KR100996035B1 - 필름상 회로접속재료, 회로부재의 접속구조물 및 그 제조방법 - Google Patents

필름상 회로접속재료, 회로부재의 접속구조물 및 그 제조방법 Download PDF

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Publication number
KR100996035B1
KR100996035B1 KR1020097008205A KR20097008205A KR100996035B1 KR 100996035 B1 KR100996035 B1 KR 100996035B1 KR 1020097008205 A KR1020097008205 A KR 1020097008205A KR 20097008205 A KR20097008205 A KR 20097008205A KR 100996035 B1 KR100996035 B1 KR 100996035B1
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KR
South Korea
Prior art keywords
circuit
film
particles
connection material
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020097008205A
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English (en)
Korean (ko)
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KR20090064461A (ko
Inventor
준 다케타츠
이츠오 와타나베
야스시 고토우
카즈오 야마구치
마사키 후지이
아야 후지이
Original Assignee
히다치 가세고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004002308A external-priority patent/JP4380328B2/ja
Priority claimed from JP2004002305A external-priority patent/JP4380327B2/ja
Application filed by 히다치 가세고교 가부시끼가이샤 filed Critical 히다치 가세고교 가부시끼가이샤
Publication of KR20090064461A publication Critical patent/KR20090064461A/ko
Application granted granted Critical
Publication of KR100996035B1 publication Critical patent/KR100996035B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/52Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0224Conductive particles having an insulating coating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
KR1020097008205A 2004-01-07 2005-01-06 필름상 회로접속재료, 회로부재의 접속구조물 및 그 제조방법 Expired - Lifetime KR100996035B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00002305 2004-01-07
JP2004002308A JP4380328B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JP2004002305A JP4380327B2 (ja) 2004-01-07 2004-01-07 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法
JPJP-P-2004-00002308 2004-01-07

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020087014740A Division KR100908370B1 (ko) 2004-01-07 2005-01-06 회로접속재료용 피복입자

Publications (2)

Publication Number Publication Date
KR20090064461A KR20090064461A (ko) 2009-06-18
KR100996035B1 true KR100996035B1 (ko) 2010-11-22

Family

ID=34752086

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020087014740A Expired - Lifetime KR100908370B1 (ko) 2004-01-07 2005-01-06 회로접속재료용 피복입자
KR1020097008206A Expired - Lifetime KR100981483B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 회로부재의 접속구조 및 그 제조방법
KR1020067015544A Expired - Lifetime KR100865204B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 이것을 이용한 필름상 회로접속재료,회로부재의 접속구조 및 그 제조방법
KR1020097008205A Expired - Lifetime KR100996035B1 (ko) 2004-01-07 2005-01-06 필름상 회로접속재료, 회로부재의 접속구조물 및 그 제조방법

Family Applications Before (3)

Application Number Title Priority Date Filing Date
KR1020087014740A Expired - Lifetime KR100908370B1 (ko) 2004-01-07 2005-01-06 회로접속재료용 피복입자
KR1020097008206A Expired - Lifetime KR100981483B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 회로부재의 접속구조 및 그 제조방법
KR1020067015544A Expired - Lifetime KR100865204B1 (ko) 2004-01-07 2005-01-06 회로접속재료, 이것을 이용한 필름상 회로접속재료,회로부재의 접속구조 및 그 제조방법

Country Status (7)

Country Link
US (1) US20100025089A1 (enExample)
EP (1) EP1702968A4 (enExample)
KR (4) KR100908370B1 (enExample)
CN (2) CN103409082A (enExample)
SG (1) SG158842A1 (enExample)
TW (4) TW200525005A (enExample)
WO (1) WO2005066298A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4967482B2 (ja) * 2006-02-27 2012-07-04 日立化成工業株式会社 導電粒子、接着剤組成物及び回路接続材料
CN101536260B (zh) * 2006-11-10 2012-01-11 日立化成工业株式会社 粘接膜、以及电路部件的连接结构和连接方法
CN101689410B (zh) * 2007-08-02 2013-10-16 日立化成株式会社 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法
KR101238178B1 (ko) * 2007-10-29 2013-02-28 히타치가세이가부시끼가이샤 회로 접속 재료, 접속 구조체 및 그의 제조 방법
JP5430093B2 (ja) * 2008-07-24 2014-02-26 デクセリアルズ株式会社 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
CN102870208B (zh) * 2010-04-01 2015-07-01 株式会社村田制作所 电子部件及其制造方法
CN104584141B (zh) * 2012-11-28 2017-04-12 积水化学工业株式会社 带有绝缘性粒子的导电性粒子、导电材料及连接结构体
GB2518363A (en) * 2013-09-18 2015-03-25 Novalia Ltd Circuit board assembly
DE102013219688B3 (de) * 2013-09-30 2015-02-05 Robert Bosch Gmbh Wärmeleitfähiges Verbindungsmittel, Verbindungsanordnung und Verfahren zum Herstellen einer wärmeleitenden Verbindung
CN105295812B (zh) * 2014-07-22 2021-03-02 昭和电工材料株式会社 连接材料和太阳能电池模块
KR102422589B1 (ko) * 2017-01-27 2022-07-18 쇼와덴코머티리얼즈가부시끼가이샤 절연 피복 도전 입자, 이방 도전 필름, 이방 도전 필름의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
US10733136B1 (en) * 2019-03-01 2020-08-04 Western Digital Technologies, Inc. Vertical surface mount type C USB connector

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999460A (en) * 1989-08-10 1991-03-12 Casio Computer Co., Ltd. Conductive connecting structure
JPH04115407A (ja) * 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JP3004042B2 (ja) * 1990-10-12 2000-01-31 綜研化学株式会社 金属含有樹脂粒子およびその用途
JP2748705B2 (ja) * 1991-02-14 1998-05-13 日立化成工業株式会社 回路の接続部材
JPH07105716A (ja) * 1993-10-05 1995-04-21 Soken Kagaku Kk 被覆粒子および異方導電性接着剤
JPH07133466A (ja) * 1993-11-09 1995-05-23 Soken Kagaku Kk 接着方法
TW277152B (enExample) * 1994-05-10 1996-06-01 Hitachi Chemical Co Ltd
WO1996031574A1 (en) * 1995-04-04 1996-10-10 Hitachi Chemical Company, Ltd. Adhesive, adhesive film and adhesive-backed metal foil
EP0744884A3 (en) * 1995-05-23 1997-09-24 Hitachi Chemical Co Ltd Method of manufacturing a multilayer printed circuit board
KR100261793B1 (ko) * 1995-09-29 2000-07-15 니시무로 타이죠 고강도 고신뢰성 회로기판 및 그 제조방법
AU2327400A (en) * 1999-02-08 2000-08-25 Hitachi Chemical Co. Ltd. Adhesive, electrode-connecting structure, and method of connecting electrodes
US6939913B1 (en) * 1999-08-25 2005-09-06 Hitachi Chemical Company, Ltd. Adhesive agent, method of connecting wiring terminals and wiring structure
MY124944A (en) * 2000-02-09 2006-07-31 Hitachi Chemical Co Ltd Resin composition, adhesives prepared therewith for bonding circuit members,and circuits boards
JP4788036B2 (ja) * 2000-11-29 2011-10-05 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4752107B2 (ja) * 2000-11-29 2011-08-17 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
JP4852785B2 (ja) * 2000-11-29 2012-01-11 日立化成工業株式会社 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
KR100589799B1 (ko) * 2003-05-06 2006-06-14 한화석유화학 주식회사 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품
US7393771B2 (en) * 2004-06-29 2008-07-01 Hitachi, Ltd. Method for mounting an electronic part on a substrate using a liquid containing metal particles

Also Published As

Publication number Publication date
SG158842A1 (en) 2010-02-26
EP1702968A4 (en) 2010-08-25
TW200942596A (en) 2009-10-16
TWI320427B (enExample) 2010-02-11
CN103409082A (zh) 2013-11-27
US20100025089A1 (en) 2010-02-04
KR100908370B1 (ko) 2009-07-20
KR20090074778A (ko) 2009-07-07
TW200945373A (en) 2009-11-01
KR100981483B1 (ko) 2010-09-10
EP1702968A1 (en) 2006-09-20
CN101944659A (zh) 2011-01-12
TWI323276B (enExample) 2010-04-11
KR20090064461A (ko) 2009-06-18
KR20070012337A (ko) 2007-01-25
TWI320575B (enExample) 2010-02-11
TW200951201A (en) 2009-12-16
KR100865204B1 (ko) 2008-10-23
CN101944659B (zh) 2016-08-17
WO2005066298A1 (ja) 2005-07-21
KR20080065314A (ko) 2008-07-11
TW200525005A (en) 2005-08-01

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