KR102586088B1 - Adhesive compositions and structures - Google Patents

Abstract

(식 중, X는 유기기를 나타내고, R¹ 및 R²는 각각 독립적으로 알킬기를 나타내고, m은 0 내지 2의 정수를 나타내고, s는 6 이상의 정수를 나타낸다.)An adhesive composition containing a silane compound having a structure represented by the following general formula (I).

( ^{Wherein ,}

Description

Adhesive compositions and structures

The present invention relates to adhesive compositions and structures.

In semiconductor devices and liquid crystal display devices (display display devices), various adhesives have been used conventionally for the purpose of bonding various members in the devices. The properties required for adhesives are very diverse, including adhesiveness, heat resistance, and reliability under high temperature and high humidity conditions. In addition, the adherend used for adhesion includes printed wiring boards, organic substrates (for example _, polyimide substrates), metals (titanium, copper, aluminum, etc.), ITO, IZO, _IGZO , SiN Since substrates with a wide variety of surface states are used, molecular design of adhesives tailored to each adherend is required.

Conventionally, thermosetting resins (epoxy resins, acrylic resins, etc.) that exhibit high adhesiveness and high reliability have been used in adhesives for semiconductor devices or liquid crystal display devices. As components of adhesives using epoxy resins, epoxy resins and latent curing agents that generate cationic or anionic species reactive to the epoxy resin by heat or light are generally used. The latent curing agent is an important factor that determines the curing temperature and curing speed, and various compounds have been used from the viewpoint of storage stability at room temperature and curing speed when heated. In the actual process, the desired adhesiveness was obtained by, for example, curing under curing conditions of 170 to 250°C and 10 seconds to 3 hours.

In addition, in recent years, with the high integration of semiconductor elements and the high precision of liquid crystal display elements, the pitch between elements and interconnections has become narrow, and there is a risk of adversely affecting surrounding members due to heat during curing. In addition, in order to reduce costs, it is necessary to improve throughput, so that adhesion can be achieved at low temperatures (90 to 170°C) and in a short period of time (within 1 hour, preferably within 10 seconds, more preferably within 5 seconds). , adhesion at low temperature and short-time curing (low temperature fast curing) is required. In order to achieve this low-temperature, short-time curing, it is necessary to use a thermal potential catalyst with low activation energy, but it is known to be very difficult to achieve both storage stability at around room temperature.

Therefore, in recent years, radical curing adhesives using a combination of (meth)acrylate derivatives and peroxide, a radical polymerization initiator, and cationic curing adhesives using a combination of an epoxy resin and an onium salt, a cationic polymerization initiator, have been attracting attention. In the radical curing system, short-time curing is possible because radicals, which are reactive species, are very reactive, and peroxides stably exist below the decomposition temperature of the radical polymerization initiator, enabling low-temperature short-time curing and storage stability (e.g. For example, it is a curing system that achieves both storage stability at around room temperature. The cationic curing system is a curing system that achieves both low-temperature, short-time curing and storage stability because the onium salt, which is a reactive species, is highly reactive, enabling short-time curing, and the cationic species stably exists below the decomposition temperature of the onium salt. am.

On the other hand, in the above-described adhesive, in order to achieve firm adhesion to the adherend, a low molecular weight additive that can interact with the surface of the adherend through covalent bonding, hydrogen bonding, hydrophobic interaction due to van der Waals forces, etc., is used as a couple. There are cases where a ring agent or the like is used. Examples of the coupling agent include silane coupling agent; Compounds containing phosphoric acid groups, carboxyl groups, etc. are used. In particular, organic functional groups introduced into the resin matrix after curing (e.g., organic functional groups represented by epoxy groups, acryloyl groups, vinyl groups, etc.) and alkoxysilanes or coupling agents that interact with the surface of the adherend (e.g., When a coupling agent having a functional group such as a phosphate group is used, the adherend and the adhesive can be bonded more firmly (for example, see Patent Document 1 below).

Japanese Patent Publication No. 2013-191625 International Publication No. 2009/063827

However, adhesive compositions containing silane compounds are required to have excellent adhesive strength after reliability tests maintained under high temperature and high humidity conditions such as 85°C 85%RH and 60°C 95%RH.

The purpose of the present invention is to provide an adhesive composition having excellent adhesive strength after a reliability test, and a structure using the same.

The adhesive composition of the present invention contains a silane compound having a structure represented by the following general formula (I).

( ^{Wherein ,}

However, conventionally, adhesives containing a silane compound having an alkoxysilyl group and an organic group bonded to the alkoxysilyl group through an alkylene group are sometimes used. In contrast, the present inventor discovered the following knowledge regarding these silane compounds. That is, in conventional silane compounds, the carbon number of the alkylene group existing between Si of the alkoxysilyl group and the organic group is small (for example, the number of methylene groups (CH ₂ ) is as short as 3 or less). Therefore, when the first functional group of one of the alkoxysilyl group and the organic group reacts with one of the components of the adhesive (resin, etc.) and the adherend, it is difficult for the alkoxysilyl group and the organic group to be sufficiently separated, so that the alkoxysilyl group and the organic group Since the degree of steric freedom of the second functional group on the other side of the organic group is low, the reaction between the second functional group and the other component of the adhesive (resin, etc.) and the other side of the adherend does not occur sufficiently, so that the effect as a silane compound is not sufficiently achieved. I couldn't use it. As a result, there were problems such as a decrease in adhesive strength after a reliability test in which sufficient adhesive strength was not obtained and left under high temperature and high humidity conditions such as 85°C 85%RH and 60°C 95%RH.

On the other hand, the adhesive composition of the present invention has excellent adhesive strength after a reliability test. In addition, the adhesive composition of the present invention has excellent adhesive strength to adherends made of various materials (e.g., inorganic materials (oxides, metals, etc.), organic materials, and composites thereof) regardless of before or after the reliability test. .

The organic group

The adhesive composition of the present invention may further contain an epoxy resin and a latent curing agent.

The adhesive composition of the present invention may further contain a radically polymerizable compound and a curing agent that generates radicals by heat or light.

The adhesive composition of the present invention may further contain electrically conductive particles.

The adhesive composition of the present invention may be used for circuit connection (adhesive composition for circuit connection).

The structure of the present invention includes the adhesive composition or its cured product.

The structure of the present invention includes a first circuit member having a first circuit electrode, a second circuit member having a second circuit electrode, and a circuit connection member disposed between the first circuit member and the second circuit member. The first circuit electrode and the second circuit electrode may be electrically connected, and the circuit connection member may include the adhesive composition or a cured product thereof.

According to the present invention, an adhesive composition having excellent adhesive strength after a reliability test and a structure using the same can be provided. Furthermore, according to the present invention, it is possible to provide an adhesive composition having excellent adhesive strength to adherends made of various materials, regardless of before or after a reliability test, and a structure using the same.

According to the present invention, it is possible to provide application of the adhesive composition or its cured product to a structure or its production. According to the present invention, application of the adhesive composition or its cured product to circuit connections can be provided. According to the present invention, application of the adhesive composition or its cured product to circuit connection structures or their production can be provided.

1 is a schematic cross-sectional view showing one embodiment of the structure of the present invention.
Figure 2 is a schematic cross-sectional view showing another embodiment of the structure of the present invention.

Hereinafter, embodiments of the present invention will be described, but the present invention is in no way limited to these embodiments.

In this specification, “(meth)acrylate” means at least one of acrylate and the corresponding methacrylate. The same applies to other similar expressions such as “(meth)acryloyl” and “(meth)acrylic acid.” Unless otherwise specified, the materials exemplified below may be used individually or in combination of two or more types. The content of each component in the composition means the total amount of the plurality of substances present in the composition, unless otherwise specified, when multiple substances corresponding to each component exist in the composition. The numerical range indicated using “to” indicates a range that includes the numerical values written before and after “to” as the minimum and maximum values, respectively. “A or B” may include either A or B, and may include both. “Room temperature” means 25°C.

In the numerical range described in stages in this specification, the upper or lower limit of the numerical range at a certain level may be replaced with the upper or lower limit of the numerical range at another level. In addition, in the numerical range described in this specification, the upper or lower limit of the numerical range may be replaced with the value shown in the examples.

The adhesive composition of this embodiment contains a silane compound (hereinafter referred to as “silane compound A” in some cases) having a structure represented by the following general formula (I). According to the adhesive composition of the present embodiment, the alkoxysilyl group and the organic group Even after reaction, the degree of steric freedom of the other functional group can be secured, so it exhibits high adhesive strength to various adherends and also has sufficient adhesive strength even after the reliability test. This adhesive composition can be suitably used as an adhesive composition for circuit connection.

^{( Wherein ,} R ¹ may be the same or different from each other. When two or more R ^2s exist, each R ² may be the same or different from each other. Each of R ¹ , R ² and C _s H _2s may be branched. .)

The alkylene group of the silane compound A may be either a straight-chain alkylene group or a branched-chain alkylene group. When the number of carbon atoms between the alkoxysilyl group and the organic group When using silane compound A having a straight-chain alkylene group, the number of methylene groups, which were conventionally short, is 6 or more, so that even after the functional group of one of the alkoxysilyl group and the organic group Therefore, it exhibits high adhesive strength to various adherends and also has sufficient adhesive strength even after reliability testing.

Components of the adhesive composition of the present embodiment include, for example, (a) epoxy resin (hereinafter referred to as “component (a)” as the case may be), (b) latent curing agent (latent curing agent for epoxy resin. Hereinafter) , hereinafter referred to as “component (b)” as the case may be), (c) a radically polymerizable compound (hereinafter referred to as the “component (c)” as the case may be), and (d) heat (heating) or light (light irradiation) ) and a curing agent that generates radicals (free radicals) (hereinafter referred to as “component (d)” depending on the case). The first aspect of the adhesive composition of this embodiment contains component (a) and component (b). The second aspect of the adhesive composition of this embodiment contains component (c) and component (d). The third aspect of the adhesive composition of this embodiment contains component (a), component (b), component (c), and component (d).

Below, each component is explained.

(Silane compound)

The organic group Atom-containing groups (groups containing sulfur atoms), epoxy groups, etc. can be mentioned. Examples of the ethylenically unsaturated bond-containing group include (meth)acryloyl group, vinyl group, and styryl group. Examples of the nitrogen atom-containing group include amino group, mono-substituted amino group, di-substituted amino group, isocyanato group, imidazole group, ureide group, maleimide group, etc. Examples of the monosubstituted amino group include alkylamino groups (methylamino group, etc.), benzylamino groups, phenylamino groups, and cycloalkylamino groups (cyclohexylamino groups, etc.). Examples of the di-substituted amino group include a non-cyclic di-substituted amino group and a cyclic di-substituted amino group. Examples of the non-cyclic di-substituted amino group include dialkylamino groups (dimethylamino group, etc.). Examples of the cyclic disubstituted amino group include morpholino group and piperazino group. Examples of sulfur atom-containing groups include mercapto groups. The epoxy group may be contained in an epoxy group-containing group (group containing an epoxy group) such as a glycidyl group or a glycidoxy group. The (meth)acryloyl group may be included in the (meth)acryloyloxy group.

The organic group X preferably has reactivity with components of the adhesive composition other than the silane compound. The organic group It is preferable to include one type.

The carbon number of the alkyl groups of R ¹ and R ² is, for example, 1 to 20. Specific examples of the alkyl group include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, tridecyl, tetradecyl, and pentade. Examples include syl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecyl group, and icosyl group. As R ¹ and R ² , each structural isomer of the above alkyl group can be used. The number of carbon atoms of the alkyl group of R ¹ is preferably 1 to 10, and is preferably 1 to 5 from the viewpoint of preventing steric hindrance when the alkoxysilyl group portion reacts with the adherend and further improving adhesion to the adherend. desirable. The number of carbon atoms in the alkyl group of R ² is preferably 1 to 10, more preferably 1 to 5, from the viewpoint of further improving adhesion to the adherend.

m is an integer from 0 to 2. From the viewpoint of further improving adhesion to the adherend, m is preferably 0 to 1, and 0 is more preferable. s is an integer of 6 or more. From the viewpoint of increasing the physical distance between the organic group From the same viewpoint, the number of carbon atoms in the carbon chain (linear portion) between the organic group

As silane compound A, glycidoxyalkyltrialkoxysilane, glycidoxyalkyldialkoxysilane, (meth)acryloxyalkyltrialkoxysilane, (meth)acryloxydialkyldialkoxysilane, alkenyltrialkoxysilane, styryl. Alkyltrialkoxysilane, N-2-(aminoethyl)-8-aminooctylmethyldimethoxysilane, N-2-(aminoethyl)-8-aminooctyltrimethoxysilane, 3-aminooctyltrimethoxysilane, 3-aminooctyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)octylamine, N-phenyl-8-aminooctyltrimethoxysilane, 8-ureidooctyltriene Toxysilane, 8-mercaptooctylmethyldimethoxysilane, 8-mercaptooctyltrimethoxysilane, 8-isocyanate octyltrimethoxysilane, 8-isocyanate octyltriethoxysilane, etc. are mentioned.

Examples of glycidoxyalkyltrialkoxysilane include 8-glycidoxyoctyltrimethoxysilane, 8-glycidoxyoctyltriethoxysilane, etc. Examples of glycidoxyalkyldialkoxysilane include 8-glycidoxyoctylmethyldimethoxysilane, 8-glycidoxyoctylmethyldiethoxysilane, etc. Examples of (meth)acryloxyalkyltrialkoxysilane include 8-(meth)acryloxyoctyltrimethoxysilane, 8-(meth)acryloxyoctyltriethoxysilane, and the like. Examples of (meth)acryloxydialkyldialkoxysilane include 8-(meth)acryloxyoctylmethyldimethoxysilane, 8-(meth)acryloxyoctylmethyldiethoxysilane, and the like. Examples of alkenyltrialkoxysilane include octenyltrialkoxysilane and octenylalkyl dialkoxysilane. Examples of octenyltrialkoxysilane include 7-octenyltrimethoxysilane and 7-octenyltriethoxysilane. Examples of octenylalkyldialkoxysilane include 7-octenylmethyldimethoxysilane and 7-octenylmethyldiethoxysilane. Examples of styrylalkyltrialkoxysilane include p-styryloctyltrimethoxysilane.

Silane compound A can be synthesized by, for example, reacting organochlorosilane with alcohol. Silane compound A may be used individually, or may be used in combination of two or more types. The adhesive composition of this embodiment may further contain a silane compound in which s is 0 to 5 in formula (I).

The content of silane compound A is adjusted as an adhesive component in the adhesive composition (adhesive composition) from the viewpoint of tending to strengthen the adhesive force at the interface between the adherend (circuit member, etc.) and the adhesive composition or its cured product (circuit connection member, etc.) The following range is preferable based on the total mass of solids other than the conductive particles (the same applies hereinafter). The content of silane compound A is preferably 0.1 mass% or more, more preferably 0.25 mass% or more, and still more preferably 0.5 mass% or more. The content of silane compound A is preferably 20% by mass or less, more preferably 10% by mass or less, and still more preferably 5% by mass or less. From this viewpoint, the content of silane compound A is preferably 0.1 to 20% by mass, more preferably 0.25 to 10% by mass, and still more preferably 0.5 to 5% by mass.

((a) component: epoxy resin)

(a) Components include bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, naphthalene-type epoxy resin, phenol novolak-type epoxy resin, cresol novolak-type epoxy resin, and bisphenol A novolak-type epoxy resin. , bisphenol F novolac type epoxy resin, alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, hydantoin type epoxy resin, isocyanurate type epoxy resin, aliphatic chain epoxy resin, etc. I can hear it. (a) Component may be halogenated or hydrogenated. (a) Components may be used individually, or may be used in combination of two or more types.

The content of component (a) is preferably within the following range based on the total mass of the adhesive components of the adhesive composition from the viewpoint of further improving adhesion to the adherend. The content of component (a) is preferably 5% by mass or more, more preferably 10% by mass or more, and still more preferably 15% by mass or more. The content of component (a) is preferably 90% by mass or less, more preferably 80% by mass or less, and still more preferably 70% by mass or less. From this viewpoint, the content of component (a) is preferably 5 to 90 mass%, more preferably 10 to 80 mass%, and still more preferably 15 to 70 mass%.

((b) Ingredient: Latent hardener)

The component (b) is not particularly limited as long as it can cure the epoxy resin. (b) Components include a curing agent capable of generating anionic species by heat or light (anionic polymerizable catalytic curing agent, etc.), a curing agent capable of generating cationic species by heat or light (cationic polymerizable catalytic curing agent, etc.), A polyaddition type hardener, etc. are mentioned. (b) Components may be used individually or in combination of two or more types. The component (b) is preferably a curing agent that has excellent rapid curing properties and can generate anionic or cationic species by heat or light from the viewpoint of unnecessary chemical equivalence considerations, and is preferably an anionically polymerizable or cationically polymerizable catalyst type. Hardeners are more preferred.

Examples of anionic polymerizable catalyst-type curing agents include imidazole-based curing agents, hydrazide-based curing agents, boron trifluoride-amine complexes, amineimides, tertiary amines, diaminomaleonitrile, melamine and its derivatives, polyamine salts, and dimethyl amines. Examples include andiamide, and their denatured products can also be used. Examples of cationically polymerizable catalyst-type curing agents include diazonium salts and sulfonium salts, and modified products thereof can also be used. Examples of polyaddition type curing agents include polyamines, polymer captans, polyphenols, and acid anhydrides.

When using tertiary amines, imidazole-based curing agents, etc. as an anionic polymerizable catalyst-type curing agent, the epoxy resin can be cured by heating at a moderate temperature of about 160 to 200 ° C. for several tens of seconds to several hours. Therefore, the pot life (usable time) can be relatively long.

As a cationically polymerizable catalyst-type curing agent, for example, a photosensitive onium salt (aromatic diazonium salt, aromatic sulfonium salt, etc.) that can cure an epoxy resin by energy ray irradiation is preferable. In addition to irradiation with energy rays, examples of those that harden the epoxy resin by activating it with heat include aliphatic sulfonium salts. These curing agents are preferable because they have rapid curing properties.

(b) A curing agent in which the components are microencapsulated by covering them with a polymer material (polyurethane-based, polyester-based, etc.), a thin film of metal (nickel, copper, etc.), or an inorganic material (calcium silicate, etc.) can extend the pot life. Therefore, it is desirable.

The content of component (b) is preferably within the following range relative to 100 parts by mass of component (a) from the viewpoint of further improving adhesion to the adherend. The content of the component (b) is preferably 10 parts by mass or more, more preferably 20 parts by mass or more, and even more preferably 30 parts by mass or more. The content of the component (b) is preferably 500 parts by mass or less, more preferably 100 parts by mass or less, and even more preferably 70 parts by mass or less. From this viewpoint, the content of component (b) is preferably 10 to 500 parts by mass, more preferably 20 to 100 parts by mass, and still more preferably 30 to 70 parts by mass.

From the viewpoint of further improving adhesion to the adherend, the content of component (b) is preferably within the following range for a total of 100 parts by mass of component (a) and the film forming material (component blended as necessary). The content of the component (b) is preferably 10 parts by mass or more, more preferably 20 parts by mass or more, and even more preferably 30 parts by mass or more. The content of the component (b) is preferably 90 parts by mass or less, more preferably 80 parts by mass or less, and still more preferably 70 parts by mass or less. From this viewpoint, the content of component (b) is preferably 10 to 90 parts by mass, more preferably 20 to 80 parts by mass, and still more preferably 30 to 90 parts by mass.

((c) component: radically polymerizable compound)

(c) Component is a compound having a functional group capable of radical polymerization. (c) Components include (meth)acrylate compounds, maleimide compounds, citraconimide resin, nadiimide resin, etc. “(meth)acrylate compound” means a compound having a (meth)acryloyl group. The component (c) may be used in the form of a monomer or oligomer, or a combination of a monomer and an oligomer may be used. (c) Components may be used individually or in combination of two or more.

Specific examples of (meth)acrylate compounds include methyl (meth)acrylate, ethyl (meth)acrylate, isopropyl (meth)acrylate, isobutyl (meth)acrylate, ethylene glycol di(meth)acrylate, and di(meth)acrylate. Ethylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, 2-hydroxy-1,3-di(meth)acryloxypropane, 2,2 -bis[4-((meth)acryloxymethoxy)phenyl]propane, 2,2-bis[4-((meth)acryloxypolyethoxy)phenyl]propane, dicyclopentenyl (meth)acrylate, Examples include tricyclodecanyl (meth)acrylate, tris((meth)acryloyloxyethyl)isocyanurate, isocyanuric acid EO-modified di(meth)acrylate, and urethane (meth)acrylate. . As a radically polymerizable compound other than a (meth)acrylate compound, for example, a compound described in Patent Document 2 (International Publication No. 2009/063827) can be suitably used. A (meth)acrylate compound may be used individually, or may be used in combination of two or more types.

From the viewpoint of excellent reactivity and stress relaxation, the component (c) is preferably a (meth)acrylate compound, and more preferably urethane (meth)acrylate. From the viewpoint of improving heat resistance, the (meth)acrylate compound preferably has at least one substituent selected from the group consisting of a dicyclopentenyl group, a tricyclodecanyl group, and a triazine ring.

In addition, as the component (c), it is preferable to use a radically polymerizable compound having a phosphate ester structure represented by the following formula (II), and the radically polymerizable compound such as a (meth)acrylate compound and the formula (II) It is more preferable to use together a radically polymerizable compound having a phosphate ester structure represented by ). In these cases, the adhesive strength to the surface of an inorganic material (metal, etc.) is improved, so they are suitable for adhering circuit electrodes to each other, for example.

[Wherein, p represents an integer of 1 to 3, and R represents a hydrogen atom or a methyl group.]

The radically polymerizable compound having the phosphoric acid ester structure is obtained, for example, by reacting phosphoric acid anhydride with 2-hydroxyethyl (meth)acrylate. Specific examples of the radically polymerizable compound having the phosphoric acid ester structure include mono(2-(meth)acryloyloxyethyl)acid phosphate, di(2-(meth)acryloyloxyethyl)acid phosphate, etc. . The radically polymerizable compound having a phosphate ester structure represented by formula (II) may be used individually or in combination of two or more types.

From the viewpoint of further improving adhesion to the adherend, the content of the radically polymerizable compound having a phosphate ester structure represented by formula (II) is 100 (total amount of components corresponding to the radically polymerizable compound). 0.1 to 1000 parts by mass is preferable, and 1 to 100 parts by mass is more preferable. The content of the radically polymerizable compound having a phosphate ester structure represented by formula (II) is determined by adding the radically polymerizable compound and the film forming material (component used as necessary) from the viewpoint of further improving the adhesion to the adherend. The amount is preferably 0.01 to 50 parts by mass, and 0.5 to 10 parts by mass is more preferable for a total of 100 parts by mass.

The radically polymerizable compound may contain allyl (meth)acrylate. In this case, the content of allyl (meth)acrylate is preferably 0.1 to 10 parts by mass, and more preferably 0.5 to 5 parts by mass, based on a total of 100 parts by mass of the radical polymerizable compound and the film forming material (components used as necessary). desirable.

The content of component (c) is preferably within the following range based on the total mass of the adhesive components of the adhesive composition from the viewpoint of further improving adhesion to the adherend. The content of the component (c) is preferably 10% by mass or more, more preferably 20% by mass or more, and even more preferably 30% by mass or more. The content of the component (c) is preferably 90% by mass or less, more preferably 80% by mass or less, and even more preferably 70% by mass or less. From this viewpoint, the content of component (c) is preferably 10 to 90% by mass, more preferably 20 to 80% by mass, and even more preferably 30 to 70% by mass.

((d) Ingredient: Hardener that generates radicals by heat or light)

(d) As the component, (d1) a curing agent that generates free radicals by heat (hereinafter referred to as “component (d1)” as the case may be), or (d2) a curing agent that generates free radicals by light (hereinafter, in the case Depending on this, “(d2) component”) can be used. Component (d1) is a curing agent that is decomposed by heat and generates free radicals. Examples of the (d1) component include peroxides (organic peroxides, etc.) and azo compounds. From the viewpoint of high reactivity and improvement of pot life, the component (d1) is preferably an organic peroxide whose half-life temperature of 10 hours is 40°C or higher and the half-life temperature of 1 minute is 180°C or lower, and the half-life temperature of 10 hours is 60°C or higher. Organic peroxides having a temperature of ℃ or higher and a half-life of 1 minute of 170 ℃ or lower are more preferable.

Specific examples of the component (d1) include diacyl peroxide (benzoyl peroxide, etc.), peroxydicarbonate, peroxy ester, peroxy ketal, dialkyl peroxide, hydroperoxide, silyl peroxide, etc. .

As the component (d1), from the viewpoint of suppressing corrosion of electrodes (circuit electrodes, etc.), a curing agent containing a concentration of chlorine ions and organic acids of 5000 ppm or less is preferable, and a curing agent containing less organic acid generated after thermal decomposition is more preferable. Specific examples of such component (d1) include peroxyester, dialkyl peroxide, hydroperoxide, silyl peroxide, etc., and from the viewpoint of obtaining high reactivity, peroxyester is more preferable.

Examples of peroxyesters include cumyl peroxyneodecanoate, 1,1,3,3-tetramethylbutylperoxyneodecanoate, 1-cyclohexyl-1-methylethylperoxyneodecanoate, and t-hexyl. Silperoxyneodecanoate, t-butylperoxypivalate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl-2,5-di(2- Ethylhexanoylperoxy)hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate Noate, t-butylperoxyisobutyrate, 1,1-bis(t-butylperoxy)cyclohexane, t-hexylperoxyisopropylmonocarbonate, t-butylperoxy-3,5,5- Trimethylhexanoate, t-butylperoxylaurate, 2,5-dimethyl-2,5-di(m-toluoylperoxy)hexane, t-butylperoxyisopropylmonocarbonate, t-butylper Oxy-2-ethylhexyl monocarbonate, t-hexyl peroxybenzoate, t-butyl peroxy acetate, etc. are mentioned. As the (d1) component other than the peroxyester, for example, a compound described in Patent Document 2 (International Publication No. 2009/063827) can be suitably used. Peroxyesters may be used individually, or two or more types may be used in combination.

Component (d2) is a curing agent that is decomposed by light and generates free radicals. As the component (d2), a compound that generates free radicals when irradiated with light with a wavelength of 150 to 750 nm can be used. Such compounds include, for example, those described in Photoinitiation, Photopolymerization, and Photocuring, J.-P, from the viewpoint of high sensitivity to light irradiation. The α-acetoaminophenone derivatives and phosphine oxide derivatives described in Fouassier, Hanser Publishers (1995), pages 17 to 35 are preferred. (d2) Components may be used individually, or may be used in combination of two or more types. You may use a combination of component (d2) and component (d1) (the above peroxide, azo compound, etc.). You may use component (d1) or component (d2) in combination with a curing agent that generates free radicals by ultrasonic waves, electromagnetic waves, etc.

(d) Components are appropriately selected depending on the target connection temperature, connection time, potable time, etc. (d) Components may be used individually or in combination of two or more types. (d) Component and a decomposition accelerator, a decomposition inhibitor, etc. may be used together. Additionally, component (d) may be microencapsulated by coating it with a polyurethane-based or polyester-based polymer material. Microencapsulated curing agents are preferred because of their extended pot life.

The content of component (d) is preferably in the following range from the viewpoint of easily obtaining a sufficient reaction rate when the connection time is 25 seconds or less. The content of component (d) is preferably 0.1 part by mass or more, and more preferably 1 part by mass or more, per 100 parts by mass of component (c). The content of component (d) is preferably 40 parts by mass or less, and more preferably 20 parts by mass or less, per 100 parts by mass of component (c). From this viewpoint, the content of component (d) is preferably 0.1 to 40 parts by mass, and more preferably 1 to 20 parts by mass, per 100 parts by mass of component (c).

The content of component (d) is preferably in the following range from the viewpoint of easily obtaining a sufficient reaction rate when the connection time is 25 seconds or less. The content of component (d) is preferably 0.1 part by mass or more, and more preferably 1 part by mass or more, based on a total of 100 parts by mass of component (c) and film forming material (component used as necessary). The content of component (d) is preferably 40 parts by mass or less, and more preferably 20 parts by mass or less, based on a total of 100 parts by mass of component (c) and film forming material (component used as necessary). From this viewpoint, the content of component (d) is preferably 0.1 to 40 parts by mass, and more preferably 1 to 20 parts by mass, based on a total of 100 parts by mass of component (c) and film forming material (component used as necessary). desirable.

When the connection time is not limited, the content of component (d) is preferably within the following range from the viewpoint of easily obtaining a sufficient reaction rate. The content of component (d) is preferably 0.01 parts by mass or more, and more preferably 0.1 part by mass or more, per 100 parts by mass of component (c). The content of component (d) is preferably 30 parts by mass or less, and more preferably 15 parts by mass or less, per 100 parts by mass of component (c). From this viewpoint, the content of component (d) is preferably 0.01 to 30 parts by mass, and more preferably 0.1 to 15 parts by mass, per 100 parts by mass of component (c).

When the connection time is not limited, the content of component (d) is preferably within the following range from the viewpoint of easily obtaining a sufficient reaction rate. The content of component (d) is preferably 0.01 parts by mass or more, and more preferably 0.1 part by mass or more, based on a total of 100 parts by mass of component (c) and film forming material (component used as necessary). The content of the component (d) is preferably 30 parts by mass or less, and more preferably 15 parts by mass or less, based on a total of 100 parts by mass of the component (c) and the film forming material (component used as necessary). From this point of view, the content of component (d) is preferably 0.01 to 30 parts by mass, more preferably 0.1 to 15 parts by mass, based on a total of 100 parts by mass of component (c) and film forming material (component used as necessary). desirable.

(Film former)

The adhesive composition of this embodiment may contain a film forming material as needed. When a liquid adhesive composition is solidified into a film, the film forming material improves the handleability of the film under normal conditions (at room temperature and pressure) and provides properties such as resistance to tearing, cracking, and sticking to the film. can be granted. Examples of film forming materials include phenoxy resin, polyvinyl formal, polystyrene, polyvinyl butyral, polyester, polyamide, xylene resin, and polyurethane. Among these, phenoxy resin is preferable from the viewpoint of excellent adhesion, compatibility, heat resistance, and mechanical strength. Film forming materials may be used individually or in combination of two or more types.

Examples of the phenoxy resin include a resin obtained by polyaddition of a bifunctional epoxy resin and a bifunctional phenol, and a resin obtained by reacting a bifunctional phenol with epihalohydrin until polymerization. Phenoxy resin can be obtained, for example, by reacting 1 mole of difunctional phenol and 0.985 to 1.015 mole of epihalohydrin in a non-reactive solvent at a temperature of 40 to 120°C in the presence of a catalyst such as an alkali metal hydroxide. there is. As a phenoxy resin, from the viewpoint of excellent mechanical and thermal properties of the resin, the mixing equivalence ratio of the difunctional epoxy resin and the difunctional phenol is set to epoxy group/phenol hydroxyl group = 1/0.9 to 1/1.1, and the alkali metal compound is used. , in the presence of a catalyst such as an organophosphorus compound or a cyclic amine compound, in an organic solvent (amide-based, ether-based, ketone-based, lactone-based, alcohol-based, etc.) with a boiling point of 120°C or higher, under conditions where the reaction solid content is 50% by mass or less. A resin obtained by heating to 50 to 200° C. and subjecting the resin to a central addition reaction is preferred. Phenoxy resins may be used individually or in combination of two or more types.

Examples of the bifunctional epoxy resin include bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol AD-type epoxy resin, bisphenol S-type epoxy resin, biphenyl diglycidyl ether, and methyl-substituted biphenyl diglycidyl ether. You can. Bifunctional phenols are compounds having two phenolic hydroxyl groups. As bifunctional phenols, hydroquinones, bisphenol A, bisphenol F, bisphenol AD, bisphenol S, bisphenol fluorene (4,4'-(9-fluorenylidene)diphenol, etc.), methyl-substituted bisphenol fluorene, dihyde. and bisphenols such as hydroxybiphenyl and methyl-substituted dihydroxybiphenyl. The phenoxy resin may be modified (for example, epoxy modified) with a radical polymerizable functional group or other reactive compound.

The content of the film forming material is preferably 10 to 90 parts by mass, more preferably 20 to 60 parts by mass, based on 100 parts by mass of the adhesive component of the adhesive composition.

(conductive particle)

The adhesive composition of this embodiment may further contain electrically conductive particles. Constituent materials of the conductive particles include metals such as gold (Au), silver (Ag), nickel (Ni), copper (Cu), solder, and carbon. Additionally, coated conductive particles may be formed by using a non-conductive resin, glass, ceramic, plastic, etc. as the core and covering the core with the metal (metal particles, etc.) or carbon. Covered conductive particles or heat-fused metal particles are preferable because they have deformability by heat and pressure, so they eliminate fluctuations in the height of the circuit electrodes during connection and improve reliability by increasing the contact area with the electrodes during connection. do.

The average particle diameter of the conductive particles is preferably 1 to 30 μm from the viewpoint of excellent dispersibility and conductivity. The average particle diameter of the conductive particles can be measured using, for example, instrumental analysis such as laser diffraction. From the viewpoint of excellent conductivity, the content of the conductive particles is preferably 0.1 part by mass or more, and more preferably 1 part by mass or more, per 100 parts by mass of the adhesive component of the adhesive composition. From the viewpoint of easily suppressing short circuit of electrodes (circuit electrodes, etc.), the content of conductive particles is preferably 100 parts by mass or less, and more preferably 50 parts by mass or less, with respect to 100 parts by mass of the adhesive component of the adhesive composition.

(Other ingredients)

The adhesive composition of this embodiment may contain a polymerization inhibitor, such as hydroquinone and methyl ether hydroquinone, as needed.

The adhesive composition of this embodiment may further contain a homopolymer or copolymer obtained by polymerizing at least one monomer component selected from the group consisting of (meth)acrylic acid, (meth)acrylic acid ester, and acrylonitrile. The adhesive composition of this embodiment preferably contains acrylic rubber, etc., which is a copolymer obtained by polymerizing glycidyl (meth)acrylate having a glycidyl ether group, from the viewpoint of excellent stress relaxation. The weight average molecular weight of the acrylic rubber is preferably 200,000 or more from the viewpoint of increasing the cohesion of the adhesive composition.

The adhesive composition of this embodiment may contain coated fine particles in which the surfaces of the conductive particles are coated with a polymer resin or the like. When such coated fine particles are used in combination with the above-described conductive particles, even when the content of conductive particles increases, short-circuiting due to contact between conductive particles is easily suppressed, and the insulation between adjacent circuit electrodes can be improved. The above-mentioned coated fine particles may be used alone without using conductive particles, or the coated fine particles and conductive particles may be used together.

The adhesive composition of this embodiment may contain rubber particles, fillers, softeners, accelerators, anti-aging agents, colorants, flame retardants, thixotropic agents, coupling agents, phenol resins, melamine resins, isocyanates, etc. The adhesive composition of this embodiment may appropriately contain additives such as an adhesion improver (excluding the coupling agent), a thickener, a leveling agent, a colorant, and a weather resistance improver.

The rubber fine particles preferably have an average particle diameter of twice that of the conductive particles or less, and have a storage elastic modulus at room temperature of 1/2 or less of the storage elastic modulus of the conductive particles and the adhesive composition at room temperature. In particular, when the material of the rubber particles is silicone, acrylic emulsion, SBR, NBR, or polybutadiene rubber, it is appropriate to use the rubber particles individually or in a mixture of two or more types. Three-dimensional crosslinked rubber fine particles have excellent solvent resistance and are easily dispersed in the adhesive composition.

Fillers can improve electrical characteristics (connection reliability, etc.) between circuit electrodes. As a filler, for example, particles having an average particle diameter of 1/2 or less of the average particle diameter of the conductive particles can be suitably used. When non-conductive particles are used in combination with a filler, particles with an average particle diameter smaller than that of the non-conductive particles can be used as the filler. The content of the filler is preferably 5 to 60 parts by mass with respect to 100 parts by mass of the adhesive component of the adhesive composition. When the content is 60 parts by mass or less, the effect of improving connection reliability tends to be more fully obtained. When the content is 5 parts by mass or more, the effect of adding the filler tends to be sufficiently obtained.

The adhesive composition of this embodiment can be used in paste form if it is liquid at room temperature. If it is solid at room temperature, in addition to using it by heating, you may also use a solvent to form a paste. There is no particular limitation as to the solvent that can be used, as long as it is non-reactive with respect to the adhesive composition and additives and shows sufficient solubility, but a solvent with a boiling point of 50 to 150°C at normal pressure is preferred. If the boiling point is 50°C or higher, the solvent has insufficient volatility at room temperature, so it can be used even in an open system. If the boiling point is 150°C or lower, it is easy to volatilize the solvent, so good reliability is obtained after adhesion.

The adhesive composition of this embodiment may be in a film form. A film can be obtained by adding a solvent or the like to the adhesive composition as needed and applying the resulting solution onto a fluororesin film, polyethylene terephthalate film, or peelable substrate (release paper, etc.), and then removing the solvent or the like. Additionally, a film can be obtained by impregnating a substrate such as a non-woven fabric with the solution, placing it on a peelable substrate, and then removing the solvent, etc. When used in film form, it is more convenient from the viewpoint of excellent handling properties, etc.

The adhesive composition of this embodiment can be bonded by applying pressure along with heating or light irradiation. By using heating and light irradiation together, bonding can be achieved at a lower temperature and in a shorter time. The light irradiation is preferably irradiated with light in a wavelength range of 150 to 750 nm. It can be cured at an irradiation dose of 0.1 to 10 J/cm ² using a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp (ultra-high pressure mercury lamp, etc.), a xenon lamp, a metal halide lamp, etc. The heating temperature is not particularly limited, but a temperature of 50 to 170°C is preferable. The pressure is not particularly limited as long as it does not damage the adherend, but is preferably 0.1 to 10 MPa. Heating and pressurization are preferably performed within the range of 0.5 seconds to 3 hours.

The adhesive composition of this embodiment can be used as an adhesive for different types of adherends with different thermal expansion coefficients. Specifically, circuit connection materials such as anisotropic conductive adhesive, silver paste, silver film, etc.; It can be used as a semiconductor device adhesive material such as elastomer for CSP, underfill material for CSP, and LOC tape. The adhesive composition of the present embodiment has excellent adhesive strength to adherends made of various materials (e.g., inorganic materials (oxides, metals, etc.), organic materials, and composites thereof) regardless of before or after the reliability test.

<Structure and its manufacturing method>

The structure of this embodiment includes the adhesive composition of this embodiment or its cured product. The structure of this embodiment is, for example, a semiconductor device such as a circuit connection structure. As one form of the structure of this embodiment, the circuit connection structure includes a first circuit member having a first circuit electrode, a second circuit member having a second circuit electrode, and between the first circuit member and the second circuit member. It has an arranged circuit connection member. The first circuit member has, for example, a first substrate and a first circuit electrode disposed on the first substrate. The second circuit member has, for example, a second substrate and a second circuit electrode disposed on the second substrate. The first circuit electrode and the second circuit electrode face each other and are electrically connected. The circuit connection member contains the adhesive composition of this embodiment or its cured product. The structure according to the present embodiment may be provided with the adhesive composition according to the present embodiment or a cured product thereof, and a member (substrate, etc.) without a circuit electrode may be used instead of the circuit member of the circuit connection structure.

The method for manufacturing the structure of this embodiment includes a step of curing the adhesive composition of this embodiment. As one form of the method of manufacturing the structure of the present embodiment, the method of manufacturing the circuit connection structure includes forming a structure between a first circuit member having a first circuit electrode and a second circuit member having a second circuit electrode. A batch process for arranging the adhesive composition, a heating and pressing process for pressurizing the first circuit member and the second circuit member to electrically connect the first circuit electrode and the second circuit electrode, and heating and curing the adhesive composition. do. In the arrangement process, the first circuit electrode and the second circuit electrode may be arranged to face each other. In the heating and pressing process, the first circuit member and the second circuit member can be pressed in directions opposing each other.

Hereinafter, using the drawings, a circuit connection structure and its manufacturing method will be described as one form of this embodiment. 1 is a schematic cross-sectional view showing one embodiment of a structure. The circuit connection structure 100a shown in FIG. 1 includes a circuit member (first circuit member) 20 and a circuit member (second circuit member) 30 that face each other, and the circuit member 20 and the circuit A circuit connection member 10 is disposed between the members 30 to connect them. The circuit connection member 10 contains a cured product of the adhesive composition of this embodiment.

The circuit member 20 includes a substrate (first substrate) 21 and a circuit electrode (first circuit electrode) 22 disposed on the main surface 21a of the substrate 21. An insulating layer (not shown) may be disposed on the main surface 21a of the substrate 21 as the case may be.

The circuit member 30 includes a substrate (second substrate) 31 and a circuit electrode (second circuit electrode) 32 disposed on the main surface 31a of the substrate 31. An insulating layer (not shown) may be disposed on the main surface 31a of the substrate 31 as the case may be.

The circuit connection member 10 contains an insulating material (cured product of components excluding conductive particles) 10a and conductive particles 10b. The conductive particles 10b are disposed at least between the circuit electrodes 22 and 32 that face each other. In the circuit connection structure 100a, the circuit electrode 22 and the circuit electrode 32 are electrically connected through the conductive particles 10b.

The circuit members 20 and 30 have one or more circuit electrodes (connection terminals). As the circuit members 20 and 30, for example, members having electrodes that require electrical connection can be used. Circuit members include chip components such as semiconductor chips (IC chips), resistor chips, and condenser chips; Substrates such as printed boards and semiconductor mounting boards can be used. Combinations of the circuit members 20 and 30 include, for example, a semiconductor chip and a semiconductor mounting substrate. Materials for the substrate include, for example, inorganic materials such as semiconductors, glass, and ceramics; Organic substances such as polyimide, polyethylene terephthalate, polycarbonate, (meth)acrylic resin, and cyclic olefin resin; and composites such as glass/epoxy. The substrate may be a plastic substrate.

Figure 2 is a schematic cross-sectional view showing another embodiment of the structure. The circuit connection structure 100b shown in FIG. 2 has the same structure as the circuit connection structure 100a except that the circuit connection member 10 does not contain the conductive particles 10b. In the circuit connection structure 100b shown in FIG. 2, the circuit electrode 22 and the circuit electrode 32 are electrically connected by direct contact without passing through conductive particles.

The circuit connection structures 100a and 100b can be manufactured, for example, by the following method. First, when the adhesive composition is in a paste form, a resin layer containing the adhesive composition is disposed on the circuit member 20 by applying and drying the adhesive composition. When the adhesive composition is in the form of a film, a resin layer containing the adhesive composition is disposed on the circuit member 20 by attaching the film-shaped adhesive composition to the circuit member 20 . Subsequently, the circuit member 30 is placed on the resin layer disposed on the circuit member 20 so that the circuit electrodes 22 and 32 are opposed to each other. Then, by subjecting the resin layer containing the adhesive composition to heat treatment or light irradiation, the adhesive composition is cured and a cured product (circuit connection member 10) is obtained. As a result, the circuit connection structures 100a and 100b are obtained.

Example

Hereinafter, the present invention will be described in detail based on examples, but the present invention is not limited to the following examples.

<Production of adhesive composition on film>

[Example 1]

A phenoxy resin was synthesized from a bisphenol A type epoxy resin and a phenol compound (4,4'-(9-fluorenylidene)-diphenol) having a fluorene ring structure in the molecule. This phenoxy resin was dissolved in a mixed solvent of toluene/ethyl acetate = 50/50 (mass ratio) to prepare a solution with a solid content of 40% by mass. Next, an acrylic rubber (a copolymer of 40 parts by mass of butyl acrylate, 30 parts by mass of ethyl acrylate, 30 parts by mass of acrylonitrile, and 3 parts by glycidyl methacrylate, weight average molecular weight of 800,000) was prepared as a rubber component. , this acrylic rubber was dissolved in a mixed solvent of toluene/ethyl acetate = 50/50 (mass ratio) to prepare a solution with a solid content of 15% by mass. In addition, a liquid curing agent-containing epoxy resin (epoxy equivalent weight: 202) was prepared. Additionally, as a silane compound, 8-glycidoxyoctyltrimethoxysilane (product name: KBM4803, manufactured by Shin-Etsu Chemical Co., Ltd.) was prepared.

These materials were blended so that the mass ratio (solid content) of phenoxy resin, acrylic rubber, epoxy resin containing hardener, and silane compound was 20:30:47:3, and varnish A1 (liquid containing adhesive composition) was prepared. Additionally, conductive particles A were produced in which a nickel layer with a thickness of 0.2 μm was formed on the surface of the particle with polystyrene as the core. The average particle diameter of the conductive particles was 5 μm and specific gravity was 2.5. Varnish B1 (liquid containing circuit connection material) was prepared by mixing 5 parts by mass of this conductive particle A with 100 parts by mass of solid content of varnish A1. Varnish B1 was applied using a coating device on a 50㎛ thick polyethylene terephthalate (PET) film that had been surface treated on one side, and then dried with hot air at 70°C for 3 minutes to produce a film-like adhesive composition with a thickness of 20㎛. It was formed on PET film.

[Comparative Example 1]

As the silane compound, Example 1 and A film-like adhesive composition was produced in the same manner.

[Example 2]

50 g of phenoxy resin (product name: PKHC, manufactured by Union Carbide Co., Ltd., weight average molecular weight 45000) was dissolved in a mixed solvent of toluene/ethyl acetate = 50/50 (mass ratio) to obtain a phenoxy resin solution with a solid content of 40% by mass. It was prepared. As a radically polymerizable compound, isocyanuric acid EO-modified diacrylate (product name: M-215, Toagosei Co., Ltd.), 2-(meth)acryloyloxyethyl phosphate (product name: P-2M, Kyoeki) (manufactured by Shah Kagaku Co., Ltd.) and urethane acrylate (product name: U-2PPA, manufactured by Shinnakamura Kagaku Kogyo Co., Ltd.) were used. As a silane compound, 7-octenyltrimethoxysilane (product name: KBM1083, manufactured by Shin-Etsu Chemical Co., Ltd.) was prepared. Benzoyl peroxide (product name: Naifer BMT-K40, manufactured by Nichiyu Corporation) was prepared as a radical generator.

For these materials, the mass ratio (solid content) of phenoxy resin, isocyanuric acid EO-modified diacrylate, 2-(meth)acryloyloxyethyl phosphate, urethane acrylate, silane compound, and radical generator is 50:19: The mixture was mixed in a ratio of 3:20:3:5, and varnish B1 (liquid containing adhesive composition) was prepared. Additionally, 5 parts by mass of conductive particles A were mixed with 100 parts by mass of solid content of varnish B1 to prepare varnish B2 (liquid containing circuit connection material). Varnish B2 was applied using a coating device on a 50㎛ thick polyethylene terephthalate (PET) film that had been surface treated on one side, and then dried with hot air at 70°C for 3 minutes to produce a film-like adhesive composition with a thickness of 20㎛. It was formed on PET film.

[Comparative Example 2]

A film-like adhesive composition was prepared in the same manner as in Example 2, except that vinyltrimethoxysilane (product name: KBM103, manufactured by Shin-Etsu Chemical Co., Ltd.) was used as the silane compound instead of 7-octenyltrimethoxysilane. was produced.

[Example 3]

As the silane compound, 8-methacryloxyoctyltrimethoxysilane (product name: KBM5803, manufactured by Shin-Etsu Chemical Co., Ltd.) was used instead of 7-octenyltrimethoxysilane, in the same manner as in Example 2. Thus, a film-like adhesive composition was produced.

[Comparative Example 3]

As the silane compound, 3-methacryloxypropyltrimethoxysilane (product name: KBM503, manufactured by Shin-Etsu Chemical Co., Ltd.) was used instead of 7-octenyltrimethoxysilane, in the same manner as in Example 2. Thus, a film-like adhesive composition was produced.

<Evaluation of adhesive strength>

As a first circuit member, a flexible circuit board (FPC) having 500 copper circuits with a line width of 75 μm, a pitch of 150 μm, and a thickness of 18 μm was prepared. As a second circuit member, glass (thickness 0.7 mm) on which a thin layer of silicon nitride (SiN _x ) of 0.5 μm was formed was prepared. With the film-like adhesive composition of Examples 1 to 3 or Comparative Examples 1 to 3 interposed between the first circuit member and the second circuit member, a heat compression device (heating method: constant heat type, manufactured by Doré Engineering Co., Ltd.) ) was used to heat and press at 170°C and 3 MPa for 20 seconds to connect them over a width of 2 mm to produce a circuit connection structure (connection body).

For this circuit connection structure, the adhesive strength immediately after adhesion (after heating and pressing at 170°C and 3MPa for 20 seconds) and the adhesive strength after being left in a constant temperature and humidity chamber at 85°C and 85%RH for 100 hours were 90 in accordance with JISZ0237. Measured by the ℃ peeling method. Here, the measuring device for adhesive strength was Tensilon UTM-4 (peel speed 50 mm/min, 25°C) manufactured by Toyo Baldwin Co., Ltd.

The results of the measurements performed as above are shown in Table 1.

From the above, in each of Examples 1 to 3, compared to Comparative Examples 1 to 3, the adhesive strength immediately after adhesion was high, and the adhesive strength to the substrate (inorganic substrate) surface was maintained well even after the reliability test (high temperature and high humidity treatment). It has been confirmed that this is possible.

10… Circuit connection member, 10a... Insulating material, 10b... Conductive particle, 20… First circuit member, 21... First substrate, 21a... If you give it, 22… First circuit electrode, 30... Second circuit member, 31... Second substrate, 31a... If you give it, 32… Second circuit electrodes, 100a, 100b... Circuit connection structure.

Claims (8)

An adhesive composition containing a silane compound having a structure represented by the following general formula (I) and conductive particles.

( ^{wherein ,} It contains at least one member selected from the group consisting of an epoxy group, a nitrogen atom-containing group, and a sulfur atom-containing group, and the nitrogen atom-containing group includes an amino group, a mono-substituted amino group, a di-substituted amino group, an isocyanato group, an imidazole group, It is a ureide group, or a maleimide group, and the sulfur atom-containing group is a mercapto group.) The adhesive composition according to claim 1, further comprising an epoxy resin and a latent hardener. The adhesive composition according to claim 1 or 2, further comprising a radically polymerizable compound and a curing agent that generates radicals by heat or light. The adhesive composition according to claim 1 or 2, which is for circuit connection. A structure comprising the adhesive composition according to claim 1 or 2 or a cured product thereof. a first circuit member having a first circuit electrode;
a second circuit member having a second circuit electrode;
It has a circuit connection member disposed between the first circuit member and the second circuit member,
The first circuit electrode and the second circuit electrode are electrically connected,
A structure in which the circuit connection member contains an adhesive composition containing a silane compound having a structure represented by the following general formula (I) or a cured product thereof.

( ^{wherein ,} It contains at least one member selected from the group consisting of an epoxy group, a nitrogen atom-containing group, and a sulfur atom-containing group, and the nitrogen atom-containing group includes an amino group, a mono-substituted amino group, a di-substituted amino group, an isocyanato group, an imidazole group, It is a ureide group, or a maleimide group, and the sulfur atom-containing group is a mercapto group.) delete delete

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