WO2009017001A1 - Circuit member connecting structure - Google Patents

Circuit member connecting structure Download PDF

Info

Publication number
WO2009017001A1
WO2009017001A1 PCT/JP2008/063170 JP2008063170W WO2009017001A1 WO 2009017001 A1 WO2009017001 A1 WO 2009017001A1 JP 2008063170 W JP2008063170 W JP 2008063170W WO 2009017001 A1 WO2009017001 A1 WO 2009017001A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
circuit member
connecting structure
electrode
circuit electrode
Prior art date
Application number
PCT/JP2008/063170
Other languages
French (fr)
Japanese (ja)
Inventor
Kazuyoshi Kojima
Kouji Kobayashi
Motohiro Arifuku
Nichiomi Mochizuki
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to CN200880022959.8A priority Critical patent/CN101690425A/en
Priority to JP2009525351A priority patent/JPWO2009017001A1/en
Publication of WO2009017001A1 publication Critical patent/WO2009017001A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Abstract

In a circuit member connecting structure (1), a circuit connecting material containing a plurality of conductive particles (12) is arranged between a first circuit member (30) having a first circuit electrode (32) and a second circuit member (40), which faces the first circuit member (30) and has a second circuit electrode (42), and a current is carried between the first circuit electrode (32) and the second circuit electrode (42). Furthermore, the circuit member connecting structure (1) is provided with at least one connection area where a current is carried between the first circuit electrode (32) and the second circuit electrode (42) through two conductive particles (12). A part of the outermost layer (22) of the conductive particle (12) is protruded outward and a plurality of protruding sections (14) are formed. The outermost layer (22) is made of a metal having a Vickers hardness of 300HV or more.
PCT/JP2008/063170 2007-07-27 2008-07-23 Circuit member connecting structure WO2009017001A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880022959.8A CN101690425A (en) 2007-07-27 2008-07-23 Circuit member connecting structure
JP2009525351A JPWO2009017001A1 (en) 2007-07-27 2008-07-23 Circuit member connection structure

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-195764 2007-07-27
JP2007195764 2007-07-27
JP2008-144852 2008-06-02
JP2008144852 2008-06-02

Publications (1)

Publication Number Publication Date
WO2009017001A1 true WO2009017001A1 (en) 2009-02-05

Family

ID=40304233

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063170 WO2009017001A1 (en) 2007-07-27 2008-07-23 Circuit member connecting structure

Country Status (5)

Country Link
JP (1) JPWO2009017001A1 (en)
KR (1) KR20100039419A (en)
CN (1) CN101690425A (en)
TW (1) TW200924569A (en)
WO (1) WO2009017001A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011012180A (en) * 2009-07-02 2011-01-20 Hitachi Chem Co Ltd Circuit connecting material and circuit connection structure
JP2011066015A (en) * 2010-12-21 2011-03-31 Sony Chemical & Information Device Corp Conductive particle, anisotropic conductive material, and connection structure
JP2012155950A (en) * 2011-01-25 2012-08-16 Sekisui Chem Co Ltd Conductive particle, anisotropic conductive material and connection structure
EP2230687A3 (en) * 2009-03-18 2012-12-05 Smartrac IP B.V. Switching assembly, method for electric and/or mechanical connection and device for applying connection elements
WO2018168627A1 (en) * 2017-03-14 2018-09-20 パナソニックＩｐマネジメント株式会社 Touch sensor

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018030438A1 (en) * 2016-08-08 2018-02-15 積水化学工業株式会社 Conduction inspection device member and conduction inspection device
CN114371578A (en) * 2021-12-23 2022-04-19 长沙惠科光电有限公司 Display panel and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000171823A (en) * 1998-12-03 2000-06-23 Casio Comput Co Ltd Liquid crystal display element
JP2000340926A (en) * 1999-05-26 2000-12-08 Process Lab Micron:Kk Manufacture of metal/plastic hybrid structure printing plate
JP2005166438A (en) * 2003-12-02 2005-06-23 Hitachi Chem Co Ltd Circuit connecting material, and connection structure of circuit member using it

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007242307A (en) * 2006-03-06 2007-09-20 Sekisui Chem Co Ltd Conductive particulate and anisotropic conductive material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000171823A (en) * 1998-12-03 2000-06-23 Casio Comput Co Ltd Liquid crystal display element
JP2000340926A (en) * 1999-05-26 2000-12-08 Process Lab Micron:Kk Manufacture of metal/plastic hybrid structure printing plate
JP2005166438A (en) * 2003-12-02 2005-06-23 Hitachi Chem Co Ltd Circuit connecting material, and connection structure of circuit member using it

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2230687A3 (en) * 2009-03-18 2012-12-05 Smartrac IP B.V. Switching assembly, method for electric and/or mechanical connection and device for applying connection elements
JP2011012180A (en) * 2009-07-02 2011-01-20 Hitachi Chem Co Ltd Circuit connecting material and circuit connection structure
JP2011066015A (en) * 2010-12-21 2011-03-31 Sony Chemical & Information Device Corp Conductive particle, anisotropic conductive material, and connection structure
JP2012155950A (en) * 2011-01-25 2012-08-16 Sekisui Chem Co Ltd Conductive particle, anisotropic conductive material and connection structure
WO2018168627A1 (en) * 2017-03-14 2018-09-20 パナソニックＩｐマネジメント株式会社 Touch sensor

Also Published As

Publication number Publication date
KR20100039419A (en) 2010-04-15
JPWO2009017001A1 (en) 2010-10-21
CN101690425A (en) 2010-03-31
TW200924569A (en) 2009-06-01

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