CN101807573A - 半导体器件 - Google Patents

半导体器件 Download PDF

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Publication number
CN101807573A
CN101807573A CN201010142391A CN201010142391A CN101807573A CN 101807573 A CN101807573 A CN 101807573A CN 201010142391 A CN201010142391 A CN 201010142391A CN 201010142391 A CN201010142391 A CN 201010142391A CN 101807573 A CN101807573 A CN 101807573A
Authority
CN
China
Prior art keywords
semiconductor device
wiring
signal line
area
internal circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201010142391A
Other languages
English (en)
Chinese (zh)
Inventor
铃木进也
樋口和久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Publication of CN101807573A publication Critical patent/CN101807573A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
    • F16K11/02—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit
    • F16K11/06—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only sliding valves, i.e. sliding closure elements
    • F16K11/065—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only sliding valves, i.e. sliding closure elements with linearly sliding closure members
    • F16K11/07—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only sliding valves, i.e. sliding closure elements with linearly sliding closure members with cylindrical slides
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B13/00—Oxygen; Ozone; Oxides or hydroxides in general
    • C01B13/02—Preparation of oxygen
    • C01B13/0229—Purification or separation processes
    • C01B13/0248—Physical processing only
    • C01B13/0259—Physical processing only by adsorption on solids
    • C01B13/0262—Physical processing only by adsorption on solids characterised by the adsorbent
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/04—Purification or separation of nitrogen
    • C01B21/0405—Purification or separation processes
    • C01B21/0433—Physical processing only
    • C01B21/045—Physical processing only by adsorption in solids
    • C01B21/0455—Physical processing only by adsorption in solids characterised by the adsorbent
    • C01B21/0466—Zeolites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
    • F16K31/04—Actuating devices; Operating means; Releasing devices electric; magnetic using a motor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Liquid Crystal (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
CN201010142391A 2005-02-15 2006-02-14 半导体器件 Pending CN101807573A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP037129/2005 2005-02-15
JP2005037129A JP4846244B2 (ja) 2005-02-15 2005-02-15 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2006100074814A Division CN1822366B (zh) 2005-02-15 2006-02-14 半导体器件

Publications (1)

Publication Number Publication Date
CN101807573A true CN101807573A (zh) 2010-08-18

Family

ID=36814810

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201010142391A Pending CN101807573A (zh) 2005-02-15 2006-02-14 半导体器件
CN2006100074814A Expired - Fee Related CN1822366B (zh) 2005-02-15 2006-02-14 半导体器件

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2006100074814A Expired - Fee Related CN1822366B (zh) 2005-02-15 2006-02-14 半导体器件

Country Status (5)

Country Link
US (2) US7629652B2 (https=)
JP (1) JP4846244B2 (https=)
KR (1) KR20060092093A (https=)
CN (2) CN101807573A (https=)
TW (1) TWI430431B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106373975A (zh) * 2015-07-22 2017-02-01 瑞萨电子株式会社 半导体器件
CN114256201A (zh) * 2020-09-11 2022-03-29 铠侠股份有限公司 半导体装置及配线构造

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4846244B2 (ja) * 2005-02-15 2011-12-28 ルネサスエレクトロニクス株式会社 半導体装置
JP4552776B2 (ja) * 2005-06-30 2010-09-29 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4830371B2 (ja) 2005-06-30 2011-12-07 セイコーエプソン株式会社 集積回路装置及び電子機器
US7755587B2 (en) 2005-06-30 2010-07-13 Seiko Epson Corporation Integrated circuit device and electronic instrument
JP4186970B2 (ja) 2005-06-30 2008-11-26 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4010334B2 (ja) * 2005-06-30 2007-11-21 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4661400B2 (ja) 2005-06-30 2011-03-30 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4951902B2 (ja) * 2005-06-30 2012-06-13 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4010335B2 (ja) 2005-06-30 2007-11-21 セイコーエプソン株式会社 集積回路装置及び電子機器
KR100828792B1 (ko) 2005-06-30 2008-05-09 세이코 엡슨 가부시키가이샤 집적 회로 장치 및 전자 기기
JP4151688B2 (ja) * 2005-06-30 2008-09-17 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4010336B2 (ja) 2005-06-30 2007-11-21 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4665677B2 (ja) 2005-09-09 2011-04-06 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4586739B2 (ja) * 2006-02-10 2010-11-24 セイコーエプソン株式会社 半導体集積回路及び電子機器
JP5123510B2 (ja) * 2006-09-28 2013-01-23 ルネサスエレクトロニクス株式会社 半導体装置
JP4882700B2 (ja) * 2006-11-22 2012-02-22 セイコーエプソン株式会社 集積回路装置及び電子機器
JP5147234B2 (ja) 2006-12-28 2013-02-20 パナソニック株式会社 半導体集積回路装置
JP5234717B2 (ja) * 2007-03-20 2013-07-10 ローム株式会社 半導体集積回路装置
JP5097096B2 (ja) * 2007-12-28 2012-12-12 パナソニック株式会社 半導体集積回路
JP5301231B2 (ja) * 2008-09-30 2013-09-25 株式会社テラミクロス 半導体装置
JP5395407B2 (ja) * 2008-11-12 2014-01-22 ルネサスエレクトロニクス株式会社 表示装置駆動用半導体集積回路装置および表示装置駆動用半導体集積回路装置の製造方法
JP2010224084A (ja) * 2009-03-23 2010-10-07 Hitachi Displays Ltd 液晶表示装置
JP5503208B2 (ja) * 2009-07-24 2014-05-28 ルネサスエレクトロニクス株式会社 半導体装置
JP5315186B2 (ja) 2009-09-18 2013-10-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5746494B2 (ja) * 2010-11-24 2015-07-08 ルネサスエレクトロニクス株式会社 半導体装置、液晶ディスプレイパネル及び携帯情報端末
KR102378636B1 (ko) * 2011-05-24 2022-03-25 소니그룹주식회사 반도체 장치
CN104715082A (zh) * 2013-12-12 2015-06-17 北京华大九天软件有限公司 一种平板显示器设计中通过重复的特征形状实现窄边框布线轮廓的翼状布线方法
KR102272214B1 (ko) * 2015-01-14 2021-07-02 삼성디스플레이 주식회사 표시 장치
US11227862B2 (en) 2017-02-28 2022-01-18 Murata Manufacturing Co., Ltd. Semiconductor device
JP2018142688A (ja) * 2017-02-28 2018-09-13 株式会社村田製作所 半導体装置
CN108511411B (zh) 2017-02-28 2021-09-10 株式会社村田制作所 半导体装置
CN109377874B (zh) * 2018-12-21 2021-07-09 上海中航光电子有限公司 显示面板和显示装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07153844A (ja) * 1993-12-01 1995-06-16 Nec Corp 半導体集積回路装置
US5514892A (en) * 1994-09-30 1996-05-07 Motorola, Inc. Electrostatic discharge protection device
US6172732B1 (en) * 1995-06-16 2001-01-09 Hitachi, Ltd. Liquid crystal display device suited to narrow frame
KR100197989B1 (ko) * 1996-06-24 1999-06-15 김영환 정전기 보호회로를 구비한 반도체장치
JP3948822B2 (ja) * 1998-04-21 2007-07-25 ローム株式会社 半導体集積回路
JP3693843B2 (ja) * 1999-02-25 2005-09-14 株式会社日立製作所 液晶表示装置
US6825504B2 (en) * 1999-05-03 2004-11-30 Hitachi, Ltd. Semiconductor integrated circuit device and method of manufacturing the same
JP4017060B2 (ja) * 2000-09-06 2007-12-05 株式会社ルネサステクノロジ 半導体装置
JP4298179B2 (ja) 2001-02-13 2009-07-15 セイコーインスツル株式会社 半導体装置
JP4907797B2 (ja) * 2001-08-21 2012-04-04 ルネサスエレクトロニクス株式会社 半導体集積回路および液晶表示装置
JP2004006691A (ja) * 2002-03-29 2004-01-08 Sanyo Electric Co Ltd 半導体集積回路装置
TW200305272A (en) * 2002-03-29 2003-10-16 Sanyo Electric Co Semiconductor integrated circuit device
JP4445189B2 (ja) * 2002-08-29 2010-04-07 株式会社ルネサステクノロジ 半導体装置およびその製造方法
JP2004296998A (ja) * 2003-03-28 2004-10-21 Matsushita Electric Ind Co Ltd 半導体装置
JP4428504B2 (ja) * 2003-04-23 2010-03-10 株式会社ルネサステクノロジ 半導体集積回路装置
JP5008840B2 (ja) * 2004-07-02 2012-08-22 ローム株式会社 半導体装置
JP4846244B2 (ja) * 2005-02-15 2011-12-28 ルネサスエレクトロニクス株式会社 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106373975A (zh) * 2015-07-22 2017-02-01 瑞萨电子株式会社 半导体器件
CN114256201A (zh) * 2020-09-11 2022-03-29 铠侠股份有限公司 半导体装置及配线构造

Also Published As

Publication number Publication date
KR20060092093A (ko) 2006-08-22
US7629652B2 (en) 2009-12-08
TW200723498A (en) 2007-06-16
JP2006228770A (ja) 2006-08-31
JP4846244B2 (ja) 2011-12-28
CN1822366A (zh) 2006-08-23
US20060180864A1 (en) 2006-08-17
US8294214B2 (en) 2012-10-23
TWI430431B (zh) 2014-03-11
US20100059882A1 (en) 2010-03-11
CN1822366B (zh) 2010-05-12

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: RENESAS ELECTRONICS CORPORATION

Free format text: FORMER OWNER: RENESAS TECHNOLOGY CORP.

Effective date: 20100906

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: TOKYO TO, JAPAN TO: KANAGAWA, JAPAN

TA01 Transfer of patent application right

Effective date of registration: 20100906

Address after: Kanagawa

Applicant after: Renesas Electronics Corporation

Address before: Tokyo, Japan, Japan

Applicant before: Renesas Technology Corp.

C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20100818