd | Conductive particulate and anisotropic conductive material |
-
2008
- 2008-07-23 JP JP2009525351A patent/JPWO2009017001A1/en not_active Withdrawn
- 2008-07-23 CN CN200880022959.8A patent/CN101690425A/en active Pending
- 2008-07-23 WO PCT/JP2008/063170 patent/WO2009017001A1/en active Application Filing
- 2008-07-23 KR KR1020107004355A patent/KR20100039419A/en not_active Application Discontinuation
- 2008-07-25 TW TW97128438A patent/TW200924569A/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000171823A (en) * | 1998-12-03 | 2000-06-23 | Casio Comput Co Ltd | Liquid crystal display element |
JP2000340926A (en) * | 1999-05-26 | 2000-12-08 | Process Lab Micron:Kk | Manufacture of metal/plastic hybrid structure printing plate |
JP2005166438A (en) * | 2003-12-02 | 2005-06-23 | Hitachi Chem Co Ltd | Circuit connecting material, and connection structure of circuit member using it |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2230687A3 (en) * | 2009-03-18 | 2012-12-05 | Smartrac IP B.V. | Switching assembly, method for electric and/or mechanical connection and device for applying connection elements |
JP2011012180A (en) * | 2009-07-02 | 2011-01-20 | Hitachi Chem Co Ltd | Circuit connecting material and circuit connection structure |
JP2011066015A (en) * | 2010-12-21 | 2011-03-31 | Sony Chemical & Information Device Corp | Conductive particle, anisotropic conductive material, and connection structure |
JP2012155950A (en) * | 2011-01-25 | 2012-08-16 | Sekisui Chem Co Ltd | Conductive particle, anisotropic conductive material and connection structure |
WO2018168627A1 (en) * | 2017-03-14 | 2018-09-20 | パナソニックIpマネジメント株式会社 | Touch sensor |
Also Published As
Publication number | Publication date |
---|---|
TW200924569A (en) | 2009-06-01 |
CN101690425A (en) | 2010-03-31 |
KR20100039419A (en) | 2010-04-15 |
JPWO2009017001A1 (en) | 2010-10-21 |
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