TWI320427B - - Google Patents

Info

Publication number
TWI320427B
TWI320427B TW098120262A TW98120262A TWI320427B TW I320427 B TWI320427 B TW I320427B TW 098120262 A TW098120262 A TW 098120262A TW 98120262 A TW98120262 A TW 98120262A TW I320427 B TWI320427 B TW I320427B
Authority
TW
Taiwan
Prior art keywords
circuit
particles
mass
covered
insulating fine
Prior art date
Application number
TW098120262A
Other languages
English (en)
Chinese (zh)
Other versions
TW200951201A (en
Inventor
Jun Taketatsu
Itsuo Watanabe
Yasushi Gotou
Kazuo Yamaguchi
Masaki Fujii
Aya Fujii
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004002305A external-priority patent/JP4380327B2/ja
Priority claimed from JP2004002308A external-priority patent/JP4380328B2/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200951201A publication Critical patent/TW200951201A/zh
Application granted granted Critical
Publication of TWI320427B publication Critical patent/TWI320427B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
TW098120262A 2004-01-07 2005-01-07 Circuit connection material, circuit member connection structure, and manufacturing method thereof TW200951201A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004002305A JP4380327B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2004002308A JP4380328B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Publications (2)

Publication Number Publication Date
TW200951201A TW200951201A (en) 2009-12-16
TWI320427B true TWI320427B (enExample) 2010-02-11

Family

ID=34752086

Family Applications (4)

Application Number Title Priority Date Filing Date
TW098120264A TW200945373A (en) 2004-01-07 2005-01-07 Circuit connection material, circuit member connection structure, and manufacturing method thereof
TW098120262A TW200951201A (en) 2004-01-07 2005-01-07 Circuit connection material, circuit member connection structure, and manufacturing method thereof
TW098120260A TW200942596A (en) 2004-01-07 2005-01-07 Film-shaped circuit connection material, circuit member connection structure, and manufacturing method thereof
TW094100507A TW200525005A (en) 2004-01-07 2005-01-07 Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW098120264A TW200945373A (en) 2004-01-07 2005-01-07 Circuit connection material, circuit member connection structure, and manufacturing method thereof

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW098120260A TW200942596A (en) 2004-01-07 2005-01-07 Film-shaped circuit connection material, circuit member connection structure, and manufacturing method thereof
TW094100507A TW200525005A (en) 2004-01-07 2005-01-07 Circuit connection material, film-shaped circuit connection material using the same, circuit member connection structure, and manufacturing method thereof

Country Status (7)

Country Link
US (1) US20100025089A1 (enExample)
EP (1) EP1702968A4 (enExample)
KR (4) KR100908370B1 (enExample)
CN (2) CN101944659B (enExample)
SG (1) SG158842A1 (enExample)
TW (4) TW200945373A (enExample)
WO (1) WO2005066298A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI703769B (zh) * 2019-03-01 2020-09-01 美商西方數位科技公司 連接裝置及組合連接裝置之方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4967482B2 (ja) * 2006-02-27 2012-07-04 日立化成工業株式会社 導電粒子、接着剤組成物及び回路接続材料
TW201217482A (en) * 2006-11-10 2012-05-01 Hitachi Chemical Co Ltd Adhesive film, and connection structure and connecting method for circuit member
EP2178094A4 (en) * 2007-08-02 2013-02-20 Hitachi Chemical Co Ltd SWITCHING CONNECTING MATERIAL AND CONNECTING STRUCTURE OF A SWITCHING ELEMENT AND CONNECTION METHOD OF A SWITCHING ELEMENT ON THE SWITCHING CONNECTING MATERIAL
EP2206756A1 (en) * 2007-10-29 2010-07-14 Hitachi Chemical Company, Ltd. Circuit connecting material, connection structure and method for producing the same
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
WO2011125414A1 (ja) * 2010-04-01 2011-10-13 株式会社村田製作所 電子部品及びその製造方法
KR102095291B1 (ko) * 2012-11-28 2020-03-31 세키스이가가쿠 고교가부시키가이샤 절연성 입자 부착 도전성 입자, 도전 재료 및 접속 구조체
GB2518363A (en) 2013-09-18 2015-03-25 Novalia Ltd Circuit board assembly
DE102013219688B3 (de) * 2013-09-30 2015-02-05 Robert Bosch Gmbh Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung
CN105295812B (zh) * 2014-07-22 2021-03-02 昭和电工材料株式会社 连接材料和太阳能电池模块
KR102422589B1 (ko) * 2017-01-27 2022-07-18 쇼와덴코머티리얼즈가부시끼가이샤 절연 피복 도전 입자, 이방 도전 필름, 이방 도전 필름의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999460A (en) * 1989-08-10 1991-03-12 Casio Computer Co., Ltd. Conductive connecting structure
JPH04115407A (ja) * 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JP3004042B2 (ja) * 1990-10-12 2000-01-31 綜研化学株式会社 金属含有樹脂粒子およびその用途
JP2748705B2 (ja) * 1991-02-14 1998-05-13 日立化成工業株式会社 回路の接続部材
JPH07105716A (ja) * 1993-10-05 1995-04-21 Soken Kagaku Kk 被覆粒子および異方導電性接着剤
JPH07133466A (ja) * 1993-11-09 1995-05-23 Soken Kagaku Kk 接着方法
TW277152B (enExample) * 1994-05-10 1996-06-01 Hitachi Chemical Co Ltd
US5965269A (en) * 1995-04-04 1999-10-12 Hitachi Chemical Company, Ltd. Adhesive, adhesive film and adhesive-backed metal foil
EP0744884A3 (en) * 1995-05-23 1997-09-24 Hitachi Chemical Co Ltd Method of manufacturing a multilayer printed circuit board
KR100261793B1 (ko) * 1995-09-29 2000-07-15 니시무로 타이죠 고강도 고신뢰성 회로기판 및 그 제조방법
KR100483565B1 (ko) * 1999-02-08 2005-04-15 히다치 가세고교 가부시끼가이샤 회로접속재료
CN101037572A (zh) * 1999-08-25 2007-09-19 日立化成工业株式会社 粘合剂,配线端子的连接方法和配线结构体
MY124944A (en) * 2000-02-09 2006-07-31 Hitachi Chemical Co Ltd Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards
JP4788036B2 (ja) * 2000-11-29 2011-10-05 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4752107B2 (ja) * 2000-11-29 2011-08-17 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4852785B2 (ja) * 2000-11-29 2012-01-11 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
KR100589799B1 (ko) * 2003-05-06 2006-06-14 한화석유화학 주식회사 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품
US7393771B2 (en) * 2004-06-29 2008-07-01 Hitachi, Ltd. Method for mounting an electronic part on a substrate using a liquid containing metal particles

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI703769B (zh) * 2019-03-01 2020-09-01 美商西方數位科技公司 連接裝置及組合連接裝置之方法

Also Published As

Publication number Publication date
KR100908370B1 (ko) 2009-07-20
KR100996035B1 (ko) 2010-11-22
CN103409082A (zh) 2013-11-27
US20100025089A1 (en) 2010-02-04
KR100981483B1 (ko) 2010-09-10
TW200525005A (en) 2005-08-01
CN101944659A (zh) 2011-01-12
KR100865204B1 (ko) 2008-10-23
SG158842A1 (en) 2010-02-26
CN101944659B (zh) 2016-08-17
TW200942596A (en) 2009-10-16
KR20090074778A (ko) 2009-07-07
TW200951201A (en) 2009-12-16
TW200945373A (en) 2009-11-01
EP1702968A1 (en) 2006-09-20
TWI323276B (enExample) 2010-04-11
KR20070012337A (ko) 2007-01-25
EP1702968A4 (en) 2010-08-25
KR20090064461A (ko) 2009-06-18
KR20080065314A (ko) 2008-07-11
TWI320575B (enExample) 2010-02-11
WO2005066298A1 (ja) 2005-07-21

Similar Documents

Publication Publication Date Title
TWI320427B (enExample)
DE60205664D1 (de) Wärmehärtbare harzzusammensetzung
FI20041525L (fi) Elektroniikkamoduuli ja menetelmä sen valmistamiseksi
MX2020009766A (es) Estructura de multiples capas y metodo relacionado de fabricacion para dispositivos electronicos.
WO2009043649A3 (de) Dreidimensionaler elektronischer schaltungsträgeraufbau, sowie schaltungsgrundträger aufweisend den schaltungsträgeraufbau als funktionsbauteil und dreidimensionale schaltungsanordnung bestehend aus zumindest zwei derartigen dreidimensionalen schaltungsträgeraufbauten
TW200739611A (en) Thermosetting type conductive paste and laminated ceramic electronic component having an external electrode formed by using such thermosetting type conductive paste
EP2055757A4 (en) CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE OF A CIRCUIT MEMBER AND METHOD FOR PRODUCING THE CONNECTING STRUCTURE OF A CIRCUIT MEMBER
SG170618A1 (en) Polymeric oligonucleotide prodrugs
TW200726334A (en) Circuit board structure having capacitance array and embedded electronic component and method for fabricating the same
WO2005125298A3 (en) Method for manufacturing an electronics module comprising a component electrically connected to a conductor- pattern layer
WO2009044732A1 (ja) 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
WO2009028241A1 (ja) 異方性導電フィルム及びそれを用いた接続構造体の製造方法
WO2008032870A3 (en) Electronic components mounting adhesive and electronic components mounting structure
WO2008106555A3 (en) Piezoelectric package with improved lead structure
TW200642554A (en) Multilayer circuit board with embedded components and method of manufacture
WO2006094025A3 (en) Fabricated adhesive microstructures for making an electrical connection
EP1753277A3 (en) Wiring circuit board
WO2009075079A1 (ja) 回路板、回路板の製造方法およびカバーレイフィルム
TW200739612A (en) Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure
EP1278404A4 (en) PRINTED CIRCUIT BOARD AND ITS PRODUCTION
TW200744180A (en) Stack structure of circuit board having embedded with semiconductor component
ATE386341T1 (de) Elektromechanischer wandler mit mindestens einem piezoelektrischen element
TWI256128B (en) Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus
TW200718299A (en) Wiring board, wiring material, copper-clad laminate, and wiring board fabrication method
US10334725B1 (en) Adhesive based reconfigurable electronic circuit building system

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent