WO2009063827A1 - Matériau de connexion de circuit et structure pour connecter un élément de circuit - Google Patents

Matériau de connexion de circuit et structure pour connecter un élément de circuit Download PDF

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Publication number
WO2009063827A1
WO2009063827A1 PCT/JP2008/070417 JP2008070417W WO2009063827A1 WO 2009063827 A1 WO2009063827 A1 WO 2009063827A1 JP 2008070417 W JP2008070417 W JP 2008070417W WO 2009063827 A1 WO2009063827 A1 WO 2009063827A1
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WO
WIPO (PCT)
Prior art keywords
circuit
connecting material
electrode
circuit member
diameter
Prior art date
Application number
PCT/JP2008/070417
Other languages
English (en)
Japanese (ja)
Inventor
Sunao Kudou
Kouji Kobayashi
Motohiro Arifuku
Kazuyoshi Kojima
Nichiomi Mochizuki
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to CN200880114878A priority Critical patent/CN101849266A/zh
Priority to JP2009522470A priority patent/JPWO2009063827A1/ja
Publication of WO2009063827A1 publication Critical patent/WO2009063827A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Non-Insulated Conductors (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

L'invention porte sur un matériau de connexion de circuit agencé entre un premier élément de circuit (30), possédant une première électrode de circuit (32), et un second élément de circuit (40), qui fait face au premier élément de circuit (30) et possède une seconde électrode de circuit (42). Le matériau de connexion de circuit connecte électriquement la première électrode de circuit (32) et la seconde électrode de circuit (42). Le matériau de connexion de circuit contient une composition adhésive et des particules conductrices (12) présentant un diamètre de 0,5 à 7 µm. Une couche extérieure (22) de la particule conductrice (12) est composée d'un métal présentant une dureté Vickers de 300 Hv ou plus, une partie de la couche extérieure (22) fait saillie à l'extérieur pour former une section saillante (14), et le diamètre et la dureté de la particule conductrice (12) sont dans une relation spécifique.
PCT/JP2008/070417 2007-11-12 2008-11-10 Matériau de connexion de circuit et structure pour connecter un élément de circuit WO2009063827A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880114878A CN101849266A (zh) 2007-11-12 2008-11-10 电路连接材料以及电路部件的连接结构
JP2009522470A JPWO2009063827A1 (ja) 2007-11-12 2008-11-10 回路接続材料、及び回路部材の接続構造

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007293079 2007-11-12
JP2007-293079 2007-11-12
JP2008-144856 2008-06-02
JP2008144856 2008-06-02

Publications (1)

Publication Number Publication Date
WO2009063827A1 true WO2009063827A1 (fr) 2009-05-22

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PCT/JP2008/070417 WO2009063827A1 (fr) 2007-11-12 2008-11-10 Matériau de connexion de circuit et structure pour connecter un élément de circuit

Country Status (5)

Country Link
JP (2) JPWO2009063827A1 (fr)
KR (1) KR20100080628A (fr)
CN (1) CN101849266A (fr)
TW (1) TWI395801B (fr)
WO (1) WO2009063827A1 (fr)

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Publication number Priority date Publication date Assignee Title
WO2011002084A1 (fr) * 2009-07-02 2011-01-06 日立化成工業株式会社 Particule conductrice
JP2011029179A (ja) * 2009-07-02 2011-02-10 Hitachi Chem Co Ltd 導電粒子
JP2011029180A (ja) * 2009-07-02 2011-02-10 Hitachi Chem Co Ltd 被覆導電粒子
WO2012086278A1 (fr) * 2010-12-24 2012-06-28 ソニーケミカル＆インフォメーションデバイス株式会社 Film adhésif conducteur anisotrope, structure de connexion et procédé de fabrication
WO2013008744A1 (fr) * 2011-07-08 2013-01-17 日立化成工業株式会社 Dévidoir pour ruban adhésif, corps enroulé, produit d'emballage, mise en œuvre en tant que dévidoir pour ruban adhésif pour enroulement de ruban adhésif de dévidoir, et procédé de fabrication de ce dévidoir pour ruban adhésif
EP3096330A4 (fr) * 2014-01-14 2017-06-28 Toyo Aluminium Kabushiki Kaisha Particules conductrices composites, composition de résine conductrice contenant ces dernières et article conducteur revêtu
KR20180079371A (ko) 2015-11-04 2018-07-10 히타치가세이가부시끼가이샤 접착제 조성물 및 구조체
KR20180079370A (ko) 2015-11-04 2018-07-10 히타치가세이가부시끼가이샤 접착제 조성물 및 구조체
KR20180084929A (ko) 2015-11-25 2018-07-25 히타치가세이가부시끼가이샤 회로 접속용 접착제 조성물 및 구조체
KR20190133021A (ko) 2017-03-29 2019-11-29 히타치가세이가부시끼가이샤 접착제 조성물 및 구조체
KR20230135612A (ko) 2021-01-25 2023-09-25 가부시끼가이샤 레조낙 필름상 접착제 및 접속 구조체의 제조 방법

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CN110546222A (zh) * 2017-04-28 2019-12-06 日立化成株式会社 粘接剂组合物及连接体的制造方法
KR20200108439A (ko) 2018-01-17 2020-09-18 히타치가세이가부시끼가이샤 접착제 조성물, 접속 구조체 및 그의 제조 방법
WO2021206115A1 (fr) 2020-04-10 2021-10-14 昭和電工マテリアルズ株式会社 Composition adhésive, film adhésif, structure connectée et leur procédé de production

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195339A (ja) * 1998-12-25 2000-07-14 Sony Chem Corp 異方導電性接着フィルム
JP2000309715A (ja) * 1999-04-26 2000-11-07 Sekisui Chem Co Ltd 重合体微粒子及び導電性微粒子
JP2003234020A (ja) * 2002-02-06 2003-08-22 Sekisui Chem Co Ltd 導電性微粒子
JP2003323813A (ja) * 2002-02-28 2003-11-14 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路端子の接続構造
JP2005166438A (ja) * 2003-12-02 2005-06-23 Hitachi Chem Co Ltd 回路接続材料、及びこれを用いた回路部材の接続構造
JP2007012378A (ja) * 2005-06-29 2007-01-18 Fujikura Kasei Co Ltd 導電性微粒子

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100539060B1 (ko) * 1997-10-28 2007-04-25 소니 케미카루 가부시키가이샤 이방도전성접착제및접착용막

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195339A (ja) * 1998-12-25 2000-07-14 Sony Chem Corp 異方導電性接着フィルム
JP2000309715A (ja) * 1999-04-26 2000-11-07 Sekisui Chem Co Ltd 重合体微粒子及び導電性微粒子
JP2003234020A (ja) * 2002-02-06 2003-08-22 Sekisui Chem Co Ltd 導電性微粒子
JP2003323813A (ja) * 2002-02-28 2003-11-14 Hitachi Chem Co Ltd 回路接続材料及びそれを用いた回路端子の接続構造
JP2005166438A (ja) * 2003-12-02 2005-06-23 Hitachi Chem Co Ltd 回路接続材料、及びこれを用いた回路部材の接続構造
JP2007012378A (ja) * 2005-06-29 2007-01-18 Fujikura Kasei Co Ltd 導電性微粒子

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KR101271814B1 (ko) 2009-07-02 2013-06-07 히타치가세이가부시끼가이샤 도전 입자
JP2011029179A (ja) * 2009-07-02 2011-02-10 Hitachi Chem Co Ltd 導電粒子
JP2011029180A (ja) * 2009-07-02 2011-02-10 Hitachi Chem Co Ltd 被覆導電粒子
CN102474024A (zh) * 2009-07-02 2012-05-23 日立化成工业株式会社 导电粒子
CN102474024B (zh) * 2009-07-02 2014-09-17 日立化成株式会社 导电粒子
WO2011002084A1 (fr) * 2009-07-02 2011-01-06 日立化成工業株式会社 Particule conductrice
KR101410185B1 (ko) 2010-12-24 2014-06-19 데쿠세리아루즈 가부시키가이샤 이방성 도전 접착 필름, 접속 구조체 및 그 제조 방법
WO2012086278A1 (fr) * 2010-12-24 2012-06-28 ソニーケミカル＆インフォメーションデバイス株式会社 Film adhésif conducteur anisotrope, structure de connexion et procédé de fabrication
KR20140037923A (ko) * 2011-07-08 2014-03-27 히타치가세이가부시끼가이샤 접착 테이프용 릴, 권중체, 곤포물, 릴의 접착 테이프를 권회하기 위한 접착 테이프용 릴로서의 용도, 및 접착 테이프용 릴의 제조 방법
WO2013008744A1 (fr) * 2011-07-08 2013-01-17 日立化成工業株式会社 Dévidoir pour ruban adhésif, corps enroulé, produit d'emballage, mise en œuvre en tant que dévidoir pour ruban adhésif pour enroulement de ruban adhésif de dévidoir, et procédé de fabrication de ce dévidoir pour ruban adhésif
JPWO2013008744A1 (ja) * 2011-07-08 2015-02-23 日立化成株式会社 接着テープ用リール、巻重体、梱包物、リールの接着テープを巻回するための接着テープ用リールとしての使用、及び接着テープ用リールの製造方法
KR101940349B1 (ko) 2011-07-08 2019-01-18 히타치가세이가부시끼가이샤 접착 테이프용 릴, 권중체, 곤포물, 릴의 접착 테이프를 권회하기 위한 접착 테이프용 릴로서의 용도, 및 접착 테이프용 릴의 제조 방법
EP3096330A4 (fr) * 2014-01-14 2017-06-28 Toyo Aluminium Kabushiki Kaisha Particules conductrices composites, composition de résine conductrice contenant ces dernières et article conducteur revêtu
US10227496B2 (en) 2014-01-14 2019-03-12 Toyo Aluminium Kabushiki Kaisha Composite conductive particle, conductive resin composition containing same and conductive coated article
KR20180079371A (ko) 2015-11-04 2018-07-10 히타치가세이가부시끼가이샤 접착제 조성물 및 구조체
KR20180079370A (ko) 2015-11-04 2018-07-10 히타치가세이가부시끼가이샤 접착제 조성물 및 구조체
KR20180084929A (ko) 2015-11-25 2018-07-25 히타치가세이가부시끼가이샤 회로 접속용 접착제 조성물 및 구조체
KR20190133021A (ko) 2017-03-29 2019-11-29 히타치가세이가부시끼가이샤 접착제 조성물 및 구조체
KR20230135612A (ko) 2021-01-25 2023-09-25 가부시끼가이샤 레조낙 필름상 접착제 및 접속 구조체의 제조 방법

Also Published As

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JPWO2009063827A1 (ja) 2011-03-31
CN101849266A (zh) 2010-09-29
KR20100080628A (ko) 2010-07-09
JP2013055058A (ja) 2013-03-21
TW200946629A (en) 2009-11-16
TWI395801B (zh) 2013-05-11

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