KR20180079371A - Adhesive compositions and structures - Google Patents

Abstract

(식 중, X는 유기기를 나타내고, R¹ 및 R²는 각각 독립적으로 알킬기를 나타내고, m은 0 내지 2의 정수를 나타내고, s는 6 이상의 정수를 나타낸다.)An adhesive composition comprising a silane compound having a structure represented by the following general formula (I).

(Wherein X represents an organic group, R ¹ and R ² each independently represent an alkyl group, m represents an integer of 0 to 2, and s represents an integer of 6 or more.)

Description

Adhesive compositions and structures

The present invention relates to an adhesive composition and a structure.

BACKGROUND ART [0002] Various kinds of adhesives have been conventionally used for bonding semiconductor elements and liquid crystal display elements (display display elements) to various members in devices. The properties required for adhesives are very diverse, including adhesiveness, heat resistance, and reliability in high temperature and high humidity conditions. Examples of the adherend to be used for adhesion include metals (such as titanium, copper, and aluminum), ITO, IZO, IGZO, SiN _x , SiO _2, and the like, as well as printed wiring boards, organic substrates (such as polyimide substrates) A substrate having a variety of surface states is used, and a molecular design of an adhesive for each adherend is required.

BACKGROUND ART [0002] Conventionally, thermosetting resins (epoxy resins, acrylic resins, etc.) showing high adhesiveness and high reliability have been used in adhesives for semiconductor devices or liquid crystal display devices. As a constituent component of an adhesive using an epoxy resin, a latent curing agent which generates a cationic species or an anionic species having reactivity with an epoxy resin and an epoxy resin by heat or light is generally used. The latent curing agent is an important factor for determining the curing temperature and the curing rate, and various compounds have been used in view of the storage stability at room temperature and the curing rate at the time of heating. In the actual process, the desired adhesiveness is obtained by curing at a temperature of, for example, 170 to 250 DEG C for 10 seconds to 3 hours.

In recent years, along with the high integration of semiconductor elements and the high-definition of liquid crystal display elements, the inter-element pitch and inter-wiring pitch are narrowed, which may adversely affect peripheral members due to heat at the time of curing. In order to lower the cost, it is necessary to improve the throughput, and it is necessary to perform the bonding at a low temperature (90 to 170 DEG C) and in a short time (within 1 hour, preferably within 10 seconds, more preferably within 5 seconds) , And adhesion at low temperature short time curing (low temperature fast curing). In order to achieve this low-temperature short-time curing, it is necessary to use a thermal latent catalyst having a low activation energy, but it is known that it is very difficult to combine storage stability near room temperature.

For this reason, in recent years, radical curing adhesives using a (meth) acrylate derivative together with a peroxide as a radical polymerization initiator, cationic curing adhesives using an epoxy resin and an onium salt as a cation polymerization initiator have attracted attention. The radical curing system has a low-temperature short-time curing time and a storage stability (for example, a low-temperature short-time curing time and a long-term storage stability) in view of the fact that radicals which are reaction active species are highly reactive and can be cured for a short period of time, Storage stability at around room temperature). In the cationic curing system, since the onium salt, which is a reactive active species, has high reactivity, it can be cured in a short time, and the cationic species stably exists below the decomposition temperature of the onium salt, to be.

On the other hand, in the above-mentioned adhesive, as a low molecular weight additive capable of interacting with the surface of an adherend by hydrophobic interaction by covalent bonding, hydrogen bonding, van der Waals force, etc. in order to realize firm adhesion with an adherend, Lingering agent or the like may be used. As the coupling agent, for example, a silane coupling agent; A compound containing a phosphoric acid group, a carboxyl group, or the like is used. (For example, an organic functional group represented by an epoxy group, an acryloyl group, a vinyl group, etc.) introduced into the matrix of the resin after curing, an alkoxysilane or a coupling agent which interacts with an adherend surface (for example, (E.g., a coupling agent having a functional group represented by a phosphoric acid group or the like) is used, the adherend and the adhesive can be firmly adhered (see, for example, Patent Document 1 below).

Japanese Patent Application Laid-Open No. 2013-191625 International Publication No. 2009/063827

However, the adhesive composition containing the silane compound is required to have excellent adhesive strength after the reliability test in which the adhesive composition is held under high temperature and high humidity conditions such as 85 캜 85% RH and 60 캜 95% RH.

An object of the present invention is to provide an adhesive composition having excellent adhesive strength after a reliability test and a structure using the same.

The adhesive composition of the present invention contains a silane compound having a structure represented by the following general formula (I).

(Wherein X represents an organic group, R ¹ and R ² each independently represent an alkyl group, m represents an integer of 0 to 2, and s represents an integer of 6 or more.)

However, in some cases, an adhesive containing a silane compound having an organic group bonded to an alkoxysilyl group through an alkoxysilyl group and an alkylene group may be used. On the contrary, the inventors of the present invention have found the following findings concerning such silane compounds. That is, in the conventional silane compound, the number of carbon atoms of the alkylene group existing between Si of the alkoxysilyl group and the organic group is small (for example, the number of the methylene group (CH ₂ ) is 3 or less). Therefore, when the first functional group on one side of the alkoxysilyl group and the organic group reacts with one of the constituent components (resin and the like) of the adhesive and the adherend, the alkoxysilyl group and the organic group are difficult to be sufficiently separated from each other, The reaction of the second functional group with the other components of the adhesive component (resin or the like) and the adherend is not sufficiently performed because the second functional group of the other organic group is low and the effect as the silane compound is sufficiently I could not show it. As a result, there has been a problem that the adhesive strength is lowered after a reliability test in which sufficient adhesive strength is not obtained and the adhesive is left in a high temperature and high humidity condition such as 85 캜 85% RH and 60 캜 95% RH.

On the other hand, the adhesive composition of the present invention has an excellent adhesive strength after the reliability test. The adhesive composition of the present invention has an excellent adhesive strength regardless of before and after the reliability test for an adherend composed of various materials (for example, an inorganic material (oxide, metal, etc.), an organic material and a composite thereof) .

The organic group X preferably includes at least one member selected from the group consisting of a (meth) acryloyl group, a vinyl group, an epoxy group, a nitrogen atom-containing group and a sulfur atom-containing group.

The adhesive composition of the present invention may further contain an epoxy resin and a latent curing agent.

The adhesive composition of the present invention may further contain a radical polymerizing compound and a curing agent that generates radicals by heat or light.

The adhesive composition of the present invention may further contain conductive particles.

The adhesive composition of the present invention may be a circuit connection (adhesive composition for circuit connection).

The structure of the present invention comprises the above adhesive composition or a cured product thereof.

A structure of the present invention includes a first circuit member having a first circuit electrode, a second circuit member having a second circuit electrode, and a circuit connecting member disposed between the first circuit member and the second circuit member And the first circuit electrode and the second circuit electrode are electrically connected to each other, and the circuit connecting member includes the adhesive composition or a cured product thereof.

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide an adhesive composition having excellent adhesive strength after a reliability test, and a structure using the adhesive composition. Further, according to the present invention, it is possible to provide an adhesive composition having excellent adhesive strength, and a structure using the adhesive composition, regardless of before and after the reliability test, on an adherend composed of various materials.

According to the present invention, application of an adhesive composition or a cured product thereof to a structure or a preparation thereof can be provided. According to the present invention, the application of an adhesive composition or a cured product thereof to a circuit connection can be provided. According to the present invention, it is possible to provide an application of an adhesive composition or a cured product thereof to a circuit connection structure or its manufacture.

1 is a schematic cross-sectional view showing an embodiment of the structure of the present invention.
2 is a schematic cross-sectional view showing another embodiment of the structure of the present invention.

Hereinafter, embodiments of the present invention will be described, but the present invention is not limited to these embodiments at all.

In the present specification, "(meth) acrylate" means at least one of acrylate and methacrylate corresponding thereto. Quot ;, " (meth) acryloyl ", " (meth) acrylic acid ", and the like. The materials exemplified below may be used singly or in combination of two or more, unless otherwise specified. The content of each component in the composition means the total amount of the plurality of substances present in the composition, unless otherwise specified, when a plurality of substances corresponding to each component are present in the composition. The numerical range indicated by using " to " indicates a range including the numerical values before and after " to " as the minimum value and the maximum value, respectively. &Quot; A or B " may include either A or B, or both of them may be included. "Room temperature" means 25 ° C.

In the numerical range described stepwise in this specification, the upper limit value or the lower limit value of the numerical range of a certain step may be replaced with the upper limit value or the lower limit value of the numerical range of the other steps. In the numerical range described in this specification, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the embodiment.

The adhesive composition of the present embodiment contains a silane compound having a structure represented by the following general formula (I) (hereinafter sometimes referred to as "silane compound A"). According to the adhesive composition of the present embodiment, since the alkylene group having a smaller number of carbon atoms is substituted with an alkylene group having 6 or more carbon atoms, the alkoxysilyl group and the organic group X are easily separated from each other, and thus one of the alkoxysilyl group and the organic group X Since the three-dimensional degree of freedom of the other functional group can be ensured even after the reaction, a high bonding strength to various adherends is exhibited, and sufficient adhesive strength is obtained even after the reliability test. Such an adhesive composition can be suitably used as an adhesive composition for circuit connection.

(In the formula, X is a case that represents an organic group, R ¹ and R ² represents an alkyl group, each independently, m is an integer of 0 to 2, s represents at least six constant. R ¹ a plurality is present, each R ¹ is may be same or different from each other. when R ² has a plurality is present, each R ² may be the same or different from each other. R ^1, R ^2, and are optionally each C _s H _2s is branched .)

The alkylene group of the silane compound A may be either a straight chain alkylene group or a branched chain alkylene group. When the number of carbon atoms between the alkoxysilyl group and the organic group X in the straight chain alkylene group and the branched chain alkylene group is the same, a straight chain alkylene group is preferable from the viewpoint of making it easier to secure three dimensional degrees of freedom. In the case of using the silane compound A having a straight chain alkylene group, since the methylene group number of the conventional silane compound group A is at least 6, the three-dimensional degree of freedom of the other functional group can be ensured even after one of the alkoxysilyl group and the organic group X has reacted Therefore, it exhibits high adhesive strength to various adherends and has sufficient adhesive strength even after the reliability test.

Examples of the constituent components of the adhesive composition of the present embodiment include (a) an epoxy resin (hereinafter sometimes referred to as "component (a)"), (b) a latent curing agent (latent curing agent of an epoxy resin (C) a radically polymerizable compound (hereinafter occasionally referred to as " component (c) "), and (d) (Hereinafter sometimes referred to as " component (d) ") which generates radicals (free radicals) The first aspect of the adhesive composition of the present embodiment contains the component (a) and the component (b). The second aspect of the adhesive composition of the present embodiment contains the component (c) and the component (d). The third aspect of the adhesive composition of the present embodiment contains the component (a), the component (b), the component (c) and the component (d).

Hereinafter, each component will be described.

(Silane compound)

Examples of the organic group X of the silane compound A having the structure represented by the formula (I) include an ethylenically unsaturated bond-containing group (a group containing an ethylenically unsaturated bond), a nitrogen atom-containing group (a group containing a nitrogen atom) An atom-containing group (a group containing a sulfur atom), and an epoxy group. Examples of the ethylenically unsaturated bond-containing group include a (meth) acryloyl group, a vinyl group, and a styryl group. Examples of the nitrogen atom-containing group include an amino group, a mono-substituted amino group, a disubstituted amino group, an isocyanato group, an imidazole group, an ureide group and a maleimide group. Examples of the mono-substituted amino group include an alkylamino group (such as a methylamino group), a benzylamino group, a phenylamino group, and a cycloalkylamino group (e.g., a cyclohexylamino group). Examples of the di-substituted amino group include a non-cyclic di-substituted amino group and a cyclic di-substituted amino group. Examples of the noncyclic di-substituted amino group include a dialkylamino group (dimethylamino group and the like). Examples of the cyclic di-substituted amino group include a morpholino group and a piperazino group. Examples of the sulfur atom-containing group include a mercapto group and the like. The epoxy group may be contained in an epoxy group-containing group (group containing an epoxy group) such as a glycidyl group or a glycidoxy group. The (meth) acryloyl group may be contained in the (meth) acryloyloxy group.

The organic group X preferably has reactivity with components of the adhesive composition other than the silane compound. The organic group X is preferably at least one group selected from the group consisting of a (meth) acryloyl group, a vinyl group, an epoxy group, a nitrogen atom-containing group and a sulfur atom-containing group, from the viewpoint of further improving the reactivity with respect to components of the adhesive composition other than the silane compound. It is preferable to include one species.

The number of carbon atoms of the alkyl group of R ¹ and R ² is, for example, 1 to 20. Specific examples of the alkyl group include a methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, A hexadecyl group, a heptadecyl group, an octadecyl group, a nonadecyl group, and an eicosyl group. As R ¹ and R ² , each structural isomer of the above alkyl group can be used. The number of carbon atoms of the alkyl group of R ¹ is preferably from 1 to 10, more preferably from 1 to 5, more preferably from 1 to 10, more preferably from 1 to 10, from the viewpoint of preventing the steric hindrance when the alkoxysilyl group portion reacts with the adherend, desirable. The number of carbon atoms of the alkyl group of R ² is preferably from 1 to 10, and more preferably from 1 to 5, from the viewpoint of further improving the adhesiveness with an adherend.

and m is an integer of 0 to 2. m is preferably 0 to 1, more preferably 0, from the viewpoint of further improving adhesion with the adherend. s is an integer of 6 or more. s is preferably an integer of 6 to 20, more preferably an integer of 6 to 10, from the viewpoint of increasing the physical distance between the organic group X and the alkoxysilyl group and enhancing the reactivity of both functional groups. From the same viewpoint, the carbon number of the carbon chain (straight chain portion) between the organic group X and the alkoxysilyl group in the formula (I) is preferably 6 to 20, more preferably 6 to 10.

Examples of the silane compound A include glycidoxyalkyltrialkoxysilane, glycidoxyalkyldialkoxysilane, (meth) acryloxyalkyltrialkoxysilane, (meth) acryloxydialkyldialkoxysilane, alkenyltrialkoxysilane, styryl (Aminoethyl) -8-aminooxymethyltrimethoxysilane, N-2- (aminoethyl) -8-aminooctylmethyldimethoxysilane, N-2- Triethoxysilyl-N- (1,3-dimethylbutylidene) octylamine, N-phenyl-8-aminooctyltrimethoxysilane, 8-ureido dioctyltri Mercaptooctyltrimethoxysilane, 8-isocyanate octyltrimethoxysilane, 8-isocyanate octyltriethoxysilane, and the like can be given.

Examples of the glycidoxyalkyltrialkoxysilane include 8-glycidoxypropyltrimethoxysilane and 8-glycidoxybutyltriethoxysilane. Examples of the glycidoxyalkyl dialkoxy silane include 8-glycidoxy octyl methyl dimethoxy silane and 8-glycidoxy octyl methyl diethoxy silane. Examples of the (meth) acryloxyalkyltrialkoxysilane include 8- (meth) acryloxyoxytitrimethoxysilane and 8- (meth) acryloxyoxytitriethoxysilane. Examples of the (meth) acryloxyalkyldialkoxysilane include 8- (meth) acryloxyoctylmethyldimethoxysilane and 8- (meth) acryloxyoctylmethyldiethoxysilane. Examples of the alkenyltrialkoxysilane include octenyltrialkoxysilane, octenylalkyldialkoxysilane, and the like. Examples of the octenyltrialkoxysilane include 7-octenyltrimethoxysilane and 7-octenyltriethoxysilane. Examples of the octenylalkyl dialkoxysilane include 7-octenylmethyldimethoxysilane and 7-octenylmethyldiethoxysilane. Examples of the styrylalkyltrialkoxysilane include p-styryloxytitrimethoxysilane and the like.

The silane compound A can be synthesized by, for example, reacting an organochlorosilane with an alcohol. The silane compound A may be used singly or in combination of two or more kinds. The adhesive composition of the present embodiment may further contain a silane compound represented by the formula (I) wherein s is 0 to 5.

The content of the silane compound A is preferably such that the adhesive component in the adhesive composition (the adhesive composition (component (A)) in the adhesive composition tends to be more adhered to the interface between the adherend (circuit member or the like) and the adhesive composition or the cured product (Hereinafter, the same shall apply hereinafter) based on the total mass of the conductive particles. The content of the silane compound A is preferably 0.1% by mass or more, more preferably 0.25% by mass or more, still more preferably 0.5% by mass or more. The content of the silane compound A is preferably 20% by mass or less, more preferably 10% by mass or less, still more preferably 5% by mass or less. From this point of view, the content of the silane compound A is preferably 0.1 to 20% by mass, more preferably 0.25 to 10% by mass, and still more preferably 0.5 to 5% by mass.

(component (a): epoxy resin)

Examples of the component (a) include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, naphthalene type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, , Bisphenol F novolak type epoxy resin, alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, hydantoin type epoxy resin, isocyanurate type epoxy resin, aliphatic chain epoxy resin, . The component (a) may be halogenated or hydrogenated. The component (a) may be used alone or in combination of two or more.

The content of the component (a) is preferably within the following range based on the total mass of the adhesive component of the adhesive composition, from the viewpoint of further improving the adhesiveness with the adherend. The content of the component (a) is preferably 5% by mass or more, more preferably 10% by mass or more, and still more preferably 15% by mass or more. The content of the component (a) is preferably 90 mass% or less, more preferably 80 mass% or less, still more preferably 70 mass% or less. From this viewpoint, the content of the component (a) is preferably 5 to 90 mass%, more preferably 10 to 80 mass%, and still more preferably 15 to 70 mass%.

(component (b): latent curing agent)

The component (b) is not particularly limited as long as it can cure the epoxy resin. Examples of the component (b) include a curing agent capable of generating anionic species by heat or light (an anion polymerizable catalyst type curing agent and the like), a curing agent capable of generating cation species by heat or light (a cationic polymerizable catalyst type curing agent, A mid-part type curing agent and the like. The component (b) may be used singly or in combination of two or more. The component (b) is preferably a curing agent capable of generating anionic species or cationic species by heat or light, from the viewpoint of excellent fast curability and no consideration of chemical equivalence, and an anionic polymerizable or cationic polymerizable catalyst type A curing agent is more preferable.

Examples of the anionic polymerizable catalyst type curing agent include imidazole type curing agents, hydrazide type curing agents, boron trifluoride - amine complexes, amine imides, tertiary amines, diaminomalonitrile, melamine and derivatives thereof, salts of polyamines, And the like, and modified products thereof can also be used. Examples of the cationically polymerizable catalyst type curing agent include diazonium salts and sulfonium salts, and modified products thereof can also be used. Examples of the central mold-type curing agent include polyamines, polymeric compounds, polyphenols, and acid anhydrides.

When tertiary amines, imidazole-based curing agents and the like are used as the anionic polymerizable catalyst-type curing agent, the epoxy resin can be cured by heating at a temperature of about 160 to 200 占 폚 at a middle temperature of several tens of seconds to several hours. Therefore, the pot life (usable time) can be relatively increased.

As the cationically polymerizable catalyst type curing agent, for example, photosensitive onium salts (aromatic diazonium salts, aromatic sulfonium salts, etc.) capable of curing the epoxy resin by irradiation with energy rays are preferred. In addition to irradiation with energy rays, an aliphatic sulfonium salt and the like can be cited for activating the epoxy resin by heat to cure the epoxy resin. Such a curing agent is preferable in that it has fast curability.

A curing agent in which the component (b) is microencapsulated by coating with a polymer material (polyurethane, polyester, etc.), a thin film of a metal (nickel, copper or the like), an inorganic material (calcium silicate or the like) Therefore, it is preferable.

The content of the component (b) is preferably within the following range with respect to 100 parts by mass of the component (a) from the viewpoint of further improving the adhesion with an adherend. The content of the component (b) is preferably 10 parts by mass or more, more preferably 20 parts by mass or more, and further preferably 30 parts by mass or more. The content of the component (b) is preferably 500 parts by mass or less, more preferably 100 parts by mass or less, and further preferably 70 parts by mass or less. From this point of view, the content of the component (b) is preferably 10 to 500 parts by mass, more preferably 20 to 100 parts by mass, still more preferably 30 to 70 parts by mass.

The content of the component (b) is preferably within the following range with respect to 100 parts by mass in total of the component (a) and the film-forming material (component to be blended as required) from the viewpoint of further improving the adhesion with the adherend. The content of the component (b) is preferably 10 parts by mass or more, more preferably 20 parts by mass or more, and further preferably 30 parts by mass or more. The content of the component (b) is preferably 90 parts by mass or less, more preferably 80 parts by mass or less, and further preferably 70 parts by mass or less. From such a viewpoint, the content of the component (b) is preferably from 10 to 90 parts by mass, more preferably from 20 to 80 parts by mass, still more preferably from 30 to 90 parts by mass.

(Component (c): Radically polymerizable compound)

(c) is a compound having a radically polymerizable functional group. Examples of the component (c) include (meth) acrylate compounds, maleimide compounds, citraconimide resins, and nadimide resins. The term "(meth) acrylate compound" means a compound having a (meth) acryloyl group. The component (c) may be used in the form of a monomer or an oligomer, or a monomer and an oligomer may be used in combination. The component (c) may be used alone or in combination of two or more.

Specific examples of the (meth) acrylate compound include methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, isobutyl (meth) acrylate, ethylene glycol di (Meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, 2-hydroxy-1,3-di (Meth) acryloxypolyethoxy) phenyl] propane, dicyclopentenyl (meth) acrylate, dicyclopentenyl (meth) acrylate, (Meth) acryloyloxyethyl) isocyanurate, isocyanuric acid EO-modified di (meth) acrylate, urethane (meth) acrylate, and the like . As the radically polymerizable compound other than the (meth) acrylate compound, for example, the compound described in Patent Document 2 (International Publication No. 2009/063827) can be suitably used. (Meth) acrylate compounds may be used alone or in combination of two or more.

The component (c) is preferably a (meth) acrylate compound, and more preferably a urethane (meth) acrylate, from the viewpoint of excellent reactivity and stress relaxation property. The (meth) acrylate compound preferably has at least one substituent selected from the group consisting of a dicyclopentenyl group, a tricyclodecanyl group and a triazine ring from the viewpoint of improvement in heat resistance.

As the component (c), it is preferable to use a radically polymerizable compound having a phosphate ester structure represented by the following formula (II). The radically polymerizable compound such as a (meth) ) Is more preferably used in combination with a radically polymerizable compound having a phosphate ester structure. In these cases, since the bonding strength to the surface of the inorganic material (metal or the like) is improved, it is suitable for bonding between circuit electrodes, for example.

Wherein p represents an integer of 1 to 3, and R represents a hydrogen atom or a methyl group.

The radically polymerizable compound having a phosphate ester structure is obtained, for example, by reacting anhydrous phosphoric acid with 2-hydroxyethyl (meth) acrylate. Specific examples of the radically polymerizable compound having a phosphate ester structure include mono (2- (meth) acryloyloxyethyl) acid phosphate and di (2- (meth) acryloyloxyethyl) acid phosphate . The radically polymerizable compounds having a phosphate ester structure represented by the formula (II) may be used singly or in combination of two or more kinds.

The content of the radically polymerizable compound having a phosphate ester structure represented by the formula (II) is preferably such that the radical polymerizing compound (the total amount of the components corresponding to the radically polymerizable compound) 100 Is preferably from 0.1 to 1000 parts by mass, more preferably from 1 to 100 parts by mass, per part by mass. The content of the radically polymerizable compound having a phosphoric acid ester structure represented by the formula (II) is preferably from 0.1 to 10 parts by weight, more preferably from 1 to 100 parts by weight, based on 100 parts by weight of the radically polymerizable compound and the film forming material Is preferably from 0.01 to 50 parts by mass, more preferably from 0.5 to 10 parts by mass, per 100 parts by mass of the total amount.

The radically polymerizable compound may contain allyl (meth) acrylate. In this case, the content of the allyl (meth) acrylate is preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass per 100 parts by mass of the total amount of the radical polymerizing compound and the film forming material desirable.

The content of the component (c) is preferably within the following range based on the total mass of the adhesive component of the adhesive composition, from the viewpoint of further improving the adhesion with the adherend. The content of the component (c) is preferably 10 mass% or more, more preferably 20 mass% or more, and further preferably 30 mass% or more. The content of the component (c) is preferably 90 mass% or less, more preferably 80 mass% or less, and still more preferably 70 mass% or less. From this viewpoint, the content of the component (c) is preferably from 10 to 90% by mass, more preferably from 20 to 80% by mass, still more preferably from 30 to 70% by mass.

(component (d): a curing agent which generates radicals by heat or light)

As the component (d), a curing agent which generates free radicals by heat (hereinafter referred to as "component (d1)" in some cases), or a curing agent which generates free radicals by light (d2) (D2) component " according to the following formula). (d1) is a curing agent which is decomposed by heat to generate free radicals. Examples of the component (d1) include peroxides (such as organic peroxides) and azo compounds. The organic peroxide (d1) is preferably an organic peroxide having a half-life of 10 hours at a temperature of 40 ° C or higher and a half-life of 1 minute at a temperature of 180 ° C or lower in view of improvement of high reactivity and available time, Deg.] C or more, and the half life thereof is 1 minute or less at 170 [deg.] C or less.

Specific examples of the component (d1) include diacyl peroxide (such as benzoyl peroxide), peroxydicarbonate, peroxy ester, peroxyketal, dialkyl peroxide, hydroperoxide and silyl peroxide .

As the component (d1), a curing agent having a concentration of chlorine ions and an organic acid of 5000 ppm or less is preferable from the viewpoint of suppressing the corrosion of electrodes (circuit electrodes, etc.), and a curing agent having a small amount of organic acid generated after pyrolysis is more preferable. Specific examples of the component (d1) include peroxyesters, dialkyl peroxides, hydroperoxides, silyl peroxides and the like, and peroxyesters are more preferred from the viewpoint of obtaining high reactivity.

Examples of peroxy esters include cumyl peroxyneodecanoate, 1,1,3,3-tetramethyl butyl peroxyneodecanoate, 1-cyclohexyl-1-methyl ethyl peroxyneodecanoate, t-hexyl Butylperoxy pivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-di (2- Ethylhexanoylperoxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy- Butyl peroxyisobutyrate, 1,1-bis (t-butylperoxy) cyclohexane, t-hexylperoxyisopropyl monocarbonate, t-butylperoxy- Butyl peroxylaurate, 2,5-dimethyl-2,5-di (m-toluoylperoxy) hexane, t-butylperoxyisopropyl monocarbonate, t- Oxy-2-ethylhexyl monocarbonate, t-hexylperoxybenzoate T-butyl peroxyacetate, and the like. As the component (d1) other than the peroxyester, for example, the compound described in Patent Document 2 (International Publication No. 2009/063827) can be suitably used. The peroxyesters may be used singly or in combination of two or more.

(d2) is a curing agent which decomposes by light to generate free radicals. As the component (d2), a compound capable of generating a free radical by light irradiation at a wavelength of 150 to 750 nm can be used. As such a compound, for example, from the viewpoint of high sensitivity to light irradiation, photoinitiation, Photopolymerization, and Photocuring, J. -P. Acetaminophenone derivatives and phosphine oxide derivatives described in Fouassier, Hanser Publishers (1995), p17 to p35] are preferable. The component (d2) may be used alone or in combination of two or more. (d2) and the component (d1) (the peroxide, the azo compound, etc.) may be used in combination. The component (d1) or the component (d2) may be used in combination with a curing agent which generates free radicals by ultrasonic waves, electromagnetic waves or the like.

The component (d) is appropriately selected according to the intended connection temperature, connection time, available time, and the like. The component (d) may be used singly or in combination of two or more. (d), a decomposition accelerator, a decomposition inhibitor, or the like may be used in combination. Further, the component (d) may be coated with a polyurethane or polyester-based polymer material or the like and microencapsulated. The microencapsulated curing agent is preferable because the pot life is prolonged.

The content of the component (d) is preferably within the following range from the viewpoint that a sufficient reaction rate can be easily obtained when the connection time is 25 seconds or less. The content of the component (d) is preferably 0.1 part by mass or more, more preferably 1 part by mass or more based on 100 parts by mass of the component (c). The content of the component (d) is preferably 40 parts by mass or less, more preferably 20 parts by mass or less based on 100 parts by mass of the component (c). From this point of view, the content of the component (d) is preferably 0.1 to 40 parts by mass, more preferably 1 to 20 parts by mass with respect to 100 parts by mass of the component (c).

The content of the component (d) is preferably within the following range from the viewpoint that a sufficient reaction rate can be easily obtained when the connection time is 25 seconds or less. The content of the component (d) is preferably 0.1 part by mass or more, more preferably 1 part by mass or more based on 100 parts by mass of the total amount of the component (c) and the film forming material (component to be used as required). The content of the component (d) is preferably 40 parts by mass or less, more preferably 20 parts by mass or less based on 100 parts by mass of the total amount of the component (c) and the film-forming material (component to be used as required). From this point of view, the content of the component (d) is preferably 0.1 to 40 parts by mass, more preferably 1 to 20 parts by mass relative to 100 parts by mass of the total amount of the component (c) and the film forming material desirable.

The content of the component (d) in the case where the connection time is not limited is preferably in the following range from the viewpoint that a sufficient reaction rate can be easily obtained. The content of the component (d) is preferably 0.01 parts by mass or more, more preferably 0.1 parts by mass or more based on 100 parts by mass of the component (c). The content of the component (d) is preferably 30 parts by mass or less, more preferably 15 parts by mass or less based on 100 parts by mass of the component (c). From this point of view, the content of the component (d) is preferably 0.01 to 30 parts by mass, more preferably 0.1 to 15 parts by mass with respect to 100 parts by mass of the component (c).

The content of the component (d) in the case where the connection time is not limited is preferably in the following range from the viewpoint that a sufficient reaction rate can be easily obtained. The content of the component (d) is preferably 0.01 parts by mass or more, more preferably 0.1 parts by mass or more based on 100 parts by mass of the total amount of the component (c) and the film forming material (component to be used as required). The content of the component (d) is preferably 30 parts by mass or less, more preferably 15 parts by mass or less based on 100 parts by mass of the total amount of the component (c) and the film forming material (component to be used as required). From this point of view, the content of the component (d) is preferably 0.01 to 30 parts by mass, more preferably 0.1 to 15 parts by mass relative to 100 parts by mass of the total amount of the component (c) and the film forming material desirable.

(Film forming material)

The adhesive composition of the present embodiment may contain a film forming material as required. When the liquid adhesive composition is solidified in a film form, the film-forming material improves the handling property of the film in a normal state (normal temperature and normal pressure), and is characterized in that the property such as tearing resistance, . Examples of the film forming material include phenoxy resin, polyvinylformal, polystyrene, polyvinyl butyral, polyester, polyamide, xylene resin, polyurethane and the like. Of these, phenoxy resins are preferable from the viewpoint of excellent adhesiveness, compatibility, heat resistance and mechanical strength. The film forming materials may be used singly or in combination of two or more kinds.

Examples of the phenoxy resin include resins obtained by modifying bifunctional epoxy resins and bifunctional phenols, and resins obtained by reacting bifunctional phenols and epihalohydrins until they are polymerized. The phenoxy resin can be obtained, for example, by reacting 1 mol of bifunctional phenols and 0.985 to 1.015 mol of epihalohydrin in the presence of a catalyst such as an alkali metal hydroxide at a temperature of 40 to 120 DEG C in a nonreactive solvent have. As the phenoxy resin, from the viewpoint of excellent mechanical and thermal characteristics of the resin, it is particularly preferable to set the ratio of the equivalent ratio of the bifunctional epoxy resin and the bifunctional phenol to the epoxy group / phenol hydroxyl group = 1 / 0.9 to 1 / 1.1, (Amide type, ether type, ketone type, lactone type, alcohol type, etc.) having a boiling point of 120 ° C or higher in the presence of a catalyst such as an organic phosphorus compound or a cyclic amine compound To 50 < 0 > C to 200 < 0 > C to carry out a heavy-chain reaction. The phenoxy resins may be used alone or in combination of two or more.

Examples of the bifunctional epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, bisphenol S type epoxy resin, biphenyl diglycidyl ether and methyl substituted biphenyl diglycidyl ether. . A bifunctional phenol is a compound having two phenolic hydroxyl groups. Examples of bifunctional phenols include hydroquinones, bisphenol A, bisphenol F, bisphenol AD, bisphenol S, bisphenol fluorene (4,4 '- (9-fluorenylidene) diphenol and the like), methyl substituted bisphenol fluorene, And bisphenols such as methylbiphenyl, n-butylbiphenyl, n-butylbiphenyl, and the like. The phenoxy resin may be modified (for example, epoxy-modified) by a radical polymerizable functional group or other reactive compound.

The content of the film forming agent is preferably 10 to 90 parts by mass, more preferably 20 to 60 parts by mass with respect to 100 parts by mass of the adhesive component of the adhesive composition.

(Conductive particles)

The adhesive composition of the present embodiment may further contain conductive particles. Examples of the constituent material of the conductive particles include metals such as gold (Au), silver (Ag), nickel (Ni), copper (Cu) and solder, carbon and the like. Alternatively, it may be a coated conductive particle obtained by coating a non-conductive resin, glass, ceramics, plastic, or the like with a nucleus and the nucleus with the metal (metal particle or the like) or carbon. Since the coated conductive particles or the hot-melted metal particles have deformability due to heating and pressing, the variation in the height of the circuit electrodes at the time of connection is solved and the contact area with the electrodes at the time of connection is increased. Do.

The average particle diameter of the conductive particles is preferably 1 to 30 mu m from the viewpoint of excellent dispersibility and conductivity. The average particle diameter of the conductive particles can be measured by using instrumental analysis such as laser diffraction. The content of the conductive particles is preferably 0.1 part by mass or more, more preferably 1 part by mass or more based on 100 parts by mass of the adhesive component of the adhesive composition from the viewpoint of excellent conductivity. The content of the conductive particles is preferably 100 parts by mass or less, more preferably 50 parts by mass or less based on 100 parts by mass of the adhesive component of the adhesive composition, from the viewpoint of suppressing shorting of electrodes (circuit electrodes and the like).

(Other components)

The adhesive composition of the present embodiment may suitably contain a polymerization inhibitor such as hydroquinone, methyl ether hydroquinone or the like, if necessary.

The adhesive composition of the present embodiment may further contain a homopolymer or copolymer obtained by polymerizing at least one monomer component selected from the group consisting of (meth) acrylic acid, (meth) acrylic acid ester and acrylonitrile. The adhesive composition of the present embodiment preferably contains an acrylic rubber or the like as a copolymer obtained by polymerizing glycidyl (meth) acrylate having a glycidyl ether group from the viewpoint of excellent stress relaxation. The weight average molecular weight of the acrylic rubber is preferably 200,000 or more from the viewpoint of enhancing the cohesive strength of the adhesive composition.

The adhesive composition of the present embodiment may contain coated microparticles obtained by coating the surface of the conductive particles with a polymer resin or the like. When such coated fine particles are used in combination with the conductive particles, it is possible to improve the insulation between adjacent circuit electrodes in that the short circuit due to contact between the conductive particles can be suppressed even when the content of the conductive particles is increased. The coated fine particles may be used alone without using conductive particles, or coated fine particles and conductive particles may be used in combination.

The adhesive composition of the present embodiment may contain rubber fine particles, a filler, a softener, an accelerator, an anti-aging agent, a colorant, a flame retarder, a thixotropic agent, a coupling agent, a phenol resin, a melamine resin and an isocyanate. The adhesive composition of the present embodiment may suitably contain additives such as an adhesion improver (excluding a coupling agent), a thickener, a leveling agent, a colorant, and an anti-weathering agent.

The rubber fine particles are preferably particles having an average particle diameter of not more than twice the average particle diameter of the conductive particles and a storage elastic modulus at room temperature of not more than 1/2 of the storage elastic modulus of the conductive particles and the adhesive composition at room temperature. Particularly when the material of the rubber microparticles is silicone, acrylic emulsion, SBR, NBR or polybutadiene rubber, it is preferable to use the rubber microparticles either singly or in combination of two or more. The three-dimensionally crosslinked rubber fine particles have excellent solvent resistance and are easily dispersed in the adhesive composition.

The filler can improve the electrical characteristics (connection reliability, etc.) between the circuit electrodes. As the filler, for example, particles having an average particle diameter equal to or less than 1/2 of the average particle diameter of the conductive particles can be suitably used. When the particles having no conductivity are used in combination with the filler, particles having an average particle diameter or less of the particles having no conductivity can be used as the filler. The content of the filler is preferably 5 to 60 parts by mass with respect to 100 parts by mass of the adhesive component of the adhesive composition. When the content is 60 parts by mass or less, the effect of improving the connection reliability tends to be sufficiently obtained. Since the content is 5 parts by mass or more, the effect of adding the filler tends to be sufficiently obtained.

The adhesive composition of the present embodiment can be used in the form of a paste when it is liquid at room temperature. In the case of solid at room temperature, in addition to being used by heating, a paste may be made using a solvent. The solvent which can be used is not particularly limited as long as it is a solvent which is not reactive with the adhesive composition and the additive and exhibits sufficient solubility, but a solvent having a boiling point of 50 to 150 캜 at normal pressure is preferable. If the boiling point is 50 占 폚 or higher, the volatility of the solvent at room temperature is insufficient, so that it can be used in an open system. When the boiling point is 150 캜 or lower, it is easy to volatilize the solvent, so that good reliability can be obtained after bonding.

The adhesive composition of this embodiment may be a film. A solution obtained by adding a solvent or the like to the adhesive composition as required is applied on a fluororesin film, a polyethylene terephthalate film, a peelable base material (release paper or the like), and then the solvent or the like is removed. In addition, a film can be obtained by impregnating a substrate such as a nonwoven fabric with the above solution, placing it on a peelable substrate, and then removing the solvent or the like. When used in the form of a film, it is more convenient from the viewpoint of excellent handling properties and the like.

The adhesive composition of the present embodiment can be adhered by heating or pressing with light irradiation. By using heating and light irradiation in combination, it is possible to adhere at a lower temperature in a short time. The light irradiation preferably irradiates light in a wavelength range of 150 to 750 nm. Using a low pressure mercury lamp, medium-pressure mercury lamp, high pressure mercury lamp (extra-high pressure mercury lamp, etc.), a xenon lamp, a metal halide lamp or the like can be cured with a dose of 0.1 to 10J / cm ^2. The heating temperature is not particularly limited, but a temperature of 50 to 170 占 폚 is preferable. The pressure is not particularly limited as long as it does not cause damage to the adherend, but is preferably 0.1 to 10 MPa. The heating and pressurization are preferably performed in a range of 0.5 seconds to 3 hours.

The adhesive composition of the present embodiment can be used as an adhesive for a different adherend having a different thermal expansion coefficient. Specifically, a circuit connecting material represented by an anisotropic conductive adhesive, a silver paste, or a silver film; An elastomer for CSP, an underfill material for CSP, an LOC tape, and the like. The adhesive composition of the present embodiment has an excellent adhesive strength regardless of before and after the reliability test for an adherend composed of various materials (for example, an inorganic material (oxide, metal, etc.), an organic material and a composite thereof).

<Structure and Method of Manufacturing the Same>

The structure of the present embodiment comprises the adhesive composition of the present embodiment or a cured product thereof. The structure of the present embodiment is, for example, a semiconductor device such as a circuit connection structure. In one form of the structure of the present embodiment, the circuit connecting structure is constituted by a first circuit member having a first circuit electrode, a second circuit member having a second circuit electrode, and a second circuit member having a first circuit member and a second circuit member interposed between the first circuit member and the second circuit member And a circuit connecting member disposed therein. The first circuit member has, for example, a first substrate and a first circuit electrode disposed on the first substrate. The second circuit member has, for example, a second substrate and a second circuit electrode disposed on the second substrate. The first circuit electrode and the second circuit electrode are opposed to each other and electrically connected to each other. The circuit connecting member includes the adhesive composition of the present embodiment or a cured product thereof. The structure according to the present embodiment may be provided with the adhesive composition or the cured product thereof according to the present embodiment, and a member (substrate or the like) having no circuit electrode may be used instead of the circuit member of the circuit connection structure.

The method of manufacturing the structure of the present embodiment includes a step of curing the adhesive composition of the present embodiment. As a form of the manufacturing method of the structure of the present embodiment, the manufacturing method of the circuit connection structure is characterized in that, between the first circuit member having the first circuit electrode and the second circuit member having the second circuit electrode, A step of disposing the adhesive composition, a step of pressing the first circuit member and the second circuit member to electrically connect the first circuit electrode and the second circuit electrode, and a heating and pressing step of heating and curing the adhesive composition do. In the arranging step, the first circuit electrode and the second circuit electrode may be disposed so as to face each other. In the heating and pressing process, the first circuit member and the second circuit member can be pressed in directions opposite to each other.

Hereinafter, with reference to the drawings, a circuit connection structure and a manufacturing method thereof will be described as an embodiment of the present embodiment. 1 is a schematic sectional view showing an embodiment of a structure. The circuit connecting structure 100a shown in Fig. 1 has a circuit member (first circuit member) 20 and a circuit member (second circuit member) 30 opposed to each other, Between the members 30, a circuit connecting member 10 for connecting them is disposed. The circuit connecting member 10 includes a cured product of the adhesive composition of the present embodiment.

The circuit member 20 includes a substrate (first substrate) 21 and a circuit electrode (first circuit electrode) 22 disposed on the main surface 21a of the substrate 21. An insulating layer (not shown) may be disposed on the main surface 21a of the substrate 21 as occasion demands.

The circuit member 30 includes a substrate (second substrate) 31 and circuit electrodes (second circuit electrodes) 32 disposed on the main surface 31a of the substrate 31. [ An insulating layer (not shown) may be disposed on the main surface 31a of the substrate 31 as occasion demands.

The circuit connecting member 10 contains an insulating material (a cured product of components other than conductive particles) 10a and conductive particles 10b. The conductive particles 10b are disposed at least between the circuit electrodes 22 and the circuit electrodes 32 facing each other. In the circuit connecting structure 100a, the circuit electrodes 22 and the circuit electrodes 32 are electrically connected through the conductive particles 10b.

The circuit members 20 and 30 have a single or a plurality of circuit electrodes (connection terminals). As the circuit members 20 and 30, for example, a member having an electrode requiring electrical connection can be used. As the circuit member, a chip component such as a semiconductor chip (IC chip), a resistor chip, and a capacitor chip; A printed board, a board such as a semiconductor mounting board, or the like can be used. Examples of the combination of the circuit members 20 and 30 include a semiconductor chip and a semiconductor mounting substrate. Examples of the material of the substrate include inorganic materials such as semiconductor, glass, and ceramic; Organic materials such as polyimide, polyethylene terephthalate, polycarbonate, (meth) acrylic resin and cyclic olefin resin; Glass / epoxy, and the like. The substrate may be a plastic substrate.

2 is a schematic cross-sectional view showing another embodiment of the structure. The circuit connecting structure 100b shown in Fig. 2 has the same structure as the circuit connecting structure 100a except that the circuit connecting member 10 does not contain the conductive particles 10b. In the circuit connection structure 100b shown in Fig. 2, the circuit electrode 22 and the circuit electrode 32 are in direct contact with each other and do not communicate with each other through the conductive particles.

The circuit connecting structures 100a and 100b can be manufactured, for example, by the following method. First, when the adhesive composition is in a paste form, a resin layer containing the adhesive composition is placed on the circuit member 20 by applying and drying the adhesive composition. When the adhesive composition is in the form of a film, a resin layer containing the adhesive composition is placed on the circuit member 20 by attaching the adhesive composition on the film to the circuit member 20. [ Subsequently, the circuit member 30 is mounted on the resin layer disposed on the circuit member 20 such that the circuit electrode 22 and the circuit electrode 32 are disposed to face each other. Then, the resin composition containing the adhesive composition is subjected to heat treatment or light irradiation, whereby the adhesive composition is cured to obtain a cured product (circuit connecting member 10). Thus, the circuit connecting structures 100a and 100b are obtained.

Example

Hereinafter, the present invention will be described concretely with reference to examples, but the present invention is not limited to the following examples.

&Lt; Preparation of adhesive composition on film &

[Example 1]

A phenoxy resin was synthesized from a bisphenol A type epoxy resin and a phenol compound (4,4 '- (9-fluorenylidene) -diphenol) having a fluorene ring structure in the molecule. This phenoxy resin was dissolved in a mixed solvent of toluene / ethyl acetate = 50/50 (mass ratio) to prepare a solution having a solid content of 40% by mass. Subsequently, an acrylic rubber (40 parts by mass of butyl acrylate-30 parts by mass of ethyl acrylate-30 parts by mass of acrylonitrile-copolymer of 3 parts by mass of glycidyl methacrylate, weight average molecular weight 80,000) was prepared , And this acrylic rubber was dissolved in a mixed solvent of toluene / ethyl acetate = 50/50 (mass ratio) to prepare a solution having a solid content of 15 mass%. Further, a liquid curing agent-containing epoxy resin (epoxy equivalent weight: 20,000) containing a microcapsule type latent curing agent (microencapsulated amine type curing agent), a bisphenol F type epoxy resin and a naphthalene type epoxy resin at a mass ratio of 34: 202 were prepared. As a silane compound, 8-glycidoxypropyltrimethoxysilane (trade name: KBM4803, manufactured by Shin-Etsu Chemical Co., Ltd.) was prepared.

These materials were blended so that the mass ratio (solid content) of the phenoxy resin, the acrylic rubber, the epoxy resin containing the curing agent, and the silane compound was 20: 30: 47: 3 to prepare the varnish A1 (liquid containing the adhesive composition). Further, a conductive particle A in which a nickel layer having a thickness of 0.2 탆 was formed on the surface of particles made of polystyrene as nuclei was prepared. The average particle diameter of the conductive particles was 5 占 퐉 and the specific gravity was 2.5. This conductive particle A was compounded in an amount of 5 parts by mass based on 100 parts by mass of the solid content of the varnish A1 to prepare a varnish B1 (liquid containing a circuit connecting material). The varnish B1 was coated on a polyethylene terephthalate (PET) film having a thickness of 50 占 퐉 on one surface and coated with varnish, followed by hot air drying at 70 占 폚 for 3 minutes to obtain an adhesive composition having a thickness of 20 占 퐉. PET film.

[Comparative Example 1]

Except that 3-glycidoxypropyltrimethoxysilane (trade name: KBM403, manufactured by Shin-Etsu Chemical Co., Ltd.) was used instead of 8-glycidoxypropyltrimethoxysilane as the silane compound. In the same manner, a film-like adhesive composition was prepared.

[Example 2]

50 g of a phenoxy resin (product name: PKHC, manufactured by Union Carbide, weight average molecular weight 45000) was dissolved in a mixed solvent of toluene / ethyl acetate = 50/50 (mass ratio) to prepare a phenoxy resin solution having a solid content of 40% Lt; / RTI &gt; (Product name: P-2M, trade name: M-215, product of Toagosei Co., Ltd.) and 2- (meth) acryloyloxyethyl phosphate Ltd.) and urethane acrylate (trade name: U-2PPA, manufactured by Shin Nakamura Kagaku Kogyo K.K.) were used. As a silane compound, 7-octenyltrimethoxysilane (trade name: KBM1083, manufactured by Shin-Etsu Chemical Co., Ltd.) was prepared. Benzoyl peroxide (trade name: NIPPER BMT-K40, manufactured by Nichiyu Kagaku Co., Ltd.) was prepared as a radical generator.

These materials were mixed in a mass ratio (solid content) of 50: 19: 1 of phenoxy resin, isocyanuric acid EO-modified diacrylate, 2- (meth) acryloyloxyethyl phosphate, urethane acrylate, silane compound and radical generator, 3: 20: 3: 5 to prepare varnish B1 (liquid containing adhesive composition). Further, the conductive particles A were compounded in an amount of 5 parts by mass based on 100 parts by mass of the solid content of the varnish B1 to prepare a varnish B2 (liquid containing a circuit connecting material). The varnish B2 was coated on a polyethylene terephthalate (PET) film having a thickness of 50 占 퐉 on one side and then dried at 70 占 폚 for 3 minutes to obtain a film-like adhesive composition having a thickness of 20 占 퐉 PET film.

[Comparative Example 2]

Except that vinyltrimethoxysilane (trade name: KBM103, manufactured by Shin-Etsu Chemical Co., Ltd.) was used in place of 7-octenyltrimethoxysilane as the silane compound, the adhesive composition Respectively.

[Example 3]

Except that 8-methacryloxyoxytitrimethoxysilane (trade name: KBM5803, manufactured by Shin-Etsu Chemical Co., Ltd.) was used instead of 7-octenyltrimethoxysilane as the silane compound To prepare a film-like adhesive composition.

[Comparative Example 3]

Except that 3-methacryloxypropyltrimethoxysilane (trade name: KBM503, manufactured by Shin-Etsu Chemical Co., Ltd.) was used in place of 7-octenyltrimethoxysilane as the silane compound To prepare a film-like adhesive composition.

<Evaluation of Adhesive Strength>

As a first circuit member, a flexible circuit board (FPC) having 500 copper circuits with a line width of 75 mu m, a pitch of 150 mu m, and a thickness of 18 mu m was prepared. As the second circuit member, a glass (0.7 mm thick) glass in which a thin layer of 0.5 탆 silicon nitride (SiN _x ) was formed was prepared. (The heating method: Constant heat type, manufactured by Dora Engineering Co., Ltd.) in the state in which the adhesive compositions on the films of Examples 1 to 3 or Comparative Examples 1 to 3 were interposed between the first circuit member and the second circuit member ) Was subjected to heating and pressing at 170 占 폚 and 3 MPa for 20 seconds and connected over a width of 2 mm to prepare a circuit connection structure (connection body).

The adhesive strength of this circuit connection structure immediately after bonding (after the heating and pressing at 170 DEG C and 3 MPa for 20 seconds) and the adhesive strength after being left in a constant temperature and humidity bath at 85 DEG C and 85% RH for 100 hours were measured in accordance with JIS Z0237 at 90 C &lt; / RTI &gt; Here, Tensilon UTM-4 (peeling speed: 50 mm / min, 25 캜) manufactured by Toyo Baldwin Co., Ltd. was used as the apparatus for measuring the bonding strength.

Table 1 shows the results of the measurement performed as described above.

Thus, in each of Examples 1 to 3, as compared with Comparative Examples 1 to 3, the adhesive strength immediately after bonding was high and the adhesion to the surface of the substrate (inorganic substrate) was good even after the reliability test (high temperature and high humidity treatment) .

10 ... Circuit connecting member, 10a ... Insulating material, 10b ... Conductive particles, 20 ... The first circuit member, 21 ... The first substrate, 21a ... If you give, 22 ... The first circuit electrode, 30 ... A second circuit member 31, The second substrate 31a, If you give, 32 ... The second circuit electrodes, 100a, 100b ... Circuit connection structure.

Claims (8)

An adhesive composition comprising a silane compound having a structure represented by the following general formula (I).

(Wherein X represents an organic group, R ¹ and R ² each independently represent an alkyl group, m represents an integer of 0 to 2, and s represents an integer of 6 or more.) The adhesive composition according to claim 1, wherein the organic group X comprises at least one member selected from the group consisting of a (meth) acryloyl group, a vinyl group, an epoxy group, a nitrogen atom-containing group and a sulfur atom-containing group. The adhesive composition according to claim 1 or 2, further comprising an epoxy resin and a latent curing agent. The adhesive composition according to any one of claims 1 to 3, further comprising a radically polymerizable compound and a curing agent that generates a radical by heat or light. The adhesive composition according to any one of claims 1 to 4, further comprising conductive particles. 6. The adhesive composition according to any one of claims 1 to 5, which is for circuit connection. A structure comprising the adhesive composition according to any one of claims 1 to 6 or a cured product thereof. A first circuit member having a first circuit electrode,
A second circuit member having a second circuit electrode,
And a circuit connecting member disposed between the first circuit member and the second circuit member,
The first circuit electrode and the second circuit electrode are electrically connected,
Wherein the circuit connecting member comprises the adhesive composition according to any one of claims 1 to 6 or a cured product thereof.

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