CN101940071B - 多层电路板和电机驱动电路板 - Google Patents

多层电路板和电机驱动电路板 Download PDF

Info

Publication number
CN101940071B
CN101940071B CN2009801048927A CN200980104892A CN101940071B CN 101940071 B CN101940071 B CN 101940071B CN 2009801048927 A CN2009801048927 A CN 2009801048927A CN 200980104892 A CN200980104892 A CN 200980104892A CN 101940071 B CN101940071 B CN 101940071B
Authority
CN
China
Prior art keywords
distribution
circuit board
layer
phase
conductor layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009801048927A
Other languages
English (en)
Chinese (zh)
Other versions
CN101940071A (zh
Inventor
内田修弘
中井基生
须增宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JTEKT Corp
Original Assignee
JTEKT Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JTEKT Corp filed Critical JTEKT Corp
Publication of CN101940071A publication Critical patent/CN101940071A/zh
Application granted granted Critical
Publication of CN101940071B publication Critical patent/CN101940071B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62D—MOTOR VEHICLES; TRAILERS
    • B62D5/00—Power-assisted or power-driven steering
    • B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
    • B62D5/0403—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box
    • B62D5/0406—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box including housing for electronic control unit
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Power Steering Mechanism (AREA)
  • Structure Of Printed Boards (AREA)
CN2009801048927A 2008-02-07 2009-02-05 多层电路板和电机驱动电路板 Expired - Fee Related CN101940071B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-028111 2008-02-07
JP2008028111A JP5444619B2 (ja) 2008-02-07 2008-02-07 多層回路基板およびモータ駆動回路基板
PCT/JP2009/051943 WO2009099131A1 (ja) 2008-02-07 2009-02-05 多層回路基板およびモータ駆動回路基板

Publications (2)

Publication Number Publication Date
CN101940071A CN101940071A (zh) 2011-01-05
CN101940071B true CN101940071B (zh) 2012-10-03

Family

ID=40952204

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801048927A Expired - Fee Related CN101940071B (zh) 2008-02-07 2009-02-05 多层电路板和电机驱动电路板

Country Status (5)

Country Link
US (1) US8288658B2 (ja)
EP (1) EP2249631B1 (ja)
JP (1) JP5444619B2 (ja)
CN (1) CN101940071B (ja)
WO (1) WO2009099131A1 (ja)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101385094B1 (ko) * 2007-09-11 2014-04-14 삼성디스플레이 주식회사 인쇄회로기판, 이를 갖는 표시장치 및 이의 제조방법
JP5039171B2 (ja) 2010-05-11 2012-10-03 三菱電機株式会社 電動式駆動装置およびその電動式駆動装置を搭載した電動式パワーステアリング装置
CN103153754B (zh) * 2010-10-27 2016-11-16 三菱电机株式会社 电动助力转向用电动机驱动控制装置
EP2557666B1 (en) * 2011-08-10 2020-05-20 LG Innotek Co., Ltd. EPS motor
JP6075128B2 (ja) * 2013-03-11 2017-02-08 株式会社ジェイテクト 駆動回路装置
DE112014004770B4 (de) 2013-10-17 2022-10-13 Wolfspeed, Inc. Hochspannungs-Leistungs-Chipmodul
US9389656B2 (en) * 2014-01-30 2016-07-12 Asia Vital Components Co., Ltd. Heat dissipation structure applied to mobile device
US20150221576A1 (en) * 2014-01-31 2015-08-06 Asia Vital Components Co., Ltd. Heat Dissipation Structure for Semiconductor Element
CN104022695A (zh) * 2014-06-23 2014-09-03 济南科亚电子科技有限公司 一种双有刷直流驱动器
CN108093671B (zh) * 2015-09-18 2021-07-06 三菱电机株式会社 一体型电动助力转向装置
US9839146B2 (en) 2015-10-20 2017-12-05 Cree, Inc. High voltage power module
JP6672747B2 (ja) * 2015-11-30 2020-03-25 株式会社ニコン 電子ユニット、撮像装置及びフレキシブル基板
CN106364551A (zh) * 2016-10-21 2017-02-01 杭州飞越汽车零部件有限公司 采用嵌入式多层电路板eps控制器的动力总成
US10410952B2 (en) 2016-12-15 2019-09-10 Infineon Technologies Ag Power semiconductor packages having a substrate with two or more metal layers and one or more polymer-based insulating layers for separating the metal layers
JP7422542B2 (ja) * 2016-12-15 2024-01-26 サン・ディエゴ・ステート・ユニバーシティ・リサーチ・ファンデーション 局在的配電ネットワーク設計のための重なり合わない電源／グランドプレーン
US10008411B2 (en) * 2016-12-15 2018-06-26 Infineon Technologies Ag Parallel plate waveguide for power circuits
JP2018148693A (ja) 2017-03-06 2018-09-20 日立オートモティブシステムズ株式会社 電動モータの駆動制御装置
JP6729474B2 (ja) * 2017-04-24 2020-07-22 三菱電機株式会社 半導体装置
US10522442B2 (en) * 2017-06-29 2019-12-31 Performance Motion Devices, Inc. Dissipating heat from an electronic device in a protective housing
JP6549200B2 (ja) * 2017-10-03 2019-07-24 三菱電機株式会社 電力変換回路
JP6779193B2 (ja) * 2017-11-07 2020-11-04 日立オートモティブシステムズ株式会社 電動駆動装置
EP3487274A1 (en) * 2017-11-20 2019-05-22 Valeo Comfort and Driving Assistance Electronic device comprising a structral piece with a cage positionned over an electronic component
JP6490255B1 (ja) * 2018-01-16 2019-03-27 三菱電機株式会社 車載電子装置
USD908632S1 (en) 2018-09-17 2021-01-26 Cree Fayetteville, Inc. Power module
JP7172849B2 (ja) 2019-05-17 2022-11-16 株式会社デンソー 電力変換装置
JP7136023B2 (ja) * 2019-07-01 2022-09-13 株式会社豊田自動織機 回路基板及び回路基板モジュール
US10959323B1 (en) 2019-09-06 2021-03-23 Performance Motion Devices, Inc. Over-torque protection features for mounting an electronic device to a heat dissipation object
JP7215402B2 (ja) * 2019-11-28 2023-01-31 株式会社豊田自動織機 半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002044961A (ja) * 2000-07-19 2002-02-08 Kyocera Corp インバータ制御モジュール
JP2005064028A (ja) * 2003-08-12 2005-03-10 Ngk Spark Plug Co Ltd 配線基板
JP2007027618A (ja) * 2005-07-21 2007-02-01 Fuji Name Plate Kk プリント配線板及びその製造方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04310315A (ja) * 1991-04-09 1992-11-02 Mitsubishi Electric Corp 放電加工用電源装置
JP2854757B2 (ja) * 1992-06-17 1999-02-03 三菱電機株式会社 半導体パワーモジュール
JP3684239B2 (ja) * 1995-01-10 2005-08-17 株式会社 日立製作所 低ｅｍｉ電子機器
JPH09181407A (ja) * 1995-12-25 1997-07-11 Sony Tektronix Corp 回路基板
JP3732927B2 (ja) * 1997-07-31 2006-01-11 京セラ株式会社 多層配線基板
WO1999016654A1 (fr) 1997-10-01 1999-04-08 Kayaba Kogyo Kabushiki Kaisha Moteur electrique pour dispositif de direction assistee
JPH11152050A (ja) * 1997-11-21 1999-06-08 Kayaba Ind Co Ltd 電動パワーステアリング装置
JP3595163B2 (ja) * 1998-05-26 2004-12-02 松下電器産業株式会社 電子機器
JP3552549B2 (ja) 1998-09-08 2004-08-11 株式会社豊田自動織機 半導体モジュールの電極端子接続構造
JP3795687B2 (ja) * 1998-12-15 2006-07-12 三菱電機株式会社 大電流回路基板
JP3644835B2 (ja) * 1999-01-18 2005-05-11 三菱電機株式会社 電動式パワーステアリング回路装置
JP3692906B2 (ja) * 2000-05-25 2005-09-07 日産自動車株式会社 電力配線構造及び半導体装置
JP2002094246A (ja) * 2000-09-13 2002-03-29 Minebea Co Ltd 多層プリント配線基板及び多層プリント配線基板の実装方法
JP3774624B2 (ja) 2000-10-18 2006-05-17 三菱電機株式会社 電動パワーステアリング装置
JP3614380B2 (ja) 2001-05-17 2005-01-26 三菱電機株式会社 電動式パワーステアリング装置
US6420778B1 (en) * 2001-06-01 2002-07-16 Aralight, Inc. Differential electrical transmission line structures employing crosstalk compensation and related methods
US6765298B2 (en) * 2001-12-08 2004-07-20 National Semiconductor Corporation Substrate pads with reduced impedance mismatch and methods to fabricate substrate pads
JP3638269B2 (ja) * 2002-03-14 2005-04-13 三菱電機株式会社 電動式パワーステアリング装置
JP4479522B2 (ja) * 2005-02-02 2010-06-09 株式会社デンソー 電子装置
KR100799839B1 (ko) 2005-03-30 2008-01-31 삼성전기주식회사 파장변환용 형광체 혼합물과 이를 이용한 백색 발광장치
JP4333675B2 (ja) * 2006-01-12 2009-09-16 株式会社デンソー インバータ装置用配線基板
WO2007080748A1 (ja) * 2006-01-16 2007-07-19 Mitsubishi Electric Corporation 電動機の駆動回路及び空気調和機の室外機
JP4353951B2 (ja) * 2006-03-06 2009-10-28 三菱電機株式会社 電動式パワーステアリング装置
JP4209904B2 (ja) * 2006-06-16 2009-01-14 三菱電機株式会社 多層基板
JP4962228B2 (ja) * 2006-12-26 2012-06-27 株式会社ジェイテクト 多層回路基板およびモータ駆動回路基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002044961A (ja) * 2000-07-19 2002-02-08 Kyocera Corp インバータ制御モジュール
JP2005064028A (ja) * 2003-08-12 2005-03-10 Ngk Spark Plug Co Ltd 配線基板
JP2007027618A (ja) * 2005-07-21 2007-02-01 Fuji Name Plate Kk プリント配線板及びその製造方法

Also Published As

Publication number Publication date
JP2009188271A (ja) 2009-08-20
EP2249631A1 (en) 2010-11-10
WO2009099131A1 (ja) 2009-08-13
CN101940071A (zh) 2011-01-05
EP2249631B1 (en) 2017-12-27
JP5444619B2 (ja) 2014-03-19
EP2249631A4 (en) 2014-06-25
US20110011633A1 (en) 2011-01-20
US8288658B2 (en) 2012-10-16

Similar Documents

Publication Publication Date Title
CN101940071B (zh) 多层电路板和电机驱动电路板
JP4909961B2 (ja) 電動パワーステアリング用制御装置
CN102255539B (zh) 逆变器装置及利用该逆变器装置的驱动单元
JP5435284B2 (ja) 駆動装置
JP5446937B2 (ja) 電子回路内蔵型モータ
JP5435285B2 (ja) 駆動装置
WO2010150530A1 (ja) 駆動装置
JP4957815B2 (ja) 半導体モジュール及びそれを用いた電子回路内蔵型モータ
US8552604B2 (en) Drive unit of electric motor and motorized equipment using the drive unit
CN101064485B (zh) 电路装置、电路模块和电力变换装置和车载电机系统
JP5177711B2 (ja) 電動装置
US7445081B2 (en) Electric power steering apparatus
JP5655694B2 (ja) 駆動装置
JP5397417B2 (ja) 半導体装置、および、それを用いた駆動装置
JP5967071B2 (ja) 電子制御装置、および、これを用いた電動パワーステアリング装置
WO2010150527A1 (ja) 駆動装置
US10800444B2 (en) Electric driving device and electric power steering device
JP2012245915A (ja) 制御ユニット、および、これを用いた駆動装置
US8520394B2 (en) Control device
EP2658113A2 (en) Motor control multilayer circuit board
CN103287483A (zh) 电动马达的控制装置以及具备它的车辆用转向操作装置
JP4209904B2 (ja) 多層基板
CN109074109B (zh) 电力转换装置、以及使用该电力转换装置的电动助力转向装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121003

Termination date: 20220205

CF01 Termination of patent right due to non-payment of annual fee