KR20060092093A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

Info

Publication number
KR20060092093A
KR20060092093A KR1020060014124A KR20060014124A KR20060092093A KR 20060092093 A KR20060092093 A KR 20060092093A KR 1020060014124 A KR1020060014124 A KR 1020060014124A KR 20060014124 A KR20060014124 A KR 20060014124A KR 20060092093 A KR20060092093 A KR 20060092093A
Authority
KR
South Korea
Prior art keywords
region
wiring
internal circuit
electrode pad
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020060014124A
Other languages
English (en)
Korean (ko)
Inventor
신야 스즈끼
가즈히사 히구찌
Original Assignee
가부시끼가이샤 르네사스 테크놀로지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 르네사스 테크놀로지 filed Critical 가부시끼가이샤 르네사스 테크놀로지
Publication of KR20060092093A publication Critical patent/KR20060092093A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
    • F16K11/02—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit
    • F16K11/06—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only sliding valves, i.e. sliding closure elements
    • F16K11/065—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only sliding valves, i.e. sliding closure elements with linearly sliding closure members
    • F16K11/07—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only sliding valves, i.e. sliding closure elements with linearly sliding closure members with cylindrical slides
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B13/00—Oxygen; Ozone; Oxides or hydroxides in general
    • C01B13/02—Preparation of oxygen
    • C01B13/0229—Purification or separation processes
    • C01B13/0248—Physical processing only
    • C01B13/0259—Physical processing only by adsorption on solids
    • C01B13/0262—Physical processing only by adsorption on solids characterised by the adsorbent
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/04—Purification or separation of nitrogen
    • C01B21/0405—Purification or separation processes
    • C01B21/0433—Physical processing only
    • C01B21/045—Physical processing only by adsorption in solids
    • C01B21/0455—Physical processing only by adsorption in solids characterised by the adsorbent
    • C01B21/0466—Zeolites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
    • F16K31/04—Actuating devices; Operating means; Releasing devices electric; magnetic using a motor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Liquid Crystal (AREA)
KR1020060014124A 2005-02-15 2006-02-14 반도체 장치 Withdrawn KR20060092093A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005037129A JP4846244B2 (ja) 2005-02-15 2005-02-15 半導体装置
JPJP-P-2005-00037129 2005-02-15

Publications (1)

Publication Number Publication Date
KR20060092093A true KR20060092093A (ko) 2006-08-22

Family

ID=36814810

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060014124A Withdrawn KR20060092093A (ko) 2005-02-15 2006-02-14 반도체 장치

Country Status (5)

Country Link
US (2) US7629652B2 (https=)
JP (1) JP4846244B2 (https=)
KR (1) KR20060092093A (https=)
CN (2) CN101807573A (https=)
TW (1) TWI430431B (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180037620A (ko) * 2011-05-24 2018-04-12 소니 주식회사 반도체 장치
KR102044715B1 (ko) * 2017-02-28 2019-11-14 가부시키가이샤 무라타 세이사쿠쇼 반도체 장치
US10707200B2 (en) 2017-02-28 2020-07-07 Murata Manufacturing Co., Ltd. Semiconductor device
US11227862B2 (en) 2017-02-28 2022-01-18 Murata Manufacturing Co., Ltd. Semiconductor device

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4846244B2 (ja) * 2005-02-15 2011-12-28 ルネサスエレクトロニクス株式会社 半導体装置
JP4010336B2 (ja) 2005-06-30 2007-11-21 セイコーエプソン株式会社 集積回路装置及び電子機器
KR100828792B1 (ko) 2005-06-30 2008-05-09 세이코 엡슨 가부시키가이샤 집적 회로 장치 및 전자 기기
JP4830371B2 (ja) 2005-06-30 2011-12-07 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4951902B2 (ja) * 2005-06-30 2012-06-13 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4552776B2 (ja) * 2005-06-30 2010-09-29 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4010335B2 (ja) 2005-06-30 2007-11-21 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4186970B2 (ja) 2005-06-30 2008-11-26 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4010334B2 (ja) * 2005-06-30 2007-11-21 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4661400B2 (ja) 2005-06-30 2011-03-30 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4151688B2 (ja) 2005-06-30 2008-09-17 セイコーエプソン株式会社 集積回路装置及び電子機器
US7755587B2 (en) 2005-06-30 2010-07-13 Seiko Epson Corporation Integrated circuit device and electronic instrument
JP4665677B2 (ja) 2005-09-09 2011-04-06 セイコーエプソン株式会社 集積回路装置及び電子機器
JP4586739B2 (ja) * 2006-02-10 2010-11-24 セイコーエプソン株式会社 半導体集積回路及び電子機器
JP5123510B2 (ja) * 2006-09-28 2013-01-23 ルネサスエレクトロニクス株式会社 半導体装置
JP4882700B2 (ja) * 2006-11-22 2012-02-22 セイコーエプソン株式会社 集積回路装置及び電子機器
JP5147234B2 (ja) * 2006-12-28 2013-02-20 パナソニック株式会社 半導体集積回路装置
JP5234717B2 (ja) * 2007-03-20 2013-07-10 ローム株式会社 半導体集積回路装置
JP5097096B2 (ja) * 2007-12-28 2012-12-12 パナソニック株式会社 半導体集積回路
JP5301231B2 (ja) * 2008-09-30 2013-09-25 株式会社テラミクロス 半導体装置
JP5395407B2 (ja) * 2008-11-12 2014-01-22 ルネサスエレクトロニクス株式会社 表示装置駆動用半導体集積回路装置および表示装置駆動用半導体集積回路装置の製造方法
JP2010224084A (ja) * 2009-03-23 2010-10-07 Hitachi Displays Ltd 液晶表示装置
JP5503208B2 (ja) 2009-07-24 2014-05-28 ルネサスエレクトロニクス株式会社 半導体装置
JP5315186B2 (ja) 2009-09-18 2013-10-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5746494B2 (ja) * 2010-11-24 2015-07-08 ルネサスエレクトロニクス株式会社 半導体装置、液晶ディスプレイパネル及び携帯情報端末
CN104715082A (zh) * 2013-12-12 2015-06-17 北京华大九天软件有限公司 一种平板显示器设计中通过重复的特征形状实现窄边框布线轮廓的翼状布线方法
KR102272214B1 (ko) * 2015-01-14 2021-07-02 삼성디스플레이 주식회사 표시 장치
JP6664897B2 (ja) * 2015-07-22 2020-03-13 ルネサスエレクトロニクス株式会社 半導体装置
CN109377874B (zh) * 2018-12-21 2021-07-09 上海中航光电子有限公司 显示面板和显示装置
JP7451362B2 (ja) * 2020-09-11 2024-03-18 キオクシア株式会社 半導体装置及び配線構造

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07153844A (ja) * 1993-12-01 1995-06-16 Nec Corp 半導体集積回路装置
US5514892A (en) * 1994-09-30 1996-05-07 Motorola, Inc. Electrostatic discharge protection device
JP3509875B2 (ja) * 1995-06-16 2004-03-22 株式会社 日立製作所 狭額縁に適した液晶表示装置
KR100197989B1 (ko) * 1996-06-24 1999-06-15 김영환 정전기 보호회로를 구비한 반도체장치
JP3948822B2 (ja) * 1998-04-21 2007-07-25 ローム株式会社 半導体集積回路
JP3693843B2 (ja) 1999-02-25 2005-09-14 株式会社日立製作所 液晶表示装置
US6825504B2 (en) * 1999-05-03 2004-11-30 Hitachi, Ltd. Semiconductor integrated circuit device and method of manufacturing the same
JP4017060B2 (ja) * 2000-09-06 2007-12-05 株式会社ルネサステクノロジ 半導体装置
JP4298179B2 (ja) 2001-02-13 2009-07-15 セイコーインスツル株式会社 半導体装置
JP4907797B2 (ja) * 2001-08-21 2012-04-04 ルネサスエレクトロニクス株式会社 半導体集積回路および液晶表示装置
TW200305272A (en) 2002-03-29 2003-10-16 Sanyo Electric Co Semiconductor integrated circuit device
JP2004006691A (ja) * 2002-03-29 2004-01-08 Sanyo Electric Co Ltd 半導体集積回路装置
JP4445189B2 (ja) * 2002-08-29 2010-04-07 株式会社ルネサステクノロジ 半導体装置およびその製造方法
JP2004296998A (ja) * 2003-03-28 2004-10-21 Matsushita Electric Ind Co Ltd 半導体装置
JP4428504B2 (ja) * 2003-04-23 2010-03-10 株式会社ルネサステクノロジ 半導体集積回路装置
JP5008840B2 (ja) * 2004-07-02 2012-08-22 ローム株式会社 半導体装置
JP4846244B2 (ja) * 2005-02-15 2011-12-28 ルネサスエレクトロニクス株式会社 半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180037620A (ko) * 2011-05-24 2018-04-12 소니 주식회사 반도체 장치
KR102044715B1 (ko) * 2017-02-28 2019-11-14 가부시키가이샤 무라타 세이사쿠쇼 반도체 장치
US10707200B2 (en) 2017-02-28 2020-07-07 Murata Manufacturing Co., Ltd. Semiconductor device
US11227862B2 (en) 2017-02-28 2022-01-18 Murata Manufacturing Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
TW200723498A (en) 2007-06-16
CN1822366B (zh) 2010-05-12
CN1822366A (zh) 2006-08-23
JP4846244B2 (ja) 2011-12-28
US20060180864A1 (en) 2006-08-17
US8294214B2 (en) 2012-10-23
TWI430431B (zh) 2014-03-11
US20100059882A1 (en) 2010-03-11
US7629652B2 (en) 2009-12-08
CN101807573A (zh) 2010-08-18
JP2006228770A (ja) 2006-08-31

Similar Documents

Publication Publication Date Title
JP4846244B2 (ja) 半導体装置
TWI578388B (zh) Semiconductor device
US5027188A (en) Semiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrate
JP4094656B2 (ja) 半導体装置
KR102714981B1 (ko) 집적회로 칩과 이를 포함하는 집적회로 패키지 및 디스플레이 장치
US20130264647A1 (en) Semiconductor integrated circuit device
KR102633136B1 (ko) 집적회로 칩과 이를 포함하는 집적회로 패키지 및 디스플레이 장치
CN110741476A (zh) 晶片接合的背照式成像器
US11088113B2 (en) Semiconductor storage device and method of manufacturing the same
US9196580B2 (en) Semiconductor device and semiconductor package containing the same
US7253531B1 (en) Semiconductor bonding pad structure
JP5272052B2 (ja) 半導体装置
JP4890827B2 (ja) 半導体装置
US20030053277A1 (en) Integrated circuit device with bump bridges and method for making the same
JP4585564B2 (ja) 半導体装置
JP5259674B2 (ja) 半導体装置
JP2003249557A (ja) 半導体集積回路装置

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20060214

PG1501 Laying open of application
N231 Notification of change of applicant
PN2301 Change of applicant

Patent event date: 20100805

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid