WO2009063827A1 - Circuit connecting material and structure for connecting circuit member - Google Patents

Circuit connecting material and structure for connecting circuit member Download PDF

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Publication number
WO2009063827A1
WO2009063827A1 PCT/JP2008/070417 JP2008070417W WO2009063827A1 WO 2009063827 A1 WO2009063827 A1 WO 2009063827A1 JP 2008070417 W JP2008070417 W JP 2008070417W WO 2009063827 A1 WO2009063827 A1 WO 2009063827A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
connecting material
electrode
circuit member
diameter
Prior art date
Application number
PCT/JP2008/070417
Other languages
French (fr)
Japanese (ja)
Inventor
Sunao Kudou
Kouji Kobayashi
Motohiro Arifuku
Kazuyoshi Kojima
Nichiomi Mochizuki
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to JP2009522470A priority Critical patent/JPWO2009063827A1/en
Priority to CN200880114878A priority patent/CN101849266A/en
Publication of WO2009063827A1 publication Critical patent/WO2009063827A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Multi-Conductor Connections (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)

Abstract

A circuit connecting material is arranged between a first circuit member (30) having a first circuit electrode (32), and a second circuit member (40), which faces the first circuit member (30) and has a second circuit electrode (42), and the circuit connecting material electrically connects the first circuit electrode (32) and the second circuit electrode (42) with each other. The circuit connecting material contains an adhesive composition and conductive particles (12) having a diameter of 0.5-7μm. An outermost layer (22) of the conductive particle (12) is composed of a metal having a Vickers hardness of 300Hv or more, a part of the outermost layer (22) protrudes outward to form a protruding section (14), and the diameter and the hardness of the conductive particle (12) are in a specific relation.
PCT/JP2008/070417 2007-11-12 2008-11-10 Circuit connecting material and structure for connecting circuit member WO2009063827A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009522470A JPWO2009063827A1 (en) 2007-11-12 2008-11-10 Circuit connection material and circuit member connection structure
CN200880114878A CN101849266A (en) 2007-11-12 2008-11-10 Circuit connecting material and structure for connecting circuit member

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007293079 2007-11-12
JP2007-293079 2007-11-12
JP2008144856 2008-06-02
JP2008-144856 2008-06-02

Publications (1)

Publication Number Publication Date
WO2009063827A1 true WO2009063827A1 (en) 2009-05-22

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Country Status (5)

Country Link
JP (2) JPWO2009063827A1 (en)
KR (1) KR20100080628A (en)
CN (1) CN101849266A (en)
TW (1) TWI395801B (en)
WO (1) WO2009063827A1 (en)

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WO2011002084A1 (en) * 2009-07-02 2011-01-06 日立化成工業株式会社 Conductive particle
JP2011029180A (en) * 2009-07-02 2011-02-10 Hitachi Chem Co Ltd Coated conductive particle
JP2011029179A (en) * 2009-07-02 2011-02-10 Hitachi Chem Co Ltd Conductive particle
WO2012086278A1 (en) * 2010-12-24 2012-06-28 ソニーケミカル＆インフォメーションデバイス株式会社 Anisotropic conductive adhesive film, connection structure and method for manufacturing same
WO2013008744A1 (en) * 2011-07-08 2013-01-17 日立化成工業株式会社 Reel for adhesive tape, tape roll, packaging, use of reel as reel for adhesive tape for winding adhesive tape, and method for manufacturing reel for adhesive tape
EP3096330A4 (en) * 2014-01-14 2017-06-28 Toyo Aluminium Kabushiki Kaisha Composite conductive particles, conductive resin composition containing same and conductive coated article
KR20180079370A (en) 2015-11-04 2018-07-10 히타치가세이가부시끼가이샤 Adhesive compositions and structures
KR20180079371A (en) 2015-11-04 2018-07-10 히타치가세이가부시끼가이샤 Adhesive compositions and structures
KR20180084929A (en) 2015-11-25 2018-07-25 히타치가세이가부시끼가이샤 Adhesive composition and structure for circuit connection
KR20190133021A (en) 2017-03-29 2019-11-29 히타치가세이가부시끼가이샤 Adhesive Compositions and Structures
KR20230135612A (en) 2021-01-25 2023-09-25 가부시끼가이샤 레조낙 Method for manufacturing film-like adhesives and bonded structures

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CN110546222A (en) * 2017-04-28 2019-12-06 日立化成株式会社 Adhesive composition and method for producing connected body
WO2019142791A1 (en) 2018-01-17 2019-07-25 日立化成株式会社 Adhesive composition, connection structure and method for producing same
CN115349003B (en) 2020-04-10 2024-02-06 株式会社力森诺科 Adhesive composition, adhesive film, connection structure, and method for producing same

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JP2003234020A (en) * 2002-02-06 2003-08-22 Sekisui Chem Co Ltd Conductive minute particle
JP2003323813A (en) * 2002-02-28 2003-11-14 Hitachi Chem Co Ltd Circuit connecting material and connection structure of circuit terminal using the same
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Cited By (19)

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KR101271814B1 (en) 2009-07-02 2013-06-07 히타치가세이가부시끼가이샤 Conductive particle
JP2011029180A (en) * 2009-07-02 2011-02-10 Hitachi Chem Co Ltd Coated conductive particle
JP2011029179A (en) * 2009-07-02 2011-02-10 Hitachi Chem Co Ltd Conductive particle
CN102474024A (en) * 2009-07-02 2012-05-23 日立化成工业株式会社 Conductive particle
CN102474024B (en) * 2009-07-02 2014-09-17 日立化成株式会社 Conductive particle
WO2011002084A1 (en) * 2009-07-02 2011-01-06 日立化成工業株式会社 Conductive particle
KR101410185B1 (en) 2010-12-24 2014-06-19 데쿠세리아루즈 가부시키가이샤 Anisotropic conductive film, connection structure and method of manufacturing the same
WO2012086278A1 (en) * 2010-12-24 2012-06-28 ソニーケミカル＆インフォメーションデバイス株式会社 Anisotropic conductive adhesive film, connection structure and method for manufacturing same
KR20140037923A (en) * 2011-07-08 2014-03-27 히타치가세이가부시끼가이샤 Reel for adhesive tape, tape roll, packaging, use of reel as reel for adhesive tape for winding adhesive tape, and method for manufacturing reel for adhesive tape
WO2013008744A1 (en) * 2011-07-08 2013-01-17 日立化成工業株式会社 Reel for adhesive tape, tape roll, packaging, use of reel as reel for adhesive tape for winding adhesive tape, and method for manufacturing reel for adhesive tape
JPWO2013008744A1 (en) * 2011-07-08 2015-02-23 日立化成株式会社 Reel for adhesive tape, wound body, package, use as reel for adhesive tape for winding reel adhesive tape, and method for manufacturing reel for adhesive tape
KR101940349B1 (en) 2011-07-08 2019-01-18 히타치가세이가부시끼가이샤 Reel for adhesive tape, tape roll, packaging, use of reel as reel for adhesive tape for winding adhesive tape, and method for manufacturing reel for adhesive tape
EP3096330A4 (en) * 2014-01-14 2017-06-28 Toyo Aluminium Kabushiki Kaisha Composite conductive particles, conductive resin composition containing same and conductive coated article
US10227496B2 (en) 2014-01-14 2019-03-12 Toyo Aluminium Kabushiki Kaisha Composite conductive particle, conductive resin composition containing same and conductive coated article
KR20180079370A (en) 2015-11-04 2018-07-10 히타치가세이가부시끼가이샤 Adhesive compositions and structures
KR20180079371A (en) 2015-11-04 2018-07-10 히타치가세이가부시끼가이샤 Adhesive compositions and structures
KR20180084929A (en) 2015-11-25 2018-07-25 히타치가세이가부시끼가이샤 Adhesive composition and structure for circuit connection
KR20190133021A (en) 2017-03-29 2019-11-29 히타치가세이가부시끼가이샤 Adhesive Compositions and Structures
KR20230135612A (en) 2021-01-25 2023-09-25 가부시끼가이샤 레조낙 Method for manufacturing film-like adhesives and bonded structures

Also Published As

Publication number Publication date
TW200946629A (en) 2009-11-16
KR20100080628A (en) 2010-07-09
TWI395801B (en) 2013-05-11
CN101849266A (en) 2010-09-29
JP2013055058A (en) 2013-03-21
JPWO2009063827A1 (en) 2011-03-31

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